| The environmental footprint of IC production: review, analysis, and lessons from historical trends T Pirson, TP Delhaye, AG Pip, G Le Brun, JP Raskin, D Bol IEEE Transactions on Semiconductor Manufacturing 36 (1), 56-67, 2022 | 48 | 2022 |
| The environmental footprint of IC production: Meta-analysis and historical trends T Pirson, T Delhaye, A Pip, G Le Brun, JP Raskin, D Bol ESSDERC 2022-IEEE 52nd European Solid-State Device Research Conference …, 2022 | 18 | 2022 |
| Could unsustainable electronics support sustainability? N Moreau, T Pirson, G Le Brun, T Delhaye, G Sandu, A Paris, D Bol, ... Sustainability 13 (12), 6541, 2021 | 18 | 2021 |
| Enhanced ultraviolet photoresponse in a graphene-gated ultra-thin Si-based photodiode G Li, N André, B Huet, T Delhaye, N Reckinger, LA Francis, L Liao, ... Journal of Physics D: Applied Physics 52 (24), 245101, 2019 | 14 | 2019 |
| New universal figure of merit for embedded Si piezoresistive pressure sensors TP Delhaye, N André, LA Francis, D Flandre IEEE Sensors Journal 21 (1), 213-221, 2020 | 11 | 2020 |
| Ultra-low-power SOI CMOS pressure sensor based on orthogonal PMOS gauges N André, TP Delhaye, MAK Jazairli, B Olbrechts, P Gérard, LA Francis, ... XXII IMEKO TC4 International Symposium and XX International Workshop on ADC …, 2017 | 9 | 2017 |
| High-efficiency wireless power transfer for mm-size biomedical implants TP Delhaye, N André, S Gilet, C Gimeno, LA Francis, D Flandre 2017 IEEE SENSORS, 1-3, 2017 | 5 | 2017 |
| Low-power silicon strain sensor based on CMOS current reference topology N Roisin, TP Delhaye, N André, JP Raskin, D Flandre Sensors and Actuators A: Physical 339, 113491, 2022 | 4 | 2022 |
| Tuning Range Comparison between Different Planar Inductors Layouts on PCB S Kaziz, B Maamer, T Delhaye, F Tounsi, LA Francis, D Flandre 2020 IEEE International Conference on Design & Test of Integrated Micro …, 2020 | 3 | 2020 |
| Bottom-Up Life-Cycle Assessment of MEMS Piezoresistive Pressure Sensors TP Delhaye, G Le Brun, D Flandre, JP Raskin 2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS …, 2021 | 2 | 2021 |
| One-day fast-prototyping process for functionalized membrane array on flexible substrate T Delhaye, C Ge, L Francis, E Cretu, D Flandre 45th International Conference on Micro & Nano Engineering, 2019 | 2 | 2019 |
| Macro-Modeling Library in Simscape for MEMS Pressure Sensors Based on Energy-Flow Paradigm TP Delhaye, D Flandre, LA Francis, E Cretu Symposium on "Design, Test, Integration and Packaging os MEMS/MOEMS", 2019 | 2 | 2019 |
| Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB S Stoukatch, N André, T Delhaye, F Dupont, JM Redouté, D Flandre 2020 IEEE SENSORS, 1-4, 2020 | 1 | 2020 |
| Strain sensor N Roisin, D Flandre, N André, T Delhaye | | 2023 |
| Improving MOSFET Piezoresistive Strain Gauges Limit of Detection Using Lock-In Principle TP Delhaye, N Roisin, N André, LA Francis, D Flandre 2021 IEEE Sensors, 1-4, 2021 | | 2021 |
| Enhancing Partial Discharge Detection by Tuning Residual Stresses in Ultrathin CMOS-compatible Multilayer Membranes for Resonant Frequency Control E Masarweh, N André, T Delhaye, L Francis, D Flandre Micro and Nano Engineering Conference, 2021 | | 2021 |
| Capteurs CMOS physiques & physiologiques flexibles et basse consommation D Flandre, N André, T Delhaye, L Francis, JP Raskin Ecole d'hiver Francophone sur les Technologies de Conception des Systèmes …, 2019 | | 2019 |
| Wearable physical & physiological low-power sensors D Flandre, N André, T Delhaye, T Walewyns, L Francis, WP Convergence Workshop at the 48th ESSDERC-ESSCIRC Conference 2018, 2018 | | 2018 |
Denis FlandreICTEAM, EPL, Université catholique de Louvain (UCL)Verified email at uclouvain.be
Laurent A. FRANCISUniversité catholique de Louvain, ICTEAM Institute, Ecole Polytechnique de LouvainVerified email at uclouvain.be
Nicolas ANDREICTEAM, EPL, Université catholique de LouvainVerified email at uclouvain.be