AMIS-30660

High Speed CAN

Transceiver
Description
The AMIS−30660 CAN transceiver is the interface between a
controller area network (CAN) protocol controller and the physical http://onsemi.com
bus and may be used in both 12 V and 24 V systems. The transceiver
provides differential transmit capability to the bus and differential MARKING
receive capability to the CAN controller. DIAGRAM
Due to the wide common−mode voltage range of the receiver inputs, 8
the AMIS−30660 is able to reach outstanding levels of SOIC−8 30660−2
8
electromagnetic susceptibility (EMS). Similarly, extremely low CASE 751 ALYW
1 G
electromagnetic emission (EME) is achieved by the excellent
1
matching of the output signals.
30660−2 = Specific Device Code
Features A = Assembly Location
L = Wafer Lot
• Fully Compatible with the ISO 11898−2 Standard
Y = Year
• Certified “Authentication on CAN Transceiver Conformance (d1.1)” W = Work Week
• High Speed (up to 1 Mbit/s) G = Pb−Free Package

• Ideally Suited for 12 V and 24 V Industrial and Automotive

Applications PIN ASSIGNMENT
• Low EME Common−Mode Choke is No Longer Required
• Differential Receiver with Wide Common−Mode Range ($35 V) for
TxD 1 8 S
High EMS
• No Disturbance of the Bus Lines with an Unpowered Node GND 2 7 CANH

AMIS−
30660
• Transmit Data (TxD) Dominant Time−out Function
VCC 3 6
• Thermal Protection CANL
• Bus Pins Protected Against Transients in an Automotive RxD 4 5 Vref
Environment
• Silent Mode in which the Transmitter is Disabled PC20040918.3
• Short Circuit Proof to Supply Voltage and Ground
(Top View)
• Logic Level Inputs Compatible with 3.3 V Devices
• These are Pb−Free Devices*
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.

*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.

© Semiconductor Components Industries, LLC, 2012 1 Publication Order Number:

August, 2012 − Rev. 10 AMIS−30660/D
 AMIS−30660

Table 1. TECHNICAL CHARACTERISTICS

Symbol Parameter Conditions Min Max Unit
VCANH DC Voltage at Pin CANH 0 < VCC < 5.25 V; No Time Limit −45 +45 V
VCANL DC Voltage at Pin CANL 0 < VCC < 5.25 V; No Time Limit −45 +45 V
Vo(dif)(bus_dom) Differential Bus Output Voltage in 42.5 W < RLT < 60 W 1.5 3 V
Dominant State

tpd(rec−dom) Propagation Delay TxD to RxD See Figure 6 70 245 ns

tpd(dom−rec) Propagation Delay TxD to RxD See Figure 6 100 245 ns
CM−range Input Common−Mode Range for Guaranteed Differential Receiver Threshold −35 +35 V
Comparator and Leakage Current

VCM−peak Common−Mode Peak See Figures 7 and 8 (Note 1) −500 500 mV

VCM−step Common−Mode Step See Figures 7 and 8 (Note 1) −150 150 mV
1. The parameters VCM−peak and VCM−step guarantee low electromagnetic emission.

V CC

8 3
S
Thermal
shutdown
VCC

7
Driver CANH
control CANL
TxD Timer 6
1

AMIS−30660

4
RxD COMP
Ri(cm) V cc / 2
+

5
V ref Ri(cm)

PD20070607.1
GND
Figure 1. Block Diagram

Table 2. PIN LIST AND DESCRIPTIONS

Pin Name Description
1 TxD Transmit data input; low input → dominant driver; internal pull−up current
2 GND Ground
3 VCC Supply voltage
4 RxD Receive data output; dominant transmitter → low output
5 VREF Reference voltage output
6 CANL Low−level CAN bus line (low in dominant mode)
7 CANH High−level CAN bus line (high in dominant mode)
8 S Silent mode control input; internal pull−down current

