Jul 21, 2026
-
Press Release
Henkel launches next-generation thermal gap filler with 6.5W/m∙K conductivity
Rising thermal loads in vehicle electronics are increasing the need for high-performance thermal management solutions, especially in advanced applications such as ADAS, ECUs, or power conversion components in electric vehicles. To address this fast-evolving challenge, Henkel Adhesive Technologies has launched Bergquist Gap Filler TGF 6500LVO, a next-generation thermal gap filler with 6.5W/m∙K thermal conductivity. This new material enables more effective heat transfer in critical systems, helping manufacturers manage increasing power density and maintain performance and reliability.
Learn more