Ultra-Low Pressure

Digital Sensor
SM9333/SM9336 Series
Differential Pressure Sensors
FEATURES
• Pressure ranges: 125 and 250 Pa Differential
• Accuracy after Autozero: < 1%FS
• 16 bit I2C Digital interface
• Pressure calibrated and temperature compensated output
• Compensated temperature range: -20 to 85oC

DESCRIPTION
The SM9333/SM9336 are digital, ultra-low pressure sensors offering Combining the pressure sensor with a signal-conditioning ASIC in a
state-of-the-art MEMS pressure transducer technology and CMOS single package simplifies the use of advanced silicon micro-machined
mixed signal processing technology to produce a digital, fully pressure sensors. The pressure sensor can be mounted directly on a
conditioned, multi-order pressure and temperature compensated standard printed circuit board and a high level, calibrated pressure
sensor in JEDEC standard SOIC-16 package with a dual vertical signal can be acquired from the digital interface. This eliminates the
porting option. It is available in a differential pressure configuration. need for additional circuitry, such as a compensation network or
microcontroller containing a custom correction algorithm.
The total accuracy after board mount and system level autozero is
less than 1%FS. The excellent warmup behavior and long term The SM9333/SM9336 are shipped in sticks or tape & reel.
stability further assures its expected performance over the life of the
part.

Medical Industrial
Sleep Apnea HVAC

CPAP Airflow Measurement

Ventilators Pressure Transmitters

Gas Flow Instrumentation Pneumatic Gauges

Air Flow Monitors Pressure Switches

Life Sciences Safety Cabinets

Gas Flow Instrumentation

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1. Absolute Maximum Ratings

All parameters are specified at Vdd = 3.3 V supply voltage at 25oC, unless otherwise noted.

No. Characteristic Symbol Minimum Maximum Units

1 Supply Voltage VDD 3.0 5.5 V

2 Digital IO Voltage VIO,DIG -0.3 VDD+0.3 V

3 Max. Digital IO Current (DC) IIO,DIG -10 +10 mA

4 Storage Temperature(a,b) TSTG -40 +125 °C

5 Proof Pressure (a, c) PProof 7 (1.0) kPa (PSI)
6 Burst Pressure (a, d) PBurst 20 (2.9) kPa (PSI)

Notes:
a. Tested on a sample basis.
b. Clean, dry air compatible with wetted materials. Wetted materials include silicon, glass, RTV (silicone), gold, aluminum, copper, nickel,
palladium, epoxy, stainless steel and plastic (mold compound).
c. Proof pressure is defined as the maximum pressure to which the device can be taken and still perform within specifications after
returning to the operating pressure range.
d. Burst pressure is the pressure at which the device suffers catastrophic failure resulting in pressure loss through the device.

2. ESD
No. Description Symbol Minimum Maximum Units
2.1 ESD HBM Protection at all Pins VESD(HBM) -2 2 kV

3. External Components

No. Description Symbol Min. Typ. Max. Units

1 Supply bypass capacitor* CVDD 100 nF

2 I2C Data and clock pull up resistors* RP 4.7 kOhm

* Not tested in production

4. Calibrated Pressure Ranges

Calibrated Pressure Ranges
No. Device Type PMIN (Pa) PMAX (Pa)
1 SM9333 – 125 Differential -125 +125

2 SM9336 – 250 Differential -250 +250

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5. Recommended Operating Conditions

The recommended operating conditions must not be exceeded in order to ensure proper functionality of the device. All parameters
specified in the following sections refer to these recommended operating conditions unless stated otherwise.

No. Description Symbol Min. Typ. Max. Units

1 Supply Voltage VVDD 3.0 3.3 3.6 V

2 Low level input voltage at SDA, SCL VIN,I2C,lo -0.3 0.9 V

3 High level input voltage at SDA, SCL VIN,I2C,hi 0.8 * VVDD VVDD+0.3 V

4 Compensated Temperature (b) TCOMP -20 +85 °C

5 Operating Temperature TA -20 85 °C

Notes:
b. Clean, dry air compatible with wetted materials.

