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DEEE!El
I+IIL-P-29590
29 November 1991

MILITARY SPECIFICATION

POWER SUPPLIES, AIRBORNE, ELECTRONIC

GENERAL SPECIFICATIONFOR

This spe,c$ficationis approved for use by all Departments and Agencies of

the Department of Defense.

1. SCOPE

1.1 Scope. This specificationcovers the general requirements for

families of standard electronic power supplles for use in military aircraft
systems including combat and other mlsslon critical applications. These power
sumlies are coordinated under the Standard Hardware Acquisition and Reliability
Program (SHARP).

1.2 Classiflcatfon. Electr@c power supplies whose initial

application is for airborne use are classified as one of the followlng
families.

$eneficlal comments (reconunendatfons,addltlorts,deletions) and any

pertinent data which may be of use in fmprovlng this document should be
addressed to: Commanding Officer, Naval Air Engtneerlng Center, Systems
Engineering and $tandardlzationDepartment ($ESQ). Code 53, Lakehurst, NJ
08733-5100 by using the self-addressedStandardlzatlonDocument Improvement
Proposal (OD Form 1426) appearing at the end of this document or by letter.

AMSC $/A FSC 6130

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
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1.2.1 Family Al. These units are forced air cooled Weapon Replaceable
Assemblies (WRA) with an envelope in accordancewith MIL-E-85726.

1.2.2 Family A2. These units are Shop ReplaceableAssemblies (SRA) in

the form of modules in format B, Span 2; format C; or format E.

Classes

Class 11 - For primary utilization in airborne applications and where

stringent environmentalrequirementsare imposed. Power
supply interface temperature,rib surfaces, at minus 55
degrees Celsius (°C) low and 85°C high.

Class IV - For utilizationwhere class II power supplies may be exposed

to nuclear radiation. Power supply interface temperature,
rib surfaces, at minus 55°C low and 85°C high.

Formats

Format B - The basic size (span 2) has a span of 5.74

Span 2 inches (145.8 millimeters (mm)), a thickness of 0.290 inches
(7.366 mm), and a total height of 1.95 inches (49.5 mm),
including keying pins. The size may increase in thickness
within the constraints of MIL-STD-1389. See appendix B of
MIL-STD-1389.

Format C - The basic size has a span of 5.88 inches (149.4 mm), a
thickness of 0.280 inches (7.112 mm), and a total height of
4.06 inches (103.1 mm), including keying pins. The size may
increase in thickness within the constraints of MIL-STD-
1389. See appendix C of MIL-STD-1389.

Format E - The basic size has a span of 5.88 inches (149.4 mm)l a
thickness of 0.380 inches (9.652 mm), and a total height of
6.68 inches (169.7 mm), including keying pins. The,size may
increase in thickness within the constraints of MIL-STD-
1389. See appendix E of MIL-STD-1389.

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2. APPLICABLE DOCUMENTS

2.1 Government documents.

2.1.1 Specifications.standards. and handbooks. The following

specifications, standards, and handbooks form a part of this document to the
extent specified herein. Unless otherwise specified, the issues of these
documents are those listed in that Issue of the Department of Defense Index
of Specifications and Standards (OOOISS) and supplement thereto, cited in the
solicitation (see 6.2).

SPECIFICATIONS

FEOERAL

QQ-N-290 Nickel Plating (Electrodeposited).

PPP-3-00636 Boxes, Shipping, Fiberboard.

ZZ-R-765 Rubber, Silicone (General Specification).

MILITARY

141L-T-27 ‘Transformersand Inductors (Aud~o, Power, and

High-Power Pulse), General Speciflcatlonfor.

MIL-P-116 Preservation,Methods of.

MIL-B-117 Bags, Sleeves and Tubing.

MIL-E-5400 Electronic Equipment, Aerospace, General

Specificationfor.

MIL-C-5541 Chemical Conversion Coatings on Aluminum and

Aluminum Alloys.

MIL-M-7793 Meter. Time Totallzing.

MIL-A-8625 Anodic Coatings, For Aluminum and Aluminum

Alloys.

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MIL-W-8939 Welding, Resistance,Electronic Circuit Modules.

MIL-Q-9858 Quality Program Requirements.

MIL-S-19500 SemiconductorDevices, General Specification for.

MIL-C-28754 Connectors, Electrical,Modular, and Component

Parts, General Specificationfor.

MIL-M-28787 Modules, Standard Electronic,General

Specificationfor.

MIL-C-28809 Circuit Card Assemblies, Rigid, Flexible, and

Rigid-Flex.

MIL-A-28870 Assemblies, ElectricalBackplane, Printed-Wiring,

General Specificationfor.

MIL-M-3851O Microcircuits,General Specification for.

MIL-H-38534 Hybrid Microcircuits,General Specification for.

MIL-C-38999 Connector, ElectricalCircular, Miniature, High

Density Quick Disconnect (Bayonet,Threaded and
Breech Coupling), Environment Resistant,
Removable Crimp and Hermetic Solder Contacts,
General Specificationfor.

MIL-C-39003 Capacitors, Fixed, Electrolytic (Solid

Electrolyte),Tantalum, Established Reliability,
General Specificationfor.

MIL-C-39006/22 Capacitors, Fixed, Electrolytic {Nonsolid

Electrolyte),Tantalum, (Polarized,Sintered
Slug), 85°C (VoltageDerated to 125°C),
EstablishedReliability,Style CLR79.

MIL-R-39008 Resistors, Fixed, Composition (Insulated),

Established Reliability,General Specification
for.

MIL-C-39018/9 Capacitors, Fixed, Electrolytic (Aluminum Oxide),

(Polarized),EstablishedReliability,Style CUR02
(Insulated).

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MIL-G-45204 - Gold Plating, Electrodeposited.

KIIL-I-46058 - InsulatingCompound, Electrical (for Coating

Printed Circuit Assemb14es).

MIL-P-50884 - Printed Miring, Flexible and RigId-Flex.

I’4IL-P-5511O - Printed Wiring 8oard, General Specification for.

141L-C-83527 - Connectors, Plug and Receptacle, Electrical,

Rectangular Multiple Insert Type, Rack to Panel,
Environment Resisting, 150°C Total Continuous
Operating Temperature.

MIL-E-85726 - Enclosure, Standard Av~onics, Forced Air Cooled,

General Specificationfor.

STANDARDS

FEDERAL

FEO-STO-595 - Colors Used In Government Procurement.

MILITARY

hlIL-sTr)-12 - Abbreviationsfor Use on Drawings, and in

Specifications,Standards and Technical
Oocuments.

MIL-STII-129 - Marking for Shfpment and Storage.

MIL-STO-130 - IdentificationMarking ofU.S. MilitaryProperty.

hlIL-sTo-202 - Test Methods for Electronic and Electrical

Component Parts.

MIL-STO-275 - Printed Wiring for Electronic Equipment.

141L-STD-454 - Standard General Requirements for Electronic

Equipment.

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MIL-STD-461 ElectromagneticEmission and Susceptibility

Requirementsfor the Control of Electromagnetic
Interference.

MIL-STD-462 ElectromagneticInterferenceCharacteristics;
Measurement of.

MIL-STD-481 ConfigurationControl-EngineeringChanges (Short

Form), Deviations and Waivers.

MIL-STD-701 Lists of Standard SemiconductorDevices.

MIL-STD-704 Aircraft Electric Power Characteristics.

MIL-STD-756 ReliabilityModeling and Prediction.

MIL-STD-81O EnvironmentalTest Methods and Engineering

Guidelines.

MIL-STD-883 Test Methods and Procedures for Microelectronics.

MIL-STD-889 Dissimilar Metals.

MIL-STD-961 Military Specificationsand Associated Documents,

Preparationof.

MIL-STD-1285 Marking of Electrical and Electronic Parts.

MIL-STD-1389 Design Requirementsfor Standard Electronic

Modules.

MIL-STD-1472 Human EngineeringDesign Criteria for Military

Systems, Equipment, and Facilities.

MIL-STD-1562 Lists of Standard Microcircuits.

MIL-STD-1665 Test Equipment for the Standard Electronic

Modules Program.

MIL-STD-1686 ElectrostaticDischarge Control Program for

Protection of Electrical and Electronic Parts,
Assemblies and Equipment (Excluding Electrically
Initiated Explosive Devices) (Metric).

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MIL-STD-1772 - CertificationRequirements for Hybrid

MicrocircuitFacilities and Lines.

000-STO-1788 - Avionics InterfaceDesign Standard.

I+IIL-STD-2000 - Standard Requirementsfor Soldered Electrical and

ElectronicAssemblies.

MIL-STO-2038 - Requirementsfor Employing Standard Power

supplies.

141L-STD-2073-1 - CIODMateriel Procedures for Development and

Application of Packaging Requirements.

MIL-STO-2164 - EnvironmentalStress Screening Process for

Electronic Equipment.

MIL-STO-45662 - Calibration Systems Requirements.

HANDBOOKS

FEOERAL

HANOBOOK H4-2 Federal Supply Code for Manufacturers (United

States and Canada) Code to name.

HANDBOOK ti6 - Federal Item Name Oirectory for Supply

Cataloging.

MILITARY

t41L-H03K-217 - Reliability Prediction of Electronic Equtpment.

000-HDBK-263 - ElectrostaticOlschmje Control Handbook for

Protectionof Electr~6al and Electronic Parts,
Assemblies and Equipment (Excluding Electrically
Initiated Explosive Oevfces) (14etric).

(Unless otherwise indtcated,copies of federal and mi1itary

speciflcattons,standards, and’handbooks are available from the
Standardization Documents Order Oesk, Building 40, 700 Robbins Avenue,
Philadelphia, PA 19111-5094.)

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2.2 Non-Governmentpublications. The following documents form a part of

this document to the extent specified herein. Unless otherwise specified,
the issues of the documents which are DOD adopted are those listed in the
issue of the DoDISS cited in the solicitation. Unless otherwise specified,
the issues of documents not listed in the DoDISS are the issues of the
documents cited in the solicitation (see 6.2).

AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI)

S1.4 Sound Level Meters, Specificationfor.

S1.11 Specificationfor Octave-Band and Fractional-Octave-

Band Analog and Digital Filters.

(Applicationfor copies should be addressed to the American National

Standards Institute, 1430 Broadway, New York, New York 10018-3308.)

2.3 Order of precedence. In the event of a conflict between the text of

this document and the references cited herein (except for related associated
detail specifications),the text of this document takes precedence. Nothing
in this document, however, supersedes applicable laws and regulations unless
a specific exemption has been obtained.

3. REQUIREMENTS

3.1 General.

3.1.1 Associated detail specifications. The individual power supply

requirements shall be as specified herein and in accordance with the
associated detail specification. In the event of any conflict between the
requirements of this specificationand the associated detail specification,
the latter shall govern.

3.1.1.1 Specification format. Associated detail specificationsfor both

family Al and family A2 shall be slash sheets to this specificationand shall
be written in accordance with MIL-STD-2038.

3.1.2, Definitions. The definition of terms used in this specification

shall be in accordance with 6.5 of this document and definitions in MIL-STD-
2038.

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3.2 Qualification. Power supplies furnished under this specification

shall be products which are authorized by the airborne power supply products
quality assurance activity (APSP-QAA)for Iistlng on the applicable qualtfled
products list at the time of delivery (see 4.4 and 6.4).

3.3 Electrical rxvformance rewirernents. Power supplies shall be In

accordance with the electrical requirements herein and in the associated
detail specifications.

3.3.1 Innut power.

3.3.1.1 Normal o~eration. Power supplies shall operate and maintain

specified performance when the Input power has the characteristicsfor normal
operation as specified InlMIL-ST?&704.

3.3.1.2 Emerqency operation. Power supplies shall operate and maintain

specified performance during emergency operation when the input power has the
characteristics spec$fied in MIL-STD-704.

3.3.1.3 Transient operation. Power supplies shall operate and maintain

specified performance when the input power has the characteristicsspeclfled
in MIL-STtl-704(see 3.3.2.21, 4.7.2.9.1, 4.7.2.9.2, 4.7.2.9.3 and 4.7.2.9.4).

3.3.1.4 Abnormal operation. Power supplies shall be permitted degraded

performance or loss of function when the input power characteristicsare
outside the normal operation limlts but wlthln the abnomal operation Mnlts
of MIL-SUI-704. Power supplies shall not produce a damaging or unsafe
condition dur?ng abnormal operation. Power supplies shall automatically
recover full specified performance within 250 msec after the Input power
characteristics are restored to the normal operation limits.

3.3.1.5 Auxiliary DC input. Power supplles shall operate and maintain

spec~fied performance when operating from DC power applied to the auxiliary
input terminals which are separate from the AC Input terminals. The ~lnal
DC input voltage amplitude and characteristicsare speciffed ~n the
associated detail specification. Intended uses of the auxtlliiryDC input
include back-up power, uninterruptedpower and extension of the power supply
hold-up capability.
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3.3.1.6 Alternate input sources. When specified in the associated

detail specification,power.supplies shall operate from alternate input
sources to allow for multiple platform or subsystem applications.
Requirements for alternate input sources shall be in accordance with the
associated detail specification.

3.3.1.7 Input Protection. Power supplies shall not be damaged by

polarity reversal, momentary interruptions(up to 30 seconds), loss of a
single phase (with 3-phase input), low input line voltage, or a short circuit
on the input power lines. The maximum input current drawn under any steady
state input voltage conditions less than the maximum specified input voltage
shall be no greater than 1.8 times the steady state Root Mean Square (RMS) or
DC current at maximum rated load and nominal input voltage. The applicable
turn-on current paragraph (see 3.3.1.11.1 or 3.3.1.11.2) shall apply for the
maximum input current drawn during any transient input condition. The power
supply output shall not exceed the overvoltagerequirements specified in
3.3.2.15 during the transient or overvoltage input power conditions. Upon
restoration of normal input power, the power supplies shall recover
automatically and perform as specified herein. A power supply failure shall
not cause damage to the input power lines.

3.3.1.8 Turn-on threshold. Power supply turn-on threshold is defined

as the input voltage where the output voltage rises to a level greater than
or equal to 95 percent of the nominal level, at maximum load. The AC Input
voltage threshold for power supply turn-on shall be between 90 and 104 VAC
RMS line-to-neutral. The threshold for an alternate DC input (see 3.3.1.6)
shall be specified in the associated detail specification.

3.3.1.8.1 Turn-on threshold for a DC or alternate input voltaqe. The

threshold for a DC or alternate input voltage shall be as specified in the
associated detail specification.

3.3.1.9 Turn-on to turn-off hysteresis. Power supply turn-off is

defined as the input voltage where the output voltage drops to a level less
than 95 percent of the nominal level, at maximum load. The power SUPPIY
turn-off line-to-neutralvoltage shall be a minimum of 15 VAC RMS below the
input voltage threshold at which the power supply turned on (see 3.3.1.8).
However, to allow for the coincidence of transient low line, maximum line
distortion and maximum phase unbalance conditions,the turn-off voltage shall
be less than 75 VAC RMS line-to-neutral. The power supply outputs are not
required to meet the static output regulation requirements (see 3.3.2.5) for
input voltages less than 80 VAC RMS line-to-neutralregardless of the turn-
off threshold.

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3.3.1.9.1 Turn-on to turn-off hysteresis for a DC or alternate input

voltaue. Turn-on to turn-off hysteresis for a DC or alternate Input voltage
shall be as specified in the assoc~ated detail specification.

3.3.1.10 Inwt current balance. The RMS value of the input currents
on the 3-phase input lines shall be within 5 percent of each other when the
source voltage is balanced within 1 percent between input lines.

3.3.1.11 Turn-on current. The followlng requirementsapply to all AC,

DC, and alternate inputs to the power supply.

3.3.1.11.1 Step InPut. The peak 4nrush current dur~ng the entire
turn-on cycle resulting from a step input voltage shall be limited to 10
ttmes the input steady state true RMS or DC current at maximumrated load and
nominal ilnputvoltage. The rate of change of the step input voltage shall be
greater than or equal to one volt permlcrosecond (see 4.7.2.1).

3.3.1.11.2 SlowlY ristim Inmit. For slowly r~s$ng input voltage wfth
a rate of change less than 1 volt per millisecond or for remote turn-on (see
3.3.3.1), the rate of rise of input current shall be not greater than 10
amperes (A) per millisecond per k~lowatt of nominal Input power. This
spec$fled rate of rise of input current $s related to the max$mum value of
external input Inductance specified $n the associated detail speciftcat~on.
The peak input current durtng the entire turn-on cycle shall be limlted to
2.5 t$mes the input steady state true W or DC current at max~mum rated load
and nominal input voltage.

3.3.1.12 tiarmonlccurrent limitation. Each power supply shall

minimize harmonic distortion effects cm the electrical system. Power
supplies shall llmlt the harmonic content of the Input current so that no
individual harmonic line current from the second harmontc through
20 kilohertz (kHz) exceeds a magnftude of 100/n percent of the unit’s full
load fundamental current, where n 4s the harmonfc multiple number. Ilarmonlc
llne current requirements apply when power supplies are operating In the mode
thatgenerates thehlghest Input current harmontcs (see 4.7.2.2).

3.3.1.13 Power factor. The power factor shall be between 0.8 and
unity (see 4.7.2.3).

3.3.1.14 Electrical bondlnq. Power supplles shall have aminlmumof

one zero-volt reference connector pin connected directly to external parts of
the power supply (except other connector pins or parts requlrlng electrical
Isolation). OC resistance between the connector pfn and any part of the
chassts shall be 0.1 ohm maximum. The connector pin shall have a current
rating equal to or greater than the Input power pins. Non-conductive
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protective finishes shall be omitted (or removed) from bonding surfaces. The
design shall assure permanence of low impedance bonds in the presence of
humid and saline atmospheres over the power supply life.

3.3.1.15 External input filter. When specified in the associated

detail specification, an external input filter is required to enable the
power supplies to meet conducted emissions in accordancewith MIL-STD-461,
requirement CE03. The input impedance limit (see 3.10.9) of the power supply
shall be as specified in the associated detail specificationso the input
filter can be designed by the user to operate together with the power supply.

3.3.1.16 Isolation resistance. Input power connections and chassis

ground shall be isolated by not less than 10 megohms resistance at 600 VDC.
Input power connections and DC output voltage and return shall be isolated by
not less than 10 megohms resistance at 600 VDC.

3.3.1.17 Input capacitive loadinq. The capacitive loading on each

input power line to chassis ground shall be not greater than 0.02 microfarad
(Uf).

3.3.2 Output Dower.

3.3.2.1 Output voltaqe and current. Power supplies shall deliver the
DC voltages and rated currents in accordancewith the associated detail
specifications. Where more than one output voltage may be selected, the
output voltage shall be determined by the wiring interconnectionof the
system. Unless otherwise specified in the associated detail specification,
any output adjustment devices (other than pin programming) shall be Internal
to the power supply (see 3.10.6) and shall be designated as factory, depot or
shop adjust only”. If the adjustment entails a moving part (for example,
potentiometer), the part shall be secured after adjustment to prevent
movement during vibration and shock.

3.3.2.2 Output load characteristics. Power supplies shall provide the

output voltage and currents specified in the associated detail specification
for load conditions which include resistive, capacitive (up to 30 uf per
rated output ampere), and constant current loads. The requirements shall be
met for input line variationswithin the specified limits, through all
environmental extremes specified, and for any combination of these
conditions. The threshold voltage at which a constant current load shall be
assumed to operate at full rated load shall be less than or equal to 2.0 VDC.
Additional capacitive loading for parallel output shall be in accordance with
3.3.2.20.

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3.3.2.3 Total rimle and noise. Unless otherwise specified in the

associated detail specification,total peak-to-peakripple and noise in the
10 Hz to 5 megahertz (MHz) bandwidth (see 4.7.2.4) including spikes, hash,
periodic and aperiodic components, shall not exceed 1.3 percent of the
nominal output voltages of each power supply or 130 millivolts (mV),
whichever is greater, while operating over the range of 10 to 100 percent of
full rated load current and over the specified input voltage range. In
addition, the ripple and notse In a 10 Hz to 5 MHz bandwidth shall not exceed
2 percent of the nominal output voltages of each power supply or 200mV,
whichever is greater, when operated at loads in excess of 100 percent which
do not result in more than a 5 percent decrease in output voltage or at loads
below the specified minimum (see 4.7.2.4). The peak-to-peak ripple and noise
in a 10 Hz to 20 MHz bandwidth shall not exceed 6 percent of the namlnal
output voltages of each power supply.

3.3.2.3.1 Low freauencyrinnle and nofse. The peak-to-peak ripple and

noise in a 10 Hz to 10 kHz bandwidth impressedupon the output voltage shall
not exceed 0.5 percent of the nominal output voltage or 50 mV. whichever Is
greater. This requirement shall be met at full rated load current and over
the specified input voltage range (see 4.7.2.4.1).

3.3.2.3.2 Hl~h frequency ripple and noise. The peak-to-peak ripple and
noise in a bandwidth from 10 kHz to 20 megahertz (MHz) impressed upon the
output voltage shall not exceed 0.5 percent of the nominal output voltage or
50 mV. whichever is greater. This requirement shall be met at full rated
loadcurrent and over the specified Input voltage range (see 4.7.2.4.2).

3.3.2.3.3 Slnale snectral line amplitude. Mhen specified in the

associated detail specification,the amplitude of any single spectral line on
the outputs of the power supply shall meet the requirements as specified
therein under any allowable combirtatfonofinput voltage and output load
current.

3.3.2.4 Common mode output current. Comnon mode output current from
any power output terminal and return termfnal pair to the chassis shall not
exceed 200 milliamperes peak-to-peak (mAp-p) tn the 10 HZ to 20 MHz band for
any load current from 10 percent to full rated load (see 4.7.2.5).

3.3.2.5 Static line and load recwlation. Unless otherwise specified in

the associated detail specification,the steady state output voltage shall
remain within plus or minus one percent of the spectfied nominal output

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voltage at 25°C for all a- owable combinationsof input voltage and output
current. Static line and oad regulation shall be measured in accordance
with 4.7.2.6.

3.3.2.6 Static regulation temperature effects. Line and load

recmlation shall not exceed Plus or minus 2 percent of the nominal output
vo~tages of the power supply”when operated over the temperature and altitude
range specified in 3.5.2.1.1 for family Al or 3.5.2.l.2(a),3.5.2.l.2(b), and
3.5.2.l.2(d) for family A2 and for all allowed simultaneousvariations of
line voltage and load current.

3.3.2.7 Dynamic load regulation. The transient response of the output

voltage to a step change In load current shall be non-oscillatoryor highly
damped. The response shall be limited to an initial single half cycle
overshoot (undershoot)with an amplitude less than 3 percent of the nominal
output voltage. If present, the second half cycle undershoot (overshoot)
shall have an amplitude less than 1.5 percent of the nominal output voltage.
Any additional overshoot or undershoot excursions shall be within the ripple
and noise envelope specified in 3.3.2.3 (see 4.7.2.7).

3.3.2.8 D.Ynamicline regulation. The transient response of the output

voltage to a step change in input voltage shall be non-oscillatoryor highly
damped. The response shall be limited to an initial single half cycle
overshoot (undershoot)with an amplitude less than 3 percent of the nominal
output voltage. If present, the second half cycle undershoot (overshoot)
shall have an amplitude less than 1.5 percent of the nominal output voltage.
Any additional overshoot or undershoot excursions shall be within the ripple
and noise envelope specified in 3.3.2.3 (see 4.7.2.8).

