MiniContac RS

User manual

Order Code: 10030565

 MiniContac RS

Manual 5.3, English

LPKF Laser & Electronics AG

Osteriede 7
D-30827 Garbsen
Germany
Phone + 49 - 51 31 - 70 95 - 0
Fax + 49 - 51 31 - 70 95 - 90
E-mail info@lpkf.com
Website http://www.lpkf.com
MiniContac RS

Copyright© 2014 LPKF AG The distribution or copying of this manual or parts thereof in any form, as well as
the use of its content, require the written permission of LPKF AG. Subject to
modifications.
Translation
Item number: 10030565
 Overview

Overview

Chap- Description
ter

1 Product description
This chapter contains all general information about the unit.

2 Safety Instructions
This chapter contains all relevant information for the safe use of the
unit.

3 Function description
This chapter contains all information about the unit's functions.

4 Transport and storage

This chapter contains all information on transport and storage of the
unit.

5 Installation and preparing operation

This chapter contains all instructions on proper installation and pre-
paring the unit for operation.

6 Operation
This chapter describes in detail the operation of the unit.

7 Troubleshooting
This chapter provides useful advice on eliminating minor faults of the
unit.

8 Service and repair

This chapter contains all servicing and maintenance measures.

9 Storage
This chapter describes the decommissioning of the unit.

10 Appendix
This chapter contains useful information about this manual and about
consumables.

Manual 5.3 Rev.: 7.05.2014 3

Symbols used

Symbols used

› This symbol warns of hazards to life or health.

WARNING

› This symbol warns of hazards of material damage.

CAUTION

Tip: This symbol is used for advice on how to prevent malfunctions or

how to improve process flow.

Formatting conventions
Bold text is used to emphasise important information.
Menu items are printed in BOLD CAPITALS.
ITALIC CAPITALS identify the names of the chemicals used.

4 MiniContac RS
 Contents

Contents

1 Product description 9

1.1 Brand and type identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

1.2 Scope of delivery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.3 Manufacturer/Distributors/Customer Service . . . . . . . . . . . . . . . . . . . . . . . . 10
1.4 Certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.4.1 Declaration of Conformity (German) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.4.2 Declaration of conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.5 Accessories and consumables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2 Safety Instructions 15

3 Function description 17

3.1 Function and scope of application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.1.1 Unit description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.1.2 Description of the individual tanks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.1.3 Fill level sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.1.4 Control panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.1.5 Menus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.1.6 Reverse Pulse Plating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.2 Safe and correct use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.3 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.4 Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.5 Energy consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.6 Emission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

4 Transport and storage 29

4.1 Transport. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.2 Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

5 Installation and preparing operation 31

5.1 Safety measures before installing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Manual 5.3 Rev.: 7.05.2014 5

Contents

5.2 Unpacking, disposal of packing materials . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Unpacking the unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.3 Setting up and putting into service . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.3.1 Assembling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Installing the unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Mounting the copper anodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Inserting the thermometer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Checking/Setting the mains voltage setting . . . . . . . . . . . . . . . . . . . . . . . . . 34
Connecting the mains cable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.3.2 Filling the tanks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Filling in chemicals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.3.3 Initialisation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Initialising the unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
5.4 Storage and conservation in the intervals of normal usage . . . . . . . . . . . . . 37
5.5 Intended operators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
5.6 Storage of the documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

6 Operation 39

6.1 Changing settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Changing profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Calculating the current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
6.2 Latching the circuit board holder. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Latching the circuit board holder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
6.3 The through-plating process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.3.1 Work prerequisites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.3.2 Work process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Fastening the circuit board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Phase 1: Degreasing the circuit board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Phase 2: Cleaning the circuit board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Phase 3: Activating the circuit board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Phase 4: Preparing the copper plating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Phase 4: Starting copper plating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Phase 4: Checking the circuit board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Phase 4: Resuming the copper plating . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Phase 4: Finishing the copper-plating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Rinsing and drying the circuit board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
6.4 Process sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
6.4.1 Standard circuit board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
6.4.2 Multi-layer circuit board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

6 MiniContac RS
 Contents

6.4.3 Flexible circuit board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

6.5 Waste Disposal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

7 Troubleshooting 53

7.1 Safety advice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

7.2 Error codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
7.3 Other fault indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
7.4 Simple troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
7.4.1 Cleaning the anode rails . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Removing deposits on the anode rails . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
7.4.2 Easing frame movement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Easing frame movement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
7.4.3 Replacing the fuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Replacing the fuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
7.5 Customer service . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

8 Service and repair 57

8.1 Routine inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

8.2 Service and repair by user. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
8.2.1 Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
8.2.2 Chemical Baths. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Filtering bath 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Adding SHINE 400 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Draining the tanks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

9 Storage 63

9.1 Decommissioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Decommissioning the unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Packing the unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
9.2 Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
9.3 Disposal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Disposing of the unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

10 Appendix 65

10.1 List of figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

Manual 5.3 Rev.: 7.05.2014 7

Contents

10.2 List of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

10.3 Through-plating log . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
10.4 Analysis results (German) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
10.4.1 Analysis result 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
10.4.2 Analysis result 1 (cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
10.4.3 Analysis result 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
10.4.4 Analysis result 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
10.4.5 Analysis result 3 (cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
10.4.6 Analysis result 3 (cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
10.4.7 Analysis result 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
10.4.8 Analysis result 4 (cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
10.4.9 Analysis result 4 (cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
10.4.10 Analysis report . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
10.5 Analysis results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
10.5.1 Analysis result 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
10.5.2 Analysis result 1 (cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
10.5.3 Analysis result 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
10.5.4 Analysis result 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
10.5.5 Analysis result 3 (cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
10.5.6 Analysis result 3 (cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
10.5.7 Analysis result 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
10.5.8 Analysis result 4 (cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
10.5.9 Analysis result 4 (cont.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
10.5.10 Analysis report . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
10.6 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

8 MiniContac RS
 Product description

1. Product description

1.1 Brand and type identification

Fig. 1: Type plate

MiniContac RS

The MiniContac RS unit has the item number 119987.

1.2 Scope of delivery

The MiniContac RS unit is shipped with the following items:

2 phosphated copper anodes with anode bags
2 circuit board holders (1 x with electric connector, 1
x w/o electric connector)
3 covers (1 for tanks 1&2, 1 for tank 3, and 1 for tank
4)
1 measuring cup
1 collecting tank
1 digital thermometer
1 spray bottle
1 wiper
1 roll of adhesive tape
1 tube clamp
1 this manual

For operating the unit you will need further accessories and consumables
that have to be ordered separately (see chapter 1.5‚ "Accessories and
consumables", on page 13).

Manual 5.3 Rev.: 7.05.2014 9

Manufacturer/Distributors/Customer Service

1.3 Manufacturer/Distributors/Customer Service

LPKF Laser & Electronics AG

Osteriede 7
D-30827 Garbsen
Germany

Phone + 49 - 51 31 - 70 95 - 0
Fax + 49 - 51 31 - 70 95 - 90
E-mail info@lpkf.com
Website http://www.lpkf.com

1.4 Certification

1.4.1 Declaration of Conformity (German)

EG-Konformitätserklärung nach Maschinenrichtlinie 98/37/EG,

Anhang II A
Der Hersteller / Inverkehrbringer
LPKF Laser & Electronics AG
Osteriede 7
30827 Garbsen
Germany

erklärt hiermit, dass folgendes Produkt

Produktbezeichnung: Anlage zur Durchkontaktie-
rung von Leiterplatten
Serien-/Typenbezeichnung: MiniContac RS

den Bestimmungen der (den) oben gekennzeichneten Richtlinie(n) - ein-

schließlich deren zum Zeitpunkt der Erklärung geltenden Änderungen -
entspricht.
Wir unterhalten ein von der BVQI zertifiziertes Qualitätssicherungs-
system nach ISO 9001 und haben daher bei der Entwicklung und Her-
stellung nachstehende EG Richtlinien und EN Normen beachtet.