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 AMIS−30660

Table 3. ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Conditions Min Max Unit
VCC Supply Voltage −0.3 +7 V
VCANH DC Voltage at Pin CANH 0 < VCC < 5.25 V; −45 +45 V
No Time Limit

VCANL DC Voltage at Pin CANL 0 < VCC < 5.25 V; −45 +45 V
No Time Limit

VTxD DC Voltage at Pin TxD −0.3 VCC + 0.3 V

VRxD DC Voltage at Pin RxD −0.3 VCC + 0.3 V
VS DC Voltage at Pin S −0.3 VCC + 0.3 V
Vref DC Voltage at Pin VREF −0.3 VCC + 0.3 V
Vtran(CANH) Transient Voltage at Pin CANH (Note 2) −150 +150 V
Vtran(CANL) Transient Voltage at Pin CANL (Note 2) −150 +150 V
Vesd Electrostatic Discharge Voltage at All Pins (Note 3) −4 +4 kV
(Note 5) −500 +500 V

Latchup Static Latchup at All Pins (Note 4) 100 mA

Tstg Storage Temperature −55 +155 °C
Tamb Ambient Temperature −40 +125 °C
TJunc Maximum Tunction Temperature −40 +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. Applied transient waveforms in accordance with ISO 7637 part 3, test pulses 1, 2, 3a, and 3b (see Figure 4).
3. Standardized human body model ESD pulses in accordance to MIL883 method 3015.7.
4. Static latch−up immunity: static latch−up protection level when tested according to EIA/JESD78.
5. Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3−1993.

Table 4. THERMAL CHARACTERISTICS

Symbol Parameter Conditions Value Unit
Rth(vj−a) Thermal Resistance from Junction−to−Ambient in SOIC−8 In Free Air 150 K/W
Package

Rth(vj−s) Thermal resistance from Junction−to−Substrate of Bare Die In Free Air 45 K/W

VBAT 60 W 60 W
IN OUT
5V−reg
47 nF
V CC V CC

S 3
8 CANH
7
CAN
CAN RxD AMIS− Vref
4 5 BUS
controller 30660
CANL
TxD 6
1 60 W
60 W
2

PC20040918.2 GND GND 47 nF

Figure 2. Application Diagram

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 AMIS−30660

FUNCTIONAL DESCRIPTION

Operating Modes
The behavior of AMIS−30660 under various conditions is
illustrated in Table 5 below. In case the device is powered,
one of two operating modes can be selected through Pin S.

Table 5. FUNCTIONAL TABLE OF AMIS−30660 (X = DON’T CARE)

VCC Pin TxD Pin S Pin CANH Pin CANL Bus State Pin RxD
4.75 V to 5.25 V 0 0 (or Floating) High Low Dominant 0
4.75 V to 5.25 V X 1 VCC / 2 VCC / 2 Recessive 1
4.75 V to 5.25 V 1 (or Floating) X VCC / 2 VCC / 2 Recessive 1
VCC < PORL (Unpowered) X X 0 V < CANH 0 V < CANL < Recessive 1
< VCC VCC