6. OPERATING CHARACTERISTICS TABLE

All parameters are specified at Vdd = 3.3 V DC supply voltage at 25oC, unless otherwise noted.

No. Characteristic Symbol Minimum Typical Maximum Units

1 Supply Current (e) IVDD 3.3 3.8 mA
2 Digital Pressure Output @ PMIN OUTMIN -26,215 Counts
3 Digital Pressure Output @ PMAX OUTMAX +26,214 Counts
4 Digital Full Scale Span FS 52,429 Counts
5 Resolution (Digital Output) 16 Bits
6 Update Rate 2000 Hz
Digital AZ SM9333 – 125 Differential -1.25 0.2 1.25 %FS
7 Output ACCAZ
Accuracy (f, g, h) SM9336 – 250 Differential -1 0.1 1 %FS

Digital Output SM9333 – 125 Differential -2.75 ± 0.5 2.75 %FS

8 ACC
Accuracy (f) SM9336 – 250 Differential -1.5 ± 0.3 1.5 %FS
9 Bandwidth BW 20 Hz
10 Position Sensitivity SG 0.1 %FS/g
from supply VDD > 3.0 V
Power-up
11 to output settled to 90% tUP 5 ms
time*
of final value
pressure step response;
Step response
12 output rising from 10% to tRESP ms
time* 1
90% of final value
pressure step response;
Step response
13 output settling to full tSETTLE 10 ms
settling time*
accuracy
* Not tested in production
Notes:
e. Supply current given for continuous operation. Device can be set to sleep mode with significantly lower power consumption. Refer to
section 11 for details.
f. The accuracy specification applies over all operating conditions in dry clean air. This specification includes the combination of linearity,
repeatability, and hysteresis errors over pressure, temperature, and 3.3 V supply voltage.
g. Based on system level autozero at 25 oC after board mount or solder reflow.
h. Based on sample testing during initial product qualification, not tested in production.
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7 I2C Interface
No. Description Condition Symbol Min. Typ. Max. Units
1 SDA output low voltage* ISDA = 3 mA VSDA,OL 0 0.4 V

2 Low-to-High transition threshold* pins SA0, SCL VSDA,LH 0.5 0.6 0.7 VDD

3 High-to-Low transition threshold* pins SA0, SCL VSDA,HL 0.3 0.4 0.5 VDD

4 I2C clock frequency* fSCL 400 kHz

5 Bus free time between a START and STOP condition* tBUSF 1300 ns

6 Clock low time* tLO 1300 ns

7 Clock high time* tHI 600 ns

8 START condition hold time* tSH 100 ns

9 Data setup time* tSU 100 ns

10 Data hold time* tH 0 ns

11 Setup time for repeated START condition* tRSH 600 ns

12 Setup time for STOP condition* tPSU 600 ns

13 Rise time of SDA and SCL signals* tR 300 ns

14 Fall time of SDA and SCL signals* tF 300 ns

* Not tested in production

8. Qualification Standards
REACH Compliant
RoHS Compliant
PFOS/PFOA Compliant
For qualification specifications, please contact Sales at sales@si-micro.com

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9. Package Reference
SOIC-16 (C) Vertical Package Dimensions

Notes:
• All dimensions in units of [mm]
• Moisture Sensitivity Level (MSL): Level 3
• Clean, dry air compatible with wetted materials. Wetted materials include : Wetted materials include silicon, glass, RTV (silicone), gold,
aluminum, copper, epoxy and mold compound.
• Tolerance on all dimensions ±0.13 mm unless otherwise specified.
• [B] is tube connected to bottom side of sensor die.
• [T] is tube connected to top side of sensor die. Topside pressure is positive pressure. An increase in topside pressure will result in an
increase in sensor output
• Bottom plate is stainless steel
• Robust JEDEC SOIC-16 package for automated assembly
• Manufactured according to ISO9001 , ISO14001 and ISO/TS 16949 standards

