Freescale Semiconductor Document Number: MPXHZ6130A

Data Sheet: Technical Data Rev. 1.2, 06/2015

MPXHZ6130A, 15 to 130 kPa,

Absolute, Integrated Pressure Sensor MPXHZ6130A
The MPXHZ6130A series sensor integrates on-chip, bipolar op amp circuitry and
thin film resistor networks to provide a high output signal and temperature
compensation. The sensor's packaging has been designed to provide resistance Super small outline packages
to high humidity conditions as well as common automotive media. The small form
factor and high reliability of on-chip integration make this pressure sensor a logical
choice for the system designer.
The MPXHZ6130A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output signal MPXHZ6130A6U MPXHZ6130AC6U
that is proportional to applied pressure. Case 98ARH99066A Case 98ARH99089A

Features
• 1.5% maximum error over 0 °C to 85 °C Top view
• Resistant to high humidity and common automotive media
• Improved accuracy at high temperature DNC 5 4 VOUT
• Ideally suited for microprocessor or microcontroller-based systems DNC 6 3 GND
• Temperature compensated from -40 °C to +125 °C DNC 7 2 VS
• Durable thermoplastic (PPS) surface mount package DNC 8 1 DNC
Typical applications
• Aviation altimeters
Pin 1 identification,
• Industrial controls chamfered corner
• Engine control/manifold absolute pressure (MAP) Pinout
• Weather stations and weather reporting devices

Ordering information
# of Ports Pressure type Device
Part number Shipping Package
None Single Dual Gauge Differential Absolute marking

Small Outline Package (MPXHZ6130A series)

MPXHZ6130A6U Rail 98ARH99066A • • MPXHZ6130A

MPXHZ6130AC6U Rail 98ARH99089A • • MPXHZ6130A

Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
© 2006-2010, 2012, 2015 Freescale Semiconductor, Inc. All rights reserved.
Contents
1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 Minimum recommended footprint for super small packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.2 Package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Related Documentation
The MPXHZ6130A device features and operations are described in a variety of reference manuals, user guides, and application
notes. To find the most-current versions of these documents:
1. Go to the Freescale homepage at:
http://www.freescale.com/
2. In the Keyword search box at the top of the page, enter the device number MPXHZ6130A.
3. In the Refine Your Result pane on the left, click on the Documentation link.
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1 General Description
1.1 Block diagram
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.

VS

Thin Film Gain Stage #2

Temperature and
Sensing Compensation Ground VOUT
Element and Reference
Gain Stage #1 Shift Circuitry

Pins 1, 5, 6, 7, and 8 are internal device connections.

GND
Do
. not connect to external circuitry or ground.

Figure 1. Fully integrated pressure sensor schematic

1.2 Pinout

DNC 5 4 VOUT
DNC 6 3 GND
DNC 7 2 VS
DNC 8 1 DNC

Pin 1 identification, chamfered corner

Figure 2. Device pinout (top view)

Table 1. Pin functions

Pin Name Function

1 DNC Do not connect to external circuitry or ground. Pin 1 is denoted by chamfered corner.
2 VS Voltage supply
3 GND Ground
4 VOUT Output voltage
5 DNC Do not connect to external circuitry or ground.
6 DNC Do not connect to external circuitry or ground.
7 DNC Do not connect to external circuitry or ground.
8 DNC Do not connect to external circuitry or ground.

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2 Mechanical and Electrical Specifications
2.1 Maximum ratings

Table 2. Maximum ratings(1)

Rating Symbol Value Units
Maximum pressure (P1 > P2) Pmax 400 kPa
Storage temperature Tstg -40 to +125 °C
Operating temperature TA -40 to +125 °C
(2)
Output source current @ full-scale output Io + 0.5 mAdc
(2)
Output sink current @ minimum pressure offset Io - -0.5 mAdc
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2.Maximum output current is controlled by effective impedance from VOUT to Gnd or VOUT to VS in the application circuit.