3.3.2.9 Interactionof multiple output supplies. The requirements of

this specification apply to each output with all possible combinations of
output loading.

3.3.2.10 Hold-up time. Each power supply output voltage shall remain
within 3 percent regulation limits for a minimum of 50 microseconds (us) at
full rated load current following the loss of input power. This hold-up time

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requirement shall be following the loss of input power when operating at any
allowable input voltage down to and Including the minimum transient AC or DC
voltage of MIL-STD-704. When a power ~nterrupt signal $s available from the
power supply, the hold-up time requirement shall be met following the loss of
input power as indicated by the power Interrupt signal (see 3.3.4.3).

3.3.2.11 Power turn-on/turn-offresponse. Each power supply output

voltage shall rise to and remain within the regulation limits within 250
milliseconds (ins)after application of the input power (with remote on/off
control turned on (see 3.3.3.1)) and under any allowable load. The maximum
transient component of excursion of output voltage (overshoot or undershoot)
resulting from turn-on or turn-off shall not exceed plus or minus 5 percent
of the nominal output voltage. The output voltage shall rise as specified
even with an externally applled positive or negative bias on the output pins.
The positive bias shall be any voltage up to and including the upper
regulation limit of the output voltage. The negative bias shall be a current
source of 1 ampere or 10 percent of full load (whichever Is less) applled
into the negative output pins with the current return path through the
positive output pins.

3.3.2.12 Control turn-on/turn-offresponse. Each power supply output

voltage shall rise to and remain within the regulation limits within 250 ms
after turn-on of the remote on/off control and under any allowable load (see
3.3.3.1). The maximum transient component of excursion of output voltage
(overshoot or undershoot) resultlng from turn-on or turn-off shal1 not exceed
plus or minm 5 percent of the nominal output voltage. The output voltage
shall rise as specified even with an externally applied positive or negative
bias on ttaeoutput pins as specified in 3.3.2.11.

3.3.2.13 Overcurrent protection. Each output of a power supply shall

be provided with overcurrent (and short-circuit)protection with automattc
recovery. Overcurrent shall not exceed 125 percent full rated load current.
Recovery from overcurrent shall occur within 250 ms (recovery time after
removal of the overcurrent). The maximum transient component of excurston of
output voltage (overshootor undershoot) resultlng from overcurrent recovery
shall not exceed plus or minus 5 percent of the nominal output voltage. The
power supply shall operate under any overcurrent indefinitely.

3.3.2.14 Overvoltage protection. The voltage of each output of a power

supply shall not exceed 15 percent above its highest nominal output voltage.
The power supplies shall not acttvate the output overvoltage circuitry in the
event of power supply turn-on, short circu$t recovery, load or line
transients or noise spikes. Activat~ons of these types shall be

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regarded as a fa ure of the power supply. Unless otherwise specified in the

associated detai specification,overvoltage crowbar protection shall not be
used.

3.3.2.14.1 Overvoltage latch. Unless otherwise specified in the

associated detail specification,the overvoltageprotection circuit shall
latch all outputs off when an overvoltagecondition occurs on any one output.
The power supply output voltage shall reset when the Input voltage is taken
to zero and then reapplied. If the overvoltage condition has not been
cleared, the protector circuit shall trip again.

3.3.2.15 Remote voltaqe sensinq. Unless otherwise specified in the

associated detail specification,power supplies shall be capable of remote
voltage sensing up to 10 inches (length of load and sense leads) from the
power supply output terminals and compensatingfor at least a 3 percent
voltage drop of the highest nominal output voltage in the load leads between
the power supply output voltage terminals and the corresponding load
terminals. When the associated detail specificationrequires remote voltage
sensing, there shall be an applicationwarning in the associated detail
specificationthat the allowed load lead inductanceto the sense point
together with the load capacitance can affect stability. (See associated
detail specification.)

3.3.2.15.1 Ouen sensinq lead Protection. Each power SUPPIY type

requiring remote sensing shall provide protection against excessive output
voltage overshoot in the event of opening one or both remote sensing leads.
The output voltages (at the power supply terminals) shall completely recover
to and remain within plus or minus 5 percent of the nominal supply output
voltage within 100 ms after the occurrence of an open sensing lead. The
maximum excursion of output voltage measured across the power supply output
voltage terminals during this 100 ms interval shall not exceed 0.5 VDC or
plus 10 or minus 5 percent of the nominal output voltages, whichever is
greater. Reversal of the sensing leads shall not cause damage to the power
supply nor cause the power supply output to exceed the overvoltage limits.
Opening of a load lead (with sense leads connected) shall not cause damage to
the power supply.

3.3.2.16 Output impedance. The value of output impedance will be

specified in the associated detail specification.

3.3.2.17 Isolation resistance. The chassis ground shall be isolated

from the output voltage and return connections by greater than 10 megohms
resistance at 50 VDC. The outputs of multiple output power supplies shall be
isolated in accordance with the associated detail specification.

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3.3.2.18 Nonpolarized operation. Unless otherwise specified in the

associated detail specification,all power supplies shall meet all
requirements when operated as either positive or negative power supplies.

3.3.2.19 Reverse voltaqe protect~on. Unless otherwise specified In the

associated detail speciflcat~on,the power supply shall be protected against
reverse voltage on its output terminals by clamping the reversed voltage to
1.0 WXor less while sfnking uIpto 1 ampere or 10 percent of Its full load
current (whichever is less) continuously. This requirement is designed to
provide protection when an unenergized power supply has a low level leakage
current applied to its output, through load circuitry, from another
energized, opposite polarity power supply.

3.3.2.20 Parallel o~eratlon. When applicable, the requirement fQr

parallel operation shall be specified In the associated detail specification.
The following minimum requirements shall be specified:

(a) The number of power supplies of equal power rating to be

paralleled.

(b) The method of current shartng.

(c) The current sharing differential.

(d) The maximum output capacitance of each power supply.

(e) Allowed impedance Imbalance between each parallel output and the
load.

Failure modes that may cause a systemof parallel power supplles to fail
shall have a failure rate not greater than 5 percent of the faflure rate
determined by the mean time between failures (MTBF) of a s~ngle power supply
(see 3.7.1). Failure of any power supply (other than a short in the power
supply output circuitry) shall not cause failure of the output power bus.
Power supplies operating in parallel shall drive the output capacitance of
the paralleled supplies in addition to the loading required in 3.3.2.?.

3.3.2.21 Line transient response. The transient response of the output

voltage to the transient voltages specified In the associated detail
specification shall be non-osc411atoryor highly damped. The response shall
be limited to an Initial stngle half cycle overshoot (undershoot)with an
amplttude less than 5 percent of the nominal output voltage. If present, the
second half cycle undershoot (overshoot)shall have an amplitude less than

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2.5 percent of the nominal output voltage. Any additional overshoot or

undershoot excursions shall be within the ripple and noise envelope specified
in 3.3.2.3 (see 4.7.2.9).

3.3.3 Control siqnals.

3.3.3.1 Output voltaqe remote on/off. The power supply output voltage
shall be capable of being turned on and off using the remote switch
interface. This interface shall accept transistor-transistorlogic (TTL)
level (zero VDC minimum, 5.5 VDC maximum) signals. A logic high (2.0 VDC
minimum, 100 microampere (uA) maximum) or open circuit shall turn the power
supply off. A logic low (0.8 VDC maximum, 3.2 milliamperes (mA) maximum) or
connecting the remote switch pin to the remote switch return shall turn the
power supply on. When specified in the associated detail specification,
input terminals shall have lOOK ohms minimum electrical isolation at 100 VDC
from the power supply circuitry and chassis.

3.3.3.2 Voltaqe proqramminq. When specified in the associated detail

specification,each power supply output voltage shall be selectable to either
value specified using contacts on the input/outputconnector. An open
circuit shall select the lower value output voltage and a closed circuit to
the voltage programming return shall select the higher output voltage.
Spurious noise signals on the voltage programmingcontact shall not be
directly transmitted to the output being controlled. Unless otherwise
specified in the associated detail specification,there shall be a minimum of
15 decibels (dB) rejection of signals (in the frequency range of 100 Hz to
50 kttz)appearing on the voltage programmingcontact.

3.3.3.3 Susceptibilityto common mode noise. The control signals shall

not be susceptible to input common mode noise up to plus or minus
15 volts between the chassis ground and any signal lead and its return (see
4.7.2.10).

3.3.3,4 Synchronization. When specified in the associated detail

specification,the power supply shall be designed such that the switching
frequency can be synchronizedwith an external source. The synchronization
signal will be as defined in the associateddetail specification.

3.3.4 Status siqnals.

3.3.4.1 Isolation. Unless otherwise specified in the associated detail

specification,status signal outputs shall be isolated from the other power
supply circuitry and chassis by a minimum of 100K ohms resistance at 30 VDC.

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3.3.4.2 Over-temperature indication. Power supplies shall contain two

internal thermally activated normally open switchingdevices to indicate
excessive tempera~ure and unsafe tem~erature. A nornlnalunsafe temperature
is 10”C above the worst case transient critical component temperature (TCCT)
(see 3.12.1.2). An excessive temperature shall be nominally ll°C to 15°C
below the nominal unsafe temperature set point. The tolerance of the
temperature sensing devices shall be plus or minus 5°C maximum. The unsafe
indicator activation shall occur before any component damage. Both
indicators shall reset to normally open prior to the resumption of power
supply operation at or below an average thermal interface (see 6.5.7) of
85”C. The current rating of the contacts shall be at least 0.5 A resistive
at 28 VOC. The voltage drop of the closed contacts shall not exceed 0.4VOC
for any current less than 0.5 A. When specified in the associated deta’il
specification, the normally open contact sw~tching device may be replaced by
a normally high level signal or a high impedance “off” state device. In thts
situation, an excessive temperature or unsafe temperature shall be indicated
by a low level (0.4 VIICmaximum, 5.0 MA minimum) signal. The maximum
applicable external voltage shall be 30 VOC and the “off” state leakage
current at 30 VOC shall not exceed 200 microampere.

3.3.4.3 Power interrupt simal. When specified in the associated

detail specification, the power supplies shall monitor internal circuitry and
shall provide a low level signal (0.4 VOC maximum, 5.0 MA minimum) to
indicate normal prime po~er input In accordancewith 3.3.1 and a high level
signal, or a high impedance “off’$state, to Indicate that prime power is low
or has been interrupted. The power interrupt signal shall be a positive
output with respect to the power interrupt signal return. The maximum
applicable external voltage shall be 30 VOC and the “off” state leakage
current at 30 VOC shall not exceed 200 uA. As the input voltage is applied
to the power supply, the power interrupt signal shall go to a low level when
the input voltage is greater than or equal to 80 VAC RhlSline-to-neutral
input voltage but less than or equal to the turn-on threshold voltage
specified in 3.3.1.8. The power Interrupt signal shall remain low until the
input voltage drops to 75 VAC RMS line-to-neutralinput voltage. The power
interrupt signal shall settle to within 10 percent of its steady state value
within 5 usec of an initial high or low transition. The power Interrupt
signal shall delay 50 usec before indicatinga loss of power. The power
interrupt input voltage for OC and alternate input power shall be specified
in the associated detail specification.

3.3.4.4 OutPut status siqnal. The power supply BIT shall monitor each
output voltage and shall provide a single low level signal (0.4 VOC maximum,
5.OMA minimum) to indicate that each power supply output voltage is eq,ualto
or greater than 91 percent plus or minus 4 percent of Its lowest nominal

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output but less than 106 percent of its highest nominal output voltage. When
the output voltage drops below 91 percent plus or minus 4 percent, the output
status signal shall go to a,high level or a high impedance “off” state. The
output status signal shall go to a high level or high impedance “off” state
when the output voltage is greater than or equal to 106 percent of the
highest nominal, but less than or equal to the overvoltage limit specified in
3.3.2.14. The output status signal shall be a positive output with respect
to the output status signal return. The maximum applicable external voltage
shall be 30 VDC and the “off” state leakage current at 30 VDC shall not
exceed 200 uA. The output status signal shall go to a high level or high
impedance “off” state when the output voltage remote on/off control is OFF
(see 3.3.3.1). The output status signal shall settle to within 10 percent of
its steady state value within 2 ms of an initial high or low transition.
When two or more power supplies are operated in parallel, the output status
signal is not required to indicate the correct status of its own output,
since it could have voltage applied to its output from a paralleled power
supply.

3.3.4.5 Malfunction siqnal. When specified in the associated detail

specification, the power supplies shall provide a signal to indicate when an
internal fault condition exists. The malfunction signal shall be a positive
output with respect to the malfunction signal return. A low level signal
(0.4 VDC maximum, 5.0 mA minimum) shal1 indicate normal power supply
operation and a high level signal or high impedance “off” state, shall
indicate that an internal fault exists. The maximum applicable external
voltage shall be 30 VDC and the “off” state leakage current at 30 VDC shall
not exceed 200 uA, The combinationsof conditions which result in a
malfunction indication are shown in table I. The malfunction signal will
indicate a malfunction when conditionsA AND C ANO D are “yes” AND B is “no”
or when C AND E are “yes” or when F is “yes”. No other combination of
conditions shall cause a malfunction indication. The malfunction low level
signal shall settle to within 10 percent of its steady state value within
2 ms of an initial high or low transition. When power supplies are
paralleled, it may be necessary to add a malfunction signal to be capable of
detecting a faulty power supply (see 3.3.4.4).

3.3.4.6 Status siqnal noise. Noise on the power interrupt signal,

output status signal and malfunction signal outputs shall be between the
limits of -500 mV ~eak to +500mV peak (referencedto the signal return) in a
100 MHz bandwidth.- This requirement shall apply when the output is at a ‘Ow
level (0.1 to 5.0 mA current).

3.3.4.7 Visual indicators. The power supplies shall light a green

light emitting diode (LED) to indicate the status of the output voltage. The
power output LED shall be ON when the output status signal is low and sha”1

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i-
be OFF when the output status s~gnal is high or off. When specified In the
associated detail specification,the power supplies shall light a green LEO
to indicate prime power is applied. The prime power LEO shall be ON when the
Dower interrupt signal fs low and shall be OFF when the power interrupt
signal is high or off. When specified In the associated detail
specification,,the power supplies .shal?light a green LEO to Indicate the
status of internal malfunctions. The malfunction LED shall be ON when the
internal malfunction signal Is low and fs to be OFF when the malfunction
signal Is high or off. The LED shall have a minimum luminous Intensfty of
0.4 mill~candelas when viewed from a Itne centered at the Indicator and
perpendicular to the surface of the power supply. The minimum luminous
intensity at 30° (see 3.4.4) shall be 0.2 millicandelas.

TABLE 1. Malfunction combinations. 1/

output I output Over- Allowed , orl/off Other Over-

malfunc- under- current input remote internal VOItage
tion voltage voltage switch on faults
(hIF) (A) (B) (c) , (0) (E) (F)

1 Yes No Yes Yes

2 . Yes - Yes
3 - - Yes

~/ Dash denotes no requirement. W- = (AE C 0) + (C E) + F

3.3.5 Efficiency. The minimum efficiencyof the power supply shall be

70 percent for family Al and80 percent for family A2 (see 4.7.2.11).

3.3.6 Internal frequencies. Power supply Internal oscillator

frequencies shall be 25 kHz or greater.

3.3.7 Time ela~sed meter (familv Al~. When specified by the associated
detail specification, the time elapsed meter shall be military qualified (see
MIL-M-7793). Electrochemicaldeposltionmeters shall not be used.

3.4 Physical requirements.

3.4.1 Size andwelqht.

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3.4.1.1 Family Al. Unless otherwise specified in the associated

detail specificationor herein, the power supply enclosure shall be in
accordance with MIL-E-85726 except for modularity,modules, and backplane
interface.

3.4.1.1.1 Enclosure size. Enclosure MCU size shall be in accordance

with the associated detail specification. The external size dimensions,
excluding cooling interfaces,of the enclosure shall be in accordance with
00D-STD-1788. The enclosure shall come in two, four, six, and eight MCU
sizes. MCU size is equivalent to DOD-STD-1788 line replaceable unit (LRU)
size.

3.4.1.1.2 Enclosure mass. The maximum weight of the packaged power

supply including the enclosure shall be in accordancewith table I of MIL-E-
85726.

3.4.1.2 Family A2. Family AZ power supply physical characteristics

shall be in accordance with appendices B, C, and E of MIL-STD-1389.

3.4.2 Connector locations and contact assic!nments.

3.4.2.1 Famil.YAl. The input/outputconnectors shall be in accordance

with MIL-E-85726 and the associated detail specification. Connectors shall
be installed in accordance with DOD-STD-1788. Connector contact assignments
shall be in accordance with the associated detail specification.

3.4.2.2 Family A2. Unless otherwise specified in the associated

detail specification,the input/outputconnectors shall be in accordance with
appendices B, C, and E of MIL-STD-1389. Electrical functions and connector
contact assignments shall be in accordance with the associated detail
specification.

3.4.3 Hold-downs.

3.4.3.1 Family Al. Hold-downs shall be in accordance with the

associated detail specificationand MIL-E-85726.

3.4.3.2 Family A2 . Hold-downs shall be in accordance with appendices

B, C and E of MIL-STD-1389 and the associated detail specification.

3.4.4 Visual indicator location. Location of the visual indicators

shall be in accordance with the associated detail specification. Indicators
shall be mounted on the power supply surface which is most readily observable
when the power supply is installed in its field application. Indicators

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shall be mounted to permit viewing from a minimum angle of 30° in any

direction from a line centered at the indicator and perpendicular to the
surface of the power supply.

3.4.5 Modular construction (fam41yAl~. Power supplies shall be

internally structured and functionally partitioned in a modular format (see
3.11.2). The selection of specific assembly design and packagtng techniques
shall reflect the reliability and maintainabilityrequirements specified
herein and in the associated detail specification.

3.4.5.1 Modules and modular constrtictfon.When app14ed to family Al,

the terms “modules” and “modular construction”shall not be construed to mean
Standard Electronic Modules (SEM) in accordance with MIL-STD-1389.

3.4.6 Human enclineerlnq.Guidelines in applying human engineering

design criteria and principles in the design of the power supplles shall be
In accordance with MIL-STO-1472.

3.5 Environmentalrequirements.

3.5.1 Vfsible degradation. Power supplies shall not show evidence of

visible degradation as a result of being exposed to the environmental
conditions spec’ifledherein (see 4.7.1.2). Deterioration,corrosion, or
change in tolerance Ilmlts of any ~nternal or external part which could in
any manner prevent the power supply from meeting operational service or
maintenance requirements shall provide reason for the APSP-QAA to consider
the power supply as having failed to withstand the conditions of an
environmental exposure. Leakage of electrolyte, lmpregnat~ngcompounds, and
so forth shall be considered damage and cause for rejection.

3.5.2 O~eratinQ environmental requirements. Power supplies shall

perfomc ont$nuouslyw ithin the performance limits and under the
environmental cond~tions specified herein. Power supplies shall meet the
electrical performance requirements (see 3.3) prior to, during (when
applicable).and following the operating environmentaltests specified in
table 11 (family Al) and table 111 (family A2). Power supplies shall not be
damaged or degraded by the environmental conditions specified.

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TABLE II. Operatinq environmentalrequirements (family All.

Requirement Test Method and

Environment condition
paragraph paragraph

temperature 3.5.2.1.1 4.7.3.2.1 MIL-STD-81O, Method 520,

and altitude Procedure III
Vibration 3.5.2.2.1 4.7.3.3.1 MIL-STD-202, Method 204,
Condition C, 2 sweeps per
axis MIL-STD-81O,
Method 514,
Procedure I,
Category 5
Mechanical shock 3.5.2.3 4.7.3.4.1 MIL-STD-81O,Method 516,
Procedure I
Long-term 3.5.2.4 4.7.3.5 1,000 hours
stability
Radiation hardness 3.5.2.5 4.7.3.6
Ionizing dose rate 4.7.3.6.1 MIL-STD-883,Method 1023
Total ionizing dose 4.7.3.6.2 MIL-STD-883, Method 1019
Electromagnet c 3.6.1 4.7.3.7 MIL-STD-461C
pulse protection Method CS1l

Explosive conditions 3.5.2.6 4.7.3.8 MIL-STD-81O, Method 511,

Procedure I

Generated 3.5.2.7 4.7.3.9 As specified herein

acoustical
noise
Electromagnetic 3.6.1 4.7.4 MIL-STD-462
interference MIL-STD-461
Part 1,
Section 5;
Part 2

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TABLE 111. O~eratinq environmentalreuuirements (familY A2~.

Requirement Test Method and

Environment :conditlon
paragraph paragraph

Temperature 3.5.2.1.2 4.7.3.2.2 Temperature:As specified

and altitude herein Altitude:
141L-STD-202,?4ethod105,
Test Condition D
Vibration 3.5.2.2.2 4.7.3.3.2 MIL-STO-202, Method 204,
Condition C, 2 sweeps per
axis MIL-S’TII-202,
Method 214, Condition I,
Letter E, 0.5 hour
Mechanical shock 3.5.2.3 4.7.3.4.2 MIL-STO-81O,Method 516,
Procedure I

Long-term 3.5.2.4 4.7.3.5 19000 hours

stability
Radiation hardness 3.5.2.5 4.7.3.6
Ionizing dose rate 4.7.3.6.1 MIL-STO-883, Method 1023
Total Ioniztng dose 4.7.3.6.2 MIL-STO-883, Method 1019

Explosive conditions 3.5.2.6 4.7.3.8 MIL-STD-810,Method 511,

Procedure I

Generated 3.5.2.7 4.7.3.9 As specified

acoustical herein
noise
Electromagnetic 3.6.2 4.7.4 MIL-STD-462
interference MIL-STO-461
Part 1,
Sectfon 5;
Part 2

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3.5.2.1 Temperature and altitude.

3.5.2.1.1 Famil.yAl. Power supplies shall meet the requirements of

3.5.2 under the operating temperature and altitude extremes in accordance
with MIL-E-5400, class 2X (see 4.7.3.2.1).

3.5.2.1.2 Family A2. Power supplies shall meet the requirements of

3.5.2 under the following conditions (see 4.7.3.2.2.).

(a) Low temperature. Power supplies shall be subjected to a cooling fin

or mounting rib temperature of minus 55*C plus O or minus 5*C.

(b) Hiqh temperature. Power supplies shall be subjected to a cooling

fin or mounting rib temperature of 85°C plus 5 or minus O*C. .

(c) Transient temperature. Power supplies shall be subjected to a

cooling fin or mounting rib transient temperatureof 105”C plus 5 or minus
O“c. The parts derating (see 3.10.2) shall not apply while operating at this
temperature; however, no part shall exceed its maximum rating.

(d) Barometric uressure. Power supplies shall withstand a reduced

barometric pressure of 8.00 millimeters of mercury.

3.5.2.2 Vibration. Power supplies shall withstand high frequency

vibration and random vibration tests. Power supply output voltages shall
remain within specified values during vibration tests. Following the
vibration tests, power supplies shall meet the electrical performance
requirements and shall show no physical deteriorationor damage (see 3.5.2).