Lot Number Identification

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SM9235/SM9333/SM9336 Applications Circuit

Package Labeling
Pin No. Pin Function
1 NC (No Connect)
2 NC
3 NC
4 NC
5 VSS
6 VDD
7 NC
8 NC
9 NC
10 SDA
11 SCL
12 NC
13 GND (ASIC Test Pin)
14 NC
15 NC
16 NC
NOTES:
• Do not connect to NC pins

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10. Ordering Information

Part Number Pressure Range b Voltage Shipping Comment

SM9333-BCE-S-125-000 Sticks (45 parts/stick)

-125 Pa to +125 Pa 3.3 V Bandwidth 20Hz a
Tape and Reel (350
SM9333-BCE-T-125-000 parts/reel)

SM9336-BCE-S-250-000 Sticks (45 parts/stick)

-250 Pa to +250 Pa 3.3 V Bandwidth 20Hz a
Tape and Reel (350
SM9336-BCE-T-250-000
parts/reel)
NOTES:
a. Contact SMI for bandwidths other than 20 Hz
b. Contact SMI for gauge parts

Package Pin-Out

11. Part Number Legend

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12. Typical Characteristics

*Zero pressure accuracy tested at 30 oC and 3.3V. Measured after HTOL (at
105 oC and 5.5V) at 168, 500 and 1000 hrs. Not tested in production

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13. Functional Description

13.1 Overview
The SM9x3x series is a high precision, factory calibrated differential pressure sensor for ultra low pressure measurements. It combines a
low pressure MEMS die with a 16 bit ASIC, utilizing DSP for multi dimensional polynomial error correction. The calibrated pressure output
data is available via digital data interface (I2C). Status information on the sensor integrity and unique serial number are accessible via this
digital interface.

13.2 Global Sensor Parameters

13.2.1 Digital Pressure Transfer Function

In general digital output data is available with a word length of 16 bit. The numeric representation is always as 2's complement, which
results in a range of:

0 ... +32767 counts (positive range, or 0000h ... 7FFFh)

-32768 ... -1 counts (negative range, or 8000h ... FFFFh)

The pressure sensor device is calibrated in the end-of-line production test over the specified Pmin to Pmax pressure range (see Section 4).
The output code at Pmin is nominally -26,215 and at Pmax it is nominally 26,214. This allows the sensor to still operate monotically outside
its nominal range till the maximum (or minimum) counts are reached. An example for a 250 differential SM9336-BCE-S-250-000 is given in
the graph below

Green: Accuracy per specification

Red and Blue: Outside specification, but expect monotonic behavior till maximum (or minimum) code is
reached

13.2.2 Conversion from counts to pressure

The digital output count gives a signed 16 bit value for pressure and to convert the count to a pressure percent reading, p%FS, (in % full
scale pressure) the following equation can be used

The equation below converts p%FS to actual calibrated pressure units pp-unit with pmin and pmax as specified in section 4

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13.2.4 Digital Temperature Transfer Function

An internal temperature sensor measures the chip temperature. The temperature characteristic is linear and is described by the following
equation:
DT = b1 * TA + b0

The temperature transfer function parameters are as follows:

Temperature Digital Output Sensitivity / Offset

Symbol Temperature [°C] Symbol Value [counts ] Symbol Value Unit
TA,1 -40 DT,OUT,1 -32768 b1 397.2 counts/°C
TA,2 125 DT,OUT,2 32767 b0 -16881 counts

The typical temperature accuracy at 30 °C is within ± 2 °C.