10 MiniContac RS
 Product description

Folgende harmonisierte Normen wurden angewandt:

• EN 349:1993 Sicherheit von Maschinen - Mindestabstände zur Ver-
meidung des Quetschens von Körperteilen
• EN 292-1:1991Sicherheit von Maschinen - Grundbegriffe, allge-
meine Gestaltungsleitsätze - Teil 1: Grundsätzliche Terminologie,
Methodik
• EN 292-2:1991+A1:1995Sicherheit von Maschinen - Grundbegriffe,
allgemeine Gestaltungsleitsätze - Teil 2: Technische Leitsätze und
Spezifikationen
• EN 1050:1996 Sicherheit von Maschinen - Leitsätze zur Risikobeur-
teilung
• EN 626-1:1994Sicherheit von Maschinen - Reduzierung des
Gesundheitsrisikos durch Gefahrstoffe, die von Maschinen ausgehen
- Teil 1: Grundsätze und Festlegungen für Maschinenhersteller
• EN 60204-1:1997Sicherheit von Maschinen - Elektrische Ausrüstung
von Maschinen - Teil 1: Allgemeine Anforderungen
• EN 61000-3-2:2000Elektromagnetische Verträglichkeit (EMV) - Teil
3-2: Grenzwerte - Grenzwerte für Oberschwingungsströme (Geräte-
Eingangsstrom bis einschließlich 16 A je Leiter)
• EN 61000-6-2:2001Elektromagnetische Verträglichkeit (EMV) - Teil
6-2 - Fachgrundnormen - Störfestigkeit - Industriebereich
• EN 61000-6-3:2001Elektromagnetische Verträglichkeit (EMV - Teil 6-
3: Fachgrundnormen - Fachgrundnorm Störaussendung - Wohnbe-
reich, Geschäfts-und Gewerbebereiche sowie Kleinbetriebe

Folgende nationale oder internationale Normen (oder Teile/Klauseln dar-

aus) und Spezifikationen wurden angewandt:
• EN55022 Klasse BFunkstörspannung, Funkstörstrahlung
• EN61000-4-3 Störfestigkeit
• EN61000-4-2 Störfestigkeit
• EN61000-4-6 Wechselstrom Netzein- und ausgänge
• EN61000-4-4 Wechselstrom Netzein- und ausgänge
• EN61000-4-5 Wechselstrom Netzein- und ausgänge
• EN61000-4-11Wechselstrom Netzein- und ausgänge

Folgende weitere EU-Richtlinien wurden angewandt:

• EMV-Richtlinie 89/336/EWG
• Niederspannungsrichtlinie 73/23/EWG

Ort: Garbsen
Datum: 25.08.2006

______________________________________
Bernd Lange (Vorstand)

Manual 5.3 Rev.: 7.05.2014 11

Certification

1.4.2 Declaration of conformity

EC declaration of conformity according to Machine Directive 98/37/EC,

Annex II A
The manufacturer / seller
LPKF Laser & Electronics AG
Osteriede 7
D-30827 Garbsen
Germany

hereby declares that the following product

Product designation: System for through-plating
of circuit boards
Series/type designation: MiniContac RS

conforms to provisions of the directive(s) identified above - including the

modifications effective at the time of this declaration.
We maintain a quality assurance system compliant with ISO 9001 that
has been certified by BVQI, which ensures that development and manu-
facturing are compliant with the following EC directives and EN stand-
ards.
The following harmonised standards were applied:
• EN 349:1993 Safety of machinery - Minimum gaps to avoid crushing
of parts of the human body
• EN 292-1:1991Safety of machinery - Basic concepts, general princi-
ples for design - Part 1: Basic terminology, methodology
• EN 292-2:1991+A1:1995Safety of machinery - Basic concepts, gen-
eral principles for design - Part 2: Technical principles and specifica-
tions
• EN 1050:1996Safety of machinery - Principles for risk assessment
• EN 626-1:1994Safety of machinery - Reduction of risks to health
from hazardous substances emitted from machinery - Part 1: Princi-
ples and specifications for machinery manufacturers
• EN 60204-1:1997Safety of machinery - Electrical equipment of
machines - Part 1: General Requirements
• EN 61000-3-2:2000Electromagnetic compatibility (EMC) - Part 3-2:
Limits - Limits for harmonic current emissions (equipment input cur-
rents up to and including 16 A per phase)
• EN 61000-6-2:2001Electromagnetic compatibility (EMC) - Part 6-2 -
Generic standards - Immunity for industrial environments
• EN 61000-6-3:2001Electromagnetic compatibility (EMC) - Part 6-3 -
Generic standards - Emission standard for residential, commercial
and light-industrial environments

The following national and international standards (or parts/clauses

thereof) and specifications were observed:

12 MiniContac RS
 Product description

• EN55022 Class BRadio interference voltage, radio interference

emission
• EN61000-4-3Interference immunity
• EN61000-4-2Interference immunity
• EN61000-4-6AC mains voltage inputs and outputs
• EN61000-4-4AC mains voltage inputs and outputs
• EN61000-4-5AC mains voltage inputs and outputs
• EN61000-4-11AC mains voltage inputs and outputs

The following additional EC directives were applied:

• EMC directive 89/336/EEC
• Low-voltage directive 73/23/EEC

Location: Garbsen (Germany)

Date: 2006-08-25

______________________________________
Bernd Lange (Chairman)

1.5 Accessories and consumables

Danger of poisoning! Danger of chemical burns!

The chemicals used are poisonous and corrosive.
› Always wear protective gloves and goggles when handling the
WARNING chemicals.
› Do not remove warning labels from the canisters of the chemi-
cals or apply warning labels if not present and store the empty
canisters for uncontaminated disposal of used chemicals.

The following chemicals that are not included but can be ordered from
LPKF are required for through-plating using the MiniContac RS unit:

6.00 l CLEANER 110

5.00 l CLEANER 210
4.00 l AKTIVATOR 310
16.00 l COPPER PLATER 400
0.25 l SHINE 400

Manual 5.3 Rev.: 7.05.2014 13

Accessories and consumables

You also need:

distilled/de-ionised water
4 Containers/canisters for disposal of spent chemicals
1 Basin/sink for rinsing the circuit boards
1 window wiper with soft blade

14 MiniContac RS
 Safety Instructions

2. Safety Instructions

› Never put your hands into the machine while it is in operation!

› Avoid any contact with the fluids used! In case of skin contact
rinse immediately with plenty of water, in case of eye contact
rinse immediately with plenty of water and consult an ophthal-
mologist!

› Do not prepare or consume food while operating the unit!

› Wash your hands after operating the unit!

› Wear suitable protective clothing while operating the unit

(protective goggles and protective gloves)!

› Do not drink the fluids.

› Do not spill any of the fluids!

› Any user modifications of the unit jeopardise the unit's safe

operation and result in the loss of warranty!

› Note that some materials may produce hazardous fumes or

gases during processing. Contact your supplier about such
hazards.

› Ventilate manually every 10 minutes when using the unit in

rooms without ventilation system.

› Observe the notes and instructions on the canisters and/or

the separate safety data sheets of the chemicals!

› Use the chemicals only for their specified purpose!

› Keep your workspace clean!

› The unit may only be used in a clean and undamaged state.

Inspect the safety devices regularly!

› Always keep a legible and complete copy of this manual at the

unit's work station.

› Only sufficiently qualified and authorised persons may oper-

ate the unit.

(Page 1 of 2)

Manual 5.3 Rev.: 7.05.2014 15

Safety Instructions

› Operators must have read this manual and know the safety
instructions.

› Take special care to rinse the circuit boards thoroughly. No

chemicals of one tank may reach the next tank. The circuit
board holders also have to be rinsed thoroughly after use.

› Do not clean the circuit boards with steel wool or similar

materials. Even the smallest metal particles can utterly spoil
the chemicals.

› Always keep the tanks covered and as clean as possible. This

will ensure a long service life of the chemicals.

› Ensure that the holes are flawless. Use the proper drilling
parameters.

(Page 2 of 2)

16 MiniContac RS
 Function description

3. Function description

3.1 Function and scope of application

The MiniContac RS unit is made for galvanic through-plating of circuit

boards using the black hole process and for galvanic reinforcement of
copper surfaces. Via holes of a minimum diameter of 0.2 mm can be
plated.
The unit can be used for double-sided and multi-layer circuit boards.

Tip: The surfaces of the copper deposited in the through-plating proc-

ess are smoother and more homogenic when using circuit boards with
a protective copper film compared to using circuit boards without such
protective film. Thus, always use circuit boards with protective copper
film if possible.

3.1.1 Unit description

The unit consists of a durable plastic and metal case containing the tanks
for the chemical baths, the motion mechanism, the circuit board holders,
and the control panel with status display.
The control panel is located on the right of the unit top and the main
switch is located on the right side panel of the unit.
Note: The MiniContac RS unit does not provide tanks for rinsing or drying. The
processed circuit boards have to be rinsed in an external basin or sink.

Manual 5.3 Rev.: 7.05.2014 17

Function and scope of application

Fig. 2: MiniContac RS

14 13 12 11

10

9
1

3
8

5 6 7

1 Tank 1 8 Heat sink

2 Tank 2 9 Cathode socket
3 Tank 3 10 Control panel
4 Tank 4 11 Circuit board holder with electrical connection (cath-
5 Collecting tank ode)
6 Service interfaces 12 Heating element
7 Mains switch 13 Circuit board holder w/o electrical connection
14 Digital thermometer

18 MiniContac RS
 Function description

Fig. 3: Rear view of

MiniContac RS
with drainage tubes

1 2 3 4 5 6

1 Tube clamp 4 Drainage tube for tank 3

2 Clamp rail 5 Drainage tube for tank 2
3 Drainage tube for tank 4 6 Drainage tube for tank 1

There is a drainage tube for each tank at the rear of the unit. Leaking flu-
ids are collected in the collecting tank of the MiniContac RS unit. If you
frequently find fluids in the collecting tank contact the LPKF service.

