NXP Semiconductors Document Number: MPX5100

Data Sheet: Technical Data Rev. 14, 12/2018

MPX5100, 0 to 100 kPa, Differential,

Gauge, and Absolute, Integrated, MPX5100
Pressure Sensors
The MPX5100 series piezoresistive transducer is a state-of-the-art monolithic Unibody packages
silicon pressure sensor designed for a wide range of applications, but particularly
those employing a microcontroller or microprocessor with A/D inputs. This
patented, single element transducer combines advanced micromachining
techniques, thin-film metallization, and bipolar processing to provide an accurate,
high-level, analog output signal that is proportional to the applied pressure.
Features
• 2.5% maximum error over 0 to 85 °C
• Ideally suited for microprocessor or microcontroller-based systems
• Patented silicon shear stress strain gauge
• Available in absolute, differential and gauge configuration MPX5100AP/GP MPX5100DP
98ASB42796B 98ASA42797B
• Durable epoxy unibody element
• Easy-to-use chip carrier option Small outline packages
Typical applications
• Patient monitoring
• Process control
• Pump/motor control
• Pressure switching
• White goods MPXV5100DP MPXV5100GP
98ASA99255D 98ASA99303D

MPXV5100GC6U MPXV5100GC7U
98ASB17757C 98ASB17759C

Ordering information
# of Ports Pressure type Device
Device name Shipping Package
None Single Dual Gauge Differential Absolute marking

Unibody Package (MPX5100 Series)

MPX5100AP Tray 98ASB42796B • • MPX5100AP
MPX5100DP Tray 98ASB42797B • • MPX5100DP
MPX5100GP Tray 98ASB42796B • • MPX5100GP
Small Outline Package (MPXV5100 Series)
MPXV5100DP Tray 98ASA99255D • • MPXV5100DP
MPXV5100GC6U Rail 98ASB17757C • • MPXV5100G
MPXV5100GC7U Rail 98ASB17759C • • MPXV5100G
MPXV5100GP Tray 98ASA99303D • • MPXV5100GP

NXP reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
© 2018 NXP Semiconductors, B.V.
Contents
1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 MPX5100AP/DP/GP Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 MPX5100AP/DP/GP Pinout (Unibody) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 MPXV5100DP/GC6U/GC7U/GP block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.4 MPXV5100DP/GC6U/GC7U/GP pinout (small outline package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.1 Pressure (P1)/Gauge (P2) side identification table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.2 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.3 Package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Related Documentation
The MPX5100 device features and operations are described in a variety of reference manuals, user guides, and application
notes. To find the most-current versions of these documents:
1. Go to the NXP homepage at:
http://www.nxp.com/
2. In the Keyword search box at the top of the page, enter the device number MPX5100.
3. In the Refine Your Result pane on the left, click on the Documentation link.
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1 General Description
1.1 MPX5100AP/DP/GP Block diagram
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a unibody package.

VS

Thin Film Gain Stage #2

Temperature and
Sensing Compensation Ground VOUT
Element and Reference
Gain Stage #1 Shift Circuitry

Pins 4, 5, and 6 are internal device connections.

GND Do not connect to external circuitry or ground.

Figure 1. Integrated pressure sensor block diagram

1.2 MPX5100AP/DP/GP Pinout (Unibody)

Figure 2. Device pinout (top view)

Table 1. Pin functions

Pin Name Function

1 VOUT Output voltage
2 GND Ground
3 VS Voltage supply
4 DNC Do not connect to external circuitry or ground.
5 DNC Do not connect to external circuitry or ground.
6 DNC Do not connect to external circuitry or ground.

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1.3 MPXV5100DP/GC6U/GC7U/GP block diagram
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a small outline package.

VS

Thin Film Gain Stage #2

Temperature and
Sensing Compensation Ground VOUT
Element and Reference
Gain Stage #1 Shift Circuitry

Pins 1, 5, 6, 7, and 8 are internal device connections.

GND Do not connect to external circuitry or ground.

Figure 3. Integrated pressure sensor block diagram

1.4 MPXV5100DP/GC6U/GC7U/GP pinout (small outline package)

DNC 5 4 VOUT
DNC 6 3 GND
DNC 7 2 VS
DNC 8 1 DNC

Figure 4. Device pinout (top view)

Table 2. Pin functions

Pin Name Function

1 DNC Do not connect to external circuitry or ground.
2 VS Voltage supply
3 GND Ground
4 VOUT Output voltage
5 DNC Do not connect to external circuitry or ground.
6 DNC Do not connect to external circuitry or ground.
7 DNC Do not connect to external circuitry or ground.
8 DNC Do not connect to external circuitry or ground.