13.3 Voltage Supply

The device is supplied from pin VDD, typically 3.3 V, but it can operate as high as 5 V. From this supply input several internal voltage
regulators are generating stabilized voltage levels for analog and digital circuit sections. The different internal voltages are monitored by
power-OK diagnostic circuitry. Also a stabilized voltage for the resistive MEMS pressure sensor is derived from VDD.

The digital data interface allows to set it into Sleep Mode using a specific command (Enter Sleep Mode), which ensures very low
consumption (IVDD,SM) of typically less than 10 µA. Of course, in Sleep Mode no pressure data is acquired.

For the I2C command to send the sensor into Sleep Mode see 13.6. To wake-up the sensor to normal operation, the clock input SCL shall be
toggled (a rising edge at SCL will wake-up the device).

13.4 Diagnosis Functions

13.4.1 MEMS Sensor Bridge Diagnostics
Internal errors of the MEMS pressure sensor are detected and the STATUS registers can be read via the digital I2C interface.

Bridge Diagnostics
An integrated bridge diagnostic circuit supervises the resistive pressure sensor to detect any of the faults as follows:
• Sensor faults:
• Short of any of the four bridge resistors of the pressure sensor
• Interruption of any of the four of bridge resistors
• Wiring faults:
• Open connection of any of the bridge supply or signals
• Wrong connection of any sensor bridge terminal to either ground or bridge supply
The MEMS sensor bridge diagnostics are active permanently (true background diagnostics) and in case of an error the bridge check fail
event is indicated by setting the bit bc_fail in the internal STATUS register.

Bridge Supply Diagnostics

Another diagnostic function checks if the supply to the sensor bridge is in its specified range. Here, in case of a supply error the bit bs_fail
in the STATUS register will be set.

13.4.2 Configuration Memory Check

The integrity of data stored in the embedded NVM used as the configuration memory (calibration parameters, device configuration,
device ID, etc.) is checked at power-up of the component by calculation of a check sum (CRC). If a check sum error is detected no reliable
pressure calculation is possible.
Therefore, the sensor remains in idle state, i.e. no pressure data transferred to the output registers DSP_T and DSP_S. In this case the bits
STATUS.dsp_s_up and dsp_t_up will never be set.

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13.5 I2C Interface

The SM9x3x features an I2C slave interface. This interface provides direct access to registers of the memory of the SM9x3x sensor. An
external I2C master (e.g. a microcontroller) can read from and write to memory addresses (registers) of the device using the following
commands:

• Random write: Sets a memory address and writes data to consecutive memory addresses of the device starting at the set memory
address.
• Random read: Sets a memory address and reads data from consecutive memory addresses of the device starting at the set memory
address.
• Read last: Reads data from the device starting at the last memory address set by the master. This facilitates repeated reading of the
same memory addresses without transmitting a memory address first.

All reads/writes must start at word aligned addresses (i.e. LSB of memory address equals 0) and read/write an even number of bytes.

I2C Interface Timing Diagram:

13.5.1 I2C Command Format

The SM9x3x-Sensor uses a standard 7-bit I2C slave address field. The LSB of the slave address specifies the frame type used to perform read
and write operations.
For LSB = 0 the protocol is compatible to standard I2C EEPROMs, for LSB = 1 the protocol is extended by a CRC protection. Thus, each device
occupies two I2C addresses: even addresses are for standard EEPROM compatible protocols and odd addresses are for CRC protected
protocols. Unprotected and CRC protected frames can be interleaved.

The two different frame types - standard EEPROM (without CRC) or CRC protected - are shown in the next two figures.

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I2C Read / Write Commands - Standard EEPROM compatible protocol:

I2C Read / Write Commands - CRC protected protocol:

The memory address field sets the byte address of the first memory location to be read from or written to. Only 16-bit-word aligned
reads/writes are supported, i.e. the LSB of memory address has to be zero always. The read/write data is transferred MSB first, low byte
before high byte.
The length field (bits[7:4]) required for CRC protected frames specifies the number of data bytes to be transferred decremented by one,
i.e. a value of 0001b corresponds to two bytes. All frames must transfer an even number of bytes. The maximum length for CRC protected
read/write frames is 16/4 bytes. For unprotected frames the length is unlimited.