PORL < VCC < 4.75 V >2V X 0 V < CANH 0 V < CANL < Recessive 1
< VCC VCC

High−Speed Mode circuit is particularly necessary when a bus line

If Pin S is pulled low (or left floating), the transceiver is short−circuits.
in its high−speed mode and is able to communicate via the
bus lines. The signals are transmitted and received to the TxD Dominant Time−out Function
CAN controller via the Pins TxD and RxD. The slopes on the A TxD dominant time−out timer circuit prevents the bus
bus line outputs are optimized to give extremely low lines from being driven to a permanent dominant state
electromagnetic emissions. (blocking all network communication) if Pin TxD is forced
permanently low by a hardware and/or software application
Silent Mode failure. The timer is triggered by a negative edge on pin TxD.
In silent mode, the transmitter is disabled. All other IC If the duration of the low−level on Pin TxD exceeds the
functions continue to operate. The silent mode is selected by internal timer value tdom, the transmitter is disabled, driving
connecting Pin S to VCC and can be used to prevent network the bus into a recessive state. The timer is reset by a positive
communication from being blocked, due to a CAN edge on Pin TxD.
controller which is out of control.
Fail−Safe Features
Overtemperature Detection A current−limiting circuit protects the transmitter output
A thermal protection circuit protects the IC from damage stage from damage caused by an accidental short−circuit to
by switching off the transmitter if the junction temperature either positive or negative supply voltage, although power
exceeds a value of approximately 160°C. Because the dissipation increases during this fault condition.
transmitter dissipates most of the power, the power The Pins CANH and CANL are protected from
dissipation and temperature of the IC is reduced. All other automotive electrical transients (according to “ISO 7637”;
IC functions continue to operate. The transmitter off−state see Figure 3). Pin TxD is pulled high internally should the
resets when Pin TxD goes high. The thermal protection input become disconnected.

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 AMIS−30660

ELECTRICAL CHARACTERISTICS

Definitions is flowing into the pin; sourcing current means the current
All voltages are referenced to GND (Pin 2). Positive is flowing out of the pin.
currents flow into the IC. Sinking current means the current

Table 6. DC AND TIMING CHARACTERISTICS

(VCC = 4.75 V to 5.25 V; Tjunc = −40°C to +150°C; RLT = 60 W unless specified otherwise.)

Symbol Parameter Conditions Min Typ Max Unit

SUPPLY (Pin VCC)
ICC Supply Current Dominant; VTXD = 0 V 25 45 65 mA
Recessive; VTXD = VCC 2 4 8

ICCS Supply Current in silent mode VS = VCC 2 4 8 mA

TRANSMITTER DATA INPUT (Pin TxD)
VIH High−level input voltage Output recessive 2.0 − VCC+0.3 V
VIL Low−level input voltage Output dominant −0.3 − +0.8 V
IIH High−level input current VTxD = VCC −1 0 +1 mA
IIL Low−level input current VTxD = 0 V −75 −200 −350 mA
Ci Input capacitance Not tested − 5 10 pF
MODE SELECT (Pin S)
VIH High−level input voltage Silent mode 2.0 − VCC+0.3 V
VIL Low−level input voltage High−speed mode −0.3 − +0.8 V
IIH High−level input current VS = 2 V 20 30 50 mA
IIL Low−level input current VS = 0.8 V 15 30 45 mA
RECEIVER DATA OUTPUT (Pin RxD)
VOH High−level output voltage IRXD = − 10 mA 0.6 x 0.75 x V
VCC VCC

VOL Low−level output voltage IRXD = 6 mA 0.25 0.45 V

REFERENCE VOLTAGE OUTPUT (Pin Vref)
VREF Reference output voltage −50 mA < IVREF < +50 mA 0.45 x 0.50 x 0.55 x V
VCC VCC VCC

VREF_CM Reference output voltage for full common −35 V <VCANH< +35V; 0.40 x 0.50 x 0.60 x V
mode range −35 V <VCANL< +35V VCC VCC VCC

BUS LINES (Pins CANH and CANL)

Vo(reces)(CANH) Recessive bus voltage at pin CANH VTxD = VCC; no load 2.0 2.5 3.0 V
Vo(reces)(CANL) Recessive bus voltage at pin CANL VTxD = VCC; no load 2.0 2.5 3.0 V
Io(reces) (CANH) Recessive output current at pin CANH −35 V < VCANH < +35 V; −2.5 − +2.5 mA
0 V <VCC < 5.25 V

Io(reces) (CANL) Recessive output current at pin CANL −35 V < VCANL < +35 V; −2.5 − +2.5 mA
0V <VCC < 5.25 V

