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"Nondestructive Inspection and Quantification of Soldering Defects in PCB ..."

Gaurav Dwivedi et al. (2023)

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DOI: 10.1109/TIM.2023.3298390

access: closed

type: Journal Article

metadata version: 2023-08-18

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  - https://dblp.org/rec/journals/tim/DwivediPLK23
Gaurav Dwivedi, Lavlesh Pensia, Viney Lohchab, Raj Kumar:
Nondestructive Inspection and Quantification of Soldering Defects in PCB Using an Autofocusing Digital Holographic Camera. IEEE Trans. Instrum. Meas. 72: 1-8 (2023)

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