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The CRC4 and CRC8 for redundancy check are computed in the same bit and byte order as the transmission over the bus. The polynomials
employed are:

• CRC4: polynomial 0x03; initialization value: 0x0F

• CRC8: polynomial 0xD5; initialization value: 0xFF

If a CRC errors occurs, then the event bit com_crc_error in the STATUS register will be set.

13.5.2 I2C Command Examples

For all examples below the 7-bit device slave address used is 0x6C for unprotected commands, and 0x6D for CRC protected commands,
respectively.

The command sequence following describes an unprotected Read command (without CRC) of 3 subsequent 16-bit words starting at
memory address 0x2E to read the corrected IC temperature, corrected pressure signal, and (synchronized) status bits of the sensor.

Random Read:

Byte # 0 1 2 3 4 5 6 7 8
SBM
0xD8 0x2E 0xD9
(sent by master)
slave slave
address 6C memory address 6C
SBM comment
+ LSB = 0 address + LSB = 1
for Write for Read
SBS
0xF2 0x7D 0xEA 0x82 0x1E 0x00
(sent by sensor)
sync‘ed
DSP_T DSP_S sync‘ed
DSP_T DSP_S Status
SBS comment (Lo-Byte) (Lo-Byte) Status
(Hi-Byte) (Hi-Byte) (b7 - b0)
ad. 0x2E ad. 0x30 (b15 - b8)
ad. 0x32

The following sequence writes one 16-bit word to address 0x22. This will copy 0x6C32 into the command register CMD to move the
component to Sleep Mode.

Random Write:

Byte # 0 1 2 3
SBM
0xD8 0x22 0x32 0x6C
(sent by master)
slave address 6C
Lo-Byte written to Hi-Byte written to
SBM comment + LSB = 0 memory address
CMD[7:0] CMD[15:8]
for Write
SBS
(sent by sensor)

SBS comment

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The next command sequence describes a CRC protected Read command of 3 subsequent 16-bit words starting at memory address 0x2E.

Random Read - protected by CRC:

Byte # 0 1 2 3 4 5 6 7 8 9 10
SBM
(sent by 0xDA 0x2E 0x5B 0xDB
master)
slave slave
address 3: length address
memory
SBM comment 6D = 4Byte 6D
address
+ LSB = 0 B: CRC4 + LSB = 1
for Write for Read
SBS
0xF2 0x7D 0xEA 0x82 0x1E 0x00 0x65
(sent by sensor)
sync‘ed
DSP_T DSP_S sync‘ed
DSP_T DSP_S Status CRC8
SBS comment (Lo-Byte) (Lo-Byte) Status
(Hi-Byte) (Hi-Byte) (b7 - b0) (calc'd)
ad. 0x2E ad. 0x30 (b15 - b8)
ad. 0x32

The next example describes a Write of one 16-bit word (contents 0xCF9E) with CRC protection to address 0x36 to clear events in the
STATUS register.

Random Write - protected with CRC:

Byte # 0 1 2 3 4 5
SBM
0xDA 0x36 0x16 0x9E 0xCF 0xA1
(sent by master)
slave address 6D 1: length = 2Byte STATUS
STATUS CRC8
SBM comment + LSB = 0 memory address 6: CRC4 (Lo-Byte)
(Hi-Byte) (calculated)
for Write ad. 0x36
SBS
(sent by sensor)

SBS comment

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13.6 Register Descriptions

Register Read or Write are performed via the digital communication interface. After power-up of the IC all registers except STATUS and
CMD are write protected.

Command register:

0x22 CMD
bits name default rw description
Writing to this register controls the state of the SM9x3x device.