Vo(dom) (CANH) Dominant output voltage at pin CANH VTxD = 0 V 3.0 3.6 4.25 V
Vo(dom) (CANL) Dominant output voltage at pin CANL VTxD = 0 V 0. 5 1.4 1.75 V
Vo(dif) (bus) Differential bus output voltage VTxD = 0 V; dominant; 1.5 2.25 3.0 V
(VCANH − VCANL) 42.5 W < RLT < 60 W
VTxD = VCC; recessive; −120 0 +50 mV
No load

Io(sc) (CANH) Short circuit output current at pin CANH VCANH = 0 V; VTxD = 0 V −45 −70 −95 mA
Io(sc) (CANL) Short circuit output current at pin CANL V CANL = 36V; VTxD = 0V 45 70 120 mA

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 AMIS−30660

Table 6. DC AND TIMING CHARACTERISTICS

(VCC = 4.75 V to 5.25 V; Tjunc = −40°C to +150°C; RLT = 60 W unless specified otherwise.)

Symbol Parameter Conditions Min Typ Max Unit

BUS LINES (Pins CANH and CANL)
Vi(dif)(th) Differential receiver threshold voltage −5 V < VCANL < +10 V; 0.5 0.7 0.9 V
−5 V < VCANH < +10 V;
See Figure 4
Vihcm(dif) (th) Differential receiver threshold voltage for −35 V < VCANL < +35 V; 0.25 0.7 1.05 V
high common−mode −35 V < VCANH < +35V;
See Figure 4
Vi(dif) (hys) Differential receiver input voltage hyster- −5 V < VCANL < +10 V; 50 70 100 mV
esis −5 V < VCANH < +10 V;
See Figure 4
Ri(cm)(CANH) Common−mode input resistance at pin 15 25 37 KW
CANH

Ri(cm) (CANL) Common−mode input resistance at pin 15 25 37 KW

CANL

Ri(cm)(m) Matching between pin CANH and pin VCANH = VCANL −3 0 +3 %

CANL common−mode input resistance

Ri(dif) Differential input resistance 25 50 75 KW

Ci(CANH) Input capacitance at pin CANH VTxD = VCC; not tested 7.5 20 pF
Ci(CANL) Input capacitance at pin CANL VTxD = VCC; not tested 7.5 20 pF
Ci(dif) Differential input capacitance VTxD = VCC; not tested 3.75 10 pF
ILI(CANH) Input leakage current at pin CANH VCC = 0 V; VCANH = 5V 10 170 250 mA
ILI(CANL) Input leakage current at pin CANL VCC = 0 V; VCANL = 5V 10 170 250 mA
VCM−peak Common−mode peak during transition See Figures 7 and 8 −500 500 mV
from dom → rec or rec → dom

VCM−step Difference in common−mode between See Figures 7 and 8 −150 150 mV

dominant and recessive state

POWER−ON−RESET (POR)
PORL POR level CANH, CANL, Vref in tri− 2.2 3.5 4.5 V
state below POR level

THERMAL SHUTDOWN
Tj(sd) Shutdown junction temperature 150 160 180 °C
TIMING CHARACTERISTICS (see Figures 5 and 6)
td(TxD−BUSon) Delay TxD to bus active Vs = 0 V 40 85 130 ns
td(TxD−BUSoff) Delay TxD to bus inactive Vs = 0 V 30 60 105 ns
td(BUSon−RxD) Delay bus active to RxD Vs = 0 V 25 55 105 ns
td(BUSoff−RxD) Delay bus inactive to RxD Vs = 0 V 65 100 135 ns
tpd(rec−dom) Propagation delay TxD to RxD from Vs = 0 V 70 245 ns
recessive to dominant
td(dom−rec) Propagation delay TxD to RxD from Vs = 0 V 100 245 ns
dominant to recessive
tdom(TxD) TxD dominant time for time out VTxD = 0 V 250 450 750 ms

