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"Reliability challenges in 3D IC packaging technology."

King-Ning Tu (2011)

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DOI: 10.1016/J.MICROREL.2010.09.031

access: closed

type: Journal Article

metadata version: 2020-02-22

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King-Ning Tu:
Reliability challenges in 3D IC packaging technology. Microelectron. Reliab. 51(3): 517-523 (2011)

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