Manual 5.3 Rev.: 7.05.2014 19

Function and scope of application

3.1.2 Description of the individual tanks

Fig. 4: Tank configuration

1 2 3 4
1 CLEANER 110 3 AKTIVATOR 310
2 CLEANER 210 4 COPPER PLATER 400

Table 1:Tank specifications

Tank 1 Tank 2 Tank 3 Tank 4

Function Degreasing Cleaning Activation Copper-plating

Chemical CLEANER 110 CLEANER 210 AKTIVATOR 310 COPPER PLATER

400

Dimensions w x l x d 45 x 363 x 328 45 x 363 x 328 45 x 363 x 246 152 x 363 x 328 mm
mm mm mm

Chemical volume 5l 5l 3.8 l 14.3 l

Heating yes, 55 °C no (room temperature 18 - 25 °C)

Cover combined single single

The amount of chemicals supplied in canisters is larger than the tank vol-
ume, so ensure that the marked fill level of the tanks is not exceeded
when filling. The tanks must not be filled higher than the triangular marks
or approx. 5 mm below the copper rails in case of tank 4(see
chapter 5.3.2‚ "Filling the tanks", on page 35).

Tip: The MiniContac RS unit does not provide tanks for rinsing and
drying. The processed circuit boards have to be rinsed in a separate
basin or sink.

20 MiniContac RS
 Function description

3.1.3 Fill level sensor

A fill level sensor is located at the rear left side wall of the first tank to
monitor the fill level. If the sensor is not covered by fluid when the unit is
switched on an error message is displayed (see chapter 7.2‚ "Error
codes", on page 53) and the heating will remain switched off. If the sen-
sor is covered by fluid when the unit is switched on the heating element is
activated and starts heating the chemical bath. The temperature is pre-
set.

Fig. 5: Fill level sensor

1 Fill level sensor 2 Digital thermometer

3.1.4 Control panel

The keys of the control panel have the following functions:

Fig. 6: Control panel keys

UP select menu item or value above ENTER confirm menu selection or value
ESC leave menu item and return to higher DOWN select menu item or value below
menu level

Manual 5.3 Rev.: 7.05.2014 21

Function and scope of application

The display screen has 4 rows of 20 character elements each. The fol-
lowing figure shows the screen sections and an example screen.

Fig. 7: Display Sections Example

j k
l
m n o
p q
1 current menu 5 following menu item or explanation
2 active profile 6 "ENT“ or remaining time
3 current menu item or value 7 message segment 1
4 "ESC“ or set phase time 8 message segment 2

Note: The factory default language setting of unit is English, the chapter "The
Setup menu" on page 24 describes the setting of the language.

The keys function as follows:

• Use the p and q keys to select a menu item or a value.
• Press the t key to leave the current menu (ESC).
• Press the u key (ENT) to activate the selected menu.
• For confirming changed values move the cursor to the right by press-
ing the u key several times and press the u key one more time to
confirm the changed value.
The following pages provide details on the individual menus.

3.1.5 Menus

The following menus can be selected:

Table 2:Menu levels

Level 1 Level 2 Level 3 Level 4

Profiles Selection Profile 1 - 9
Change Profile 1 - 6, 8 + 9 T bath 1
T bath 2
T bath 3
T bath 4
Current
RPP
Phases Phase 1 - 4 Start
Pause
Change
End

22 MiniContac RS
 Function description

Level 1 Level 2 Level 3 Level 4

Setup Save
Signal Yes
No
Fact. set
Message Yes
No
Language German
English
Interface RS 232
Ethernet
Version
Chemie Max. Ah
Cur. Ah
Refilled Yes
No
Service For LPKF service personnel only! Password required!

The Profiles menu

Profiles 1 to 7 have been pre-edited by LPKF for use with 9 x 12 “ circuit

boards. Profiles 8 and 9 can be defined by the user.

Table 3:Profile data

Pro- Application Via hole Bath Cur- RPP

file diameter Time in minutes rent
(values for 9 x 12“ cir- in A
cuit boards)
1 2 3 4

1 standard > 0.4 mm 65 5 15 90 12 off

2 standard with RPP ≤ 0.4 mm 65 5 15 90 12 on

3 multi-layer > 0.4 mm 80 10 25 120 12 off

4 multi-layer with RPP ≤ 0.4 mm 80 10 25 120 12 on

5 flexible circuit board > 0.4 mm 80 5 15 60 10 off

6 flex. circuit board with ≤ 0.4 mm 80 10 25 60 10 on

RPP

7 Initialisation see "Initialisation" on page 36

8 User-defined

9 User-defined

The data in above table can be changed individually via menu item
CHANGE (see chapter 6.1‚ "Changing settings", on page 39).

Manual 5.3 Rev.: 7.05.2014 23

Function and scope of application

Menu item SELECTION allows you to select one of profiles 1 to 9. If the

selection is saved the selected profile will be still active when the unit is
switched on the next time.

The Phases menu

The circuit board has to be processed in the sequence of PHASE 1

through PHASE 4 (degreasing, cleaning, activation, and copper-plating).
The phases have to be selected and started individually in the menu.

Input Comment
S TA R T The phase is started or continued and the time countdown
is running.
PAUSE The phase is interrupted, the time counter is on hold, and
settings can be checked or changed.
CHANGE Current values of the phase (processing time in phases 1-
4, in phase 4 also electric current and RPP) can be
changed (see chapter 6.1‚ "Changing settings", on page
39).
END Phase is finished, leave the current phase by subsequently
pressing the t key.

The Setup menu

The Setup menu has the following functions:

Table 4:Setup functions

Function Input Comment

Save Saving settings in the EEPROM

Signal Yes / No Beeper on / off

Fact. set set factory defaults

Message Yes / No Message service on / off

Language German/ Language selection

English

Interface RS 232/ Interface selection (LPKF service personnel

Ethernet only)

Version Display firmware version

Max. Ah number of Setting of the amount of electric energy

(Chemie) ampere- used (measured in ampere-hours) before
the prompt to add chemical should be dis-
hours
played

24 MiniContac RS
 Function description

Function Input Comment

Cur. Ah Display of ampere-hours used since last

(Chemie) adding of chemical

Ergänzt Yes / No Confirmation whether chemical was added;

(Chemie) entering "Yes" resets the counter to "0"

Changing the settings is described in chapter 6.1‚ "Changing settings",

on page 39.

The Service menu

The SERVICE menu is used exclusively by LPKF service personnel.

3.1.6 Reverse Pulse Plating

The “Reverse Pulse Plating“ mode is activated in profiles 2, 4, and 6 pre-

edited by LPKF (see table 3 on page 23 ). Reverse Pulse Plating is
implemented in the special LPKF control circuit that monitors the the
whole through-plating process.
Conventional electroplating results in increased deposition of material on
the rims of the via holes due to the distribution of flux lines. This so-called
"dog-bone effect" of edge buildup during metal deposition occurs espe-
cially at a large depth-to-diameter ratio of the via holes (see 1 in the fig-
ure).

Fig. 8: Dog-bone effect

1 2

1 with dog-bone effect 2 without dog-bone effect

Reverse pulse plating uses short inverted pulses during which the circuit
board acts as an anode. This causes parts of the bulging material to be
removed so that the overall copper deposition is more uniform (see 2 in
the figure).

Manual 5.3 Rev.: 7.05.2014 25

Safe and correct use

3.2 Safe and correct use

The unit must be used only as described in this manual. Any other appli-
cation is not permitted or needs prior approval of LPKF AG.

3.3 Specifications

Dimensions:

Width: 750 mm
Length: 500 mm
Height: 525 mm
Weight: approx. 47 kg (tanks empty)

Power requirements:
Voltage: 230 V + 15/ -30 % at 50 - 60 Hz
115 V + 15/ -30 % at 50 - 60 Hz
Input power: 400 VA

Ambient temperature: 18 - 25 °C (64 - 77 °F)

max size of base material: 230 x 330 mm

max size of circuit board approx. 200 x 260
mm

Note: For changing the input voltage the fuse module next to the mains
switch has to be inserted in the corresponding orientation (see "Check-
ing/Setting the mains voltage setting" on page 34).

Note: To ensure proper function of the chemical baths the ambient tem-
perature range must be strictly adhered to.