3.5.2.2.1 Family Al. Power supplies shall meet the electrical

performance requirements following the vibration test. Output voltages shall
remain within specified values during vibration. Power supplies shall not
exhibit any resonances below 80 Hz (see 4.7.3.3.1).

3.5.2.2.2 Famil.yA2. Power supplies shall meet the electrical

performance requirements following the vibration test. Output voltages shall
remain within specified values during vibration (see 4.7.3.3.2).

3.5.2.3 Mechanical shock. Power supplies shall meet the electrical

performance requirements following the shock test. There shall be no
physical damage or deterioration (see 4.7.3.4).

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3.5.2.4 Lonq-term stability. The output voltages of power supplies

shall not change more than 0.2 percent from the baseline value during 1000
hours operation at maximum rated continuous operating temperature (see
4.7.3.5).

3.5.2.5 Radiation hardness. Power supplles shall be radiation hardened

to the requirements herein and in 3.5.3.7. Power supplies shall meet ertd-of-
life electrical requirements (see 3.5.4.2) following operating exposure to an
ionizing dose rate of lxlOg rad (silicon (Si)) per second (see] (20 to 100
nanoseconds (ns) pulse width) and a total ionizing dose of 3x103 rad Si (see
4.7.3.6). The power supply may shut down during exposure and require the
input voltage to be taken to zero and then reapplied before resuming
operation.

3.5.2.6 ExPlosfve conditions. Power supplies shall meet the electrical

performance requirements following the test (see 3.5.2). The power supply
shall not cause ign$tion of an ambient-explosive-gaseousmixture with alr
when operating in such an atmosphere (see 4.7.3.8).

3.5.2.7 Generated acoustical noise. When specified in the associated

detail specification,the power supplies shall meet the generated acoustical
noise acceptance limtts specified therein (see 4.7.3.9).

3.5.3 Nonooeratin~ environmentalrequirements. Power supplies shall

meet the electrical performance requirementsspeclffed herein or in the
associated detail specification following exposure to the non-operating
environmental tests of table IV (family Al), or table V (family A2). Power
suppl~es shall not be required to operate continuouslyduring nonoperating
environmental tests; however, periodic operation of the power supply may be
required by specif$c test procedures to measure electrical performance.

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TABLE IV. Non-operatinqenvironmentalrequirements

Jfamily All. ~1

Requirement Test Method and

Environment
paragraph paragraph condition

Humidity 3.5.3.1 4.7.3.10.1 MIL-STD-81O, Method 507,

Procedure III

Temperature shock 3.5.3.2 4.7.3.11 MIL-STD-202, Method 107,

Condition B

Mechanical shock 3*5*3.3 4.7.3.12 MIL-STD-81O, Method 516,

Procedure V

Salt fog 3.5.3.4 4.7.3.13 MIL-STD-81O, Method 509,

Procedure I

Storage temperature 3.5.3.6 4.7.3.15 As specified herein

Radiation hardness 3.5.3.7 4.7.3.16 MIL-STD-883, Neutron

fluence, Method 1017

Solvents 3.5.3.8 4.7.3.17 MIL-STD-202, Method 215

Shelf life 3.5.4.1 ----------- 10 years

11 If specified, power supplies may be operated intermittently

durinq these tests; however, they shall not be operated
contiiiuously.

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TABLE V. Nonoperatingenvironmentalrequirements
Jfamily A2). II

Requirement Test Method and

Environment condftlon
paragraph paragraph

Humidity 3.5.3.1 4.7.3.10.2 HIL-STO-81O, Method 507,

~Procedure111

Temperature shock 3.5.3.2 4.7.3.11 MIL-STO-202, Method 107,

,CondltlonB

salt fog 3.5.3.4 4.7.3.13 MIL-STD-810, Method 509,

I Procedure I

Durability 3.5.3.5 4.7.3.14 As specified herein

Storage temperature 3.5.3.6 4.7.3.15 As specified herein

Radiation hardness 3.5.3.7 4.7.3.16 MIL-STD-883, Method 1017

Neutron fllfence
Solvents 3.5.3.8 4.7.3.17 %IL-STD-202, Method 215

Shelf life 3.5.4.1 ----------- 10 years

~/ If specified, power supplles may be operated intermittently

during these tests; however, they shall not be operated
continuously.

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3.5.3.1 Humidity. Power supplies shall withstand humid atmosphere

cycles when tested in accordancewith 4.7.3.10.

3.5.3.2 Temperature shock. Power supplies shall meet the electrical

performance requirements following the temperature shock (see 4.7.3.11).
There shall be no evidence of deteriorationor physical damage after
temperature shock.

3.5.3.3 Mechanical shock (family Al\. Power supplies shall meet the
electrical performance requirementsfollowing the shock test. There shall be
no physical damage or deterioration (see 4.7.3.12).

3.5.3.4 Salt foq. Power supplies shall meet the electrical performance
requirements following the effects of exposure to a salt-sea atmosphere.
There shall be no physical or chemical degradation. Failure mechanisms shall
include pits, crack formation, intergranularattack, and so forth (that is,
any concentrated attack that weakens the cross section) (see 4.7.3.13).

3.5.3.5 Durability (family A2~. Power supplies shall withstand a

minimum of 500 cycles of insertion and extraction into a test fixture that
represents a typical card cage rail assembly without loss of mechanical or
electrical integrity (see 4.7.3.14). Format C and E power supplies shall
also withstand a minimum of 500 cycles of lateral displacementto simulate
the use of thermal clamping devices. The lateral displacementsmay be
included in the insertion/extractionsequence or completed after the
insertion/extractioncycling. There shall be no exposure of nickel
underplating on the module connector contacts when examined under 3X
magnification (1OX for referee inspection)upon completion of this test. TO
enhance the visibility of any exposed underplating,the contacts may be
dipped in a 5 percent sodium sulfide solution for 2 minutes, plus or minus
15 seconds, and then rinsed prior to examination.

3.5.3.6 Storaqe temperature. Power supplies shall withstand a storage

temperature range of minus 55°C to plus 125°C (see 4.7.3.15).

3.5.3.7 Nonoperatingradiation hardness. Power supplies shall meet

post-irradiationelectrical requirementsfollowing exposure to a neutron
fluence of 2x1012 neutrons per centimeter squared (see 4.7.3.16).

3.5.3.8 Solvents. Power supplies using adhesive backed labels shall

meet the solvents requirementwithout the label peeling off of the power
supply surface (see 4.7.3.17).

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3.5.4 Power suDDIY life.

3.5.4.1 Shelf l~fe. Power supplies shall have a mlnlmum non-operating

shelf life of 10 years without refurbishmentprovided the storage temperature
is 40”C or less for a minimum of 95 percent of the storage time. Storage at
a temperature between 40°C and 80°C for 5 percent of the time shall not
affect shelf life. The useful shelf Ilfe shall be extended to at least
20years if refurbishment Is performed at the end of the initial
10 years.

3.5.4.2 End-of-life. Power supplies shall be designed such that

component aging effects shall not degrade the operational Iimlts by more than
the amount specified In table VI. Parameters not specified in table VI shall
not exceed the llmlts of the electrical performance characteristics speciffed
herein or !n the detail specificationover the useful Iffe of the power
supplies. When any 4ndlvldual power supply fails to conform to the end-of-
life requirements in table VI, the power supply is considered to have
completed its useful life.

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TABLE VI. End-of-life.

Total
requirement Initial
Parameter specified
saragraph limit
end-of-life

3.3.2.3 Total ripple 1.0 percent 1.5 percent

and noise 100 mVp-p 150 mVp-p

3.3.2.3.1 Low frequency 0.5 percent 0.6 percent

ripple and noise 50 mVp-p 60 mVp-p

3.3.2.3.2 High frequency 0.5 percent 0.75 percent

ripple and noise 50 mVp-p 75 mVp-p

3.3.2.5 Static regulation 1.0 percent 1.5 percent

3.3.2.13 Overcurrent 125 percent 127 percent

maximum maximum

3.3.2.14 Overvoltage 115 percent 116 percent

3.3.1.16 Input power 10 Megohms 1 Megohm

isolation minimum minimum
resistance

3.3.2.17 Output power 10 Megohms 1 Megohm

isolation minimum minimum
resistance

3.3.3.1 Control isolation lOOK Ohms 10KOhms

resistance minimum

3.3.4.1 Status isolation lOOK Ohms 10K Ohms

resistance minimum minimum

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3.6 Electromagneticenvironmentaleffects (E3).

3.6.1 E3 requirements [famllv Al). Unless otherwise specified in the

associated detail specification,the power supply shall meet the requirements
of MIL-!WI-461, part 2 for class Ah equ~pment as modtfied below.

(1) Conducted emissions. The power supply Input power leads shall comply
with the emissions requirements of CEOI and CE03.

(2) c~. The power supply shall operate without

malfunction or degradation beyond specified Ilmlts when subjected to the -
susceptibilityrequirements of CSO1, CS02, and CS06. The susceptibility
signals for CSOI and CS02 shall be 3 volts peak-to-peakminimum.

(3) Conducted susceptibi1Itv. electromacmetlcsmlse. The power supply

shall not exhibit any permanent malfunction or upset when subjected to
susceptib~lityrequirements of CS1l.

(4) Radiated emissions. The power supply shall comply with the emission
requirements of REOI. The requirement for RE02 shall be extended along the
standard specification limlt to 18 GHz.

(5) Radiated susce@ibi 1ity. The power supply shall operate without
malfunction or degradation beyond specified limits when subjected to the
susceptibility frequencies and modulations as outlined in table VII for RS03.
The power supply shall operate without malfunction or degradation beyond
specified limits when subjected to the susceptibilityrequirementsof RS06.

3.6.1.1 Ground plane interference. The equipment shall meet the

following requirements for ground plane interferencein accordance with
figure 1. No malfunction or degradation of performance shall be produced
when noise signals, in accordance with the following requirements,are
injected between each ground plane. (Test sample and test ground plane.)

(1) Thre$ volts R14Sfrom 320 Hz to 500 Hz (not to exceed 150 mA RMS
current).

(2) One volt RMS from 500 Hz to 20 MHz (not to exceed 150 mA RMS current
for frequencies between 500 Hz and 50 kt4z,and not to exceed 1 watt from a 50
ohm source for frequencies above 50 kHz).

(3) t8volt pulses, 70 microsecondswide at 100 pulses per second not to

exceed 15 amps peak current.

(4) 21 volt dc (not to exceed 150 nulcurrent).

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TABLE VII. Hiqh level RS03 table.

Field Field
Frequency lJ Modulation
Type Pulses/see density ~i strength ~)
(MHz) pulse width (V/m)
(mw/cm2)

0.014-850 AM ~/ 90% 1 ktizsine wave 0.66 g/

215-225 PAM ~/ 10 usec 200 10.6 ~i ::0
215-225 PAM 200 usec 200 10.6 200
400-450 PAM 4 usec 300 10.6 200
850-940 PAM 10 usec 1000 10.6 200
850-940 PAM 125 usec 300 10.6 200
940-1215 PAM 10 usec 1000 10.6 200
1215-1365 PAM 10 usec 3000 10.6 200
1365-2900 PAM 1 usec 1000 10.6 200
2900-3100 PAM 3 usec 1000 10.6 200
2900-3100 PAM 70 usec 200 10.6 200
3100-3500 PAM 10 usec 3000 10.6 200
3100-3500 PAM 50 usec 3000 10.6 200
3500-9000 PAM 1 usec 1000 10.6 200
9000-14000 PAM p.2 usec 1000 10.6 200
14000-18000 PAM 0.2 usec 50000 10.6 200
33000-33400 PAM 0.2 usec 2000 0.106 20

~/ Frequency ranges listed with more than one modulation shall be repeated
as necessary to include all different modulations shown.
~/ Peak power density for PAM signals is defined as the power density as
measured with an average power measuring device if the generator Is run
CW; that is, average power density within the pulse envelope.
~/ Volts per meter equivalent shown for reference only.
~/ Amplitude modulated.
~/ Average power density.
i5/ Pulse amplitude modulated.
~/ Peak power density.

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RF
Voltmeter I
Test Interconnecting

FL&, Sample
Cable

P ~Short Lead

...%J
.*..*.. ........
Bond Bond
T Adapter
.....
....... ...**..
. . . . . . . .. ..
. . . . . . . . . . . . . . . i....~.
Ground Plane ~::::::::::::::::::::: ...... . . . . . . . . .
.. .. .. .. ..
.**.. ....*....
● *.........,
...
Ground Plane InterferenceTest Setup (50 ktlzto 100 Mtiz)

InterconnectingCable * 1

. . . .. ...~. Test sample shall be

*..
. . . . . .. .. .. ..*. .. .. ....*
. ..
1 I
L
Voltmeter I
I isolated from ground
t Ground Plane
I

1- Audlo or
Spike*
Generator

Current
* Used for Spike Test probe to
Oscilloscope

Ground Plane InterferenceTest Setup Spike Test (320 ~Z to 50 kllz)

FIGURE 1. Ground plane SMC,Dtlblll,Y requirements.

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3.6.2 E3 requirements (famiI.yA2). The power supply shall meet the

applicable emission and susceptibilityrequirementsas shown below:

3.6.2.1. Module shieldinq. Each module shall provide, as a minimum, 40

dB of shielding effectivenesswithin the frequency range of 1 MHz to 1
GHz.

3.6.2.2 Conducted emissions. frequency domain. inr)utpower and return

leads. Conducted emissions measured at the input power leads shall not
exceed the limits specified on figure 2.

3.6.2.3 Conducted susceptibility.input Power and return Pins. The

power supply modules shall not exhibit any malfunction, degradation of
performance, or deviation from specified indications,beyond the tolerances
indicated in the individualmodule specificationwhen subjected to
susceptibility signals as described below on the input power and return
lines. The requirement is assumed to be met if 3 amperes occur before the
specified voltage on figure 3, and for 1 volt (rms) in the frequency range of
100 kHz to 400 MHz.

Modulation: 30 Hz to 50 kHz continuous wave

50 kHz to 400 MHz 80 percent amplitude modulation,
800 Hz sine wave

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100

90
~

3
w 40

30
0.61 0:1 i 160 100 0
FREQUENCY (~Z)

. . .
FIGURE 2. cted rec~ .

FREQUENCY (~Z)

FIGURE 3. Conducted suscent ibilitv limit, inmt wower and return

m.

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3.6.2.4 Conducted susce~tibllity,all pins. The modules shall not

exhibit any malfunction, degradation of performance,or deviation from
specified indications,beyond the tolerances indicated in the individual
module specificationwhen each pin is subjected to a damped sinusoid with
Imax as described on figure 4, at a minimum of 10 pulses per second.

Current waveform:

Ilft
‘T sin (21?ft)
I = IMAX e

Where: f = test frequency

Q = quality factor, 20f5
t= time in seconds
1X1O’

1X1OO

1X1(J2

1X1CT3 1X1(J2 lXICY’ lXIC$ 1X1O’ lxld lxld

FREQUENCY (~Z)

FIGURE 4. Conducted susceptibilitylimit power SUPP1.Ymodules.

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3.6.2.5 Radiated emlsslons, maqnetlc field. Themagnet~c field

emissions of any power supply module shall not exceed the level as specified
on figure 5, at 10 centimeters distance from the module case and connector.

3.6.2.6 Radiated susceptibility.maqnetlc f~eld. The ~dules shall not

exhtblt any malfunction, degradation of performance,or devlatlon from
specified Indication,beyond the tolerances Indicated in the Indlvldual
module specificationwhen subjected to a magnetfc field as specified on
figure 5, as measured at a distance of 10 centimeters from the module face
and connector.

Ixld 1X1U3 1X102 lxlcr’ lxld Ixlof lXIC?

FREQUENCY (~Z)

FIGURE 5. Radiated mametic field llmit emissions and susceptibility.

3.6.2.7 Radiated susce~tibillty.electric field. The modules shall not

exhibit any malfunction, degradation of performance,or deviation from
spec~fled Indication, beyond the tolerances indicated in the Individual
module specificationwhen subjected to an electr$c field at the levels and
modulations speclfled below.

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1 MHz to 400 MHz 40 V/m rms, 90 percent amplitude modulated,

800 Hz sine wave

200 MHz to 18 GHz 60 V/m rms, (under the modulation envelope),

800 Hz square wave

Pulsed - 2 usec pulse width

50 kHz PRF
800 Hz square wave

3.6.2.8 Electrostaticdischarqe. The modules shall not exhibit any

malfunction, degradation or performance,or deviation from specified
indication, beyond the tolerances indicated in the individualmodule
specificationwhen each pin is subjected to a 4 kilovolt discharge and when
the module case surface is subjected to a 25 kilovolt discharge sourced from
a 150 picofarad (t5 percent) capacitor in series with a 150 ohm (t5 percent)
non-inductive resistor.

3.7 Reliability.

3.7.1 Reliability requirement.

3.7.1.1 Family Al. Each power supply shall have a minimum predicted
MTBF of 40,000 hours for Naval sheltered use environment. Minimum predicted
MTBF for airborne uninhabited use environment shall be 15,000 hours (see
4.7.5.1.1).

3.7.1.2 FamilYA2. Each power supply shall have a minimum predicted

MTBF of 20,000 hours for Naval sheltered use environment. Minimum predicted
MTBF for airborne uninhabited use environment shall be in accordance with the
associated detail specification (see 4.7.5.1.2).

3.7.2 Environmental stress screeninq. Power supplies shall meet the

performance requirements following environmentalstress screening (also known
as preconditioning,burn-in, manufacturing screening). Power supplies shall
be 100 percent tested to the stress screening tests as specified in 4.7.5.2.
There shall be no evidence of deteriorationor physical damage after the
stress screening (see 4.7.1.2).

3.8 Maintainability.

3.8.1 Maintenance. Unless otherwise approved by the conunandor agency

concerned, each power supply shall be repairable. Subassembliesof high
reliability or relatively low cost shall be considered as nonrepairable. The

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power supply supplier shall inform the command or agency concerned of those
circuits which he proposes as nonrepairablesubassemblies,and shall obtain
approval therefor.

3.8.2 Service and access. The power supplies shall be designed for
maximum ease of maintenance and shall be designed to provide for personnel
protection during maintenance (see 3.15). Parts requiring adjustment or
replacement shall be readily accessible without major disassembly (see
3.10.7). Test procedures, fault isolation, and subassemblyreplacement
should be simple and capable of being performed by semiskilled,user-trained
personnel employing a minimal amount of test equipment and tools. No special
tools (in accordance with MIL-STO-454, requirement63) shall be required for
field or depot-level maintenance. Maintenance data for test, fault tsolat’lon
and repair of the power supplies shall be prepared and submitted in
accordance with MIL-STD-2038.

3.8.3 Test points. Each power supply shall have internally accessible
test points to the extent necessary in field and depot level maintenance to
allow isolation of a failed subassemblywithout removal of the power supply I
subassembly. Protection shall be provided in test point ctrcuitry
susceptible to damage caused by the grounding of test points.

3.8.4 Part nrotectlon. Power supplies shall be designed so that parts

will not be susceptible to damage during servicing and maintenance of the
power supplies.

3.9 Parts, materials and processes.

3.9.1 Selection. Parts, materials and processes shall be selected in

accordance with MIL-E-5400. This shall not relieve the power supply
manufacturer (see 6.5.3) of the responsibilityfor complying with all power
supply performance and other requirements set forth herein and in the
associated detail specification.

3.9.2 Standard Darts. Maximum utilization shall be made of standard

parts. Standard parts are those parts specified in:

(a) MIL-STO-454 or

(b) other standards and specifications,as specified here, where

approval of these parts prior to use is not required.

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3.9.3 Nonstandard parts. Nonstandardparts shall not be used without

approval in accordance with MIL-STD-2038.
3.9.4 Choice of Parts and materials. The power supply manufacturer
shall select and use items having the broadest characteristicsand of the
greatest allowable tolerances that will fulfill the performance’requirements
of the power supply. Performance shall not be dependent on the selection of
special values for individual parts.

3.9.5 Materials. Materials used in the manufacture of the power

supplies shall be in accordance with the requirements specified herein.
Materials shall be certified in accordancewith applicable Government
specificationswherever so listed. When a material is not specified, a
material shall be used which will enable the power supplies to satisfy the
requirements specified herein. Acceptance or approval of a constituent’
material shall not be construed as an assurance of the acceptance of the
finished product.

3.9.5.1 Encapsulation and embedment. The encapsulationand embedment of

electronic parts and assemblies shall be in accordance with MIL-STCJ-454,
requirement 47.

3.9.5.2 Moisture and funqus resistance. Power supplies shall be

designed so that the materials used are moisture resistant and non-nutrient
for fungus. Fungus nutrient may be used in hermetic assemblies and other
accepted and qualified uses. Other fungus nutrient materials, which are
deemed necessary, and are approved by the command or agency, shall be treated
by a method which will render the resulting exposed surface fungus resistant.
For fungus-inert material see requirement4 of MIL-STD-454.

3.9.5.3 Flammability. Materials used in fabricationof any power supply

shall be nonburning or self-extinguishingin accordancewith MIL-STD-454,
requirement 3. Materials shall be self-extinguishingwithin 5 seconds after
removal of the flame when tested in accordancewith MIL-STD-202, method 111.

3.9.5.4 Use of toxic material. Materials which are capable of producing

dangerous gases or having other harmful toxic effects over the temperature
range of minus 65°C to plus 125”C, or when exposed to fire, shall not be
used. The material shall have no adverse effect on the health of personnel
when used for its intended purpose. Questions pertinent to this effect shal1
be referred by the APSP-QAA to the appropriatedepartmentalmedical service
who will act as an advisor to the APSP-QAA. The power supply manufacturer
shall furnish to the APSP-QAA the toxicologicaldata and formulations
required to evaluate the safety of the material for the proposed use.

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3.9.5.5 Dissimilar metals. The use of dissimilar metals fn direct

contact with one another shall be avoided where possible. Uhere diss~milar
metals are used, protection against electrolytic-corrosionshall be applied
in accordance with 141L-STD-889.The preceding does not apply where
dissimilar metals are joined to provide informationinternal to the power
supply (for example, temperature sensing).

3.9.5.6 Processes. Materials used In the power supplies shal” be

corrosion resistant types or shall be processed to resist corrosion. Gold,
nickel, rhodium, tin, lead-tln alloys, or sufficientlythick plating of these
metals are satisfactory without additional protection or treatment other than
buffing or cleaning. Other materials shall have protective fln4shes in
accordance with MIL-E-5400 except as modified herein. The protective
treatment of surfaces shall enable the power supplles to meet the
requirements specified herein. Acceptance or approval of a protective
treatment shall not be construed as an assurance of the acceptance of the
finished product.

3.9.5.7 UndCCeDtable materia~S. Unacceptablematerials in accordance

with MIL-E-5400 shall not be used.

3.9.5.8 Recovered materials. Unless otherwise specified herein, all

equipment, material, and articles incorporatedin the power supplies shall be
new and shall be fabricated using materials produced from recovered mater~als
to the maximum extent practicable without Jeopardizing the intended use. The
term “recovered materials” means materials which have been collected or
recovered from solid waste and reprocessedto become a source of raw
materials, as opposed to virgin raw materials. None of the above shall be
interpreted to mean that the use of used or rebuilt products is allowed under
this specification unless otherwise specified.

