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High Quality DGS Dicing-Grinding Service

This document provides information about Dicing-Grinding Service (DGS) which offers various wafer processing services including dicing, grinding, and polishing. Some key capabilities and technologies mentioned include thickness measurement, die strength testing, automatic optical inspection, and an online customer tracking system. DGS is certified to ISO and OHSAS standards and operates from a new cleanroom facility in Germany, offering services for a variety of materials up to 300mm wafer sizes.

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agniva datta
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68 views2 pages

High Quality DGS Dicing-Grinding Service

This document provides information about Dicing-Grinding Service (DGS) which offers various wafer processing services including dicing, grinding, and polishing. Some key capabilities and technologies mentioned include thickness measurement, die strength testing, automatic optical inspection, and an online customer tracking system. DGS is certified to ISO and OHSAS standards and operates from a new cleanroom facility in Germany, offering services for a variety of materials up to 300mm wafer sizes.

Uploaded by

agniva datta
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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DGS Dicing-Grinding Service

DISCO HI-TEC EUROPE GmbH


High Quality

• Thickness measurement (Laser/Capacitive)


• Die strength measurement
• Automatic Optical Inspection
• Inspection microscope
• Automatic tracking system via internet platform for customers
• High process traceability

Bringing science
to comfortable living
through advanced
Kiru, Kezuru, Migaku
technologies.

ISO Certification Contact Dicing | Kiru


Grinding | Kezuru
DISCO HI-TEC EUROPE GmbH
Liebigstraße 8
Polishing | Migaku
85551 Kirchheim b. München
Germany
Special Solutions
Phone: +49 (0)89 90903 - 0
Fax: +49 (0)89 90903 -199
E-mail: dgs@discoeurope.com
Web: www.dicing-grinding.com
DIN EN ISO 9001 DIN EN ISO 14001 OHSAS 18001
Dicing | Kiru Polishing | Migaku The New Cleanroom Open since Summer 2013

• Single cut
• Step cup
• Dry polishing Floor size: 400 m2
• Bevel cut
• Stress relief process for higher Number of Machines: 30+
• Grooving
die strength and reduction in Now added: CAMTEK Automatic Inspection Tool
• Chopper cut die warpage Condor 200 Series
• Circle cut
• Edge trimming

Grinding | Kezuru Special Solutions for high-end applications:


• Dicing Before Grinding (DBG)
• Standard grinding
• Plasma etching for high
• Ultra-Thin grinding
die strength
• Bonded Wafer grinding
• TAIKO for power devices <100 µm
• Partial Wafer grinding
• Surface planarization
• Individual Die grinding
• Stealth Laser for various materials
• Edge trimming
• Ultrasonic dicing
• Poligrind / Ultrapoligrind
• IR/White light

All DGS applications are offered for various materials up to 300 mm in combination with
Wafer lamination | Wafer mounting | UV irradiation of tapes | Inspection (chipping inspection, die strength testing, etc.) | Vacuum sealed packaging under N2

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