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Complementing the 2-OU (OCP) model, the 4U FrontI/O HGX B300 Liquid-Cooled System offers the same compute performance in a traditional 19-inch EIA rack form factor for large-scale AI factory deployments.
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At the Open Compute Project (OCP) GlobalSummit in October, a new, micro quick-disconnect connector, known as the Mini-QD, developed by Staubli, was introduced by Ciena as the enabler for Ciena's liquid-cooled OSFP module.