3.10 Electrical desiqn and construction.

3.10.1 Com~onent selection. Electroniccomponents and hardware used in

power supplies shall have a demonstrated quality level and environmental
performance equivalent to or better than that of available military parts.
tdonhermeticallysealed packaged relays having hermetically sealed equivalents
shall not be used. Met slug tantalumcapacitors, except per 141L-C-39006/22,
shall not be used.

3.10.1.1 Germanium semiconductors. Germanium semiconductors shall not

be used.

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3.10.1.2 Discrete semiconductors. Discrete semiconductorsused in

power supplies shall be in accordancewith the requirements of MIL-S-19500
and shall be selected according to the following priority list. Devices
listed in (b), (c), and (d) shall be approved by the APSP-QAA prior to use.

(a) MIL-S-19500 JANTX devices listed in MIL-STD-701.

(b) Other MIL-S-19500 JANTX devices.

(c) Devices being considered for a MIL-S-19500 JANTX detai1

specification. Devices shall be equal to or better than MIL-S-19500 JANTX
devices.

(d) Other devices. Devices shall be equal to or better than MIL-,S-19500

JANTX devices.

3.10.1.3 Intewated circuits. Integratedcircuits shall be In

accordance with the following requirements.

3.10.1.3.1 Quality requirements. Integratedcircuits shall be in

accordance with the requirementsof MIL-M-3851O,class B. The power SUPPIY
manufacturer shall use ”MIL-M-38510JAN Qua”ified Products List (QPL) devices
when available or acquire other devices in accordancewith the “Provisions
for use of MIL-STD-883 in conjunctionwith compliant non-JAN devices”
paragraph of MIL-STD-883. Equivalent spec”fications shall be submitted to
the APSP-QAA for approval prior to initial qualification. Equivalent
specificationsexcluding DESC standard roil”tary drawings (SMD) shall include:

Screening shall be to MIL-STD-883,method 5004, class B.

Quality conformance shal1 be demonstrated in accordance with MIL-

method 5005, groups A, B, C, D, and E (if applicable),class B.

Generic data is acceptable for demonstratingquality conformance in

accordance with MIL-STD-883, method 5005, groups C and D, class B. A generic
family shall be electrically and structurallysimilar integratedcircuits.
They are designed to perform the same type of basic circuit function using
the same basic circuit element configurationand differ only in the number of
identically specified circuits which they contain. They are designed for the
same”supply, bias, and signal voltages and for input-outputcompatibility
with each other under an established set of loading rules. They are enclosed
in packages of the same constructionand outline, differing only in the
number of active external package leads included or used, and made from the
same materials by use of the same processes.

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3.10.1.3.2 Selection reciuirements. Integratedcircuits shall be fn

accordance with the requirementsof I4IL-M-3851Oand shall be selected
according to the following priority list. oevlces l~sted in (b), (c), (d)
and (e) shall be approved by the APSP-QAA prior to use.

(a) ?41
L-O!-3851OJAN tnicroc~rcuits11stealtn the table of preferred
devices in MIL-STD-1562.

(b) Other MiL-M-38510 microcircuits not 1istealin the tables of

logistics or continuous replacements, inactive or suspended military
activity, or not recommended under any circumstancesin MIL-STO-1562.

(c) Other microcircuits listed in the table of potential standardization

candidates in MIL-STD-1562 as preferred for new designs.

(d) DESC ShlOmicroclrcuitsnot listed in the tables of logistics or

continuous replacements, inactive or suspended military activity, or not
recommended under any circumstances in MIL-STO-1562.

(e) Other microcircuits (see 3.10.1.5).

3.10.1.4 Passive components. Passive components shall be selected

according to the followfng priority list. Devfces listed in (c), (d), (f),
(9), (h), and (i), shal1 be approved by the APSP-QAA prior to use.

(a) Established reliability (ER) specificationparts (minimum level R if

multiple sources exist) listed in MIL-STII-454requirements 2, 10, 33, 50, 57
and 58. (If multiple sources of level Rparts do not exist, level Pparts
may be used to achieve multiple sources). Passive components shall be as
listed inhiIL-STO-454requirements 2, 10, 33, 50, 57 and 58.

(b) ER parts (minimum level M if required to achieve multiple sourcing)

listed in MIL-STD-454 requirements 2, 10, 14, 33, 50, 57 and 58.

(c) Other ER parts.

(d) Conventional mi1itary specifIcation parts.

(e) ERparts that use the Weibull failure rate prediction method, as
specified im MIL-C-39003, shall require a B minimum failure rate level.

(f) Other passive components.

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(g) Carbon composition resistors may be used in special applications

(high voltage or high current surge) when approved as nonstandard parts.
Specificationsfor these nonstandard parts (includingMIL-R-39008 carbon
composition resistors) shall include appropriateparametric and quality
requirements.

(h) Aluminum electrolytic capacitors, style CUR02, MIL-C-39018/9 can only

be used after approval of the nonstandard part request.

(i) Connectors shal1 be designed to prevent corona discharge. When

voltages exceed 315 VDC or 223 VAC, the connectors shall comply with
requirement 45 of MIL-STO-454.

3.10.1.5 Other microcircuits. All other microcircuits shall include the

following information in the non-standardpart specification.

(a) Device nomenclature,marking, configuration,group A electrical

requirements for the full military temperature range which will insure form,
fit, function, and interchangeability.

(b) The required sampling and screening plans which will allow the
procured devices to be in accordance with the “Provisionsfor the use of MIL-
STD-883 in conjunction with compliant non-JAN devices” paragraph of MIL-STD-
883. Hybrids shall meet the requirementsof MIL-H-38534 for a class B
product assurance level.

(c) Hybrid microcircuit suppliers shall be certified to MIL-STD-1772 or

in the process of receiving MIL-STD-1772 certificationand will be audited by
APSP-QAA.

3.10.1.6 Maqnetic components. Transformers and inductors shall be in

accordance with MIL-STD-454, requirement 14. Only temperature classes V, T,
and U of MIL-T-27 shall be used. Magnetic components shall be subjected to
100 percent thermal-shock screening in accordancewith MIL-STD-202; method
107, test condition B.

3.10.2 Parts deratinq. Electrical parts shall not be stressed more than
the percentage of their rated value specified in table VIII, in the
environments specif~ed in 3.5 (except for the 105”C thermal transient
paragraph 3.5.2.1.2(c)),at nominal input voltage and at maximum rated output
power. Parts shall not be stressed more than their maximum rated vatue at
maximum input voltage and maximum rated output power. Electrical parts which
are stressed more than the indicated percentages shall be approved by the
APSP-QAA.

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TABLE VIII. Parts deratinq.

Deratlng Percent of r~ted

Part type
parameter (or indicated value)

Resistors
Carbon composition Power/voltage 50/80
Film high stability Power/voltage 50/80
Wirewound accurate Power/voltage 50/80
Wfrewound chassis Power/voltage 50/80
rnountlng
Variable wlrewound Power/voltage 50/80
Variable non-wlrewound Power/voltage 50/80
Thermistor Power/voltage 50/80
Tantalum nitride chip Power/voltage 50/80

~apac~tors
All Ripple voltage or 50
rtpple current
Ceramic Voltage 50
Glass Voltage 50
Mica:
Dipped Voltage 60
Molded Voltage 40
Film dielectric Voltage 50
?4yl
ar Voltage
Paper Voltage ;:
Tantalum soljd (100 Voltage 50
percent current surge
test required) Reverse vo~tage 2 percent of
rated
DCUp to 85°C
Reversevoltage 1 percent of
rated
DC from 85°C to
125°C
Tantalum wet (Style CLR 79, Uoltage 60
?41L-C-39006/22,only) Reverse voltage
Tantalum foil Voltage 5;

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TABLE VIII. Parts deratinq - Continued.

Deratlng Percent of rated

~art type
parameter (or indicated value)

!luminum Electrolytic (style Voltage 70

CUR02, MIL-C-39018/9 only) Reverse voltage 0
~onnectors Contact current 50 percent of max.
rating
Parallel contacts 37.5 percent of max.
rating
Working voltage 25 percent of
dielectric
withstanding
voltage
~agnetic devices Hot spot temperature 30”C below
(see 3.12.1) insulation rating

Temperaturerise above
thermal interface
(see 3.12.1) 40”C max.
Voltage, continuous
Voltage, surge ::
Voltage, insulation
breakdown 25
Current density 2.OmA per
circ mll
4.0 mA
RF coils Current density per circmil
Relays (foi1 conductors)
Current !:
Contact power 50
Contact current resistive
(centinuous) 25
inductive

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TA8LE VIII. Parts deratlnq - Continued.

leratlng ~ercentof rated

‘arttype Oarameter [or indicated value)

Dontactcurrent 10
(surge)
:011 energize/ tender’s
jropout voltage wninal rating

Ifbratlon ?5 g/

;Witches Contact current resisttve 50

!nducttve 25
Contact voltage 50

‘transistors,
bfpolar, Power~/ 50
)ower,and FET Forward current 50
Reverse voltage across
and junction
Continuous
Transientpeak ;:
Junction temperature llOEC (see 3.12.1)

liodes
Switching, general purpose, Current (surge)
rectifier, thyristor Current (continuous) %
Voltage, peak inverse 65
Zener Power 50
Al 1 Junction temperature 11O”C (see 3.12.1)

Current
Voltage (signal)
Voltage (surge)
Voltage, reverse
junctIon:
Signal 65
Surge 85

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TABLE VIII. Parts deratinq - Continued.

Derating Percent of rated

Part type
parameter (or indicated value)

Microcircuits, continued
Digital ~/ Supply voltage Hold to vendor’s
nominal rating
Fan out 80

All Junction temperature 11O”C (see 3.12.1)

1/
-- Maximum ratings as determined by the safe operating area (SOA)
curves for power switching transistors shall not be exceeded.

~/ Many families of digital microcircuitsexhibit additional

characteristicswhich may require derating (for example,
toggle frequency, hold times).

~/ This derating includes any contribution by the devlcemountlng.

3.10.3 Internal wirinq and cablinq. The use of internal wiring and
cabling shall be minimized to the greatest extent possible. When internal
wiring and cabling is required, it shall be in accordance with MIL-STD-454,
requirements 45, 69 and 71.

3.10.4 Printed-wirinci and Printed-wirinqassemblies. Printed-wiring

and printed-wiring assemblies shall conform to the following requirements.
Equivalent materials, processes, and requirements shall be utilized only when
approved by the APSP-QAA. These equivalent materials, processes, and
requirements shall be documented and forwarded to the APSP-QAA for review and
approval. The board will be laid out to prevent corona and electrical
breakdown as specified in requirement 45 of MIL-STD-454.

3.10.4.1 Riqid printed-wirinqboards. The design of rigid printed-

wiring boards shall be in accordance with MIL-STD-275. The quality of rigid
printed-wiring boards shall be in accordancewith MIL-P-5511O.

3.10.4.2 Printed-wirinqassemblies. The design and quality of printed-

wiring assemblies shall be in accordance with MIL-STD-2000.

3.10.4.3 Flexible ~rinted wirinq and assemblies. The design and

quality of flexible printed-wiringand assembles shall be in accordance with
MIL-P-50884, type 1, class B.

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3.10.5 Thick film multilaver interconnectboards [M13s) and assemblies.

All thick film MIBs and assemblies shall conform to the following
requirements. Equivalent materials, processes, and requirements-shallbe
utilized only when approved by the APSP-@A. These equivalent materials,
processes, and requirements shall be documented and forwarded to the APSP-QAA
for review and approval.

3.10.5.1 Thick film MIBs. The design of thick fllm141Elsshall be 4n

accordance with MIL-STO-1389, appendix F. The quality of thick film M18s
shall be in accordance with the requirementsof MIL-14-28787,appendix B (see
6.5.6).

3.10.5.2 Thick filmM18 assemblies. The design and quality of thick

filmM18 assemblies shall be in accordance with MIL-STO-1389, appendix H (see
6.5.6).

3.10.6 Internal adjustments. NO externally accessible adjustments

shall be permitted. Any output adjustment devices (other than pin
programming) shall be internal to the power supply and shall be designated as
factory, depot, or shop adjust only. If adjustment entails a moving part
(for example, a potentiometer),the part shal1 be secured after adjustment to
prevent movement during vibration and shock.

3.10.6.1 Ranqe of ad~ustments. The range of all adjustments to the

power supply shall be such that no damage can be Induced as a result of the
adjustment being set anywhere in Its range.

3.10.7 Failure limitation. The design shall limit failures to the

power supply in which the fault occurs. That is, a failure in one power
supply shall not induce a subsequent failure outside of the failed power
supply. The design shall limlt failure propagationwithin the power supply
to the greatest extent possible.

3.10.8 Powered socket. Power supplies shall not be removed from, or

inserted into, a powered socket. Marking on the power supply shall contain
this precautionary information.

3.10.9 Desiqnof the Dower SUPPIY forstabillt.~. The power supply

shall be designed to maximize the stability of the power supply when
operating with airborne power source impedances [Instability,if it occurs,
is caused by the source impedance being higher than the power supply negative
input impedance and forming a negative resistance osc~llator). To achieve
this stability, the design shall utilize features such as damping to minimize
the gain or peaking at resonance of its input filter network and shall
incorporate self turn-off under low Input voltage conditions (see 3.3.1.7).

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The manufacturer shall measure the power supply input impedance over the
input voltage range from maximum down to power supply turn-off and over a
frequency range of 50 Hz to 100 kHz or up to the voltage feedback loop gain
crossover frequency (whichever is greater) to evaluate the design. An
accurate computer model of the input network will be generated by the
manufacturer. The measured data and computer model and curves obtained from
this computer model shall be submitted to the APSP-QAA for evaluation. The
associated detail specificationshall define the criteria for an acceptable
model. The computer model will be made available to system manufacturers
utilizing the APSP power supplies.

3.11 Mechanical desiqn and construction.

3.11.1 General desiqn features. The power supplies shall be designed

such that their physical characteristicsenhance their ability to meet the
electrical performance requirementswhen exposed to the environments
specified in 3.5 (see 3.3). The designs shall incorporatefeatures which
will provide for operational use, repair, handling and storage without the
use of special tools, handling equipment or techniques. Design and
construction shall be in accordancewith MIL-E-5400 except as specified
herein or in the associated detail specification.

3.11.2 Internal modularity (family All.

3.11.2.1 Connectorized. The internal modules of the power supply

shall be configured such that all input and output terminationsare made
through connectors or solderless terminals. Keying shall be provided such
that each module type is uniquely keyed. Connectors used on internal modules
shall withstand 100 insertions and extractionswithout degradation.

3.11.2.2 Modular interchanqeabilit.y.Power supply types shall be

designed such that maximum commonality of internal modules is achieved among
power supply types. Internal modules of a given type shall be mechanically
and electrically interchangeableregardless of the power supply in which they
are used when operated within the required power supply design limits.

3.11.3 Power SUPD1.Yinterchangeability. Power supplies of a given

type shall be mechanically and electrically interchangeableregardless of the
system in which they are used when operated within the required power supply
design limits.

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3.11.4 Nonformal.coatinq.

3.11.4.1 FamilYA1. Unless otherwise approved by the APSP-QAA,

printed-wiring board assemblies shall be conformably coated in accordance
with HIL-C-28809 and MIL-I-46058, except that silicone resin shall not be
used. The conformal coating shall be a continuous, homogeneous, fully cured
mater$al which covers all components, leads, and clrcultry, except grounding
surfaces. The coating thickness may vary wfth the Irregularityof the
surface.

3.11.4.2 Fam~lY A2. The conformal coating shall be In accordance with

the confomal coating requirementsof MIL-S’TD-1389,appendix H. The
conformal coating shall be a continuous, homogeneous, fully cured material
which covers all components, leads, and circuitry, except grounding surfaces.
The coating thickness may vary with the irregularityof the surface.

3.11.5 External connections. The method of external connection to the

power supplies shall be as specified herein and in the associated detail
specification (see 3.4.2). Hhen multiple connector contacts are specified
for an interface function (such as an output) for current capacity,
redundancy, and so forth,,all mult~ple contacts for each function shall be
used to interface the power supply to external sources and loads.

3.11.6 Mountinq Ifamily Al). The power supplies shall be designed for
mounting in accordance with the requirementsof MIL-E-85726.

3.11.7 Finishes and Protective treatments. The finishes and

protective treatment of surfaces shall enable the power supply to meet the
requirements specified herein. Acceptance or approval of a finish or
protective treatment shall not be construed as an assurance of the acceptance
of the finished product.

3.11.7.1 FamllyA1. External aluminum alloy surfaces of the power

supply shall be anodized !n accordance with MIL-A-8625 (type optional) or
chromate conversion coated in accordance with MIL-C-5541 (class optional).
External chromate conversion coated surfaces and steel surfaces of the power
supply shall be painted. Pa~nting of anodized surfaces is optional. The
finished color of all external surfaces, except the mauntfng surface, shall
be Lusterless Gray Color No. 36231 of FEO-STO-595. The surface finish of the
power supply shall be free of any imperfectionsthat have a detrimental
effect upon the performance of the unit.

3.11.7.2 Family A2. MIL-STO-889 shall be used in the selection of

finishes and protective treatments to insure galvanic corrosion protection.

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3.11.7.2.1 Frame surface. Frame surface treatments shall be as

specified in appendices B, C and E of MIL-STD-1389.

3.11.8 Ke.yinq[family All. Power supply connectors shall be keyed in

accordance with the associated detail specificationand MIL-C-38999 or MIL-C-
83527.

3.11.9 Mechanical conficwrationrequirements [family A2\. The power

supply mechanical configurationsare specified in appendices B, C and E of
MIL-STD-1389. Power supplies shall be capable of meeting the requirements
specified in 3.11.9.1 through 3.11.9.6.5.4without mechanical or electrical
degradation (see 4.7.6).

3.11.9.1 Deuth. Unless otherwise specified in the associated detail

specification,the only parts of the power supply that extend below the
interface plane are the keying pins, contacts, and pin shields. When
specified in the associated detail specification,the body of the power
supply on multiple increment power supplies is permitted to extend below the
interface plane within the limits specified in appendices B, C and E of MIL-
STD-1389.

3.11.9.2 Rib structure. The power supply ribs shall perform the
following functions.

(a) Alignment during insertion or extraction.

(b) Retention.

(c) Cooling.

The rib configuration is shown in appendices B, C and E of MIL-STD-1389.

3.11.9.2.1 Rib strenqth. Individualpower supply ribs shall withstand

a torque of 10 inch-pounds (1.1 newton-meters)minimum maintained for 10 to
15 seconds (see 4.7.6.1).

3.11.9.3 Pin shields. Power supplies shall be provided with pin

shields to protect the contacts. Details of pin shields are specified in
appendices B, C and E of MIL-STD-1389. Power supplies are required to have
pin shields adjacent to each outside row of power supply contacts. Pin
shields shall be of a nonconductingmaterial or, if of a conducting material,
the outside surface of the shield shall be treated in a manner that will
prevent conduction into the base conducting material.

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3.11.9.3.1 Pin shield retention. The pin shield shall withstand,

without visible separation from Its base, a force of 4 pounds (18 newtons)
minimum fsee 4.7.6.2). The requirement shall be met after exposure to all
manufactbing proces~ temperatures, includingprecondltion~ngo

3.11.9.4 Fin and header structure. The power supply fin for format B
and the header structure for formats C and E shall be as specified In
appendices B, C and E of f41L-STO-1389.

3.11.9.4.1 Power supplv toraue. Format 8 power supplies shall

withstand a 6 inch-pound (0.68 newton-meter)mlnlmum torque and format C and
E power supplies shall withstand a 25 tnch-poundminimum torque (2.S3 newton-
meters) (see 4.7.6.3).

3.11.9.4.2 Header torque. Format 8 power supplies shall withstand a

6 inch-pound (0.68 newton-meter)minimum torque and format C and E power
supplies shall withstand a 10 inch-pound (1.1 newton-meter)header torque
without detrimental effect to the mechan~cal or electrical properties of the
power supply (see 4.7.6.4).

3.11.9.4.3 Fin/header cantilever load. Power supplies shall withstand

a force of 2 pounds (9 newtons) minimum for format B and 5 pounds (22
newtons) for formats C and E (see 4.7.6.5).

3.11.9.5 Connector. The power supply connector shall be as speclfled

in appendices B, C and E of MIL-STll-1389for the applicable format.
Connectors shall be in accordance with MIL-C-28754 and the requirements
specified herein. Multiple increment power supplies may 4ncrease contact row
quantities with each row of contacts complete.

3.11.9.5.1 Connector intewit~, format B. Each assembled format 3

power supply and connector shall withstand a minimum axial force along the
contact pin length In either direction equal to the product of 12 ounces
(3.3 newtons) minimum multiplied by the number of contacts wjthout any
visible separation or bending (see 4.7.6.6). (For example, 12 ounces
(3.3 newtons) mnlnlmummultiplied by 40 contacts equals 480 ounces (133
newtons)). The total computed force shall be applled simultaneouslyto all
power supply connector contacts simulating power supply insertion and
extract~on.

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3.11.9.5.2 Connector intectrit.y,formats C and E. Each assembled format

C or E power supply and connector shall withstand without damage or visible
separation a minimum axial force normal to the interface plane equal to 100
pounds (445 newtons) on insertion and 4 ounces (1.1 newtons) per contact on
extraction (see 4.7.6.6). The total computed force shall be applied
simultaneouslyto all power supply contacts simulating power supply Insertion
and extraction.

(a) On insertion, a 100 pounds plus 5 or minus O pounds (445 newton plus
22.3 or-minus O newton) force shall be uniformly applied at two locations on
the top surface of the header. These two locations are centered on the
header width and are located 0.75 inch (19.1 mm) to 1.25 inches (31.8 mm)
from both ends of the header. This force shall be uniformly applied by two
plates (0.5 inch (12.7 mm) square) forcing the power supply connector inter-
face plane against a plate with clearance provisions for the row of contacts.

(b) On extraction, a 4.0 ounce plus O or minus 0.1 ounce (1.1 newton
plus O or minus 0.03 newton) force per contact shall be applied at the two
extractor holes. A suitable means of clamping the body of the power supply
connector shall be employed to prevent extraction of the power supply from
the test fixture. The force shall be obtained in 2 to 10 seconds and
maintained for 10 to 15 seconds.

3.11.9.5.3 Contacts. The number of contacts on the power supply and

their location shall be as specified in the associated detail specification.
The contact configuration is controlled (see figure 6) only on that part of
the contact protruding from the power supply connector surface (the interface
plane).

3.11.9.5.4 Connector contact inteqrity. Each contact as mounted in the

connector shall withstand an axial force of 20 ounces (5.6 newtons) minimum
applied in 2 to 10 seconds along the length of the contact blade in either
direction and maintained for 10 to 15 seconds (see 4.7.6.7).

3.11.9.5.5 Contact material. The material used for the power supply
contacts shall be a solid metal selected according to the manufacturing
process used. Approved materials are those specified in MIL-C-28754.

3.11.9.5.6 Contact ulatinq. The contact shall be gold plated in

accordance with MIL-G-45204, type II, grade C, class 1. Contacts shall have
nickel underplating of 0.00005 inch (0.00127mm) minimum in accordance with
QQ-N-290, class 1.

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3.11.9.6 Ke.yinq. Each power supply is assigned an alpha or alpha-

numeric key code. The ftrst letter indicates the style and angular position
of the keying pln In the alpha keying pin location and the last letter
indicates the style and angular position of the keying pin In the beta keying
pin location.

