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"Improvement in high-temperature degradation by isotropic conductive ..."

M. Yamashita, K. Suganuma (2006)

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DOI: 10.1016/J.MICROREL.2005.05.020

access: closed

type: Journal Article

metadata version: 2020-02-22

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M. Yamashita, K. Suganuma:
Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers. Microelectron. Reliab. 46(5-6): 850-858 (2006)

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