26 MiniContac RS
 Function description

3.4 Power supply

The power supply connector is located on the right side panel next to the
mains switch.
Fig. 9: Power connector
and mains switch
4
3

1 Mains switch 3 Voltage module (with mains fuses)

2 Mains cable connector 4 Mark

3.5 Energy consumption

In constant use, the unit consumes approximately 0.3 kWh per hour.

3.6 Emission

The unit itself does not produce emissions. In the case of the chemicals
used refer to the safety data sheets of the chemicals.

Manual 5.3 Rev.: 7.05.2014 27

Emission

28 MiniContac RS
 Transport and storage

4. Transport and storage

4.1 Transport

Lifting hazard — heavy object.

The unit weighs approx. 47 kg. Single person lifting could cause
muscle strain or back injury.
WARNING › Always have two persons of adequate physical strength lift,
move, or install the unit.

Risk of breakage!
Unit can be damaged when transported.
› Transport the unit only proper packaging.
CAUTION › Transport utilities must be designed for loads greater than
70 kg.

4.2 Storage

Store the unit in a frost-free and dry place.

Manual 5.3 Rev.: 7.05.2014 29

Storage

30 MiniContac RS
 Installation and preparing operation

5. Installation and preparing operation

5.1 Safety measures before installing

Mains power (230/115 V) must be supplied via a Residual Current Device

(RCD, aka GFI, Ground Fault Interrupter).
A sufficiently large, horizontal, and firm workspace must be provided for
the MiniContac RS unit.

5.2 Unpacking, disposal of packing materials

Note: Unpack the unit carefully and store the packing material. This facilitates
safe packing and shipping of the unit if the unit has to be serviced.

Unpacking the unit

Lifting hazard — heavy object.

The unit weighs approx. 47 kg. Single person lifting could cause
muscle strain or back injury.
WARNING › Always have two persons of adequate physical strength lift,
move, or install the unit.

1. Lift off the the lid of the transport box.

2. Remove the enclosed smaller components from the box.
3. Remove the collecting tank from the box.
4. With the aid of at least one more person, lift the unit out of the box.
5. Store the packing material for later transport of the unit.
[ ] The unit is unpacked and can now be set up.

5.3 Setting up and putting into service

Risk of damage!
The foam packaging of the heating element can melt and contam-
inate the unit.
CAUTION › The foam packaging of the heating element must be removed
before putting the MiniContac RS unit into service!

Manual 5.3 Rev.: 7.05.2014 31

Setting up and putting into service

Tip: The unit and the chemical baths must be initialised, which takes
approx. 300 minutes, before producing the first through-plated circuit
board. Please bear this lead time in mind when putting the unit into
service.

5.3.1 Assembling

Installing the unit

Lifting hazard — heavy object.

The unit weighs approx. 47 kg. Single person lifting could cause
muscle strain or back injury.
WARNING › Always have two persons of adequate physical strength lift,
move, or install the unit.

1. Transfer the unit and its accessories to a firm, horizontal and suffi-
ciently large workspace.
2. Place the collecting tank on the workspace surface.
Note: When setting up the unit bear in mind that you need additional ba-
sins or a sink (not included) for rinsing the circuit boards.

3. With the aid of at least one more person set the unit into the collect-
ing tank.
[ ] The unit is set up and you can now mount the copper anodes.

32 MiniContac RS
 Installation and preparing operation

Mounting the copper anodes

The phosphated copper anodes supplied with the unit have to be

installed in tank 4. Proceed as follows:

Fig. 10: Copper anodes

2 2
1

2
2

1 Anode bolts (see arrows) 2 Anode rails (see arrows)

1. Unscrew the lower anode bolts (1) from the anode rails (2) in tank
4.
Note: Do not unscrew the anode rails!

2. Put some padding (e.g. the foam packaging of the heating element)
on the bottom of tank 4 for protection.
3. Remove the copper anodes from their packing material.
4. Set the first copper anode in its cloth bag on the padding in tank 4
and screw it to the anode rail using the anode bolts.
5. Repeat this step with the second copper anode.
6. Remove the padding from tank 4 and ensure that no residues
remain in the clean tank.

Manual 5.3 Rev.: 7.05.2014 33

Setting up and putting into service

7. Tie a knot of the laces of the anode bags directly above the copper
anodes and place the lace ends into the anode bags.
[ ] The copper anodes are mounted you can now insert the thermometer.

Inserting the thermometer

Fig. 11: Thermometer posi-

tion

1 Thermometer position

1. Remove the thermometer from its packaging.

Fig. 12: Inserting the ther-

mometer

2. Insert the thermometer in its intended opening in front of tank 1.

[ ] The thermometer is mounted.

Checking/Setting the mains voltage setting

The voltage setting can be switched between 110-120 V and 220-240 V.

The current setting is identified by the white triangle behind the current
voltage setting pointing to the rectangular mark (4) on the rim (see fig-
ure below). In order to switch the voltage proceed as follows:
1. Insert a flat screwdriver into the notch on the underside of the mod-
ule and carefully extract the module (3).
2. Rotate the module by 180°.

34 MiniContac RS
 Installation and preparing operation

3. Re-insert the module in such a way that the other white triangle
points to the white mark on the rim.

Fig. 13: Power connector

and mains switch 4
3

1 Mains switch 3 Voltage module (with mains fuses)

2 Mains cable connector 4 Mark

Connecting the mains cable

1. Plug the mains cable into the connector (2).

[ ] The electric connection is made and you can now fill in the chemicals.

5.3.2 Filling the tanks

Filling in chemicals

Danger of chemical burns!

Contact with the chemicals causes chemical burns.
› Wear suitable protective clothing while operating the unit (pro-
WARNING tective goggles and protective gloves)!

The tanks have been cleaned and rinsed before shipping so the
through-plating chemicals can be filled in without further preparation.
1. Fill CLEANER 110 into tank 1 up to the triangular mark.

Tip: Always ensure that tank 1 is properly filled with CLEANER 110.
Replace evaporation losses with distilled or de-ionised water only if
need be.

2. Fill CLEANER 210 into tank 2 up to the triangular mark.

Manual 5.3 Rev.: 7.05.2014 35

Setting up and putting into service

3. Fill COPPER PLATER 400 into tank 4 up to approx. 5 mm below

the copper rails.
4. Use the supplied measuring cup for measuring exactly 2 ml of
SHINE 400 per litre of COPPER PLATER 400 filled, but only 28 ml
maximum.
5. Add the measured quantity to tank 4.
6. Shake the canister containing AKTIVATOR 310 thoroughly (approx.
1 minute).
Note: Tank 3 for the AKTIVATOR chemical must be absolutely dry and
clean before filling and should be filled last.

7. Fill AKTIVATOR 310 into tank 3 up to the triangular mark.

8. Fill the supplied spray bottle with distilled or de-ionised water.
[ ] The tanks are filled with the chemicals and the unit can be initialised.

5.3.3 Initialisation

Initialising the unit

Risk of damage!
The circuit board holder with electric connector is to be used in
tank 4 only.
CAUTION › The circuit board holder with electric connector may only be
used in tank 4.

After mounting the copper anodes and filling the tanks you can put the
unit into service. Proceed as follows:
1. Switch on the unit (mains switch to I).
The unit starts heating the chemical bath in tank 1 and indicates this in the
status display.

2. Wait until the operating temperature of approx. 55 °C is reached.

Check the temperature of the chemical bath in tank 1 using the
thermometer.
3. Insert a dummy circuit board (old double-sided circuit board) in the
circuit board holder without electric connector.
4. Rinse the dummy board thoroughly in an external basin or sink.
5. Insert the dummy board into tank 1.
6. Select PROFILE 7 (Initialisation, see page 23) and start the
PHASES menu (see "Menus" on page 22).
7. Select and start PHASE 1.
When the time counter is down to 0, a beep sounds and the status display
prompts you to rinse the board.

36 MiniContac RS
 Installation and preparing operation

8. Acknowledge the end of PHASE 1 by selecting and confirming

END.
9. Take the circuit board out of the tank and rinse it thoroughly in an
external basin or sink.
Note: Phases 2 and 3 are not needed for initialisation!

10. Fasten the circuit board to the circuit board holder with electrical
connector.
11. Ensure that the cathode connector is plugged properly.
12. Insert the circuit board into tank 4.
13. Select and start PHASE 4.
This phase takes approx. 300 minutes! When the time counter is
down to 0, a beep sounds and the status display prompts you to rinse
the board.
14. Finish PHASE 4 by selecting and confirming END.
15. Rinse the circuit board thoroughly with tap water and dispose of
properly.
16. In the menu SETUP , submenu CHEMIE, confirm the item
ERGÄNZT (see "The Setup menu" on page 24).
The ampere hour counter is reset to 0.