0x6C32: SLEEP Mode

Initiate the power state SLEEP, powering down the ASIC
15:0 cmd 0 w
0xB169: RESET
Performs a reset. After reset the power-up sequence will be executed, i.e. the registers
are loaded with data from the configuration memory, also a CRC check is performed.

Temperature register:

0x2E DSP_T
bits name default rw description
Corrected temperature measurement value of the sensor.
15:0 dsp_t r Whenever this register is updated with a new measurement the STATUS.dsp_t_up event
bit is set.

Pressure register:

0x30 DSP_S
bits name default rw description
corrected pressure measurement value of the sensor.
15:0 dsp_s r Whenever this register is updated with a new measurement the STATUS.dsp_s_up event
bit is set.

The registers DSP_T and DSP_S contain invalid data after power-up until the first temperature and pressure values have been measured by
the device and transferred to these registers. In case a NVM CRC error occurred, the DSP_T and DSP_S registers would never be updated.
Thus, after power up it is necessary to wait until the STATUS.dsp_s_up and dsp_t_up bits have been set at least once before using the
temperature or pressure data. It is not sufficient to wait just for a fixed time delay.

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Status register - synchronized:

0x32 STATUS_SYNC
bits name default rw type description
0 idle 0 rw status STATUS.idle
1 - reserved - 0 rw event reserved
2 - reserved - 0 rw event reserved
3 dsp_s_up 0 rw event when DSP_S is read STATUS.dsp_s_up is copied here
4 dsp_t_up 0 rw event when DSP_T is read STATUS.dsp_t_up is copied here
5 - reserved - 0 rw status reserved
6 - reserved - 0 rw status reserved
7 bs_fail 0 rw event STATUS.bs_fail
8 bc_fail 0 rw event STATUS.bc_fail
9 - reserved - 0 rw event reserved
10 dsp_sat 0 rw status STATUS.dsp_sat
11 com_crc_error 0 rw event STATUS.com_crc_error
12 - reserved - 0 rw status reserved
13 - reserved - 0 rw status reserved
14 dsp_s_missed 0 rw event STATUS.dsp_s_missed
15 dsp_t_missed 0 rw event STATUS.dsp_t_missed
The bits STATUS_SYNC[15:5,0] are identical to the bits STATUS[15:5,0].
The bits STATUS_SYNC[4:3] are copied from the STATUS register when the corresponding DSP registers are read. First reading the DSP
registers and then STATUS_SYNC ensures that both values are consistent to each other.
The synchronized status STATUS_SYNC register can be used to continuously poll the pressure, temperature and status of the device with
a single read command by reading three 16 bit words starting at address 0x2E. By evaluating STATUS_SYNC.dsp_t_up and
STATUS_SYNC.dsp_s_up it can be determined if the values in DSP_T and DSP_S acquired during the same read contain recently updated
temperature or pressure values.

Status register:

0x36 STATUS
bits name default rw type1 description
0: chip in busy state
0 idle 0 rw status
1: chip in idle state
1 - reserved - 0 rw event reserved
2 - reserved - 0 rw event reserved
1: DSP_S register has been updated.
3 dsp_s_up 0 rw event
Cleared when DSP_S is read
1: DSP_T register has been updated.
4 dsp_t_up 0 rw event
Cleared when DSP_T is read.
5 - reserved - 0 rw status reserved
6 - reserved - 0 rw status reserved
7 bs_fail 0 rw event 1: bridge supply failure occurred
8 bc_fail 0 rw event 1: sensor bridge check failure occurred
9 - reserved - 0 rw event reserved

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0x36 STATUS
bits name default rw type1 description
1: a DSP computation leading to the current DSP_T or DSP_S values
10 dsp_sat 0 rw status
was saturated to prevent overflow
11 com_crc_error 0 rw event 1: communication CRC error
12 - reserved - 0 rw status reserved
13 - reserved - 0 rw status reserved
14 dsp_s_missed 0 rw event 1: dsp_s_up was 1 when DSP_S updated
15 dsp_t_missed 0 rw event 1: dsp_t_up was 1 when DSP_T updated
1)
• "Event" type flags remain set until cleared by writing '1' to the respective bit position in STATUS register (not STATUS_SYNC). Writing
0xFFFF to the STATUS register will clear all event bits.
• "Status" type flag represents a condition of a hardware module of the IC and persists until the condition has disappeared.