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2 Mechanical and Electrical Specifications
2.1 Maximum ratings

Table 3. Maximum ratings(1)

Rating Symbol Value Unit
Maximum pressure Pmax 400 kPa
Storage temperature Tstg -40 to +125 °C
Operating temperature TA -40 to +125 °C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

2.2 Operating characteristics

Table 4. Operating characteristics (VS = 5 Vdc, TA = 25 °C.)

Characteristic Symbol Min Typ Max Unit
Pressure range(1) POP kPa
Gauge, differential: MPX5100G/MPXV5100G 0 — 100
Absolute: MPX5100AP 15 — 115
Supply voltage(2) VS 4.75 5.0 5.25 VDC
Supply current IO — 7.0 10 mAdc
(3)
Minimum pressure offset , (0 to 85 °C) VOFF 0.088 0.20 0.313 VDC
@ VS = 5.0 V
Full-scale output(4), differential and absolute (0 to 85 °C) VFSO 4.587 4.700 4.813 VDC
@ VS = 5.0 V
Full-scale Span(5), differential and absolute (0 to 85 °C) VFSS — 4.500 — VDC
@ VS = 5.0 V
Accuracy(6) — — — ±2.5 %VFSS
Sensitivity V/P — 45 — mV/kPa
Response time(7) tR — 1.0 — ms

Output source current at full-scale output IO+ — 0.1 — mAdc

Warm-up time(8) — — 20 — ms
Offset stability(9) — — ±0.5 — %VFSS
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
4. Full-scale output (VFSO) is defined as the output voltage at the maximum or full-rated pressure.
5. Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or
maximum rated pressure at 25 °C.
TcSpan: Output deviation over the temperature range of 0 to 85 °C, relative to 25 °C.
TcOffset: Output deviation with minimum pressure applied over the temperature range of 0 to 85 °C, relative to 25 °C.
Variation from nominal: The variation from nominal values, for offset or full-scale span, as a percent of VFSS at 25 °C.
7. Response time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
8. Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
9. Offset stability is the product’s output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test.

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3 On-chip Temperature Compensation and Calibration
Figure 5 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for
operation over a temperature range of 0 to 85 °C using the decoupling circuit shown in Figure 7. The output will saturate outside
of the specified pressure range.
Figure 6 illustrates both the Differential/Gauge and the Absolute Sensing Chip in the basic chip carrier. A fluorosilicone gel
isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPX5100 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use
of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media compatibility in your application.

5
VOUT = VS*(0.009*P+0.04)
± (Pressure Error * Temperature Factor * 0.009 * VS)
VS = 5.0 V ± 0.25 VDC
4 PE = 2.5
TM = 1

Span Range (Typ)

Output Voltage (V)

Output Range (Typ)

TEMP = 0 to 85 °C
3

MAX TYP
2

1 MIN

100
110
60
0

10

20

30

40

50

70

80

90
(Typ)
Pressure (kPa) Offset
Figure 5. Output versus pressure differential

Fluorosilicone Stainless Steel Fluorosilicone Stainless Steel

Gel Die Coat Die Metal Cover Gel Die Coat Die Metal Cover

Epoxy Epoxy
Wire Bond Plastic Wire Bond Plastic
Case Case

Lead Frame Die Lead Frame Die

Differential/Gauge Element Bond Absolute Element Bond

Figure 6. Cross-sectional diagrams (not-to-scale)

Figure 7 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the power supply is recommended.

+5.0 V

VOUT OUTPUT

VS

IPS
0.01 μF 1.0 μF 470 pF

GND

Figure 7. Recommended power supply decoupling and output filtering

(For additional output filtering, please refer to application note AN1646.)

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The following figures show the nominal transfer function, temperature and pressure error over the operating range for the
MPX5100D,MPX5100G and MPXV5100G devices.

Nominal Transfer Value: VOUT = VS (P x 0.009 + 0.04)

± (Pressure Error x Temp. Mult. x 0.009 x VS)
VS = 5.0 V ± 0.25 V

Figure 8. Transfer function (MPX5100D, MPX5100G, MPXV5100G)

Break Points
Temp Multiplier
4.0
- 40 3
0 to 85 °C 1
3.0 +125 °C 3

2.0

1.0

0.0
-40 -20 0 20 40 60 80 100 120 140
Temperature in °C
Note: The Temperature Multiplier is a linear response from 0 to -40 °C and from 85 to 125 °C.