[ ] The initialisation is finished and the unit is ready for operation.

5.4 Storage and conservation in the intervals of normal usage

It is essential that the tanks are covered immediately after use in order to
prevent contamination of the chemical baths. Switch off the unit (mains
switch to 0) for longer periods of non-use (e.g. weekends).
For longer periods of non-use (several days) observe the notes in chap-
ter 8.1‚ "Routine inspection".

5.5 Intended operators

The MiniContac RS unit may only be operated by persons with at least

basic knowledge of circuit board manufacturing including multi-layer
manufacturing for electronics.

5.6 Storage of the documentation

Keep a legible copy of this manual and the chemicals documentation

near the unit.

Manual 5.3 Rev.: 7.05.2014 37

Storage of the documentation

38 MiniContac RS
 Operation

6. Operation

Danger of chemical burns!

Contact with the chemicals can cause chemical burns.
› Wear suitable protective clothing while operating the unit (pro-
WARNING tective goggles and protective gloves)!

Chemicals can be ruined!

Contaminants can cause chemical reactions and degrade the
through-plating or ruin the respective chemical bath.
CAUTION › Never use oil-contaminated compressed air for blow-off!

Chemicals can be ruined!

The chemical baths can be ruined by carry-over from the previous
baths.
CAUTION › Use the supplied adhesive tape to seal the edges of multi-layer
circuit boards to prevent carry-over.

The circuit board should be drilled only with carbide drills that are suitable
for the board material and are in mint condition. Comply with the drill
parameters found in the drill's manual or the tool libraries of BoardMaster.
Preferably use FR4 with a copper layer of 5 or 9 µm (depending on avail-
ability). As this material has a protective copper film, rinsing suffices to
clean the drilled holes.
When using base material without protective film, e.g. FR4 18/18 µm, you
need to deburr the drilled board and brush or scrub the surface, e.g. with
a non-woven synthetic (do not use steel wool). Rinse the circuit board
thoroughly, especially the holes.
Before processing the circuit board select the profile suitable for your
requirements. If you should use board material of dimensions other than
9 x 12 “, you will have to edit the profile according to the board dimen-
sions employed (see "The Profiles menu" on page 23).

6.1 Changing settings

Changing profile

In order to change the individual menu items proceed as follows (exam-

ple: T bath 2 in PROFILES):
1. Select the menu item to be changed (see "Menu levels" on
page 22).
2. Edit the time setting as follows:

Manual 5.3 Rev.: 7.05.2014 39

Changing settings

3. Select the digit using the u key.

4. Choose a number by pressing the p or q key.
Note: You can abort by pressing the t key (corresponds to ESC).

5. Press the u key several times to move the cursor to the last entry
position and press the u key one more time (corresponds to ENT).
The value entered is stored.

6. Press the t key (ESC) as many times as needed to reach the main
menu.
[ ] The change is completed.

Note: If any problem arises contact the LPKF customer service.

Calculating the current

When using circuit boards of dimensions other than provided in the pro-
files, the current has to be recalculated and the profile has to be edited
accordingly (see "Changing settings" on page 39). The current is calcu-
lated as follows:
1. Calculate the circuit board surface w x l in mm2.

40 MiniContac RS
 Operation

2. Read the current value from the following graph:

Fig. 14: Current calculation

Tip: For a circuit board of 200 x 300 mm (60,000 mm2) a current of 8.6
A must be set.

3. Change the setting of the current via the menu.

Note: If you operate the unit at too high current settings the surface of the circuit
board is degraded and the service life of the chemical bath is also reduced.

6.2 Latching the circuit board holder

Latching the circuit board holder

Handle the circuit board holders as follows:

Note: This procedure is for both circuit board holders, with and without
cathode connector.

Manual 5.3 Rev.: 7.05.2014 41

Latching the circuit board holder

1. Fit the holes of the circuit board holder onto the pins on the tank
frame (see figure below).

Fig. 15: Inserting the circuit

board holder
1
3

2
4

1 Circuit board holder 3 Plug for cathode board holder

2 Circuit board 4 Frame

2. Lift the front end of the circuit board holder for approx. 3 cm and
knock it several times (8-10 times) on the frame before setting it
down again.
Note: This removes air bubbles from small via holes.

3. Shift the circuit board holder towards the back so that the clasp
locks into place under the frame (see figure below).

Fig. 16: Latching the circuit

board holder

42 MiniContac RS
 Operation

6.3 The through-plating process

Danger of chemical burns!

Contact with the chemicals can cause chemical burns.
› Wear suitable protective clothing while operating the unit (pro-
WARNING tective goggles and protective gloves)!

Tip: Depending on tank temperature, current, circuit board size and

condition of the chemicals, an average of 0.1 - 0.2 µm copper are
deposited per minute. Thus, approx. 6 - 12 µm copper are deposited
per hour. Please note that these values are only estimates for the
attainable copper layer thickness that can vary with a unit for labora-
tory use such as the MiniContac RS unit.
If you need exact values for the copper thickness in the via holes it is
advisable to manufacture several test circuit boards and use micro-
graphs to measure the actual thickness.
Once you have found the parameters for the desired thickness you can
start through-plating the real circuit board.
We recommend using the parameters specified by us to obtain satis-
factory through-plating results.

Note: Ensure that the room temperature is in the range of 18-25 °C as the
chemical baths do not work outside this range.

Note: Use the supplied adhesive tape to seal the edges of multi-layer circuit
boards to prevent carry-over.

6.3.1 Work prerequisites

Ensure that:
• The unit is switched on (mains switch to I).
• Bath 1 is heated (operation temperature of approx. 55 °C is displayed
on the digital thermometer).

Manual 5.3 Rev.: 7.05.2014 43

The through-plating process

6.3.2 Work process

Danger of chemical burns!

Contact with the chemicals can cause chemical burns.
› Wear suitable protective clothing while operating the unit (pro-
WARNING tective goggles and protective gloves)!

Fastening the circuit board

1. Fasten the base material to the circuit board holder.

2. Rinse the circuit board thoroughly in an external basin or sink.

Phase 1: Degreasing the circuit board

1. Insert the circuit board with several knocking movements (see

"Latching the circuit board holder" on page 41) into tank 1.
2. Select and start PHASE 1.
When the time counter is down to 0, a beep sounds and the status display
prompts you to rinse the board.

3. Acknowledge the end of PHASE 1 by selecting and confirming

END.
4. Take the circuit board out of the tank and rinse it thoroughly with
tap water in an external basin or sink.
Note: It is necessary to rinse the circuit board immediately after taking it
out of bath 1 to prevent the degreasing agent from hardening. To rinse the
circuit board move it up and down in a jet of water for about 15 times or at
least 30 seconds. Ensure that the circuit board fastenings are also rinsed
in order to minimise carry-over.

[ ] The circuit board is degreased and ready for cleaning (phase 2).

Phase 2: Cleaning the circuit board

1. Insert the circuit board with several knocking movements (see

"Latching the circuit board holder" on page 41) into tank 2.
2. Select and start PHASE 2.
When the time counter is down to 0, a beep sounds and the status display
prompts you to rinse and subsequently dry the board.

3. Acknowledge the end of PHASE 2 by selecting and confirming

END.
4. Take out the circuit board and rinse thoroughly with tap water in an
external basin or sink.

44 MiniContac RS
 Operation

5. Using the spray bottle supplied with the unit, rinse the circuit board
with distilled or de-ionised water. Make sure that the via holes are
also rinsed thoroughly in this step.
Note: Take special care rinsing the circuit board otherwise the AKTIVA-
TOR chemical is ruined by trace elements of the tap water (chlorine, cal-
cium carbonate etc.) and has to be replaced completely.

6. Blow off the circuit board with oil-free compressed air until the water
is removed from the holes.
Note: The circuit board does not have to be completely dry but make sure that
the holes are completely cleared for the next phase. Too much water dilutes the
AKTIVATOR chemical!

7. Cover tanks 1 and 2 to avoid evaporation losses.

Note: Keep tank 4 covered as well.

[ ] The circuit board is cleaned and ready for activation (phase 3).

Phase 3: Activating the circuit board

1. Insert the circuit board with several knocking movements (see

"Latching the circuit board holder" on page 41) into tank 3.
2. Select and start PHASE 3.
When the time counter is down to 0, a beep sounds and the status dis-
play prompts you to dry the board.
3. Acknowledge the end of PHASE 3 by selecting and confirming
END.
4. Take the circuit board out of the tank and wipe off the AKTIVATOR
on both sides letting the liquid drip back into tank 3 using the wiper
shipped with the unit.
Note: If you are using base material without protective film use a separate
wiper with a soft blade so that the AKTIVATOR is not scraped out of the
via holes.