3.11.9.6.1 Keyinq pin orientation. Keying pins shall be orientated to

agree with the basic angle specified for the power supply by the code letters
on figures 7, 8, and 9. The code letters indicate the only possible first
and last letters, in that order of the power supply key code for the combi-
nation of keying pin styles indicatedon that part~cular figure. Code letter
combinations other than those shown entirely on figures 7, 8, or 9 are not
allowed. Power supply keying pin styles and orientations shall be taken
entirely from either figure 7, 8, or 9; no other combinations (such as mixing
an alpha orientation from figure 7 and a beta orientation from figure 8) are
allowed. Figure 10 is an example of power supply keying pin configuration
and specifies the tolerance for angular positioning.

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T
\
ABOVE

.
+

—.
CONFIGURATION

‘]
OPTIONAL
INTERFACE PLANE

— ,,
,,

T
32 32

I 4X CHAMFER
(TRANSITION
OR RADIUS
TO BE
.145 SMOOTH)
2X .04 MAX
*.020
I
--f 1

2x 15”*3”~
-IL T 4X

.005*.003
~
.04:::;

4XBREAK EDGES. SHARP

CORNERS NOT PERMITTED

Inches mm Inches mm Inches Inches mm

0.001 0.025 0.005 0.127 0.020 :~08 0.050 1.270
0.002 0.051 0.01 0.25 0.04 1.02 0.145 3.683
0.003 0.076
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general informationonly.

FIGURE 6. Family A2 blade contact.

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\n 13ETA
, LOCATION
ALPHA
A,J 0. E3,K 45. C,L 90. D,M 135.E,N 180.F,P 225” G,Q 270” W? 315”

A-AA-J A-6A-K A-CA-L A-DA-M A-EA-N

I A-FA-P A-GA-O
I
A-HA-R
I
J-A J-J J-8 J-K J-C J-L J-o J-M J-E J-N J-F J-p J-G J-Q J-H J-R

8-A 13-J B-B B-K %-C B-L B-Q E-M B-E B-N B-F a-p B-G a-o 8-H B-R

K-A K-J K-B K-K K-C K-1. K-D K-M K-E K-N K-F K-P K-G K-O K-H K-R
C–A C-J C-B C-K c-c C-L C-OC-M C-EC-N ‘c-~ c-fJ C-G C-Q C-H C-R

L-A L-J L-B L-K L-C L-L L-DL-M L-E L-N L-F L-P L-G L-Q L-H L-R

D-A O-J O-B D-K D-C D-L D-O D-M o-f o-~ D-F O-p O-G O-Q O-H D-R

M-A M-J M-B M-K M-C M-L M-O M-M M-E M-N M-FM-P M-GM-O M-H M-R

E-A E-J E-B E-K E-C P-L E-D E-M E-E E-N E-FE-P E-GE-Q E-H E-R

N-A

F-A
N-J

F-J
N-B

F-B
N-K N-C N-L N-D N-M N-E N-N M-F N-p N-G N-Q
F-K F-C F-L F-13 F-M F-E F-PJ F-F ~-~ F-G ~-O
N-H

F-t+
N-R

F-R
I
P-A P-J P-B P-K P-C P-L P-D P-M P-E P-N P-F P-F’ p-c P-Q P-H P-R

G-A G-J G-B G-K C-C G-L G-O G-M G-E G-N G-F G-P G-G G-Q G-I-I G-R

O-A O-J O-B Q-K O-C O-L Q-D O-M O-E O-N O-F O-P Q-G 0-0 o-t-i O-R

H-A I-I-J H-B H-K H-C H-L H-D H-M H-E H-N H-F H-P H-G H-O H-H H-R

R-A R-J IR-B R-K IR-C R-L IR-D R-M IR-E R-N IR-F R-p IR-G R-O R-H R-R ]

FIGURE 7. Family A2 style 1/2 keyinq chart {viewinq connector as shown on

fiwre 10~.

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MIL-P-29590

FIGURE 8. Family AZ style 1/1 keyinq chart (viewinq connector as shown on

fiqure 10\.

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IIS WIT u 90”Iv 135”‘w x

l\ BETA 45”1
I 180” 225” Y 270” Z 315

+
3%2!+ +i$i+

s-x s-Y J s-z

Zz u-x

v-x

w-x w-Y w-z

x-x x-Y x-z

Y-x Y-Y Y-z

z-x
I-t- z-Y z-z

FIG(JRE9. FamllY A2 keylnq chart (viewfnq connector as shown on ffqure 10~.

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{< 1.0031 B-C

-—- —- —- —. —-
-—- —-— -—.
-— .— -— -— .— -

a’
~ ALPHA
BETA
KEYING PIN KEYING PIN

Inches mm
0.003 0.076
2.200 55.880
5.200 132.080
+ (2200) 4
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general informationonly.

FIGURE 10. Family A2 keyinq pin orientation.

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3.11.9.6.2 Keyinq Din Iocatlons. There are two keyfng pln locations
on each power supply, one designated alpha and one designated beta. The
alpha and beta keying pln locations are near the lowest and highest numbered
connector contacts in the first row, respectively,as Illustratedon
figure 10.

3.11.9.6.3 Keyinq Dtn styles. Keying pin styles shall be as specified

on figure 11.

3.11.9.6.4 Keylnq Din sets. Only the keying p~n styles and keying pin
locat40ns specified in table IX are permttted.

TABLE IX. KeYinq pin styles and Iocatlons.

Style 1
Location
Alpha (a) Beta (b)

Style 2
I Style of
Combination

Style 1/2 .
I Notes

See figure 6
Style 1
Style 2
Style 1
Style 2 I Style 1/1
Style 2/2 I See figure 7
See figure 8

3.11.9.6.5 Keyinq Din inteqrity requirement. Iihenjnstalled in the

power supply, the keying pins shall meet the following integrity
requirements.

3.11.9.6.5.1 Keyinq D In toraue. Each keying pin shall wtthstand

a torque of 20 inch-ounces (0.14 newton-meter)minimum appl~ed ~n 2 to
10 seconds and matntalned for 10 to 15 seconds (see 4.7.6.8).

3.11.9.6.5.2 Keyinq pin DU~lOUt. Each keying pin shall withstand a

pullout force of 9 pounds (40 newtons) minimum applied in 2 to 10 seconds and
maintained for 10 to 15 seconds (see 4.7.6.9).

3.11.9.6.5.3 Keyinq Din cantilever load. Each keying pin shall

withstand a cant~lever load of 10 pounds (45 newtons) minimum applied in
2 to 10 seconds and maintained for 10 to 15 seconds (see 4.7.6.10).

3.11.9.6.5.4 KeyinqD in Dushout. Each keying pin shall withstand a

pushout force of 40 pounds (178 newtons) minimum (see 4.7.6.11). The force
shall he applied in the opposite direction to the force in 3.11.9.6.5.2.
This test applies only to connectors whose design permits keying pin pushout.

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CONFIGURATION
OPTIONAL ABOVE
INTERFACE LINE

I
I I
.27+01

@ “ \+ .02*.01
45”*5”

F=
.050*.001

lb
(90”)
.050* .001

J_f

— @.loo*,ool
--1 I- +7-’
PIN STYLE——NO 1 PIN STYLE
—.— NO 2

Inches Inches Inches mm Inches mm

0.001 0~25 0.02 0?1 0.075 1.905 0.125 3.175
0.01 0.25 0.050 1.270 0.100 2.540 0.27 6.86

NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general informationonly.

FIGURE 11. Family A2 keyinq pin styles.

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L-P-29590

3.12 Thermal desicinand construction.

3.12.1 Component tem~eratures.

3.12.1.1 Critical component temperatures{CCT). The CCT is the

max~mum component temperature allowed for a power supply operating at the
worst case temperature (71°C plus 5 or minus O°C ambient for family Al or a
rib temperature of 85°C plus O or minus 5°C for family A2) and altltude
conditions. The CCT (junctionfor semiconductors winding hot spot for
transformers, and case hot spot for other passive components) shall be 4n
accordance wltb 3.12.1.1.1 through 3.12.1.1.3. In no case shall the CCT
exceed the absolute maximum specified operating temperature (see 4.7.7).

3.12.1.1.1 Semiconductors. The CCT for semiconductordevfces shall be

Ilo”c.

3.12.1.1.2 Transformers and inductors. The CCT for transformers shall

not exceed the followlng values for the different classes of MIL-T-27.
I
3.12.1.1.2.1 ClassV, MIL-T-27. The UT shall not exceed 125°C.

3.12.1.1.2.2 Class Tori), 141L-T-27. The CCT shall not exceed

140°c.

3.12.1.1.3 otherDa~tS. The CCT of other parts shall not exceed the
individual component’s maximum speclfled operating temperature minus-20°C and
shall be speclfkd on the component’s hottest external area.

3.12.1.2 Transient critical comnonent temperature (?CCT\. The TCCT is

the maximum component temperature allowed for a power supply operattng under
worst case transient temperature and altitude conditions specified in
3.5.2.1. The TCCT shal1 be 20°C greater than that specified in 3.12.1.1. In
no case shall the TCCT exceed the absolute maxfmum specified part operating
temperature (see 4.7.7).

3.12.2 Thermal requirements.

3.12.2.1 Fam41YA1. Unless otherwise specified herein or in the

associated detail specification,the power supply thermal qulrements shall
be in accordance with MIL-E-85726 except the input power capability given In
table V of MIL-E-85726 shall be interpretedas the enclosure power
dissipattoncapabl T’ity. Cooling a~rmass flow rate and Inlet to outlet
pressure drop shall be in accordance with the associated detail
specification, but In no case shall they exceed the maximum allowed by MIL-E-
85726. Unless otherwise specified herein or In thedetall power supply

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specification, the inlet air temperature shall be 27°C plus or minus 5°C and
the outlet air temperature shall be 71°C maximum. For the purpose of
testing, analysis, and prediction, the total heat generated by the power
supply shall be removed through the power supply cooling air.

3.12.2.2 Famil.yA2. Unless otherwise specified herein or in the

associated detail specification,thermal requirements shall be in accordance
with appendices B, C and E of MIL-STO-1389.

3.12.3 Thermal ctrease. Internal constructionof the power supply shall

minimize the use of thermal grease to the greatest extent possible. Silicone
thermal grease shall not be used for heat transfer without approval of the
APSP-QAA.

3.12.4 Air seal seatin~ area [family Al). The location and dimensions
of the inlet air seal seating area reserved shall be in accordance with OOD-
STD-1788, figure 4.

3.12.5 Leakaqe (family Al\. Maximum allowable cooling air leakage rate
shall be not greater than 0.1 percent of the maximum flow rate specified in
the associated detail specificationwhen tested in accordancewith 4.7.7.3.

3.13 Proprietary Darts. processes, or techniques. A power supply shall

not be designed such that utilization of proprietary parts, processes, or
techniques will result in restrictingor eliminating additional power SUpply
designs from meeting the same performance requirements. Proprietary parts
are considered to be non-standardparts (see 3.9.3) and usage shall be
minimized to the greatest extent possible.

3.14 Identificationand markinq.

3.14.1 Power supply markinq. Power supplies shall be identified and

marked with appropriate identifiersas specified herein. The following
minimum information shall be marked on the power supplies:

(a) Certificationmark.

(b) Power supply part number, revision letter and amendment number.

(c) Power supply key code.

(d) Manufacturer’s identificationand manufacturer’spower supply

assembly number.

(e) Serial number.

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(f) Oate code.

(9) EIectrostatlc discharge (ESDI)marking.

(h) Precautionaryand safety marking [famlly Al).

(i) Input voltages (faintlyAl).

[j) Output voltages (famiIy Al).

(k) Output currents (family Al).

(1) Hold-down fastener torque.

(m) tlame(family A2).

(n) Connector contact information.

.
(0) Extractor fln IdentlfIcation (family A2).

(P] Internal subassemblymarking.

Markings shall be a mlnimumof 0.06 inch (1.52 m) high [excludingkeycode

for fam~ly A2) and applied In accordance wlth141L-STD-130. Markings shall be
a contrasting color to the surrounding power supply area. All marking shall
be ~enuanent and legible In accordance with MIL-STD-1285.

3.14.1.1 ?+iarklnq
location.

3.14.1.1.1 Fam41.vAl. The marking shall be located as specified herein

and in the associated detail specification.

3.14.1.1.2 FamilYA2. The marking shall be located as shown on

figure 12 or as specified In the associated detail specification.

. “-.

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SERIALNUMBER

VENDOR DESIGNATOR

MODULE KEY CODE CERTIFICATION

...................**......... .......***.-
444<4 W. XY * 12345“ 8322QUAL “
...................... ....*.-...*......*-
●

n
●

.060+
— .025 ~ I L
.09MIN
(MODULE - I-
KEY CODE)

50

k PIN SHIELD
8ETA KEYING PIN
CONNECTOR CONTACT-
IDENTIFICATION THESE AREAS RESERVED (EITHER
\2 SIDE OF MODULE) FOR THE MARKING
OF NAME AND PART NUMBER,
REVISION LEITER, AMENDMENT NUMBER, VENDOR’S
IDENTIFICATION, AND RAWROM TEST CODE.
REVERSED AREAS NOT REQUIRED FOR
MARKING MAY BE USED FOR
1 ALPHA KEYING PIN inspection/TEST STAMPS.
MANUFACTURER’S CODE, ETC., AT
inches CONTRACTOR’S DISCRETION.
.025 ??5
.060 1.524
.09 2.29
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general informationonly.
3. The 0.060 spacing between fin end and the module key code shal1 be
measured between the first letter of the key code and that part of the
fin nearest the alpha end of the module having a width of 0.150 Inch
(3.81OIIEN)minimum.

FIGURE 12. Family AZ markinq areas.

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3.14.1.2 Certificationmark. All power supplies which meet the

requirements of this specificationand the associated detail specifications
shall have the qualificationcertificationmark “QUAL” marked in accordance
with the associated detail specification. Authorlzatlon tornark “QUAL” must
be obtained from the APSP-@A (see 6.11). Items furnished under contracts or
purchase orders which either permit or require devlatfon from the conditions
or requirements specified herein, or in the associated detail specification,
shall not bear I$QUAL1’.In the event the item fa~ls to meet the requirements
of thts specification and the associated detail specification,the
manufacturer shall remove the “QLIAL”from the sample tested and also from all
items represented by the sample. The “QUALU certificationmark shall not be
used on power supplies acquired to contractor drawings or speclflcatfons.

3.14.1.3 Power su~ply Part number and revision status. The power
supply part number, revision letter, and amendment number shall be marked as
specified herein (see 6.10) and in the associated detail specification. This
Information Is located In the same area as the manufacturer’s identification.
All APSP part numbers wI1l be assigned by the SE?4-DRA. Requests for part
number assignment shall be prepared and submitted fn accordance with MIL-STll-
2038. A power supply shall be marked with the revision status of the
associated detail specificationto which it was tested when manufactured.

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3.14.1.4 Key code.

3.14.1.4.1 Family Al. Each power supply shall be marked with a key
code assigned in accordance with MIL-STD-2038. Keying and key codes shall be
in accordance with 3.11.8.

3.14.1.4.2 Family A2. Each power supply shall be marked with a key
code assigned in accordancewith MIL-STD-2038. Keying and key codes shall be
in accordance with 3.11.9.6.

3.14.1.5 Manufacturer’s identification. Each power supply shall be

marked with either the manufacturer’sidentificationcode or manufacturer’s
name. The manufacturer’s code, if used, shall be a numerical code as listed
in Handbook H4-2. The power supply shall be marked with the manufacturer’s
power supply assembly number. In addition, a revision level, dash number or
other appropriate designation shall be included with the power supply assem-
bly number to identify the level to which the power supply was constructed.

3.14.1.6 Serial number. Each power supply shall have a serial number
including the manufacturer’sdesignationmarked on the surface of the power
supply. The serial number shall consist of five digits with significant
digits prefixed with zeros as required. The serial number shall be affixed
to the power supply prior to electrical acceptance tests.

3.14.1.6.1 Serial number seuuence. Each power supply manufacturer

shall serialize each power supply. The serial number for any given key code
shall start with number 1 and continue in numerical sequence as many times as
the power supply is manufactured,regardless of contract or customer.

3.14.1.6.2 Manufacturer’sdesignation. A single or double alpha

character will be assigned to each manufacturercontracted to produce power
supplies. The designation shall be prefixed to the serial number. Request
for a manufacturer designation shall be submitted to the SEM Design Review
Activity (SEM-DRA) (see 6.7).

3.14.1.7 Date code. Each power supply shall be marked with a four-
digit date code designating the year and week of manufacture. The first two
digits of the code shall be the last two numbers of the year and the third
and fourth digits of the code shall be the calendar week. When the number of
the week is a single digit, it shall be preceded by a zero. The date code
for a given power supply shall be the calendar week in which the last major
manufacturing assembly process occurred prior to the final acceptance
inspection, plus or minus 1 week.

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3.14.1.8 Electrostaticdischar~e (ESD\. Power supplles that are

determined by the manufacturer or by the APSP-QAA act~vity to be sens4tf!e to
ESD by prfor knowledge of device technologiesor by testing to this
-specification shall be marked In the areas specified by the APSP-QAA or ‘n
the associated detail speclf~cattonwlth the ESO fldentlflerspecified in 141L-
STII-1285. If the minimum symbol size specified in PIIL-ST&129 cannot be met,
the size shall be maxlmlzed for the particular fin configuration.

3.14.1.9 Precautionaryand safety mark~nq.

3.14.1.9.1 FamilYA1. Unless otherwise speclfled inthe associated

detail specification, precautionaryand safety markings shall read:

“CJWTION
*op~RATE ~~TH cooLING A~~
*HAzA~,f)o~s
LINE voLTAGE
*f)~scoNNEcTpoNE~ BEFoRE
REMOVING OR INSTALLINGUNIT” I

Idhenrequired, additional precautionaryand safety labels (installationand

removal instructions, high surface temperaturecaution, and so forth) shall
be specified in the associated detail specificattonor approved by the APSP-
QAA.

3.14.1.9.2 Famil.vA2. Unless otherwise specified in the associated

detail speclflcation, precautionaryand safety marking shall read:

“CAUTION
WDI$CONNECT pOWER 8EFORE
REMOVING OR INSTALLINGUNIT”

When the power supply size is multiple thickness and if space permits, the
caution note shall be on the top of the power supply. Uhen required.
addlttonal precautionary and safety labels (see 3.14.1.9.1) shall be
specified in the associated detail specificationor approved by the APSP-@ll.

3.14.1.10 Input voltaae [famili al).. Tttetnput voltage of the power

supply shall be Indicated In accordancewith the types of tnput power (see
3.3.1).

3.14.1.11 Outrmt voltaqe {familYAl\. Each output voltage of a power

supply type shall be listed with programing levels separated by slashes and

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outputs separated by commas. For example, the output VO”tages for a dual
output, programmable power supply may be listed as:

Output voltage: 5.0/5.2 V.

3.14.1.12 Outmt currents (famil.vAll. The minimum and maximum rated

currents for each output listed in 3.14.1.11 shall be marked in the same
sequence as the output voltage levels. For example:

Output current: 1 to 10 A.

3.14.1.13 Mountinq fastener torque (familYAl~. Each power supply

shall be marked with the hold-down fastener torque requirements as specified
herein or in the associated detail specification.

3.14.1.14 Name (famil.vA2\. Each power supply shall be marked ’with

its name. The name and manufacturer’sidentificationshall be orientated
such that both are readable from the same point of view. The name marked on
the power supply shall agree with the name in the title of the associated
detail specification;however, abbreviationin accordancewith MIL-STD-12 is
permissible. The SEM-DRA is responsiblefor generation of an approved name.
The names in Cataloging Handbook H6 shall be used if they appropriately
describe the power supply. When Cataloging Handbook H6 does not list a name
which appropriately describes the power supply, a name shall be developed in
accordance with MIL-STD-961.

3.14.1.15 Connector contact identification[family A2\. Each

connector shall have contacts identified by numbers on the connector
pinshield as indicated herein (see figure 10) or in the individual slash
sheets of MIL-C-28754.

3.14.1.16 Extractor fin identification(famil.YA2~. Fins on format B

multiple thickness power supplies which are used for extraction must be
marked. See appendix B of MIL-STD-1389.

3.14.1.17 Internal subassembl.vmarking. Internal modules shall be

marked with the following information:

(a) Part number, revision letter, and amendment number.

(b) Serial number.

(c) Manufacturer’s identification.

(d) Date code.

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3.15 Safetv fpersonnel hazard~. Safety (personnel hazard) shall be in

accordance with requirement 1 of NIL-HO-454 and as speclfled herein (see
3.3.1.14).

3.16 Workmanship. Workmanship of the power supply shall be in

accordance with military specificationsand standards as speclfled herein.
General workmanship (workmanshippertaining to those areas of the power
supply not specifically stated herein) shall be tn accordance with
requirement 9 of MIL-STO-454.

3.16.1 Metallic surfaces. Hetalllc surfaces shall be free of burrs,

cracks and sharp edges. Voids, blowholes, fissures, or porosity that is
discernible by the unaided eye shall not exceed 10 percent of the total
metallic surface area. Connector contacts, keying pins, ribs and fins shall
not be bent or damaged.

3.16.1.1 Scratches. Scratches or modificationson the surface of

aluminum parts which have been processed in accordancewith NIL-A-8625 shall
be treated with chemical film in accordance with MIL-C-5541 and painted to
match the finish color. Rack~ng points only wtll be allowed on alumlrtum
surfaces which have been treated in accordancewith NIL-A-8625, type 11,
class 2. Scratches or modificationson other metallic surfaces shall be
repaired using a protective coating that will guard against corrosion and
wtll match the finish color. The area of repair shall not exceed 5 percent
of the total surface area of the power supply.

3.16.2 Monmetalllc surfaces. Nonmetallicsurfaces shall be free of

cracks, foreign mater$al, and sharp or rough edges. Voids, blisters,
pinholes, or mold marks shall not exceed 10 percent of the total molded or
potted surface area.

3.16.2.1 Molded or Dotted surfaces. Molded or potted surfaces shall

be continuous, homogeneous and fully cured and shall cover all components,
leads, and circuitry. Pits, pinholes, or voids not exceeding 0.030 Inch
(0.76 m) diameter and 0.010 inch (0.25 mm) deep or scratches not exceeding
0.020 fnch (0.51 RRn)wide byO.5 Inch (12.70 nwn)long and O.010 inch
(0.25 EMI)deep are permisslble, provided no components or clrcultry are
exposed. hxhum concentrationof defects shall not exceed 5 percent of the
total nmnetalllc surface area.

3.16.3 Solderina and printed-wirinqassembles. Soldering and

printed-board assemblies workmanship shall be in accordance with
MIL-STO-2000. For power supplles, any Item requiring approval or concurrence
by the contracting officer shall also require approval by the APSP-QAA.

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3.17 Documentation. When specified in the contract or purchase order,

documentation shall be prepared (see 6.3). The power supplles shall conform
to the released drawings.

3.18 Request for deviation or waiver. Requests for deviation or

waiver from the materials, processes and requirements specified herein and
from any applicable drawings, specifications,publications,and materials or
processes referenced herein shall be submitted to the APSP-QAA and the
command or agency concerned in accordancewith MIL-STD-481 for approval.