Figure 9. Temperature error multiplier (MPX5100D, MPX5100G, MPXV5100G)

Error Limits for Pressure

3.0

2.0

1.0
Error (kPa)

0.0 Pressure in kPa

0 20 40 60 80 100 120
-1.0

-2.0

-3.0 Pressure Error (max)

0 to 100 kPa ± 2.5 kPa

Figure 10. Pressure error band (MPX5100D, MPX5100G, MPXV5100G)

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The following figures show the nominal transfer function, temperature and pressure error over the operating range for the
MPX5100AP device.

Nominal Transfer Value: VOUT = VS (P x 0.009 - 0.095)

± (Pressure Error x Temp. Mult. x 0.009 x VS)
VS = 5.0 V ± 0.25 V

Figure 11. Transfer function (MPX5100AP)

Break Points
Temp Multiplier
4.0
- 40 3
0 to 85 °C 1
3.0 +125 ° 3

2.0

1.0

0.0
-40 -20 0 20 40 60 80 100 120 130 140
Temperature in °C
Note: The Temperature Multiplier is a linear response from 0 to -40 °C and from 85 to 125 °C.

Figure 12. Temperature error multiplier (MPX5100AP)

Error Limits for Pressure

3.0

2.0

1.0
Error (kPa)

0.0 Pressure in kPa

0 20 40 60 80 100 130
-1.0

-2.0

-3.0 Pressure Error (max)

15 to 115 kPa ± 2.5 kPa

Figure 13. Pressure error band (MPX5100AP)

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4 Package Information
4.1 Pressure (P1)/Gauge (P2) side identification table
NXP designates the two sides of the pressure sensor as the Pressure (P1) side and the Gauge (P2) side. The Pressure (P1) side
is the side containing fluoro-silicone gel which protects the die from harsh media. The MPX pressure sensor is designed to
operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the table below.

Part number Package Pressure (P1) side identifier

MPX5100AP, MPX5100GP 98ASB42796B Side with port attached
MPX5100DP 98ASB42797B Side with part marking
MPXV5100DP 98ASA99255D Side with part marking
MPXV5100GC6U 98ASB17757C Side with port attached
MPXV5100GC7U 98ASB17759C Side with port attached
MPXV5100GP 98ASA99303D Side with port attached

4.2 Minimum recommended footprint for surface mounted applications

Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the
packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask
layer to avoid bridging and shorting between solder

Figure 14. Small outline package footprint

4.3 Package dimensions

This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASB17757C.pdf.

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 –A– D 8 PL NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
4 0.25 (0.010) M T B S A S Y14.5M, 1982.
5 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
N –B– 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
G
8 INCHES MILLIMETERS
1 DIM MIN MAX MIN MAX
A 0.415 0.425 10.54 10.79
B 0.415 0.425 10.54 10.79
S C 0.500 0.520 12.70 13.21
W D 0.038 0.042 0.96 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
J 0.009 0.011 0.23 0.28
V K 0.061 0.071 1.55 1.80
M 0_ 7_ 0_ 7_
N 0.444 0.448 11.28 11.38
C S 0.709 0.725 18.01 18.41
V 0.245 0.255 6.22 6.48
H W 0.115 0.125 2.92 3.17
J
–T–
PIN 1 IDENTIFIER SEATING
M PLANE
K

Case 98ASB17757C, 8-lead small outline package

MPX5100

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This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASB17759C.pdf.

FREESCALE

Case 98ASB17759C, 8-lead small outline package

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This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASB42796B.pdf.

Case 98ASB42796B, 6-lead unibody package

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 Case 98ASB42796B, 6-lead unibody package

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This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASB42797B.pdf.

Case 98ASB42797B, 6-lead unibody package

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This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASA99255D.pdf.

Case 98ASA99255D, 8-lead, dual port, small outline package

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 Case 98ASA99255D, 8-lead, dual port, small outline package

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This drawing is located at http://cache.NXP.com/files/shared/doc/package_info/98ASA99303D.pdf.

PAGE 1 OF 2
Case 98ASA99303D, 8-lead, side port, small outline package

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 Case 98ASA99303D, 8-lead, side port, small outline package

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5 Revision History
Table 5. Revision history

Revision Revision
Description of changes
number date
• Deleted obsolete part numbers MPX5100A and MPX5100D.
• Changed format to new corporate format.
• Added pinout for MPX5100AP/DP/GP in Figure 2.
• Added pin functions for MPX5100AP/DP/GP as Table 1.
14 12/2018 • Added pinout for MPXV5100DP/GC6U/GC7U/GP as Figure 4.
• Added pin functions for MPXV5100DP/GC6U/GC7U/GP as Table 2.
• Moved section 5.1, Package dimensions to Section 4.3.
• Deleted section 5, duplicate Package Information information section.
• Added revision history as Table 5.

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Document Number: MPX5100

Rev. 14
12/2018