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"Fast Thermal Simulation of FinFET Circuits Based on a Multiblock ..."

Wangkun Jia, Brian T. Helenbrook, Ming-C. Cheng (2016)

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DOI: 10.1109/TCAD.2015.2501305

access: closed

type: Journal Article

metadata version: 2020-10-26

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  - https://dblp.org/rec/journals/tcad/JiaHC16
Wangkun Jia, Brian T. Helenbrook, Ming-C. Cheng:
Fast Thermal Simulation of FinFET Circuits Based on a Multiblock Reduced-Order Model. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(7): 1114-1124 (2016)

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