4. QUALITY ASSURANCE PROVISIONS

4.1 Responsibilityfor inspection. Unless otherwise specified in the

contract or purchase order, the supplier (see 6.5.3) is responsible for the
performance of all inspection requirements (examinationsand tests) as
specified herein. Except as otherwise specified in the contract or purchase
order, the supplier may use his own or any other facilities suitable for the
performance of the inspection requirementsspecified herein, unless
disapproved by the Government. The Government reserves the right to perform
any of the inspections set forth in this specificationwhere such inspections
are deemed necessary to ensure supplies and services conform to prescribed
requirements.

4.1.1 Responsibilityfor compliance. All items shall meet all

requirements of sections 3 and 5. The inspection set forth in this
specification shall become a part of the supplier’s overall inspection system
or quality program. The absence of any inspection requirements in the
specification shall not relieve the supplier of the responsibilityof
ensuring that all products or supplies submitted to the Government for
acceptance comply with all requirementsof the contract. Sampling
inspection, as part of manufacturingoperations, is an acceptable practice to
ascertain conformance to requirements,however, this does not authorize
submission of known defective material, either indicated or actual, nor does
it commit the Government to accept defective material.

4.1.2 APSP-OAA verification. All quality assurance operations

performed by the supplier will be subject to APSP-QAA verification. Failure
of the supplier to promptly correct deficienciesdiscovered by him or of
which he is notified shall be cause for suspension of acceptance until
corrective action has been made or until conformance of product to prescribed
criteria has been demonstrated.

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4.2 Class~flcationof InspectIon. Examlnatlon and lnspect~on of the

power supply shall be classified as follows:

(a] Qualification InspectIon (see 4.4).

(b) (@alIty conformance ~nspectlon (see 4.5).

4.3 InsDectton conditions. Inspectionsshall be performed In

accordance with the test conditions specified herein.

4.3.1 Standard test conditions. lhless otherwise specified by the

APSP-QAA, tests shall be performed In an area having a relative humidityof
up to 95 percent and a barometric pressure of between 24 and 32 inches
(610 and 813 m) of mercury. Temperature of the test area shall be
maintained at 25°C plus or minus 5°C.

4.3.2 Thermal test conditions.

.1

4.3.2.1 FamilY Al. Unless otherwise specified in the associated

detail specificationor herein, environmentaltest procedures shall be
performed with the power supply mounted in a rack, tr~, or shelf in
accordance with the requirementsof 000-S10-1788. The ambient temperature
shall be the ambient air temperature inxnediatelysurroundingthe power
supply. For test purposes, ambient temperature shall be the average of the
temperature of the ambient air above the top and below the bottom surfaces of
the power supply measured 25 mu (or mldw~ between the power supply and any
adjacent surface, whfchever $s less) from the surface at the center of the
surface area. Air velocities inmmdiatelysurrounding the avionics equipment
shall be not greater than those caused by natural (free) convection effects.
Cooling air bulk Inlet temperature shall be as specified herein. Coollng a~r
flow rate and delivery pressure shall be In accordancewith the associated
detail speciftcatlon. Inlet cooling air relative humfdity sh~ll be not
greater than 40 percent.

4.3.2.2 Famil.YA2. Unless otherwise specified fn the associated

detail specification or herefn, environmentaltest procedures shall be
performed with the power supply mounting and temperatureconditions tn
accordance with appendices 8, C, and E of MIL-STO-1389. Power supply cooling
shall be through the power supply ribs.

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4.3.3 Test equipment. The ratio of specificationtolerances to test

equipment accuracy shall at least be 10:1 for tolerances of 3 percent or
greater and at least 4:1 for tolerances of less than 3 percent. Exceptions,
due to accuracy limitationof available test equipment, shall be specified in
the associated detail specification. Deviations to either of the ratios as
specified herein or the specified exceptions shall be recorded and approved
in accordance with appendix A. Test equipment shall be accurately
calibrated. Frequency of recalibration shall be in accordance with MIL-STO-
45662. The test equipment may be laboratory instrumentsconnected in a
breadboard arrangement, a console type of equipment, or an automatic tester.
Test setups are provided for laboratory instrumentsin the associated detail
specification. The test equipment specified in the associated detail
specification is typical of equipment adequate to perform the tests and shall
be deemed as satisfying all accuracy requirements. Test equipment shall be
in accordance with MIL-STD-1665and the associated detail specification.
Test equipment not specified in MIL-STD-1665may be utilized for testing
power supplies, provided accuracy tables for the equipment specified in the
test procedure are submitted to the APSP-QAA for approval.

4.3.4 Gauqes. The supplier shall provide gauges as necessary to

ensure that each power supply meets all dimensional requirements. The
Government representativeshall be permitted to use any of the supplier’s
manufacturing gauges at no cost to the Government and shall be permitted to
check such gauges when necessary. However, the fact that manufacturing
aauaes mav have been so checked does not relieve the sumlier of the
~es~onsib~lity of meeting all dimensional requirements.””

4.3.5 Calibration standards. Standards used for calibration of

inspection and test equipment shall be of an accuracy at least four times
greater than the accuracy of the equipment being calibrated.

4.3.6 Electrostaticdischarqe. The supplier shall protect electrical

and electronic parts, assemblies,and equipment from ESD in accordance with
MIL-STD-1686 and DOD-HDBK-263.

4.4 Qualification inspection. Qualification inspection shall be

performed by the APSP-QAAor its designated representative (see 6.5.2).
Qualification inspection shall be conducted in accordance with the procedures
described herein.

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4.4.1 Inltlal auallficatlontests. Tests shall be performed to

determine the capability of the power supply to meet the requirements
specified herefn and in the associated detafl speclftcatlon. The tests
specified in table X (for family Al] and table Xl (for family AZ) and In the
associated detail speciftcatlonshall be performed on the quantity of samples
1isted. These samples shall be electricallyand mechanically interchangeable
wtth production power supplies but need not necessarily be manufactured under
production conditions. Materials and processes shall be equivalent
(equivalency shal1 be approved by the APSP-QAA prior to submittal) to those
used in production. The supplier Is not required to perform the tests marked
“Q” in the associated detal1 specifIcation, however, the samples shal1 meet
the “Q” test requirements and will be tested for compliance by the APSP-QAA
during qualificationtesting (includingperiodic check). Unless otherwise
specified, it remains as the supplier’soption to perform any test In
addition to the required quality conformance testing.

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TABLE X. Qualificationlns~ection (familv All.

Inspection Requirement Test Qual samples ~/

or test ~/ paragraph paragraph Initial Periodic

Visual 3.4, 3.11, 4.7.1.1 3 2

3.14, 3.16
Initial electrical 4.7.2 3 2
Temperature & altitude ::;.2.1.1 4.7.3.2.1 3 2
EMP !5/ 3.6.1 4.7.3.7 3 2

EMI !5/ 3.6.1 4.7.4 1

Long-term stability 3.5.2.4 4.7.3.5 1 :
CCT/TCCT 3.12.1 4.7.7.1 1 0
Vibration ~/ 3.5.2.2.1 4.7.3.3.1 1 1
Mechanical shock
Operating 2!/ 3.5.2.3 4.7.3.4.1 1 1
Nonoperating 3.5.3.3 4.7.3.12 1 1
Generated acoustical
noise 3.5.2.7 4.7.3.9 1 0
Storage temperature 3.5.3.6 4.7.3.15 1
Temperature shock 3.5.3.2 4.7.3.11 1 i
Leakage 3.12.5 4.7.7.3 1 1
Explosive conditions 3.5.2.6 4.7.3.8 1 1
Humidity 3.5.3.1 4.7.3.10.1 1 1
Salt fog 3.5.3.4 4.7.3.13 1 1
Radiation hardness ~/
Operating 3.5.2.5 4.7.3.6 0
Nonoperating 3.5.3.7 4.7.3.16 : 0

~/ Individual qualificationsamples shall be subjected to the environmental

sub-groups as indicated in the table. Sequence of testing shall be in
the order listed in the table.
~~ These tests may have their testing order reversed.
~/ These’tests may be performed at any point during qualification
inspection after completion of all tests within a subgroup provided they
are immediately Preceded by tests that satisfy the 100 percent and
sample electri~al requirementsspecified in the detail power supply
specifications.
g/ Three power supplies of each type shall be submitted for initial
qualification and 2 samples of each power supply type shall be submitted
for periodic qualification.
~/ For periodic testing, these tests will be performed on the sample which
undergoes vibration and mechanical shock and will be first in the
sequence.

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I
TABLE XI. @allfication Insmction [fam~lv A2~.

Inspection Requirement Test Qual samples 4J

or test lJ paragraph paragraph Initial Periodic
i
Visual 3*4, 3.11, ,4.7.1.1 ;3 2
3.14, 3.16
Initial electrical 4.7.2 2
Temperature& altitude ::;.2.1.2 4.7.3.2.2 ; 2
[HP g 3.6.1 4.7.4 1 1
Long-term stabillty 3.5.2.4 4*7.3.5 1 0
CCT/TCCT 3.12.1 4.7.7.2 1 0
Vibration ~/ 3.5.2.2.2 4.7.3.3.2 1 1
Operating mechanical
shock ~/ 3.5.2.3 ;4.7.3.4.2 1
Mechanical 3.11.9 4.7.6 ; 1
Ourabllity 3.5.3.5 4.7.3.14 ,1 1
Generated acoustical
noise 3.5.2.7 4.7.3.9 ‘1 o
Storage temperature 3.5.3.6 4.7.3.15 1
Temperature shock 3.5.3.2 4.7.3.11 1 i
Explostve cond4tlons 3.5.2.6 4.7.3.8 1 1
Humidity 3.5.3.1 4.7.3.10.2 1
Salt fog 3.5.3.4 4.7.3.13 1 :
Radiation hardness ~/
Operating 3.5.2.5 4.7.3.6 0
Nonoperating 3.5.3.7 4.7.3.16 i o

~/ Individual qualificationsamples shall be subjected to the environmental

sub-groups as Indtcated In the table. Sequence of testing shall be In
the order listed in the table.
~/ These tests may have their testing order reversed.
3J These tests may be performed at any polntdurlng qualification
inspection after completion of all tests within a subgroup provided they
are Immediately preceded by tests that satisfy the 100 percent and
sample electrical requirements specified In the detail puwer supply
specifications.
4J Three power supplies of each type shal1 be submitted for tnltlal
qualtflcatlon and 2 samples of each power supply type shall be submitted
for periodic qualification.
5J For periodic testing, these tests wI11 be performed on the sample which
undergoes vibration and mechanical shock and will be first In the
sequence.

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4.4.1.1 Test data. The initial qualificationsamples shall be

accompanied by test data showing compliancewith the performance
characteristicsof the associated detail specification (25°C, 100 percent and
sample tests). Any deviation shall require prior written approval from the
APSP-QAA. The supplier shall retain data for a minimum of 1 year after
completion of all applicable tests and identifiedby type and serial number
of the power supply.

4.4.1.2 Inspection and test Procedures. The supplier shall prepare

inspection and test procedures for all inspectionsand tests performed,
including inspections and tests of incomingmaterials, in-process inspections
and tests, and final inspectionsand tests. Final inspection and test
procedures shall be submitted to the APSP-QAA for approval. These procedures
shall include as a minimum the following:

(a) Quantity to be inspectedor tested.

(b) Parameters of materials to be inspected and tested.

(c) Limits of acceptance and rejection.

(d) Equipment to be uti1ized in making inspections and tests.

(e) Detailed instructionson how to perform inspections and tests.

(f) Data to be recorded.

4.4.2 Failure rate Prediction and Parts deratinq. The supplier shall
submit information to permit evaluationof the failure rate prediction as
defined herein (see 3.7.1) and of parts derating. This failure rate data
shall be supplied with the initial qualificationsamples to the APSP-QAA.

4.4.3 Thermal anal.vsis. Each power supply type shall have a thermal
analysis (see 4.7.7) performed by the supplier prior to submission of initial
qualification samples. This thermal analysis is to predict or verify that
the designs meet the thermal requirementsherein (see 3.12). The detailed
thermal analysis shall be submitted to the APSP-QAA with the initial
qualification samples.

4.4.4 Desicm conformance. The supplier shall prepare and maintain

power supply assembly drawings. The drawings shall consist of a pictorial
view of the power supply printed wiring board assemblies specifying component
location and identification,printed wiring boards, power supply structure,
electrical schematic, parts list, and any other features necessary for power
supply assembly. A note or detail view shall denote orientation of polar
diodes, capacitors, and symmetricalmulti-lead components. The APSP-QAA

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shall review power supply designs prfor to or during Initial qualification

tests for conformance to all applicable speclftcations. Thts review shall be
performed from scale drawings of the printed circuit boards, assembly
drawings, the parts llsts, the schematicsand loglc dfagrams, and all other
documentation used by the manufacturer to build the power suppltes. The
manufacturers shall submft the design package prior to or with the initial
qualification samples. Complete deslgndtsclosures shall be made for APSP-
QAAuse only.

4.4.4.1 Chanqe control. After successful Inltlal qualfflcation, the

supplier shall forward to the APSP-QAA and the comnand or agency concerned,
all changes to documents that Impact design, quallflcatlonor correlation
status. These changes shall be submitted to APSP-QAA for approval. All
changes to test procedures and manufacturingflow charts shall be approved by
the APSP-QAA.

4.4.5 Per$odic check. Periodic checks shall be performed to verify

that the supplier is manufacturingpower supplies that meet all requirements
spec$fied herein and in the associated deta$l speclf’ication.Periodic checks
shall be performed on sample power supplles selected at random by the
Government quallty assurance representativefrom power supplles produced
during the 12month period since the last wbmlssion and shall be performed
by the APSP-QAA or tts designated representative. Each sample of two power
supplies subm$tted for periodic check shall be subjected to those functional
and environmental tests listed in the periodic column of table X or table XI.
Additional tests as listed ~n the initial column may be performed as deemed
necessary by the APSP-QAA. Upon request, the supplier shall make available
to the APSP-QAA a cross-referencematrix of date code versus sertal number
versus contract, by power supply part number, on all power supplies
delfvered. The matrix shall be updated with each submittal.

4.4.5.1 Submission schedule. The supplier shall submit periodic check

samples at 12 month intervals following successful completion of Initial
qualification Inspection. After the first two periodic check intervals, the
periodic check may (at the discretion of the APSP-QAA) be changed to have the
$nterval increased to 18 months. Crtterla for this decfsion shall be past
performance, des$gn changes made, and engineering judgment. If production is
Interrupted and the 12 or 18month Interval is exceeded, the supplier shall
submit the first two power supplies produced when production resumes.

4.4.5.2 Noncontinuousproduction. hlhenproduction has been

discontln~ed during a qualiflcat~onperiod and periodic check samples are not
submitted on a timely basis, qualification status shall only be maintained
upon receipt of a letter of intent that power supply production will be
resumed within an 18 month period.

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4.4.6 Acceptance and re.iectioncriteria. Successful completion of

initial qualification inspectionor periodic checks shall be based on no
defects which may affect function, reliability,or interchangeability(as
determined by the APSP-QAA). The supplier and command or agency concerned
shall be notified in writing of the test results within 10 days following
completion of testing. In case a qualificationsample does not successfully
pass the tests, the supplier shall be notified at the time of failure.

4.4.7 Corrective action. Upon notificationof failure of qualification

inspection, the supplier shall submit a letter indicatingthe corrective
action. The corrective action may or may not require a resubmission. After
approval by the APSP-QAA and completionof corrective action, the
qualification status will be reinstated as appropriate.

4.4.8 Correlation. Test equipment shall be correlated by the APSP-QAA

or its designated representativein accordancewith the appendix. Power
supplies submitted to the APSP-QAA for qualificationmay be used for
correlation samples.

4.4.9 Quality assurance requirements. The supplier shall develop and

maintain a quality program in accordancewith MIL-Q-9858 (see 6.3). The
program should include, as a minimum, informationon the following topics:

(a) Manufacturing flow chart.

(b) Inspection and test procedures.

(c) Manufacturing instructions.

(d) Process control procedures.

(e) Process certifications.

(f) Workmanship samples.

(9) Accumulation and analysis of defect data.

(h) Power supply assembly drawings.

(i) Electrostatic discharge control program.

4.4.9.1 Manufacturing flow chart. A manufacturingflow chart shall be

prepared and submitted to the APSP-QAA for review and approval. This flow
chart shall start with the receipt of materials and show in graphic form the
sequence of manufacturing operations, inspections,and tests performed in

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producing the power supplies, and shall end wtth the shipment of the
completed power supplies. The flow chart shall Include references to the
procedures and Instructions to be followed at each operation and shall
include the stations at which workmanship samples are located and defect data
is recorded. Th4s chart shall have a title, a document number, revlslon
status, and approval blocks.

4.4.9.2 ?+hnufacturinatnstructtons. There shall be instructions

provided for each manufacturingoperation. These Instructionsshall be in
the form of written procedures and visual aids. These instructions are not
required to be submitted to the coamand or agency concerned, but shall be
submitted to the APSP-QAA for review. These Instructionsshall be retained
at the manufacturing facilities of the suppller until final acceptance by the
Government of all power supplies manufactured unconformity therewith. These
instructions shall be used In support of inspection by personnel of the
comnand or agency concerned and Government inspectors to ensure compliance
with all quality assurance provisions herein. Use of the information In this
manner shall be on a proprietary basis.

4.4.9.3 Processes reaulrina certification. The following processes

(if used in the macaufacturfngof power supplfes) shal1 be certified to their
applicable m$litary speciftcattons:

(a) Nickel plating: QQ-N-290.

(b) Gold platlng: MIL-G-45204.

(c) Anodizing: MIL-A-8625.

(d) Resistance welding of electronic circuit modules: MIL-W-8939.

(e) Special technologicalprocesses.

Process certification will be approved by the APSP-QAA.

4.4.10 Workmanship sam~les. The supplier shall prepare workmanship

samples for the evaluation of in-processworkmanship. These samples may be
in the fw’mof draw~ngs, photographs.or hardware and shall be available for
review and approval by the comnand or agency concerned. Samples shall be
maintained as standards of quality.

4.4.11 Maintenance data. Maintenance data for test, fault isolation,

and repair of the power supplies shall be prepared by the supplier and
submitted to APSP-QAA for review.

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4.4.12 Retention of qualification. Upon successful1y completing

initial qualification inspection,a supplier retains qualification status
until one of the following occurs:

(a) Change of design (includingcomponents, materials, and processes).

(b) Failure of periodic check.

(c) Failure to submit samples and associated data on a timely basis

(maximum interval under no production conditionswi11 be 18 months)
(see 4.4.5).

4.5 @alit.y conformance inspection. The following quality conformance

inspection requirements apply.

4.5.1 Quality conformance criteria. Quality conformance acceptance of

a power supply shall be based on no defects. The inspection and test plan in
table XII (for family Al) or table XIII (for family AZ) shall be used. Any
characteristic failing to conform to the requirements specified herein and In
the associated detail specificationshall be considered a defect. Power
supplies subjected to quality conformance inspection shall be completed
samples requiring no other manufacturingsteps.

4.5.2 Sampled quality conformance inspection. For sample (S) tests,

acceptance or rejection of a lot shall be based on the sampling procedures
specified in tables XII and XIII as applicable. If a failure occurs in a
sampled electrical quality conformance inspection,the entire inspection lot
shall be screened for that parameter before shipment of the lot. Power
supplies failing during the screen shall be rejected.

4.5.3 One hundred Percent inspection. For 100 percent quality

conformance inspection parameters (X tests), any power supply not meeting the
requirements specified herein and in the associated detail specification
shall be rejected.

4.5.4 Failure analysis. Failure analysis shall be conducted by the

supplier on all power supplies that fail tests required by the quality
conformance test plan in accordance with 4.5.1. Component failure analysis
is not required on failed parts resulting from recurring failure modes
provided that component analysis has been performed on prior failures and the
necessary and acceptable corrective action has been determined.

4.5.5 Inspection lot. An inspection lot shall consist of all power

supplies produced for quality conformance inspection at any one time. An
inspection lot may be defined in a contract or purchase order.

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TABLE XII. ~ual~tv conformance inspection and test plan (family Al}.

Requirement Test
Inspection paragraph paragraph
Sampl1ng

Electrical requirements 3.7.2 4.7.5.2 ,100 percent for

at 25°C fin or rfb “X” test In
temperature accordance
with the
associated
detal1
,spec~fication.
Wironmental 3.7.2 4.7.5.2 100 percent
stress
screening~/
Electrical 3.3 4.7.2 100 percent for
requirementsat “X” tests In
t25”c 2J accordance with
the associated
detail speciffca-
tton. Sample
per note ~1.
#isual: Two power
Proflle 3.4.1 4.7.1.1 supplles or
dimensions 20 percent
of the ~nspection
Keylng 3.11.8 4.7.1.1 lot, whichever
posltlon Is greater.
Marking 3*14 4.7.1.1
Workmanship 3.16 4.7.1.1

lJ Environmental stress screenlng shal1 be completed prior to the fInal

25°C electrical Inspection.
~/ For those parameters which are to be sample inspected, two power
supplies or 1 percent of the Inspection lot, whichever fs greater, shall
be randomly selected from each InspectIon lot. The electrical
parameters which are marked “S” in the associated detail specification
shall be tested for these power supplles at 25*C ambient. If failures
occur, the ent~re lot shall be screened for the parameter which failed.

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TABLE XIII. Quality conformance inspection and test ulan (family A21.

Requirement Test
Inspection Sampling
paragraph paragraph

Electrical requirements 3.7.2 4.7.5.2 100 percent for

at 25°C fin or rib “X” test in
temperature accordance
with the
associated
detai1
specification.
Environmental 3.7.2 4.7.5.2 100 percent
stress
screening ~/
Electrical 3.3 4.7.2 100 percent for
requirements at “X” tests
+25”C ~/ in accordance with
the associated
detail specifica-
tion. Sample
per note ~/.
Visual: Two power
Profile 3.4.1 4.7.1.1 supplies or
dimensions 20 percent
Marking 3.14 4.7.1.1 of the inspection
Keying 3.11.9.6 4.7.1.1 lot, whichever
Workmanship 3.16 4.7.1.1 is greater.

1/
—. Environmental stress screening shall be completed prior to the final
25°C electrical inspection. -

~/ For those parameterswhich are to be sample inspected, two power

supplies or 1 percent of the inspection lot, whichever is greater, shall
be randomly selected from each inspection lot. The electrical
parameters which are marked “S” in the associated detail specification
shall be tested for these power supplies at 25°C iunbient. If failures
occur, the entire lot shall be screened for the parameter which failed.

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4.6 Insc)ectionof Dackactfnq.Sample packages and packs and the

inspection of the preservation-packagtng,pack’ingand marking for shipment
and storage shall be in accordancewith the requirementsof section 5 and
documents specified there~n.

4.7 Test t)rocedures.

4.7.1 Visual examination. Power supplles shall be examined with no

more than a 10 power magnification lens to ensure compliance wtth this
specification and the assoc4atecidetail specification.

4.7.1.1 Initial visual examination. The followlng characteristics

shall be examined to ensure inltlal compliance:

(ii) Power supply profile. Dimensions and weight shall be checked to

ensure that they are within specified tolerances.