Serial Number register 0:

0x50 SER0
bits name default rw description

15:0 ser0 r Serial number of the IC, Lo-Word

Serial Number register 1:

0x50 SER1
bits name default rw description

15:0 ser1 r Serial number of the IC, Hi-Word

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Silicon Microstructures Warranty and Disclaimer:

Silicon Microstructures, Inc. reserves the right to make changes without further notice to any products herein and to
amend the contents of this data sheet at any time and at its sole discretion.

Information in this document is provided solely to enable software and system implementers to use Silicon
Microstructures, Inc. products and/or services. No express or implied copyright licenses are granted hereunder to design
or fabricate any silicon-based microstructures based on the information in this document.

Silicon Microstructures, Inc. makes no warranty, representation, or guarantee regarding the suitability of its products for
any particular purpose, nor does Silicon Microstructures, Inc. assume any liability arising out of the application or use of
any product or silicon-based microstructure, and specifically disclaims any and all liability, including without limitation
consequential or incidental damages. “Typical” parameters which may be provided in Silicon Microstructure’s data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Silicon
Microstructures, Inc. does not convey any license under its patent rights nor the rights of others. Silicon Microstructures,
Inc. makes no representation that the circuits are free of patent infringement. Silicon Microstructures, Inc. products are
not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or
other applications intended to support or sustain life, or for any other application in which the failure of the Silicon
Microstructures, Inc. product could create a situation where personal injury or death may occur. Should Buyer purchase or
use Silicon Microstructures, Inc. products for any such unintended or unauthorized application, Buyer shall indemnify and
hold Silicon Microstructures, Inc. and its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Silicon
Microstructures, Inc. was negligent regarding the design or manufacture of the part.

Silicon Microstructures, Inc. warrants goods of its manufacture as being free of defective materials and faulty
workmanship. Silicon Microstructures, Inc. standard product warranty applies unless agreed to otherwise by Silicon
Microstructures, Inc. in writing; please refer to your order acknowledgement or contact Silicon Microstructures, Inc.
directly for specific warranty details. If warranted goods are returned to Silicon Microstructures, Inc. during the period of
coverage, Silicon Microstructures, Inc. will repair or replace, at its option, without charge those items it finds defective.
The foregoing is buyer’s sole remedy and is in lieu of all warranties, expressed or implied, including those of
merchantability and fitness for a particular purpose. In no event shall Silicon Microstructures, Inc. be liable for
consequential, special, or indirect damages.

While Silicon Microstructures, Inc. provides application assistance personally, through its literature and the Silicon
Microstructures, Inc. website, it is up to the customer to determine the suitability of the product for its specific
application. The information supplied by Silicon Microstructures, Inc. is believed to be accurate and reliable as of this
printing. However, Silicon Microstructures, Inc. assumes no responsibility for its use. Silicon Microstructures, Inc. assumes
no responsibility for any inaccuracies and/or errors in this publication and reserves the right to make changes without
further notice to any products or specifications herein

Silicon Microstructures, Inc.TM and the Silicon Microstructures, Inc. logo are trademarks of Silicon Microstructures, Inc. All
other service or product names are the property of their respective owners.

© Silicon Microstructures, Inc. 2001-2018. All rights reserved.

Silicon Microstructures, Inc. 2001-2018. All rights reserved +1-(408) 577-0100 | sales@si-micro.com I www.si-micro.com

DOC # 40DS9302.02 Page 18

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