• case-insensitive prefix search: default
  e.g., sig matches "SIGIR" as well as "signal"
• exact word search: append dollar sign ($) to word
  e.g., graph$ matches "graph", but not "graphics"
• boolean and: separate words by space
  e.g., codd model
• boolean or: connect words by pipe symbol (|)
  e.g., graph|network

Update May 7, 2017: Please note that we had to disable the phrase search operator (.) and the boolean not operator (-) due to technical problems. For the time being, phrase search queries will yield regular prefix search result, and search terms preceded by a minus will be interpreted as regular (positive) search terms.

found 32 matches

• 2018
• 
  Innocent Agbo, Mottaqiallah Taouil, Daniel Kraak, Said Hamdioui, Pieter Weckx, Stefan Cosemans, Francky Catthoor, Wim Dehaene:
  Impact and mitigation of SRAM read path aging. Microelectron. Reliab. 87: 158-167 (2018)
• 
  Anton Alexeev, Genevieve Martin, Grigory Onushkin:
  Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs. Microelectron. Reliab. 87: 89-96 (2018)
• 
  Jürgen Auersperg, Ellen Auerswald, Christian Collet, Thierry Dean, Dietmar Vogel, Thomas Winkler, Sven Rzepka:
  Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor. Microelectron. Reliab. 87: 238-244 (2018)
• 
  Adrian Bojita, Cristian Boianceanu, Marius Purcar, Ciprian Florea, Dan Simon, Cosmin-Sorin Plesa:
  A simple metal-semiconductor substructure for the advanced thermo-mechanical numerical modeling of the power integrated circuits. Microelectron. Reliab. 87: 142-150 (2018)
• 
  Lorenzo Codecasa, Robin Bornoff, James Dyson, Vincenzo d'Alessandro, Alessandro Magnani, Niccolò Rinaldi:
  Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources. Microelectron. Reliab. 87: 194-205 (2018)
• 
  Karsten M. Decker, René M. Rehmann, Mike Roellig, Karlheinz Bock:
  Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly. Microelectron. Reliab. 87: 125-132 (2018)
• 
  Pham Luu Trung Duong, Hyunseok Park, Nagarajan Raghavan:
  Application of expectation maximization and Kalman smoothing for prognosis of lumen maintenance life for light emitting diodes. Microelectron. Reliab. 87: 206-212 (2018)
• 
  Peng Fan, Shoudao Huang, Huai Wang, Huimin Li, Derong Luo:
  From chip to inverter: Electro-thermal modeling and design for paralleled power devices in high power application. Microelectron. Reliab. 87: 271-277 (2018)
• 
  Asit Kumar Gain, Liangchi Zhang:
  Growth nature of in-situ Cu₆Sn₅-phase and their influence on creep and damping characteristics of Sn-Cu material under high-temperature and humidity. Microelectron. Reliab. 87: 278-285 (2018)
• 
  Wolfgang Goes, Yannick Wimmer, Al-Moatasem El-Sayed, Gerhard Rzepa, Markus Jech, Alexander L. Shluger, Tibor Grasser:
  Identification of oxide defects in semiconductor devices: A systematic approach linking DFT to rate equations and experimental evidence. Microelectron. Reliab. 87: 286-320 (2018)
• 
  Wolfgang Granig, Lisa-Marie Faller, Hubert Zangl:
  Sensor system optimization to meet reliability targets. Microelectron. Reliab. 87: 113-124 (2018)
• 
  Ahmed E. Hammad:
  Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu lead-free solder by adding trace amount of elements Ni and Sb. Microelectron. Reliab. 87: 133-141 (2018)
• 
  Wei He, Guan-Yu Hu, Zhi-Jie Zhou, Peili Qiao, Xiaoxia Han, Yuan-Yuan Qu, Hang Wei, Chun Shi:
  A new hierarchical belief-rule-based method for reliability evaluation of wireless sensor network. Microelectron. Reliab. 87: 33-51 (2018)
• 
  Hyunju Lee, Cheolmin Kim, Cheolho Heo, Chiho Kim, Jae-Ho Lee, Yangdo Kim:
  Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn-Ag-Cu solder. Microelectron. Reliab. 87: 75-80 (2018)
• 
  Hao Li, Mifang Cong, Ke Li, Huan Du:
  Source engineering on ruggedness and RF performance of n-channel RFLDMOS. Microelectron. Reliab. 87: 57-63 (2018)
• 
  Yuanqing Li, Li Chen, Issam Nofal, Mo Chen, Haibin Wang, Rui Liu, Qingyu Chen, Milos Krstic, Shuting Shi, Gang Guo, Sang H. Baeg, Shi-Jie Wen, Richard Wong:
  Modeling and analysis of single-event transient sensitivity of a 65 nm clock tree. Microelectron. Reliab. 87: 24-32 (2018)
• 
  Weichao Liu, Xiang Fang, Qianqian Chen, Yingxin Li, Ting Li:
  Reliability analysis of an integrated device of ECG, PPG and pressure pulse wave for cardiovascular disease. Microelectron. Reliab. 87: 183-187 (2018)
• 
  Melina Lofrano, Vladimir Cherman, Mario Gonzalez, Eric Beyne:
  Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly. Microelectron. Reliab. 87: 97-105 (2018)
• 
  Shuji Nishimoto, Seyed Ali Moeini, Toyo Ohashi, Yoshiyuki Nagatomo, F. Patrick McCluskey:
  Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications. Microelectron. Reliab. 87: 232-237 (2018)
• 
  Yuling Niu, Jing Wang, Shuai Shao, Huayan Wang, Hohyung Lee, Seungbae Park:
  A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method. Microelectron. Reliab. 87: 81-88 (2018)
• 
  D. Nouguier, X. Federspiel, Gérard Ghibaudo, M. Rafik, David Roy:
  New NBTI models for degradation and relaxation kinetics valid over extended temperature and stress/recovery ranges. Microelectron. Reliab. 87: 106-112 (2018)
• 
  Kenneth Chimezie Nwanoro, Hua Lu, Chunyan Yin, Chris Bailey:
  An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectron. Reliab. 87: 1-14 (2018)
• 
  Qi Qin, Shuai Zhao, Shaowei Chen, Dengshan Huang, Jian Liang:
  Adaptive and robust prediction for the remaining useful life of electrolytic capacitors. Microelectron. Reliab. 87: 64-74 (2018)
• 
  P. Vigneshwara Raja, Neti V. L. Narasimha Murty:
  Thermal annealing studies in epitaxial 4H-SiC Schottky barrier diodes over wide temperature range. Microelectron. Reliab. 87: 213-221 (2018)
• 
  Brice Rogié, Lorenzo Codecasa, Eric Monier-Vinard, Valentin Bissuel, Najib Laraqi, Olivier Daniel, Dario D'Amore, Alessandro Magnani, Vincenzo d'Alessandro, Niccolò Rinaldi:
  Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization. Microelectron. Reliab. 87: 222-231 (2018)
• 
  Ambika Prasad Shah, Nandakishor Yadav, Ankur Beohar, Santosh Kumar Vishvakarma:
  An efficient NBTI sensor and compensation circuit for stable and reliable SRAM cells. Microelectron. Reliab. 87: 15-23 (2018)
• 
  Warin Sootkaneung, Suppachai Howimanporn, Sasithorn Chookaew:
  Temperature effects on BTI and soft errors in modern logic circuits. Microelectron. Reliab. 87: 259-270 (2018)
• 
  Piotr Zajac, Andrzej Napieralski:
  Novel thermal model of microchannel cooling system designed for fast simulation of liquid-cooled ICs. Microelectron. Reliab. 87: 245-258 (2018)
• 
  D. Zhang, T. R. Li, J. W. Zhou, Y. C. Jiang, B. Ren, J. Huang, J. M. Zhang, Lin Wang, Ju Gao, L. J. Wang:
  Asymmetric resistive switching behaviour in a Au/a-C: Co/Au planar structure. Microelectron. Reliab. 87: 52-56 (2018)
• 
  Wen Zhao, Chaohui He, Wei Chen, Rongmei Chen, Peitian Cong, Fengqi Zhang, Zujun Wang, Chen Shen, Lisang Zheng, Xiaoqiang Guo, Lili Ding:
  Single-event multiple transients in guard-ring hardened inverter chains of different layout designs. Microelectron. Reliab. 87: 151-157 (2018)

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