Full Adder Finfet 2
Full Adder Finfet 2
Abstract: The great challenge in the nanometer regime is due to Short Channel Effects that cause an exponential
increase in the leakage current. With the advancement in technology, Conventional CMOS has Short Channel Effects.
In order to reduce the Short Channel Effects, FinFET is used. FinFETs are the new emerging transistors that can work
in the nanometer range to overcome these Short Channel Effects. The Low Power FinFET based Full Adder is
implemented by using CADENCE VIRTUOSO tools in 45nm technology with the supply voltage of 1V in CMOS and
15nm technology with the supply voltage of 0.7V in FinFET. The Simulation is done to compare power, delay and
power- delay product. The result shows that the PDP of GDI FinFET Full Adder is reduced to 67% compared to
FinFET Full Adder.
I. INTRODUCTION
The batteries driven and portable devices are of a great demand in many industrial applications which need the
implementation of low power and area efficient devices [1, 2]. Moore’s law was discovered by Gordon Moore in 1965.
He was the Co-founder of INTEL Corporation. He has set the pace for our modern digital revolution and utilized that
the computing world increases in power and decreases in cost. He has predicted that number of transistors in an
integrated circuit would quadruple for every two years. This prediction is known as Moore’s Law. Today, many of the
industrial applications are designed in nanometer range. The transistor size is restricted with the phenomena like Short
Channel Effects which include hot carrier effect and tunneling through oxide thickness.
In CPU, arithmetic logic unit (ALU) is a crucial part. The adder cell is an important unit of an ALU. Many digital
circuit adders are used to perform addition of numbers [3, 8]. In many computers, adders are used in other parts of the
processor to calculate addresses [6], table indices and similar operations. Due to the increase in the demand of portable
devices such as mobile phones, lap top, tablets [9, 10], and the need of area and power efficient VLSI circuits is arisen.
Low power adder cells are used in Low power applications. In this paper, an improved 1-bit full adder circuit is
implemented which consumes reduced power and very less number of transistors.
A 1-bit Full adder circuit consists of three inputs A, B, and Cin. The third input Cin is called carry input. The Full adder
is usually a component in cascade of adders which adds binary numbers. The Block diagram representation of full
adder is shown in the Fig.1. It consists of two outputs sum and carry output.
The Logic Diagram of 1-bit CMOS Full Adder can be constructed by using two EX-OR gates, two AND gates, and one
OR gate. The expressions for SUM and Carry output are
0 0 0 0 0
0 0 1 1 0
0 1 0 1 0
0 1 1 0 1
1 0 0 1 0
1 0 1 0 1
1 1 0 0 1
1 1 1 1 1
The Truth Table for 1-bit Full adder is shown in the Table 1.With the help of this truth table we can easily implement
Full Adder Logic.
II. FINFET
FinFET means Fin Field Effect Transistor. FinFET is a Non Planar Dual Gate Transistor used in the Silicon
Architecture which consists of very large computational density. FinFET was coined by Berkeley researchers of
university of California and it was developed for the use of Silicon-on-Insulator.
FinFET technology takes its name from the fact that the FET structure used looks like a set of fins when viewed. The
main characteristic of the FinFET is that it has a conducting channel wrapped by a thin silicon "fin" from which it gains
its name [3]. The thickness of the fin determines the effective channel length of the device.
The attractiveness of FinFET is 3D structure that rises above the planar substrate giving more volume than a planar gate
for same planar area. FinFET is used to conduct channel that rise above the insulator, thin silicon structure, shaped like
Fin called gate electrode. This gate electrode operates on a single transistor. In contrast to a Planar the source and Drain
channel is built by three dimensions on the top of the silicon substrate called as Fin. MOSFET FinField Effect
techniques are promising substitutes for bulk CMOS at nanoscale.
Single bit FinFET full adder using transistor level diagram is shown in Fig. 4. The main reason for FinFET is to
decrease the leakage power. Using two EX-OR gates, two AND gates and one OR gate FinFET single bit Full ADDER
is implemented.
The main advantage of FinFET full adder is Low cost, suppressed Short channel effects and Better in Driving current.
In digital circuits, Full adders are used extensively. The performance of 1-bit full adder is benchmarked against
conventional CMOS full adder. The FinFET based full adder shows a large reduction in delay and provided the device
with high speed performance which is better than the conventional CMOS Full Adder. The FinFET has better and
faster switching speed due to the presence of multiple gates in the FinFET structure and drives more current compared
to MOSFET structure. The main advantage of FinFET full adder is Low cost, suppressed Short channel effects and
Better in Driving current.
B. GDI Operation
GDI is nothing but Gate Diffusion Input Technique. This type of technique is suitable for lower delay and designing a
circuit with reduced power. This is because the technique helps to decrease the transistor count when compared with
CMOS and other obtainable low power methods.
It must be remarked that not all the functions are possible in standard p-well CMOS process, but can be successfully
implemented in twin well CMOS or Silicon-on-Insulator technologies.
N P G OUTPUT FUNCTION
0 1 A A’ INVERTER
0 B A A’B F1
B 1 A A’+B F2
1 B A A+B OR
B 0 A AB AND
C B A A’B+A’C MUX
B’ B A A’B+B’A XOR
B B’ A AB+A’B’ XNOR
Table 2 shows different functions of Gate Diffusion Input Technique with different combinations G, P and N [7]. With
the help of these special functions, table logic gates can be implemented with few transistors mostly in GDI when
compared with Complementary Metal oxide Semiconductor process.
GDI full adder contains three input pins A, B and Cin and two output pins sum and Cout. It is built from two XOR
gates and one MUX. GDI full adder is implemented based on some special functions given in the table. In GDI full
adder, power dissipation plays an important role in high performance applications. The full adder cell using transistors
is already explained. GDI has suffered from practical limitations like swing degradation. In the first stage of this cell,
the GDI technique is used for generating of XOR and XNOR functions. The full adder cell using transistors is already
explained. The GDI technique needs solely 8 transistors 4PMOS and 4NMOS.
GDI Full adder generates expressions for SUM and CARRY [7]. It was used based on the special functions table.
While using the Logic Function MUX as selective input, the carry logic is implemented.
When input N=C, P=B, G=A these are the inputs seen in the functions table. Instead of this replacing N=B, P=Cin, G=
A XNOR B.
Output=A’B+AC Mux function. So substituting the values we get carry function
(A XOR B) Cin + (A XNOR B) B
(AB’ + A’B) Cin + B (AB + A’B’)
(A XOR B) Cin + AB (This is the carry expression)
SUM=A XOR B XOR Cin
CARRY= (A XOR B) Cin + AB
Using the two expressions FinFET Full Adder is implemented by using Gate Diffusion Input Technique.
V. SIMULATION RESULTS
Table 4: Comparison Values for CMOS & GDI Full Adder [45nm Technology]
Table 3: Comparison Values for FinFET and GDI Finfet Full Adder [15nm Technology]
VIII. CONCLUSION
In this Project, Different Full Adder circuits are implemented by using CMOS, FinFET, GDI CMOS and GDI FinFET
and Simulated in CADENCE VIRTUOSO TOOLS using 45nm Technology with the supply voltage of 1V for CMOS
and GDI CMOS Full Adder and 15nm Technology with the supply voltage of 0.7 V for FinFET and GDI FinFET Full
adder.
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