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 AMIS−30660

MEASUREMENT SEUPS AND DEFINITIONS

+5 V
100 nF V CC

3
CANH
7
TxD
1 1 nF
AMIS− V REF Transient
5
30660 Generator
RxD 1 nF
4
6
CANL
8 2
PC20040918.4
20 pF S GND

Figure 3. Test Circuit for Automotive Transients

V RxD
High

Low

Hysteresis
PC20040829.7 0,5 0,9 V i(dif)(hys)

Figure 4. Hysteresis of the Receiver

+5 V
100 nF V CC

3
CANH
7
TxD
1
R LT
C LT
AMIS− V ref
5
30660 100 pF
60 W
RxD
4
6
CANL
8 2

20 pF S GND PC20040018.5

Figure 5. Test Circuit for Timing Characteristics

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 AMIS−30660

HIGH
TxD LOW

CANH

CANL

dominant
0,9V
Vi(dif) = 0,5V
VCANH − VCANL
recessive

RxD
0.7 x VCC
0,3 x VCC
t d(TxD−BUSon) t d(TxD−BUSoff)
t d(BUSon−RxD) t d(BUSoff−RxD)
t pd(rec−dom) t pd(dom−rec) PC20040829.6

Figure 6. Timing Diagram for AC Characteristics

+5 V
100 nF V CC

3
CANH 6.2 k W
7
TxD 10 nF
1
Active Probe
AMIS− CANL
6
Generator Spectrum Anayzer
30660 6.2 k W
RxD
4 30 W 30 W
5
V REF
8 2
20 pF S GND 47 nF

PC20040918.6
Figure 7. Basic Test Set−up for Electromagnetic Measurement

CANH

CANL

recessive
VCM = V CM−step
V CM−peak
0.5*(VCANH + VCANL)

V CM−peak PC20040829.7

Figure 8. Common−Mode Voltage Peaks (see Measurement Setup)

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 AMIS−30660

DEVICE ORDERING INFORMATION

Part Number Description Temperature Range Package Type Shipping†
AMIS30660CANH2G HS CAN Transc. (5 V) (Matte Sn) −40°C − 125°C SOIC−8 96 Tube / Tray
(Pb−Free)

AMIS30660CANH2RG HS CAN Transc. (5 V) (Matte Sn) −40°C − 125°C SOIC−8 3000 / Tape & Reel
(Pb−Free)

AMIS30660CANH6G HS CAN Transc. (5 V) (NiPdAu) −40°C − 125°C SOIC−8 96 Tube / Tray

(Pb−Free)

AMIS30660CANH6RG HS CAN Transc. (5 V) (NiPdAu) −40°C − 125°C SOIC−8 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.

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 AMIS−30660

PACKAGE DIMENSIONS

SOIC−8
CASE 751−07
ISSUE AK
NOTES:
1. DIMENSIONING AND TOLERANCING PER
−X− ANSI Y14.5M, 1982.
A 2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
8 5 PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
B S 0.25 (0.010) M Y M PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
1 IN EXCESS OF THE D DIMENSION AT
4 MAXIMUM MATERIAL CONDITION.
−Y− K 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
MILLIMETERS INCHES
G
DIM MIN MAX MIN MAX
A 4.80 5.00 0.189 0.197
C N X 45 _ B 3.80 4.00 0.150 0.157
SEATING C 1.35 1.75 0.053 0.069
PLANE D 0.33 0.51 0.013 0.020
−Z− G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
0.10 (0.004) J 0.19 0.25 0.007 0.010
H M J K 0.40 1.27 0.016 0.050
D
M 0_ 8_ 0 _ 8 _
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
0.25 (0.010) M Z Y S X S

SOLDERING FOOTPRINT*

1.52
0.060

7.0 4.0
0.275 0.155

0.6 1.270
0.024 0.050

SCALE 6:1 ǒinches

mm Ǔ

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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