2.2 Operating characteristics

Table 3. Operating characteristics (VS = 5.0 Vdc, TA = 25 °C unless otherwise noted, P1 > P2).
Characteristic Symbol Min Typ Max Unit
Pressure range POP 15 — 130 kPa
Supply voltage(1) VS 4.75 5.0 5.25 Vdc
Supply current Io — 6.0 10 mAdc
(2) @
Minimum pressure offset VS = 5.0 Volts (0 °C to 85 °C) Voff 0.132 0.200 0.268 Vdc
(3)
Full-scale output @ VS = 5.0 Volts (0 °C to 85 °C) VFSO 4.632 4.700 4.768 Vdc
Full-scale span(4) @ VS = 5.0 Volts (0 °C to 85 °C) VFSS 4.365 4.500 4.635 Vdc
(5)
Accuracy @ VS = 5.0 Volts (0 °C to 85 °C) — — — ±1.5 %VFSS
Sensitivity V/P — 39.2 — mV/kPa
(6)
Response time tR — 1.0 — ms
Warm-up time(7) — — 20 — ms
Offset stability(8) — — ±0.25 — %VFSS
1.Device is ratiometric within this specified excitation range.
2.Offset (Voff) is defined as the output voltage at the minimum rated pressure.
3.Full-scale output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
4.Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the
minimum rated pressure.
5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at
25°C due to all sources of error including the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25 °C.
TcSpan: Output deviation over the temperature range of 0 °C to 85 °C, relative to 25 °C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25 °C.
6.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to at
specified step change in pressure.
7. Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
8.Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.

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3 On-chip Temperature Compensation and Calibration
Figure 5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for
operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range.
A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted
to the sensor diaphragm. The gel die coat and durable polymer package provide a media resistant barrier that allows the sensor
to operate reliably in high humidity conditions as well as environments containing common automotive media. Contact the factory
for more information regarding media compatibility in your specific application.

Fluorosilicone
Gel Die Coat Stainless
Die Steel Cap
P1
Wire Bond Thermoplastic
Case
Lead
Frame

Absolute Element Die Bond

Sealed Vacuum Reference

Figure 3. Cross-sectional diagram SSOP (not to scale)

+5 V

VS

MPXHZ6130A
VOUT to ADC
100 nF

GND 47 pF 51 K

Figure 4. Recommended power supply decoupling and output filtering

5.0
Transfer Function:
4.5
Vout = VS x (0.007826 x P (kPa) - 0.07739)
MAX
4.0 ±(PE x TM x V x 0.007826)
S
3.5 PE = ±1.725 kPa
Output (Volts)

3.0 TM = 1 @ 0 to 85 °C MIN
2.5 VS = 5.0 Vdc
2.0
TYP
1.5
1.0
0.5
0
60

100

110

120

130
140
10

20

30

40

50

70

80

90

Pressure (ref: to sealed vacuum) in kPa

Figure 5. Output vs. absolute pressure

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 Nominal Transfer Value: VOUT = VS x (0.007826 x P (kPa) - 0.07739)
± (Pressure Error x Temp. factor x 0.007826 x VS)
VS = 5.0 ± 0.25 Vdc

Figure 6. Transfer function

4.0
Break Points

Temperature Error Factor

Temp Multiplier
3.0
-40 3
0 to 85 1
2.0 125 1.75

1.0

0.0
-40 -20 0 20 40 60 80 100 120 140
Temperature in °C
NOTE: The temperature multiplier is a linear response from 0 °C to -40 °C and from 85 °C to 125 °C

Figure 7. Temperature error band

3.0 Error Limits for Pressure

2.0
Pressure Error (kPa)

1.0

0.0 Pressure (in kPa)

20 40 60 80 100 120
-1.0

-2.0 Pressure Error (Max)

15 to 130 (kPa) ±1.725 (kPa)
-3.0

Figure 8. Pressure error band

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4 Package Information
4.1 Minimum recommended footprint for super small packages
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry,
the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder
mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.

0.050 0.387
1.27 9.83
TYP

0.150
3.81

0.027 TYP 8X
0.69

0.053 TYP 8X inch

1.35 mm

Figure 9. SSOP footprint

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4.2 Package dimensions
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99066A.pdf.

Case 98ARH99066A, 8-lead super small outline package

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 Case 98ARH99066A, 8-lead super small outline package

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 Case 98ARH99066A, 8-lead super small outline package

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This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99089A.pdf.

Case 98ARH99089A, 8-lead ported super small outline package

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 Case 98ARH99089A, 8-lead ported super small outline package

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5 Revision History
Table 4. Revision history

Revision Revision
Description
number date
1.1 05/2012 • Updated package drawing 98ARH99066A was Rev. F, updated to Rev. H.
• Updated format.
1.2 06/2015
• Updated package drawing 98ARH99089A was Rev D, updated to Rev G.

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Document Number: MPXHZ6130A

Rev. 1.2
06/2015