5. Tap the almost dry circuit board on a soft surface so that surplus
AKTIVATOR is removed even from small via holes.
6. Unfasten the board from the circuit board holder.
7. Let the circuit board dry thoroughly (e.g. using a hair dryer, max.
temperature 95 °C, +/- 5 °C for 4 minutes +/- 1 minute) and remove
surplus AKTIVATOR by tapping the board in turns on a soft sur-
face.
Note: Drying the AKTIVATOR can also be achieved using a drying cabinet
at 100 °C max. (95 °C, +/- 5 °C for 4 minutes +/- 1 minute).

Note: Ensure that the holes are not blocked by residues.

8. If you are using FR4 base material with copper film remove the film
after drying.
[ ] The circuit board is ready for copper plating (phase 4).

Manual 5.3 Rev.: 7.05.2014 45

The through-plating process

Phase 4: Preparing the copper plating

1. Remove any oxide layers on the circuit board holder with electrical
connector using sandpaper (copper gleam must be visible at the
bolt and the flat surfaces).
2. Fasten the circuit board to the circuit board holder with electrical
connector.
3. Ensure that the cathode connector is plugged properly.

Phase 4: Starting copper plating

1. Insert the circuit board with several knocking movements (see

"Latching the circuit board holder" on page 41) into tank 4.
2. Select and start PHASE 4.
During this phase it must be checked whether all via holes are plated
with copper.

Phase 4: Checking the circuit board

1. After approx. 15 to 20 minutes select and confirm PAUSE in order

to interrupt the through-plating process.
The countdown is halted.

2. Take the circuit board out of the tank.

3. Rinse the circuit board thoroughly in an external basin or sink.
4. Check the circuit board:
– Check whether the circuit board edge is copper-plated already.
– For multi-layer circuit boards the edges of which you have
sealed with adhesive tape, use a magnifying glass to inspect the
largest via hole whether it is copper-plated already.
If the circuit board edges (or holes) are already copper-plated the proc-
ess works fine. Otherwise:
– Check the parameter settings (current, RPP).

Phase 4: Resuming the copper plating

1. Reinsert the circuit board with several knocking movements (see

"Latching the circuit board holder" on page 41) into tank 4.
2. Select and confirm START.
The countdown is resumed.

46 MiniContac RS
 Operation

When half the time is over a beep is sounded and you are prompted to
turn around the circuit board.
3. Take the circuit board holder with the circuit board out of the tank,
turn it 180 °, and re-insert it with several knocking movements into
the tank (see "Latching the circuit board holder" on page 41).
4. Select and confirm START.
When the time counter is down to 0, a beep sounds and the status display
prompts you to rinse and subsequently dry the board.

5. Acknowledge the end of PHASE 4 by selecting and confirming

END.
PHASE 4 can be repeated as often as needed by pressing the u key.

Phase 4: Finishing the copper-plating

1. Take the circuit board out of bath 4 and let the chemical drip back
into the bath.

Tip: By letting the chemical drip from the circuit board back in to bath 4
you save chemicals and simultaneously protect the environment.

Fig. 17: Spraying the cir-

cuit board

2. Holding the circuit board above bath 4, spray the circuit board on
both sides with distilled or de-ionised water using the supplied
spray bottle and let the liquid drip into bath 4, thus balancing evap-
oration losses.

Rinsing and drying the circuit board

1. Rinse the circuit board in an external basin or sink with running

water for at least 30 seconds.

Manual 5.3 Rev.: 7.05.2014 47

The through-plating process

Danger of chemical burns!

If not rinsed properly, the operator can touch residual acid
remaining on the circuit board.
WARNING › Do not let the rinse time be less than 30 seconds.

Environmental hazard!
The contaminant load of the rinse water will be exceeded if not
thoroughly diluted.
CAUTION › Do not let the rinse time be less than 30 seconds.

2. Blow off the circuit board with oil-free compressed air.

3. Dry the circuit board quickly, using warm air if possible (e.g. with a
hair dryer but not in a drying cabinet).
Note: This should be done as quickly as possible to prevent the copper
from oxidising.

[ ] The through-plating of the circuit board is finished and the board can be
processed further.

48 MiniContac RS
 Operation

6.4 Process sequence

6.4.1 Standard circuit board

Rinsing Drying

Fastening circuit

(de-ionised water)
board to holder

Spray-rinsing
Rinsing (tap

Blowing off
Wiping

Tapping
Drying
water)

95 °C
Bath (time in minutes)

Phase Operation 1 2 3 4
Phase 0: Process preparation
Fasten circuit board to
0.1 holder w/o electrical
X

0.2 Rinse circuit board >30 s

Phase 1: Degreasing
Insert circuit board into
1.1 bath 1
65

1.2 Rinse circuit board >30 s

Phase 2: Cleaning
Insert circuit board into
2.1 bath 2
5

2.2 Rinse circuit board >30 s

2.3 Spray-rinse circuit board >15s

2.4 Blow off circuit board >10s

Phase 3: Activation
Insert circuit board into
3.1 bath 3
15

3.2 Wipe circuit board X

3.3 Tap circuit board >15s

4-5
3.4 Dry circuit board
Min
Phase 4: Through-plating
Fasten circuit board to
4.0 holder with electrical
X
Insert circuit board into
4.1 bath 4
20

4.2 Rinse circuit board >30s

4.3 Check circuit board

Insert circuit board into
4.4 bath 4
25

4.5 Turn circuit board 45

4.6 Spray-rinse circuit board <10s

4.7 Rinse circuit board >30s

>1
4.8 Blow-dry circuit board
Min

Manual 5.3 Rev.: 7.05.2014 49

Process sequence

6.4.2 Multi-layer circuit board

Fastening circuit board

Rinsing Drying

Rinsing (tap water)

(de-ionised water)
Spray-rinsing
to holder

Blowing off
Wiping

Tapping
Drying
95 °C
Bath (time in minutes)

Phase Operation 1 2 3 4
Phase 0: Process preparation
Fasten circuit board to
0.1 holder w/o electrical
X

0.2 Rinse circuit board >30 s

Phase 1: Degreasing
Insert circuit board into
1.1 bath 1
80

1.2 Rinse circuit board >30 s

Phase 2: Cleaning
Insert circuit board into
2.1 bath 2
10

2.2 Rinse circuit board >30 s

2.3 Spray-rinse circuit board >15s

2.4 Blow off circuit board >10s

Phase 3: Activation
Insert circuit board into
3.1 bath 3
25

3.2 Wipe circuit board X

3.3 Tap circuit board >15s

4-5
3.4 Dry circuit board
Min
Phase 4: Through-plating
Fasten circuit board to
4.0 holder with electrical
X
Insert circuit board into
4.1 bath 4
20

4.2 Rinse circuit board >30s

4.3 Check circuit board

Insert circuit board into
4.4 bath 4
40

4.5 Turn circuit board 60

4.6 Spray-rinse circuit board <10s

4.7 Rinse circuit board >30s

>1
4.8 Blow-dry circuit board
Min

50 MiniContac RS
 Operation

6.4.3 Flexible circuit board

Fastening circuit board

Rinsing Drying

Rinsing (tap water)

(de-ionised water)
Spray-rinsing
to holder

Blowing off
Wiping

Tapping
Drying
95 °C
Bath (time in minutes)

Phase Operation 1 2 3 4
Phase 0: Process preparation
Fasten circuit board to
0.1 holder w/o electrical
X

0.2 Rinse circuit board >30 s

Phase 1: Degreasing
Insert circuit board into
1.1 bath 1
80

1.2 Rinse circuit board >30 s

Phase 2: Cleaning
Insert circuit board into
2.1 bath 2
10

2.2 Rinse circuit board >30 s

2.3 Spray-rinse circuit board >15s

2.4 Blow off circuit board >10s

Phase 3: Activation
Insert circuit board into
3.1 bath 3
15

3.2 Wipe circuit board X

3.3 Tap circuit board >15s

4-5
3.4 Dry circuit board
Min
Phase 4: Through-plating
Fasten circuit board to
4.0 holder with electrical
X
Insert circuit board into
4.1 bath 4
15

4.2 Rinse circuit board >30s

4.3 Check circuit board

Insert circuit board into
4.4 bath 4
15

4.5 Turn circuit board 30

4.6 Spray-rinse circuit board <10s

4.7 Rinse circuit board >30s

>1
4.8 Blow-dry circuit board
Min

Manual 5.3 Rev.: 7.05.2014 51

Waste Disposal

6.5 Waste Disposal

Do not let spilled chemicals reach the sewer system.

The rinse water of the through-plating process can be disposed of via the
sewer system (see appendix).
Never pour spent chemicals down the drain, fill into canisters for disposal
and dispose of at a certified chemical treatment plant.
Refer to the documentation of the chemicals for the appropriate method
of disposal (neutralisation, hazardous waste disposal, chemical-physical
treatment).
Always check and adhere to local and national regulations for the internal
or external disposal of waste.
Local and national regulations always take precedence over our recom-
mendations.

