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Publication search results
found 470 matches
- 2012
- Carmine Abbate, Giovanni Busatto
, Francesco Iannuzzo
:
Unclamped repetitive stress on 1200 V normally-off SiC JFETs. Microelectron. Reliab. 52(9-10): 2420-2425 (2012) - Markus Ackermann, Verena Hein, Christian Kovács, Kirsten Weide-Zaage:
A design for robust wide metal tracks. Microelectron. Reliab. 52(9-10): 2447-2451 (2012) - Behrouz Afzal, Behzad Ebrahimi
, Ali Afzali-Kusha, Hamid Mahmoodi
:
Modeling read SNM considering both soft oxide breakdown and negative bias temperature instability. Microelectron. Reliab. 52(12): 2948-2954 (2012) - Hossein Aghababa, Behzad Ebrahimi
, Ali Afzali-Kusha, Massoud Pedram:
Probability calculation of read failures in nano-scaled SRAM cells under process variations. Microelectron. Reliab. 52(11): 2805-2811 (2012) - Ashraf Ahmed
, Alberto Castellazzi
, L. Coulbeck, M. C. Johnson:
Circuit design and experimental test of a high power IGBT non-destructive tester. Microelectron. Reliab. 52(11): 2609-2616 (2012) - Ashraf Ahmed
, Yasaman Shadrokh, Lee Coulbeck, Alberto Castellazzi
, C. Mark Johnson
:
A closed-loop IGBT non-destructive tester. Microelectron. Reliab. 52(9-10): 2358-2362 (2012) - Emeka H. Amalu, Ndy N. Ekere:
Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations. Microelectron. Reliab. 52(11): 2731-2743 (2012) - Emeka H. Amalu, Ndy N. Ekere:
High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height. Microelectron. Reliab. 52(12): 2982-2994 (2012) - R. Ardito, Attilio Frangi, Alberto Corigliano, Biagio De Masi, G. Cazzaniga:
The effect of nano-scale interaction forces on the premature pull-in of real-life Micro-Electro-Mechanical Systems. Microelectron. Reliab. 52(1): 271-281 (2012) - Hossein Asadi
, Mehdi Baradaran Tahoori, Mahdi Fazeli
, Seyed Ghassem Miremadi:
Efficient algorithms to accurately compute derating factors of digital circuits. Microelectron. Reliab. 52(6): 1215-1226 (2012) - Asen Asenov, Ulf Schlichtmann
, Cher Ming Tan
, Hei Wong
, Xing Zhou:
ICMAT 2011 - Reliability and variability of semiconductor devices and ICs. Microelectron. Reliab. 52(8): 1531 (2012) - Elena Atanassova, Albena Paskaleva
, Dencho Spassov
:
Doped Ta2O5 and mixed HfO2-Ta2O5 films for dynamic memories applications at the nanoscale. Microelectron. Reliab. 52(4): 642-650 (2012) - Yvan Avenas
, Laurent Dupont
:
Evaluation of IGBT thermo-sensitive electrical parameters under different dissipation conditions - Comparison with infrared measurements. Microelectron. Reliab. 52(11): 2617-2626 (2012) - Nuria Ayala, Javier Martín-Martínez, Rosana Rodríguez, M. B. González
, Montserrat Nafría
, Xavier Aymerich
, Eddy Simoen:
Characterization and SPICE modeling of the CHC related time-dependent variability in strained and unstrained pMOSFETs. Microelectron. Reliab. 52(9-10): 1924-1927 (2012) - M. Enver Aydin, F. Yakuphanoglu:
Electrical characterization of inorganic-on-organic diode based InP and poly(3, 4-ethylenedioxithiophene)/poly(styrenesulfonate) (PEDOT: PSS). Microelectron. Reliab. 52(7): 1350-1354 (2012) - Sakir Aydogan, M. Saglam, Abdulmecit Türüt:
Effect of temperature on the capacitance-frequency and conductance-voltage characteristics of polyaniline/p-Si/Al MIS device at high frequencies. Microelectron. Reliab. 52(7): 1362-1366 (2012) - Stefania Baccaro, Giovanni Busatto
, Mauro Citterio, Paolo Cova
, Nicola Delmonte, Francesco Iannuzzo
, Agostino Lanza
, Marco Riva, Annunziata Sanseverino, Giorgio Spiazzi
:
Reliability oriented design of power supplies for high energy physics applications. Microelectron. Reliab. 52(9-10): 2465-2470 (2012) - Marta Bagatin, Simone Gerardin
, Alessandro Paccagnella
, Carla Andreani
, Giuseppe Gorini
, Christopher D. Frost:
Temperature dependence of neutron-induced soft errors in SRAMs. Microelectron. Reliab. 52(1): 289-293 (2012) - C. Banc, J. Guinet, E. Doche:
High performance electronics in long lifetime, continuous operation, industrial products: The art of balancing conflicting interests. Microelectron. Reliab. 52(9-10): 1797-1802 (2012) - Viorel Banu
, Philippe Godignon
, Xavier Perpiñà
, Xavier Jordà
, José Millán:
Enhanced power cycling capability of SiC Schottky diodes using press pack contacts. Microelectron. Reliab. 52(9-10): 2250-2255 (2012) - Daniele Bari, Nicola Wrachien, Roberto Tagliaferro, Thomas M. Brown
, Andrea Reale, Aldo Di Carlo, Gaudenzio Meneghesso
, Andrea Cester:
Reliability study of dye-sensitized solar cells by means of solar simulator and white LED. Microelectron. Reliab. 52(9-10): 2495-2499 (2012) - Samed Barnat, Hélène Frémont, Alexandrine Guédon-Gracia, Eric Cadalen:
Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength. Microelectron. Reliab. 52(9-10): 2278-2282 (2012) - Guillaume Bascoul
, Philippe Perdu, Maryse Béguin, Dean Lewis:
High performance thermography with InGaAs photon counting camera. Microelectron. Reliab. 52(9-10): 2087-2092 (2012) - Rodrigo Possamai Bastos, Frank Sill Torres
, Giorgio Di Natale, Marie-Lise Flottes, Bruno Rouzeyre:
Novel transient-fault detection circuit featuring enhanced bulk built-in current sensor with low-power sleep-mode. Microelectron. Reliab. 52(9-10): 1781-1786 (2012) - Vitezslav Benda:
Progress in power semiconductor devices. Microelectron. Reliab. 52(3): 461-462 (2012) - Fanny Berthet, Yannick Guhel, Hamid Gualous, Bertrand Boudart, Jean-Lionel Trolet, Marc Piccione, Christophe Gaquière
:
Annihilation of electrical trap effects by irradiating AlGaN/GaN HEMTs with low thermal neutrons radiation fluence. Microelectron. Reliab. 52(9-10): 2159-2163 (2012) - Peter Borgesen, Liang Yin
, Pericles Kondos:
Acceleration of the growth of Cu3Sn voids in solder joints. Microelectron. Reliab. 52(6): 1121-1127 (2012) - Gianluca Boselli
:
ESD design challenges in state-of-the-art analog technologies. Microelectron. Reliab. 52(9-10): 1769-1775 (2012) - M. R. Bruce, L. K. Ross, C. Scholz, L. Joshi, Vrajesh Dave, C. M. Chua:
Through silicon in-circuit logic analysis for localizing logic pattern failures. Microelectron. Reliab. 52(9-10): 2043-2049 (2012) - Arief Suriadi Budiman, H.-A.-S. Shin, B.-J. Kim, S.-H. Hwang, Ho-Young Son
, Min-Suk Suh, Q.-H. Chung, K.-Y. Byun, Nobumichi Tamura
, Martin Kunz, Young-Chang Joo:
Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits. Microelectron. Reliab. 52(3): 530-533 (2012)
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