- Happy New Year from IEEE J-MMCT!
- Thank you, J-MMCT reviewers!
- Award ceremony for the 2025 IEEE J-MMCT Best Paper, Palermo, Italy - September, 2025. Credit: J-MMCT Editorial Team.
- First author of the 2025 J-MMCT Best Paper Award, Hao-Xuan Zhang - September, 2025. Credit: J-MMCT Editorial Team.
- Path Loss heatmaps inferred by sEM DeepRay and those simulated via ray-tracing. Credit: Stefanos Bakirtzis et al. DOI: 10.1109/JMMCT.2024.3506693
- Locally Corrected Nyström (LCN) solution order 4 surface current solution for a 18λ B2 Aircraft. Credit: Omid Babazadeh et al. DOI: 10.1109/JMMCT.2025.3547827
- Higher-order stabilized hybridized Discontinuous Galerkin Method. Credit: Nian-En Zhang et al. DOI: 10.1109/JMMCT.2025.3575845
- Physics-informed U-nets for solving the heat equation. Credit: S. Qi and C. D. Sarris. DOI: 10.1109/JMMCT.2023.3236946
1. Q1 journal ranked by Scopus in the category of mathematical physics. 2. For 2024. 3. Contact EiC if review exceeds 30 days.
Featured Articles
Explaining the Unexplained
We are pleased to launch a new series, Explaining the Unexplained, where authors share dilemmas, puzzling results, or observations that defy easy interpretation, and the broader community contributes responses, perspectives, and explanations. Select the “Explaining the Unexplained” track when submitting your paper.
Quantum Optimization of Reconfigurable Intelligent Surfaces for Mitigating Multipath Fading in Wireless Networks
Authors: E. Colella, L. Bastianelli, V. M. Primiani, Z. Peng, F. Moglie and G. Gradoni
Current Author Online Seminars
Multiphysics Analysis and Simulation of Wireless Passive Temperature and Pressure sensors for Harsh-Environment Applications
Authors: Yijia Cheng1, Yujie Hua2, Baiyun Wang2, Kang Wang3, Wenxuan Tang2, Gang Shao3, and Wei E. I. Sha1
Affiliation: 1Zhejiang University; 2Southeast University, 3Zhengzhou University; China
Speaker: Yijia Cheng
Paper: https://ieeexplore.ieee.org/document/11286216
Active Calls for Papers
Multiphysics Modeling for Next-Generation Electronic Packaging
Expected online publication: 2025 and 2026 Volumes
First submission deadline is 10/30/2025 (published online by 12/31/2025)
Second submission deadline is 03/31/2026 (published online by 05/31/2026)
Third submission deadline is 06/30/2026 (published online by 08/31/2026)
News
30-Day Policy
Contact EiC for an accelerated review process if no update is received within 30 days of submission
Student Editorial Assistant Team
Student Editorial Assistant Team is assembled and continues to welcome new members
Recent Author Online Seminars
Recent Calls for Papers
Computational Techniques for Advanced Packaging and Heterogeneous Integration
Expected online publication: 2025 Volume
Submission deadline is May 21, 2025
Modeling Methods for Wave Propagation in Wireless Communication Systems
Expected publication: 2024 Volume
Submission deadline is March 31, 2024