52 MiniContac RS
 Troubleshooting

7. Troubleshooting

7.1 Safety advice

Risk of damage!
The unit contains sensitive electronic circuitry.
› Have only adequately trained persons or the customer service
CAUTION do the troubleshooting.

7.2 Error codes

If the unit has detected an error this is indicated by an error code on the
display. On the lower left of the display an "E" for "error" and a corre-
sponding code number is displayed. On the lower right of the display the
error name is displayed. At the same time a beep is sounded.

Table 5:Error codes

Code display Cause Remedy

01 I < 1A Current interrupted in tank 4 Re-insert the circuit board

into tank 4 and select and
confirm START.

Check the electric contact of

the circuit board and holder

Remove the protective cop-

per film

Check the anode plug and

cable

see "Cleaning the anode

rails" on page 54

02 Level Fill level of tank 1 is too low Fill up tank 1 with CLEANER
110 up to the triangular
mark.

Fill level sensor is defective Switch off the unit.

Report the error to customer
03 VDD Voltage VDD faulty service.
04 Temp Overheated heat sink

05 24V 24V voltage faulty

06 3V Plating voltage faulty

08 TempSen Temperature sensor is

defective

Manual 5.3 Rev.: 7.05.2014 53

Other fault indicators

Code display Cause Remedy

16 I Motor Motor overload see "Easing frame move-

ment" on page 55

Motor is defective Switch off the unit.

Report the error to customer
service.

7.3 Other fault indicators

Table 6:Other faults

Fault indicator possible cause Remedy

Bath 1 remains at Heating element or heating Switch off the unit.

room temperature fuse is defective Report the error to cus-
tomer service.

Unit cannot be no mains connection Check mains connection

switched on
Mains fuse is defective see "Replacing the fuse" on
page 55

Internal fault Switch off the unit.

Report the error to cus-
tomer service.

7.4 Simple troubleshooting

7.4.1 Cleaning the anode rails

Removing deposits on the anode rails

During longer operation periods deposits of the galvanising chemical

can form on the anode rails. These deposits can interrupt the electric
current and thus prevent the copper-plating.
1. Unplug the mains cable.
2. Drain tank 4 into a clean and dry container (e.g. canister) as
described in steps 1 to 6 in "Draining the tanks" on page 60.
3. Rinse tank 4 thoroughly.
4. Unscrew the copper anodes (see fig. 10, "Copper anodes", on
page 33).
5. Remove the anodes with the anode cloth bags.

54 MiniContac RS
 Troubleshooting

6. Rinse or replace the anode bags and rinse and scrub the anodes
clean with a plastic brush.
7. Brush off the deposits on the anode rails towards the bottom of the
tank using a plastic brush.
8. Carefully polish the anode rails around the threaded holes on both
sides using sandpaper.
9. Rinse the tank thoroughly using tap water.
10. Set the copper anodes complete with their cloth bags into tank 4
and screw them to the anode rails using the anode bolts.
11. Let the rinse water drain completely and dispose of via the sewer
system.
12. Seal the tube with the stopper and re-insert it back into the clamp
rail.
13. Pour the drained chemical through a fluted filter (alternatively use
several nested paper coffee filters) into another clean and dry con-
tainer (e.g. a canister).
14. Pour the filtered chemical back into the tank.
[ ] The deposits on the anode rails are removed.

7.4.2 Easing frame movement

Easing frame movement

After a long time of operation it can happen that the frame seizes or
becomes sluggish and thus overloads the motor.
1. Unplug the mains cable.
2. Loosen the guidance blocks of the frame.
3. Re-fasten the guidance blocks so that the frame can be easily
moved.
[ ] The frame moves easily.

7.4.3 Replacing the fuse

Replacing the fuse

The mains fuses are two glass fuses (2.5 A slow at 230 V, 5 A slow at
115 V) and are located in the voltage setting module. The fuses are
located on opposite sides of the module and each fuse is mounted on
the side that is nearest to the triangular mark of its corresponding volt-
age.
1. Disconnect the mains cable.

Manual 5.3 Rev.: 7.05.2014 55

Customer service

2. Insert a flat screwdriver into the notch on the underside of the mod-
ule and carefully extract the module (1 in the figure below).

Fig. 18: Mains fuses at the

mains connector 2

1 Voltage module (with mains fuses) 2 Mark

3. Replace the defective fuse.

4. Re-insert the module oriented in such a way that the white triangle
behind the voltage rating corresponding to your mains voltage
points to the white mark of the rim (2 in above figure).
5. Reconnect the mains cable.
[ ] The fuse is replaced.

7.5 Customer service

Germany:

LPKF Laser & Electronics AG

Osteriede 7
D-30827 Garbsen

Phone: + 49 - 51 31 - 70 95 - 0
Fax: + 49 - 51 31 - 70 95 - 90
E-mail: info@lpkf.com
Website: http://www.lpkf.com

Outside Germany:
Contact your local distributor, refer to http://www.lpkf.com/ for contact
details.

56 MiniContac RS
 Service and repair

8. Service and repair

8.1 Routine inspection

Tank 4 has to be inspected visually once a week for copper sulphate

crystals on the walls and in the corners of the tank.
These crystals have to be put back into the bath.

Chemical bath can be ruined!

No copper sulphate crystals nor residues of the COPPER PLATER
400 bath may reach the neighbouring AKTIVATOR bath, the AKTI-
CAUTION VATOR bath would be ruined. In such a case the warranty is for-
feited.
› Keep the AKTIVATOR bath covered.

8.2 Service and repair by user

8.2.1 Unit

The unit itself requires no servicing.

It is essential that the tanks are covered immediately after use in order to
prevent contamination of the chemical baths.
Carefully clean the unit regularly (depending on volume of through-plated
circuit boards weekly or even daily).

Tip: Never use abrasives to remove chemicals that have dripped on

the unit, use a soft cloth instead. Otherwise, the unit's surface gets
scratched and removal of stains is made even more difficult.

8.2.2 Chemical Baths

Risk of scrap production!

Replacing or adding chemicals changes their effect.
› If chemical baths have been replaced or SHINE 400 has been
CAUTION added the unit should be re-initialised with a dummy circuit
board.

Manual 5.3 Rev.: 7.05.2014 57

Service and repair by user

Bath 1 (Degreasing)

Product: CLEANER 110

Keep covered when neither tank 1 nor tank 2 is in use.
Evaporation losses can be replaced with distilled or de-ionised water if
need be.
Replace the degreasing chemical after 3 months or when its colour has
significantly changed.
Note: Avoid unnecessary heating as this shortens the service life.

Bath 2 (Cleaning)

Product: CLEANER 210

Keep covered when neither tank 1 nor tank 2 is in use.
Evaporation losses can be replaced with distilled or de-ionised water if
need be.
Replace the chemical after 3 months or when its colour has significantly
changed.

Bath 3 (Activation)

Product: AKTIVATOR 310

Keep covered when not in use.
The chemical bath is highly sensitive to contaminants and acid ions and
thus requires careful handling.
Traces of CLEANER 110, CLEANER 210, COPPER PLATER 400, tap
water, any acidic chemicals, iron particles or similar can shortly lead to
malfunction of the chemical bath. In this case it is irrelevant whether it is
in use or not. If the unit is not in use the bath should be stirred thoroughly
once a week.
Note: After intervals of non-use (more than one day) stir the bath for 2 to 3 min-
utes with a fibre glass rod or similar. If this has created foam wait until it has sub-
sided before inserting a circuit board.

Replace losses only with AKTIVATOR 310 (fill up to triangular mark).

Chemical bath can be ruined!

The AKTIVATOR bath is highly sensitive.
› Never add water to the AKTIVATOR bath as this prevents the
CAUTION through-plating from working.

After a year at the latest, the bath has to be replaced.

After replacing the chemical ensure that it is thoroughly stirred.

58 MiniContac RS
 Service and repair

Bath 4 (Copper-plating)

Product: COPPER PLATER 400

Keep covered when not in use and filter regularly (approx. every 3
weeks).
Note: The service life of the tank's contents is approx. one year. As the service
life is influenced by careful operation and air pollution this is only an estimate
and can vary.

Filtering bath 4

1. Drain approx. 5 litres from the tank into a clean and dry container
(e.g. canister) using the same steps as in "Draining the tanks" on
page 60.
Note: Filtering this partial volume of the bath is sufficient as contaminates
accumulate at the bottom of the tank where they are flushed through the
drainage tube with this partial volume.