(b) Keyinq. Keying positions shall be checked to ensure correct

positioning.

(c) 14arkinq. Markings shall be checked to ensure completeness,correct

positioning, and leglbi14ty.

(d) ~hm;n;:l~. Workmanship shall be checked to ensure compliance

. .

4.7.1.2 Visual deciradationexamination. Power supplies shall be

visually examined upon completion of each operating and nonoperating
environmental test (see 4.7.3) after the power supply has returned to
standard conditions.

4.7.2 Electrical Performance tests. The initial electrical require-

ments of each power supply shall be tested to the extent specified In the
associated detail specification. Following each test specified in table X
(famiIy Al) and table XI (family A2), the electrical quality conformance
tests shall be performed as specified herein and in the associated detail
specification. When the electrical tests to be performed are not specified,
the 100 percent quality conformance Inspectiontests shall be performed.

4.7.2.1 Step inmt current test. For the purposes of this test (see
3.3.1.11.1), neither the power “off” period nor the power “on” period shall
be less than one second.

4.7.2.2 Inwt harmonic current test. For the purposes of testing, the
input power source shall not have a harmonic voltage content in percent RMS

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at any frequency which is greater than 25 percent of the allowable RMS

harmonic current percentage at any frequency (see 3.3.1.12). If the Input
power source does not meet this harmonic voltage requirement, then the
voltage distortion must be factored into the result of the harmonic current
measurement. The accuracy of measurementof harmonic currents shall be plus
or minus 5 percent of the harmonic being measured.

4.7.2.3 Power factor test. The power factor requirement shall apply
when the power supply is operated at rated load (see 3.3.1.13). Power factor
shall be computed by real power divided by apparent power, as indicated in
the following formula:
w
Power factor = -----------------;--~------~--~---i--------i-
22
(VIII +V212 +V313)
where
w= watts
VA, VB, VC = RMS line-to-neutralvoltages
IA, IB, IC = RMS line currents
4.7.2.4 Total ritmle and noise measurement. The total ripple and
noise shall be measured differentiallyusing a device whose 3 dB bandwidth
shall extend from a minimum frequency, no higher than 10 Hz, to at least
20MHz (see 3.3.2.3).

4.7.2.4.1 Low frequency ri!mle and noise measurement. The low

frequency ripple and noise shall be measured differentiallyusing a device
whose 3 dB bandwidth shall extend from a minimum frequency, no higher than
10 Hz, to 10 kHz plus or minus 20 percent (see 3.3.2.3.1).

4.7.2.4.2 Hiqh frequency ripple and noise measurement. The high

frequency ripple and noise shall be measured differentiallyusing a device
whose 3 dB bandwidth shall extend from 10 kHz plus or minus 20 percent to
20 MHz plus or minus 10 percent (see 3.3.2.3.2).

4.7.2.5 Common mode output current measurement. The comon mode

output current (see 3.3.2.4) measurement shall be made using a current
measuring device whose bandwidth is at least 20 MHz. A 10 UF PIUS or minus

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10 percent plastic film (or equ~valent)capacitor shall be connected between

the power supply output and Its return. The return shall be connected to the
power supply chassis. The current measuring devtce shall be connected around
the wire going from the output return to chassis.

4.7.2.6 Static line and load regulation test. Line and load
regulation (see 3.3.2.5) shall be measwed for all combinations of minimum
and maximum line voltage and no load (or mlnlmum load) and full rated load.
For multiple output power supplies, the load regulation shall be measured as
above as well as measuring that a load change on one output has a mlntmal
effect on another output (cross regulation).

4.7.2.7 Dynamic load regulation test. The step change in load current
shall be equal to 10 percent of the power supply full rated load current (see
3.3.2.7). Unless otherwise spectfted In the associated detatl speciflcatlon,
the step change shall occur In 60 us or less. The positive step change shall
be applied at any nominal load current between 10 and 90 percent of full
rated load. The negative step change shall be applied at any nomfnal load
between 20 and 100 percent. When requ~red, dynamic load regulation for load
step changes greater than 10 percent shall be specified in the associated
detail specification.

4.7.2.8 Dynamic Itrteregulation test. The step change In Input

voltage shall be equal to 21 percent of the nominal input voltage and applied
to the nominal Input voltage with a rise time between 50 and 500us (see
3.3.2.8].

4.7.2.9 Line transient test. Transient voltages shall be applied to

the input lines and the outputs checked for transient response tn accordance
with 3.3.2.21.

4.7.2.9.1 AC Ilne overvoltiiqetransient test. An AC transient voltage

(see 3.3.1.3) of an amplItude given fn the associated detai1 specificatlon
with a rise t~me of zero to 2 cycles of the input line frequency, a fall time
of zero to 32 cycles, and a duration at maximum amplitude of 5 cycles plus or
minus 1 cycle shall be superimposedon the Input 115 VAC IU4Sline-to-neutral
of any one phase. The waveformof theAC transient shall be inphasewfth
the llne-to-rteutralvoltage of the line on whtch It Is superimposed.

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4.7.2.9.2 AC line undervoltaqetransient test. AnAC transient

voltage (see 3.3.1.3) of an amplitude given in the associated detail
specificationwith a rise time of zero to 2 cycles of the input line
frequency, a fall time of zero to 32 cycles, and a duration at maximum
amplitude of 5 cycles plus or minus 1 cycle shall be superimposedon the
input 115 VAC RMS line-to-neutralof any one phase. The waveform of the AC
transient shall be 180 degrees out of phase with the line-to-neutralvoltage
of the line on which it is superimposed.

4.7.2.9.3 DC line overvoltage transient test. A DC transient voltage

of an amplitude given in the associated detail specificationwith a rise time
of zero to 0.1 ms, a fall time of zero to 40 ms, and a duration at maximum
amplitude of 10 ms plus or minus 1 ms shall be superimposedon any DC input
line pair on which the DC voltage is applied (see 3.3.l.3). The waveformof
the DC transient shall be applied so as to increase the line-to-linevoltage
of the line pair on which it is superimposed.

4.7.2.9.4 DC line undervoltaqetransient test. A DC transient voltage

of an amplitude given in the associated detail specificationwith a rise time
of zero to 0.1 ms, a fall time of zero to 50 ms, and a duration at maximum
amplltude of 50 ms plus or minus 5 ms shall be superimposedon any DC input
line pair (see 3.3.1.3). The waveform of the DC transient shall be applied
so as to decrease the line-to-linevoltage of the line pair on which it Is
superimposed.

4.7.2.10 Susceptibilityto common mode noise. Common mode noise with

plus or minus 15 Vpk shall be applied between chassis ground and each control
signal and return lead pair. The power supply shall not change state (see
3.3.3.3). The noise shall have a frequency between direct current and one
megahertz.

4.7.2.11 Efficiency measurement. The efficiency shall be measured at

nominal input voltage and at maximum rated output load current (see 3.3.5).

4.7.3 Environmentaltest procedures. Test procedures for

environmental exposures to determine conformance to the requirements.
specified in 3.5 shall be in accordance with the following subparagraphsand
the associated detail specification.

4.7.3.1 Test procedures.

4.7.3.1.1 Family Al. Unless otherwise specified herein or in the

associated detail specification,cooling air shall be supplied whenever the
power supply is operating and not be supplied whenever the power supply is
nonoperating. Unless otherwise specified, cooling air shall be turned on or

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off within 10 seconds of the time when the power supply Is turned on or off.
Unless otherwise specified in the associated detail specificationor herein,
the cooling air inlet bulk temperature shall be 27°C plus 5 or minus O“C.
Cooling alr power supply outlet temperature shall be no greater than plus
71QC. Cooling air pressure drop and mass flow rate shall be in accordance
with the associated detail specification. A power supply shall not be
required to be mounted on a rack, shelf, or tr%y during environmental
exposure for those environmentswhich do not require electrical operation.
Unless otherwise specified in the associated detail specificationor herefn,
power supply operation shall be with nomtnal input voltage and full rated
load. Standard enclosure test orientation shall be 4naccordance with MIL-E-
85726.

4.7.3.1.2 Familv A2. Unless otherwise specified in the associated

detail speclftcation, test procedures for environmentalexposures shall be as
specified herein.

4.7.3.2 Temperature and altitude.

I
4.7.3.2.1 Family Al. Power supplles shall be temperature and altltude
tested In accordance with MIL-STO-8100method 520, procedure 111. Test
levels shall be in accordance with MIL-STO-81O, table 520.O-V, for supple-
mental cooling air flow. Inlet mass flow rate shall be In accordance with
the associated detail speclftcation. The test cycle shall be In accordance
with MIL-STO-81O, table 520.O-VI and figure 520.0-5. Power supplles shall
meet the specified performance (see 3.5.2.1.1).

4.7.3.2.2 Family AZ. Power supplles shall be subjected to the speci-

fled operating temperature requirements (see 3.5.2.1.2). Power supplies with
multiple fins or ribs shall have the temperaturesmeasured on the cooling fin
or rib In accordance with appendices B, C, or E of klIL-STD-1389. The power
supply shall be set up, operated, temperaturecycled and tested according to
the associated detail specif~cationand the temperaturecycle specified on
figure 13.

(a) Low temperature test. The temperatureof the power supply thermal
interface shall be reduced to the low temperature specified in
3.5.2.1.2 in approximately5 minutes. This temperature must be
maintained for a minimum of 4 hours plus 0.25 hour for each
Increment greater than the basic format size. The power supply
environment shall be controlled to prevent frost or moisture
butldup on the power supply. The power supply is then tested and
must meet the initial electrical requirementsof the associated
detail specificationfor the temperatures specified in 3.5.2.1.2.

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(b) Hiqh temperature test. With the power supply operating, the
temperature of the power supply interface shall be increased to the
high temperature specified in 3.5.2.1.2 in approximately5 minutes.
This temperaturemust be maintained for a minimum of 4 hours plus
0.25 hour for each incrementgreater than the basic format size.
The power supply is again tested and must meet the initial
electrical requirementsof the associated detail specification.

(c) Transient tem~eraturetest. With the power supply operating, the

temperature of the power supply thermal interface shall be
increased to 20°C above the high temperature specified in 3.5.2.1.2
and maintained for one (1) hour. The power supply can be tested
any time within the next 8 hours under the condition that the
temperature is maintained but the power supply is not operating
until the test resumes. Electrical test time shall not exceed one
hour. The power supply must meet the high temperature end-of-life
requirements for the 100 percent electrical tests. After this
portion of the test is completed and with the power supply
nonoperating,the thermal interface temperature is reduced to
25°C in approximately5 minutes. This temperature is maintained
for a minimum of 2 hours plus 0.25 hour for each increment greater
than the basic format size. The power supply is again tested to
meet the initial electrical requirementsof the associated detail
specificationfor 25°C.

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RANGE OF
+ 5° ELECTRICAL OPERATION ~
105°C
-0° --- 4 b’
----- ----- ----- --

+ 5°
8S°C
-0°
--- ----- --

(SEE NOTE 4)

r ? “
2 liOURS~
25°c —+ 5°

(S= NOTE 3)

+0°
-55°c /
.5 ”--
I___/

NOTES:
-’u= ~(SEE NOTE 4)

1 HOUR

1. The total time allowed for the transient thermal test shall be I hour of
power supply operation plus eight hours of nonoperating storage plus 1
hour for electrical tests.
2. Electrical tests shal1 be performed at the indicated nodes (0).
3. Following a one hour temperature stabilizationperlod$ the power supply
shall be energized.
4. The temperature must be maintained for a minimum of 4 hours plus 0.25
hour for each increment greater than the basic format size.

FIGURE 13. ODeratinq temperature cycle.

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(d) Barometric pressure. Power supplies shall be subjected to the

reduced barometric pressure specified in 3.5.2.1.2. Power supplies
shall be tested in accordancewith MIL-STO-202,method 105, test
condition O. Power supplies shall be mounted such that the power
supply ribs are in contact with the wall of the test chamber. This
is the only cooling other than convection. The pressure shall vary
at a maximum rate of 0.5 inch (13 mm) of mercury per second. Power
supplies shall be held at the specified pressure for 30 minutes and
then, at that pressure, shall meet the electrical tests specified
in the associated detail specification. Upon removal from the
chamber. r)owersumlies shall show no evidence of deterioration or
physica~ damage and shall meet the 25°C initial electrical
requirements spec fied in the associated detail specification.

4.7.3.3 Vibration.

4.7.3.3.1 Family Al. Power supplies shall be subjected to separate

high frequency and random v bration specified in 3.5.2.2.1 in accordance w th
4.7.3.3.1.1 and 4.7.3.3.1.2. The power supply shall be mounted to a rigid
fixture by its normal mounting means. Power supplies shall be energized with
a load current greater than or equal to 10 percent of the rated output
current. Monitoring of power supply performance during a vibration test is
required (see 3.5.2.2.1).

4.7.3.3.1.1 Hiqh frequency vibration. Power supplies shall be

subjected to high frequency vibration in accordance with MIL-STO-202, method
204, test condition C, two sweeps per axis.

4.7.3.3.1.2 Random vibration. Power supplies shall be subjected to

random vibration tests in accordancewith MIL-STO-81O,method 514, procedure
I, category 5. Test duration on each axis shall consist of 30 minutes expo-
sure to functional test inputs as shown on figure 14, followed by 60 minutes
at the endurance test input level shown on figure 14, and followed by an
additional 30 minutes of functional test level.

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ENDURANCE TEST’ 16.29 RMS

7
*
0.20 ----- ----- . . . . . . .
m
I
gwh II I
CLE$OCT I I
m I
0.08

().04 I
I
I I
I
Functional :
TEST 1
9.Og RMS I
8 I
I I
I I
1 I
I I
I m 1 # ●

15 90 220 300 1000 2000

FREQUENCY, (Hz)

FIG(JRE14. llandomvtbratlon test conditions.

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4.7.3.3.2 Family A2. Power supplies shall be subjected to separate

high frequency and random vibration specified in 3.5.2.2.2 in accordance with
4.7.3.3.2.1 and 4.7.3.3.2.2. Power supply connectors shall be inserted into
a backplane utilizing appropriatemating connectors. The power supplies
shall be securely clamped along both ribs. Power supplies shall be monitored
during the vibration tests. At the completion of each axis of vibration
during the test, power supplies shall be visually examined for damage (see
4.7.1.2).

4.7.3.3.2.1 Hiqh frequent.vvibration. Power supplies shall be

subjected to high frequency vibration in accordancewith MIL-STD-202, method
204, test condition C, two sweeps per axis.

4.7.3.3.2.2 Random vibration. Power supplies shall be subjected to

random vibration in accordancewith MIL-STD-202,method 214, test condition
I, letter E, for 0.5 hour each axis.

4.7.3.4 Mechanical shock.

4.7.3.4.1 Famil.YAl. Power supplies shall be shock tested in

accordance with MIL-STD-81O,method 516, procedure I. Test level and
duration shall be in accordance with I-3.3.c(l)(b) of procedure I for
functional test of flight vehicle equipment. Power supplies shall be
energized with a load current greater than or equal to 10 percent of the
rated output current. Monitoring of power supply performance during a shock
test is not required (see 3.5.2.3).

4.7.3.4.2 Family A2. Power supplies shall be shock tested in

accordance with MIL-STD-81O,method 516, procedure I, except that peak
acceleration shall be 50 g. Test level and duration shall be in accordance
with I-3.3.c(l)(b) of procedure I for functional test of flight vehicle
equipment. Power supplies shall be energized with a load current greater
than or equal to 10 percent of the rated output current. Monitoring of power
supply performance during a shock test is not required (see 3.5.2.3).

4.7.3.5 Lonq-term stability. Each power supply shall be operated for

a minimum of 1,000 hours under isothermalambient conditions, 71°C plus
5 or minus O“C ambient temperature at full rated load current and nominal
input voltage. The baseline output voltages shall be measured 20 hours plus
or minus 2 hours after initial power supply turn on (3.5.2.4).

4.7.3.6 Radiation hardness. The test sample shall consist of power

supplies which have been subjected to and passed the electrical requirements
specified in the associated detail specificationfor the 100 percent and

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sample acceptance tests using the initial electr~cal Ilmlts at 25°C. Post-
irradlation electrical tests shall be the same electrical requirements, using
the end-of-life limits at 25°C (see 3.5.4.2). The test sample shall be
subjected to the following sequence and levels of radlatlon exposure (see
3.5.2.5].

(a) l$:~~~ng dose rate: 1X109Rads (Sl)/sec (20 ns to 100 ns pulse

.

(b) Total ionizing dose: 3 kilorad (S1).

Radiation hardness assurance requirementsare satlsfled if power supplies

pass the end-of-llfe requirementsafter each rad4at~on exposure. The
combination of these radiatton exposure environments is considered
destructive and, therefore, test sample power supplies subjected to them
shall not be used in, or shipped for use in, any operational system. For the
purpose of this specification,all terms used in the following referenced
test methods, such as “module”, “semiconductordevice”, “~ntegrated cir~uit”
or “part”, and so forth, meaning the part under test or Irradiation, shall be
interpreted or construed as meaning the power supply.

4.7.3.6.1 Ionlzlnq dose rate. Power supplies shall be tested in

accordance with t41L-STD-883,method 1023. The radiation pulse width shall be
20-200 ns with 200 rad (Si) maxfmumabsorbed total dose per pulse. All
references In method 1023 to l$near integratedcircuit and linear
microcircuit shall be applled to the power supply under test. Power Supplles
shall be operated during Irradiationas specified In the associated detail
specification. A failure $s defined as a permanent change In any spectfied
power supply current of greater than 5 percent of the pre-radiation reading,
the measurements being taken In the test fixture prior to removal of any bias
after the radiation pulse. Power supplfes must pass the 25°C end-of-l~fe
electrical tests as specified in 3.5.4.2.

4.7.3.6.2 Total ionizlnq dose. Power suppl!es shall be tested in

accordance with 141L-STD-883,method 1019. Power supplles shall be operated
at full rated load during Irradiation. Post-irradiationelectrical tests
shall be performed within 12 hours of time of exposure.

4.7.3.7 EMP Protection ~familYAl~. Power shall be subjected to the

limit specified ln3.6.l.

4.7.3.8 Ex~loslve conditions. Power suppltes shall be subjected to

explosive tests tn accordance with MIL-STO-81O,method 511, procedure E.
Test altitude shall be 70,000 feet. For family Al, ambient temperature shall

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be plus 71”C. For family A2, rib temperature shall be 85°C. The power
supply cover shall be removed during the test (see 3.5.2.6).

4.7.3.9 Generated acoustical noise. The power supply shall be tested

for generated acoustical noise in accordance with the method described
herein.

4.7.3.9.1 Test apparatus. The test apparatus shall consist of an

anechoic type test chamber, suitably formed and proportionedto produce, as
closely as possible, a diffuse sound field, the sound energy density of which
is very nearly uniform throughout the enclosure. A pentagonal chamber
configuration is recommended. Acute angles of adjacent chamber walls shall
be avoided whenever possible. Acoustical generation reproductionand
measuring equipment shall be suitable to accomplish these tests.

4.7.3.9.2 Test procedure. Noise levels at the “Operator’sposition”

shall be measured by slowly moving the measuring microphone in a 2 foot
diameter circle centered on the most probable position for an operator. The
average noise levels in each octave band, determined by an arithmetic average
of the minimum and maximum sound pressure levels found on the circle, shall
not exceed the noise level criteria for the “Operator’sposition” specified
in table XIV. Noise levels on the “25 foot radius circle”, centered on the
geometric center of the test equipment, shall be measured at a height of
5 feet, 8 inches at 12 positions equally spaced every 30°. The maximum sound
pressure levels in each octave band at each of these measurement positions
shall not exceed the noise level criteria for the “25 foot radius circle”
specified in table XIV. If any dimensions of the test equipment exceed 25
feet, the radius of the measurement circle shall be increased from 25 feet to
50 feet and the noise level criteria for the “25 foot radius circle” shall be
reduced by 6 dB in each octave band. The criteria for the “Operator’s
position” shall remain unchanged. All noise measurements shall be made with
a sound level meter and an octave band filter set meeting the requirements of
S1.4 and S1.11, respectively. The “C” weighting network (flat frequency
response) of the sound level meter shall be used in making all measurements.
Ambient background noise levels shall be at least 10 dB below the octave band
noise levels produced by the test equipment at all measurement positions.

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L-P-29590

TABLE XIV. Noise level criter4a.

Octave band center Octave band sound pressure levels

(dB ref, 0.0002 dynes/square cm)
frequencies (Hz)
Operator’s position 25 ft radius circle

76 66
1:: 60
250 :: 54
500 60 50
1000 !57 47
2000 45
4000 :: 43
8000 52 42

4.7.3.10 Humidity.

4.7.3.10.1 FamilYA1. Humidity tests shall be In accordance with 141L-

STD-81O, method 507, procedure 111. The power supply shall be In the normal
use configuration. Electrical testing shall be performed within one hour
fallwtng the conclusion of the exposure to the humid environment and power
supplies shall meet the specified performance (see 3.5.3.1) requirements.

4.7.3.10.2 Family A2. Power supplies shall be subjected to humid

atmosphere cycles as specified in 3.5.3.1. Power supplies shall be tested In
accordance with MIL-STD-81O, method 507, procedure III, except that the power
supply shall not be operated untfl all humidity cycllng has been completed.
Power supplies shall be mounted In the humidity chamber with the power supply
span at a 45° angle to a horizontal plane. At the conclusion of the exposure
to the humid environment, excess water shall be shaken and wiped from the
external surfaces of the power supply and the mechanical requirements of the
power supply shall be tested within 1 hour after removal from the test
chamber. Power supplies shall also be tested to the end-of-llfe requ~rements
of the 100 percent electrical acceptance tests and all isolatlon tests
specified in the associated detail specificationafter allowing a
4 hour stabilization period at room temperature in a free convection atmo-
sphere. There shall be no evidence of deteriorationor physical damage.

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4.7.3.11 Temperature shock. Power supplies shall be subjected to

temperature shock as specified in 3.5.3.2. Power supplies shall be tested in
accordance with MIL-STD-202,method 107, test condition B with temperature
extremes of minus 55°C (exception)and 125”C. Power supplies-shallpass the
electrical tests of 3.3 with no evidence of deteriorationor”physical damage.

4.7.3.12 Mechanical shock (family All. Power supplies shall be shock

tested in accordance with MIL-STD-81O,method 516, procedure V. Monitoring
of power supply performanceduring a shock test is not required (see
3.5.3.3).

4.7.3.13 Salt foq. Power supplies shall be subjected to salt fog as

specified in 3.5.3.4. Power supplies shall be tested in accordance with MIL-
STO-81O, method 509, procedure I. At the conclusion of exposure to the salt
fog environment, excess water shall be shaken from the external surfaces of
the power supplies. Power supplies shall be examined with the aid of a ten
power magnification lens following storage for 48 hours at room ambient
conditions to allow for evaporationof excess moisture. Failure mechanisms
shall include pits, crack formation, intergranularattack, and so forth; that
is, a concentrated attack that weakens the cross section. Surface corrosion
products shall not be evidence of failure.

