We report about a detailed comparison of the additive manufacturing methods inkjet printing
(IJP) and aerosol jet printing (AJP). Both technologies are based on the direct-writing …

Considering the demand for low temperature bonding processes in 3D integration and
packaging of microelectronic or micromechanical components, this paper introduces a method …

Reactive bonding is a still new low-temperature joining process that is based on reactive
nanoscale multilayer systems. The heat required for the bonding process is generated by a self-…

This paper focuses on the development of electroplating on 150 mm wafer level for
microsystem technology applications from 1-Ethyl-3-methylimidazolium chloride (EMImCl) with …

Mask less fabricated 3D interconnects may have a big potential in future microelectronic
applications by enhancing freedom of device design or power- and footprint saving capabilities …

Electroplating process is being used to deposit a relatively thick film of metallic materials for
various microsystems applications, such as for the wafer-level bonding sealing frame and as …

Hybrid bonding is key to achieving high-quality interconnect interfaces for fine pitch integration.
It has an advantage over other types of interconnects as it allows a high I/O count for high…

In this study we successfully bonded silicon wafer substrates with metal based thermocompression
technology. This technology has the advantage of inherent possibility of hermetic …

In this paper, wafer-to-wafer AuSi eutectic bonding was investigated and evaluated with
various sets of experimental parameters. Single crystalline Si and amorphous Si were bonded …

The low temperature joining of semiconductor substrates on wafer level by solid-liquid inter-diffusion
bonding using the Cu/Ga and Au/In systems is investigated regarding the bonding …