2. Pour the drained volume through a fluted filter (alternatively use

several nested paper coffee filters) into another clean and dry con-
tainer (e.g. a canister).
3. Pour the filtered chemical back into tank 4.
4. Replenish using COPPER PLATER 400.
5. Wipe the tank's rim with a cloth that has been moistened with dis-
tilled or de-ionised water.

Adding SHINE 400

The chemical additive SHINE 400 is consumed depending on through-

put. The unit has an internal counter for the ampere hours used. After
100 ampere hours the warning W01 CHEMIE is displayed. Complete
the current plating process before adding 5 ml SHINE 400 to the
COPPER PLATER bath.
1. Complete the current plating process with all remaining steps.
2. Afterwards, add 5 ml of SHINE 400 to tank 4.
3. Re-initialise the unit with a dummy circuit board:
– Phase 1: 10 minutes
– Phases 2 and 3 are skipped
– Phase 4: 60 minutes at 9 A, RPP off
4. Confirm adding the chemical in the setup menu (see "The Setup
menu" on page 24).
[ ] The chemical SHINE 400 has been added and the ampere hour counter is
reset to 0.

Manual 5.3 Rev.: 7.05.2014 59

Service and repair by user

Draining the tanks

Danger of chemical burns!

Contact with the chemicals can cause chemical burns.
› Wear suitable protective clothing while draining or filling the
WARNING unit (protective goggles and protective gloves)!

Environmental hazard!
The chemicals used are poisonous and corrosive.
› Never pour spent chemicals down the drain, instead fill into
WARNING canisters for disposal and dispose of at a certified treatment
plant.

Tip: Keep the empty canisters of the chemicals shipment for uncon-
taminated disposal of spent chemicals.

You need:
• the canisters for disposal
• a bucket for collecting the rinse water
• a squirt bottle or running water for rinsing the tanks

Fig. 19: Rear view

1 2 3 4 5 6 7
1 Collecting tank 5 Drainage tube for tank 3
2 Tube clamp 6 Drainage tube for tank 2
3 Clamp rail 7 Drainage tube for tank 1
4 Drainage tube for tank 4

60 MiniContac RS
 Service and repair

For draining each of the tanks (1 to 4) proceed as follows:

1. Pull the drainage tube from the clamp rail.
2. Clamp the tube shut above the fluid level with the tube clamp sup-
plied with the unit.
3. While still holding the tube upwards pull off the stopper.
4. Insert the tube's end into the corresponding canister.
5. Open the clamp enabling the chemical to drain from the tank.
6. When the tank is drained completely put the tube's end into the
bucket for the rinse water.
7. Tank 4: Rinse the anodes and the tank:
– Unscrew the anode bolts (see fig. 10, "Copper anodes", on
page 33).
– Remove the anodes with the anode cloth bags.
– Rinse and scrub the anodes clean with a plastic brush or replace
them if they are overly worn.
– Rinse or replace the anode cloth bags.
– Rinse the tank thoroughly.
– Reinsert the anodes with the anode cloth bags and fasten them
with the anode bolts (see "Mounting the copper anodes" on
page 33).
8. Tanks 1/2/3: Rinse the tank thoroughly.
9. Tank 3: Rinse the tank again with distilled or de-ionised water.
10. Let the rinse water drain completely into the bucket and dispose of
via the sewer system.
11. Seal the tube with the stopper and re-insert it back into the clamp
rail.
12. Dry the tank.
[ ] The tank is drained and can be refilled.

Manual 5.3 Rev.: 7.05.2014 61

Service and repair by user

62 MiniContac RS
 Storage

9. Storage

9.1 Decommissioning

Decommissioning the unit

1. Unplug the mains cable.

2. Wait until bath 1 has cooled down.
3. Drain the chemicals into their respective canisters.
4. Rinse the tanks of the unit thoroughly.
5. Rinse tank 3 with distilled or de-ionised water.
6. Unscrew the anode bolts (see fig. 10, "Copper anodes", on
page 33).
7. Remove the anodes with the anode cloth bags.
8. Re-install the anode bolts.
9. Rinse the anode bags and rinse and scrub the anodes clean with a
plastic brush.
10. Dry the anodes and anode cloth bags.
Note: Depending on wear replace the anodes and anode bags before
putting the unit back into service.

11. Dry the tanks.

[ ] The unit is decommissioned and can now be packed.

Packing the unit

1. Remove and pack the loose components (tank covers, digital ther-
mometer etc.) of the unit.
2. Retrieve the original packaging from storage or procure safe pack-
aging.

Lifting hazard — heavy object.

The unit weighs approx. 47 kg. Single person lifting could cause
muscle strain or back injury.
WARNING › Always have two persons of adequate physical strength lift,
move, or install the unit.

3. Pack the unit.

4. Ensure safe transport in horizontal position by applying appropriate
marks on the package (e.g. "fragile", "UP").
[ ] The unit is packed and can be transported or stored.

Manual 5.3 Rev.: 7.05.2014 63

Storage

9.2 Storage

Store the unit in a frost-free and dry place.

9.3 Disposal

Disposing of the unit

1. Decommission the unit (see chapter 9.1‚ "Decommissioning").

2. Dispose of the chemicals separately as described in chapter 6.5‚
"Waste Disposal", on page 52.
3. Dispose of the unit in adherence to local regulations concerning
plastics and electronic components.
[ ] The unit is disposed of.

64 MiniContac RS
 Appendix

10. Appendix

10.1 List of figures

Fig. 1: Type plate MiniContac RS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Fig. 2: MiniContac RS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Fig. 3: Rear view of MiniContac RS with drainage tubes . . . . . . . . . . . . . . . . . . . . . . . . . 19
Fig. 4: Tank configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Fig. 5: Fill level sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Fig. 6: Control panel keys . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Fig. 7: Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Fig. 8: Dog-bone effect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Fig. 9: Power connector and mains switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Fig. 10: Copper anodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Fig. 11: Thermometer position . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Fig. 12: Inserting the thermometer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Fig. 13: Power connector and mains switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Fig. 14: Current calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Fig. 15: Inserting the circuit board holder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Fig. 16: Latching the circuit board holder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Fig. 17: Spraying the circuit board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Fig. 18: Mains fuses at the mains connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Fig. 19: Rear view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

10.2 List of tables

Table 1: Tank specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Table 2: Menu levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 3: Profile data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 4: Setup functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 5: Error codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Table 6: Other faults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

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Through-plating log

10.3 Through-plating log

Note: Use this log to monitor and analyse the service life of the chemicals.

Chemical replaced / added

Date Size base material Cur- Time Chemical Vol-
w x l (mm) rent ume

Copy this form and place it next to the unit.

66 MiniContac RS
 Appendix

10.4 Analysis results (German)

10.4.1 Analysis result 1

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Analysis results (German)

10.4.2 Analysis result 1 (cont.)

68 MiniContac RS
 Appendix

10.4.3 Analysis result 2

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Analysis results (German)

10.4.4 Analysis result 3

70 MiniContac RS
 Appendix

10.4.5 Analysis result 3 (cont.)

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Analysis results (German)

10.4.6 Analysis result 3 (cont.)

72 MiniContac RS
 Appendix

10.4.7 Analysis result 4

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Analysis results (German)

10.4.8 Analysis result 4 (cont.)

74 MiniContac RS
 Appendix

10.4.9 Analysis result 4 (cont.)

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Analysis results (German)

10.4.10 Analysis report

76 MiniContac RS
 Appendix

10.5 Analysis results

10.5.1 Analysis result 1

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Analysis results

10.5.2 Analysis result 1 (cont.)

78 MiniContac RS
 Appendix

10.5.3 Analysis result 2

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Analysis results

10.5.4 Analysis result 3

80 MiniContac RS
 Appendix

10.5.5 Analysis result 3 (cont.)

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Analysis results

10.5.6 Analysis result 3 (cont.)

82 MiniContac RS
 Appendix

10.5.7 Analysis result 4

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Analysis results

10.5.8 Analysis result 4 (cont.)

84 MiniContac RS
 Appendix

10.5.9 Analysis result 4 (cont.)

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Analysis results

10.5.10 Analysis report

86 MiniContac RS
 Appendix

10.6 Glossary

Black Hole process

In this process, the circuit board is wetted with a graphite solution. The
solution is dried. Subsequently, the graphite layer is removed from the
copper. In the via holes where the surface is rough with glass fibres and
epoxy the graphite remains and thus forms a conductive surface.
RCD
An RCD (Residual Current Device) is an electrical device that discon-
nects a circuit whenever it detects that the electric current is not balanced
between the phase conductor and the neutral conductor. Such an imbal-
ance can be caused by current leakage through the body of a person
who is grounded and accidentally touching the energised part of the cir-
cuit. RCDs are designed to disconnect quickly enough to mitigate the
harm caused by electrical shock in such a case.

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Glossary

88 MiniContac RS