4.7.3.14 Durability (famil.vA2\. Power supplies and contacts shall be

subjected to 500 cycles of mating as specified in 3.5.3.5 at the rate of not
more than 10 cycles per minute. During the test, power supplies shall be
mounted so that the insertion and extraction forces are transmitted directly
from the fin or header to the connector. Formats C and E power supplies
shall be inserted into a backplane meeting the requirementsof MIL-A-28870.
For modules which exercise the lateral displacementoption (floating),the
card cage test system shall provide a clearance of 0.006 plus or minus
0.001 inches (0.15 plus or minus 0.03 mm) between the surface of the module
guide rib and the interfacingrail surface on the card cage. For modules
which do not exercise the lateral displacementoption (nonfloat),the
clearance above should only be 0.0030 plus 0.0005 or minus 0.0000 inches
(0.076 plus 0.013 or minus 0.000 mm) between the surface of the guide rib and
the interfacing rail surface on the card cage. The clamping pressure in both
cases shall be 75 pounds per square inch to each guide rib. Power supplies
shall be forced against the rail surface on each cycle after power supplies
are seated into the backplane. The clamping force shall be removed prior to
extraction of the power supplies. The clamping force shall be uniformly
applied to the power supply guide ribs on the surface opposite the one in
contact with the rail surface. There shall be no exposure of nickel
underplating on the power supply connector pins upon completion of the tests.

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There shall be no exposure of nickel underplatlngon the module connector

contacts when examined under 3X magnification (1OX for referee Inspection)
upon completion of this test. To enhance the vis~billty of any exposed
underplaying, the contacts may be dipped In a 5 percent sodium sulfide
solution for 2 minutes, plus or minus 15 seconds, and then rinsed prior to
examination. Fo?lowlng the test, all formats shall pass the electrical tests
specified In 3.3.

4.7.3.15 Storaqe temperature. Power supplies shall be subjected to low

and high nonoperating temperaturesas speclfled in 3.5.3.6 to ensure storage
without protective packaging for service use.

(a) Low temperature. Power suppl~es shall be placed in a chamber and

the temperature reduced until minus 55°C Is reached with a transfer
time between temperature excursions of approximately
5 minutes. The temperature shall be maintained for a period of
24 hours. At the end of the low temperature test, power supplles
shall meet the 25°C Inttlal electrical requirements specified In
the associated detail specification.

(b) Hiah temperature. Power supplies shall be placed In a chamber and

the temperature Incre@sedwith a transfer time between temperature
excursions of approximately5 mtnutes until 125°C is reached. The
temperature shall be ma~ntalned for a period of 24 hours. There
shall be no evidence of deteriorationor physical damage after this
test. At the end of the high temperature test, the power supply
shall meet the 25°C Initial electrical requirements specified 4n
the associated detail speclflcatlon.

4.7.3.16 Nono~eratinqradiation hardness. Power supplies shall be

tested in accordance with MIL-STO-883,method 1017. Power suppljes shall not
be operated during irradiation (see 3.5.3.7). The test sample shall consist
of power supplies which have been subjected to and passed the electrical
requirements specified in the associated detail specificationfor the
100 percent.and sample acceptance tests using the inlttal electrical limits
at 25°C. Post-irradiationelectrical tests shall be the same electrical
requirements, using the end-of-life llmlts at 25°C (see 3.5.4.2). Radiation
hardness assurance requirements are satisfied If power supplles pass the end-
of-llfe requirements after each radiation exposure. The radlatlon exposure
is considered destructive and, therefore, test sample power supplies
subjected to It shall not be used In, or shipped for use In, any operational
system. For the purpose of th4s specification,all terms used In the
following referenced test methods, such as “module”, “semiconductordevice”,
“Integrated circutt”, or “part”, and so forth, meaning the part under test or
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MIL-P-29590

irradiation, shall not be interpretedor construed as meaning the power

supply.

4.7.3.17 Solvents. Power supplies which use adhesive backed labels

shall meet the requirementsof 3.5.3.8 when tested in accordance with MIL-
STD-202, method 215.

4.7.4 EMI measurements. Each power supply type shall be tested using
its primary output polarity and all specified types of input power. The
testing requirement as shown in.3.6 and procedures of MIL-STD-462 shall be
used to determine conformance to the applicable emission and susceptibility
requirements. Data gathered as a result of performing tests in one
electromagnetic discipline may be sufficientto satisfy requirements in
another. Therefore, to avoid unnecessaryduplication, a single test program
should be established with similar tests conducted concurrentlywhenever
possible.

4.7.5 Reliability.

4.7.5.1 Reliability P rediction. A reliability prediction shall be

performed in accordance with MIL-STD-756,task 201, method 2005 (see 3.7.1).
MIL-HDBK-217 shall be used as the basic data source. The prediction shall be
based on a detailed thermal/electrical/mechanical stress analysis of each
part. Unless otherwise specified in the associated detail specification,the
reliability prediction shall be made at nominal input voltage and maximum
rated output power. Any exceptions as to data or approach shall be defined,
justified and submitted to the command or agency concerned and the APSP-QAA
for approval.

4.7.5.1.1 Family Al. The reliabilitypredictions shall include the

following MIL-HDBK-217 environments:

(a) Airborne uninhabited environmentat 71°C ambient temperature and

cooling air in accordancewith 4.7.3.1.1.

(b) Airborne (actual use environment)environment in accordance with

the associated detail specification.

4.7.5.1.2 Family A2. The reliabilitypredictions shall include the

following MIL-HDBK-217 environments:

(a) Airborne uninhabited environment at 85°C rib temperature.

(b) Airborne (actual use environment)environment in accordance with

the associated detail specification.

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4.7.5.2 Environmentalstress screenlnq. Each power supply shall be

subjected to random vibratton (see f!gure 15) and thermal cycllng
environmental stress screening In accordancewith MIL-STO-2164. Thermal
cycltng shall consist of a min~mum of twelve cycles with the last three
consecutive cycles being faflure free. The temperature cycllng profile and
power supply on and off time shall be as shownon figure 16.

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GRMS= 6.06
0.04g2/Hz

+3df3/OCTAVE

ACCELERATION
SPECTRAL I I I
DENSITY I I I
G2/Hz I I I
I I I I
I 1 I I
I I I 1
I I I I
I I I I
I 1 I I
I I I I
I I I I
I I I I
I I 1 1
I I 1 1
1 I I
20 80 360 2000
FREQUENCY HZ

FIGURE 15. Random vibration s~ectrum.

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NOTES:
1. 11 = ‘T3= 2 hours. The temperature at points E and 8 apply to the power I

supply ambient temperature (family Al) or the average ffn or rtb

temperature (family A2). However, the power supply shall be considered
to have reached thermal stability only when the part with the greatest
thermal Inertia has a rate of change of less than ~C per hour or Is
within 5°C of the ambient temperature. Thermal stablltty shall be
attained a minimum of 20 minutes prior to points A or C. Coollng air
shall be on except during T2 and T3 (see 4.7.3.1).
2. For T2 and T4, the average rate of change of the chwnber ambient
temperature shall be a minimum of 5*C per minute.
3. T5 = 10mirtutes maximum. 16 = 2 minutes minimum.
4. The thermal cycle shall begin at point 5with the power supply energized
at the maximum rated load and nominal input voltage.
5. At point A, turn the power supply off and on 5 times for a maximum time
of 1 minute in each state. Monttor the output status signal (see
:.;.:.:). Alternately, verify output voltage for mnpliancewith

6. T&~ ;h~ power supply off and reduce the temperature to point B..
7. At potnt C, the power supply shall be turned on. Honftor the output
status stgnal (see 3.3.4.4).
8. At point 00 turn power supply off and on 5 times for amaxlmumtlme of 1
minute In each state. Monitor the output status signal (see 3.3.4.4).
9. Increase the temperature to point E and repeat the cycle.
10. The power supplles shall be energized at the maximum rated load and
nominal input voltage during the power on time of the test cycle.

FIGURE 16. Thermal cyclina screen.

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4.7.5.2.1 Thermal c.yclinq(family Al). The test chamber high and

low set Doint temperatures shall be DIUS 71°C and minus 55”C. respectively.
Cooling air high and low temperaturesat the power supply inlet shall be plus
54°C and minus 54oC, respectively.

4.7.5.2.2 Thermal cyclinq (family A21. The test chamber low and high
set point temperatures shall be such that the power supply achieves -55°C and
+85°C rib temperatures for the duration of the low and high temperature soak
periods, respectively. The power supply rib temperature shall be monitored
continuously, and the fixture shall allow the average rib temperature to
increase and decrease, at the same average rate, with the chamber air
temperature.

4.7.5.3 Dist)ositionoffailures. Disposition of power supplies which

do not successfully complete the thermal cycling and random vibration shall
be covered by the supplier’s plan of control (see 4.4.9).

4.7.6 Mechanical inteqrity tests (family A2). Following the tests

specified in 4.7.6.1 through 4.7.6.11, the power supply shall meet all the
configuration requirements specified herein, in the associated detail speci-
fication, and the electrical requirementsof 3.3.

4.7.6.1 Rib strenqth. The individualpower supply ribs shall

withstand the torque specified in 3.11.9.2.1 applied in a direction
. perpendicular to the plane of the ribs and along the full length of the rib
using a method similar to that shown on figure 17. The torque shall be
applied at a rate such that the specified torque is applied in 2 to 10
seconds from the time the torque is first applied to the rib and maintained
for 10 to 15 seconds.

4.7.6.2 Pin shield retention. Each pin shield shall withstand the
force specified in 3.11.9.3.1. The force shall be applied to each end of
each pin shield in a direction normal to a plane passing through the center-
line of both keying pins in each of two directions 180° apart. The point of
application of the force shall be midway between the first and second
electrical contacts on each end up 0.06 inch plus O or minus 0.03 inch (1.5
mm plus O or minus 0.8 nun)from the bottom edge of the pin shield (see figure
18). The rate of application of force shall be such that the specified force
is applied in 2 to 5 seconds and maintained for 10 to 15 seconds at 25°C plus
or minus 5“C. For multiple span power supplies employing connectors having
rows of 50 contacts, the foregoing tests are also required at points opposite
the midpoint between contacts 25 and 26 and contacts 75 and 76.

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/“

; i~;O --’f
\ 10 IN”-<6 (1.13 NEWTOhI-
\
\
\
~ METERS) TOROUE MIN.

\ I /’

NOTES:
1. Required for all formats.
2. Metrfc equivalents are given for general Informationonly.
3. Metric equivalents are in parenthesis.

FIGURE 17. Rib stremth.

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m‘f$ikGiiii’i!%w
—

DIRECTIONS (0.0)
OF FORCE (0.8)
4 LB
(18 NEWTONS)
MINIMUM

NOTES:
1. Olmensions are in inches.
2. Metric equivalents are given for general informationonly.
Metric equivalents are in parentheses.
:: On power supplies with 20 contact row connectors, the force Is applied at
4 different points for a total of 8 measurements. On power
supplies with 50 contact row connectors, the force is applied at 6
different points for a total of 12 measurements.
5. Required for all formats.

FIGURE 18. Pin shield retention.

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4.7.6.3 Power SUDPIY torque. The power supply shall be mounted in a

fixture which restrains the movement of the base of the power supply (see
figure 19) and shall have atorqueas specified In 3.11.9.4.1 applied to the
power supply fin or header In each of two oppos~ng directions. The torque
shall be app14ed at a rate such that the specified torque is applted In 2 to
10 seconds from the t~me the torque is first applied to the power supply fin
or header and maintained for 10 to 15 seconds. During the period of time In
which torque is applied, the power supply shall be rigidly supported within a
zone between the interface plane and 0.50 inch (12.7 mm) above the interface
plane for format B, or 1.0 inch (25.4 mm) above the interface plane for
formats C and E.

4.7.6.4 Reader torque. Mith the power supply restrained as specified

in 4.7.6.6, the torque specified in 3.11.9.4.2 shall be appl~ed in both
directions along the header on format C and E power supplies (see figure 20).
The torque shall be applied in2 to 10 seconds and maintained for 10 to 15
seconds.
4.7.6.5 Fin/header cantilever load. The force specified in 3.11.9.4.3
shall be applied at the center of the fln or header along the centerline I
between the two extractor holes and perpendicularto the plane of the fin or
header In twodlrections (see figure 21). The power supply shall be rigidly
supported along the power supply r~bs within a zone between the interface
plane and 0.50 Inch (12.7 mm) above the interface plane. The specified force
shall be applied In 2 to 10 seconds from the time the force Is first applled
and maintained for 10 to 15 seconds.

4.7.6.6 Connector Inteqrity. Wflththe power supply ribs supported to

prevent movement of the unit, the force specified in 3.11.9.5 shall gradually
be applied to the connector in both directions of the longitudinalaxis of
the contact. The force shall be applied at a rate such that the specified
force is applied in 2 to 10 seconds from the time the force !s first applied
to the connector and maintained for 10 to 15 seconds.

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FORMATS 8: 6 IN-LB (0.68 NEWTON-METERS)TORQUE MIN. IN BOTH DIRECTIONS.

FORMATS C, E: 25 IN-LB (2.82 NEWTON-METERS)TORQUE MIN. IN BOTH DIRECTIONS.

NOTES:
1. dimensions are in inches.
2. Metric equivalents are given for general informationonly.
3. Metric equivalents are in parenthesis.
4. “A” is 0.5 inch (12.7 MM) for format B, and 1.0 inch
(25.4 mm) for formats C and E.

FIGURE 19. Power SUPPIV tor~ue=

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10 IN-LB (1.3 5J~WTON-METERS)

TOf?OUE M;N, [hIBOTH OIRECTIONS

PLANE

NOTES:
1. Metric eautvalents are qiven for general Information only.
2. Metric equivalents are In parenthesis.

FJGURE 20. Header torque.

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FORMAT B: 2 LB (9 NEWTONS)
FORMATS C, E: 5 LB (22.3 NEWTONS)
MINIMUM IN BOTH DIRECTIONS

NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general informationonly.
3. Metric equivalents are in parenthesis.

FIGURE 21. Fin/header cantilever load.

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4.7.6.7 Connector contact inteqrity. With the body of the connector

supported to prevent movement of the connector, the force specified In
3.11.9.5.4 shall be gradually applfed to each contact in the connector
individually In both direct~ons of the Iongltudlnalaxis of the contact. The
force shall be applied at a rate such that the spectfled force is applled in
2 to 10 seconds from the time the force ts f!rst applied to the contacts and
maintained for 10 to 15 seconds.

4.7.6.8 Keyinq Din torque. Iiiththe power supply supported to prevent

rotation of the unit about the longitudinalaxis of the keying p~n to be
tested, the torque specified in 3.11.9.6.5.1shall be applied In a plane
perpendicular to the longitudinalaxfs of the keying ptn. The torque shall
be applied such that the specified torque Is applied in 2 to 10 seconds from
the time torque is first applied to the pln and matntafned for 10 to 15
seconds. The longitudinal axis of the keying pin Is considered the center of
the keying pln diameter extending the !ength of the keying pin.

4.7.6.9 Keyinu Din DU~lOUt* With the power supply supported to

prevent movement of the unit, the force specified in 3.11.9.6.5.2 shall be
applied to the keying pln in the longitudinalax~s of the keying pin. The
force shall be applied at a rate such that the specified force is applled In
2 to 10 seconds from the time the force Is first applled to the keying pin
and maintained for 10 to 15 seconds.

4.7.6.10 Keyinq D in cantilever load. With the power supply supported

to prevent movement of the unit, the force specified in 3.11.9.6.5.3 shall
gradually be appl~ed perpendicular to the long~tudinalaxis of the keying pin
at a minimum distance of 0.200 inch (5.08 mm) from the Interface surface.
The force shall be applied at a rate such that the speciffed force Is applled
in 2 to 10 seconds from the time the force ~s first appl~ed to the keying pin
and maintained for 10 to 15 seconds. The keying pin under test shall have no
external support along the keying pin length extending from the tnterface
surface during the test.

4.7.6.11 Keyinq Pin nustiout. With the power supply body supported to
prevent movement of the unit, the force specified in 3.11.9.6.5.4 shall be
applied to the keying pin in the longitudinalaxis of the keying pin. The
force shall be a,ppliedat a rate such that the speclf~ed force is applied in
2 to 10 seconds from the time the force is first applied to the keying pln
and maintained for 10 to 15 seconds. The force shall be applied in the
opposite direction to the force in 4.7.6.9.

4.7.7 Thermal measurements. Component temperature verification shall

be performed by the APSP-QAA in accordance with 4.7.7.1 through 4.7.7.2 (see
3.12.1 and 4.4.3).

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4.7.7.1 Family Al.

4.7.7.1.1 ~. With the power supply operating in accordance with the

associated detail specification (if no circuit is specified, the long term
stability test circuits shall be used), the temperaturesof the components
shall be monitored while operating in accordancewith 4.7.3.1.1. The CCT of
any component shall not exceed the maximum allowable component temperature
(see 3.12.1.1).

4.7.7.1.2 ~. The TCCT shall be tested during test cycle time

210 to 240 minutes of the temperature and altitude test procedure of 4.7.3.2.
The power supply shall operate at full load with all input voltages
maintained constant during power supply operation. The temperature of the
components shall be monitored. The TCCT of any component shall not exceed
the maximum allowable component temperature (see 3.12.1.2).

4.7.7.2 Family A2. Power supplies shall be set up in thermal test

fixtures, operated according to the associated detail specification (if no
circuit is specified, the life test circuit shall be used), and tested to the
requirements described below. Unless otherwise specified in the associated
detail specification,all power shall be dissipated through each thermal
interface individuallywithout any heat loss from the other interfaces. The
fin or rib temperatures shall be monitored as near as possible to the thermal
interface without disrupting the integrityof the thermal interface (see
3.12.1).

4.7.7.2.1 QQ. With the power supply operating at its class high

I thermal interface temperature, the temperaturesof components shall meet the

requirements of critical component temperature in 3.12.1.1.

4.7.7.2.2 ~. With the power supply operating at its class high

I
thermal interface temperature,the temperature shall be raised 20”C above the
class high temperature in approximately5 minutes and maintained for
1 hour. The power supply component temperature shall meet the requirements
of the transient critical component temperatures in 3.12.1.2.

4.7.7.3 Leakaqe (family Al}. The power supplies shall meet the

I
leakage requirements of 3.12.5 with the cooling air system pressurized to no
less than 2 inches of water at a temperature of 21°C plus or minus
5“C. The power supply shall be mounted by its usual means with elastomeric
air seals mating with the sealing area. The elastomeric seal material shall
be ZZ-R-765, class 36, grade 50 or equivalent.

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5. PACKAGING

[The packaging requlrements specifled herein apply only for direct Government
acquisition. For the extent of applicabilityof the packaging requirements
of reference documents listed In section 2, see 5.4 and 6.6.)

5.1 Process method. The method of preservationshall be in accordance

with method IIb of 141L-P-116and the requ~rements specified herein.
Preservation and packing shall be in accordancewith level A of
HIL-STO-2073-1.

5.2 Preservation.

5.2.1 Cleaninq. Power supplies shall be cleaned in accordance with

MIL-P-116, process C-1.

5.2.2 OrYinq. Power supplies shall be dried in accordance with MIL-P-

116.

5.2.3 Preservation application. Contact preservativesshall not be

used.

5.2.4 Desiccants and humidity indicators. Desiccant shall be provided

in accordance with 141L-P-116. Humidity Indicatorsare not required.

5.2.5 Interior Dackaqe. A power supply shall be contained in a snug-

fitting carton in accordance with PPP-13-00636,class weather reststant; type,
variety~ grades and style optional; normal requirements. $OX closure shall
be in accordance with method IVof the appendix to PPP-13-00636.

5.2.6 Barrier. The interior package shall be enclosed in a sealed bag

in accordance with MIL-B-117, type I, class E, style 1. Electrostatic
discharge protective packaging shall be accomplished in accordance with MIL-
P-116. Power supplies requiring protection from electrostaticfield forces
shall be enclosed in sealed bags conforidng to MIL-B-117, type 1, class A,
style 2.

5.3 Packinq.

5.3.1 Cushioning. Cushioning shall be provided by shock and

v$bration-absorbingmaterials or devices that adequately protect the power
supplles from physical damage during handling, shipment, and storage.

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5.3.2 Exterior packaqe. An exterior package shall be provided which

conforms to PPP-B-00636, class weather resistant, type, variety, grade, and
style optional, special requirements. Closure of the exterior package shall
be in accordance with method V of the appendix to PPP-B-00636 and shall not
damage the barrier bag. Exterior containers shall be of a minimum tare and
cube consistent with the protection required.

5.4 Alternate Packaqinq. Alternate packaging approaches shall be

submitted to the command or agency concerned for approval.

6. NOTES

(This section contains informationof a general or explanatory nature that

may be helpful, but is not mandatory.)

6.1 Intended use. Power supplies specified herein are intended for use
in military systems and subsystems.

6.2 Acquisition requirements. Acquisition documents must specify the

following:

(a) Title, number, and date of this specification.

(b) Issue of DoDISS to be cited in the solicitation,and if required,
the specific issue of individualdocuments referenced (see section
2).

(c) Title, number, and date of the associated detai1 specificationand

the part number.

(d) $vels of preservation,packaging, and packing required (see section

.

(e) QUAL certification,as required (see 3.14.1.2).

6.3 Considerationof data requirements. The following data

requirements should be consideredwhen this specification is applied on a
contract. The applicable Data Item Descriptions (DID’s) should be reviewed
in conjunction with the specific acquisition to ensure that only essential
data are requested/providedand that the DID’s are tailored to reflect the
requirements of the specific acquisition. To ensure correct contractual
application of the data requirements,a Contract Data Requirements List (DD
Form 1423) must be prepared to obtain the data, except where ”DOO FAR
Supplement 27.475-1 exempts the requirement for a DD Form 1423.

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Reference Suggested
Parammh DID Number 010 Title Tailorinq

4.4.1.1 DI-NUTI-80809 Test/inspection ---

reports

4.4.2 DI-R-7082 Reliability pre- ---

dictions report

4.4.4 01-EIRPR-81000 Product drawfngs ---

and associated llsts

4.5*4 DI-RELI-80255 Failure surmnaryand ---

6.8.2 analysis report

4.4.9 UOI-R-23743 ~~~ityprogram ---

4.4.11 DI-T-25837 Document, lo.4.3f

maintenance Applies without
requirement exceptions

The above 010’s were those cleared as of the date of this specification. The
current ~ssue of DOD 501O.I2-L,Acquisition Management Systems and Oata
Requirements Control List [AMSOL),must be researched to ensure that only
current, cleared 010’s are cited on the 00 Form 1423.

6.3.1 Oata remlrements for qualification. Oata items identified in

this speclficat~on are required to be delivered to the APSP-QAA for the
purpose of facilitating qualificationtesting. The data will not be
disclosed outside the Government nor duplicated, used, or disclosed, in whole
or in part, for any purpose other than to evaluate the power supply submdtted
for qualification testing (see 6.3.l.1). Generally, these data requirement
deliveries coinc~de with qualificationsubmission schedules and are not a
functfon of power supply acquisitions. Deliverable data required (but not
restricted to those listed) by this speclflcatlonfur qualification are cited
In the following paragraphs.

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ParaqraPh no. Data requirementtitle

3.10.4 Printed-wiringand printed-wiringassemblies

(equivalentmaterials, processes and requirements)
4.4.1 Initial qualificationtests
4.4.1.1 Test data
4.4.1.2 Inspectionand test procedures
4.4.2 Failure rate predictionand parts derating
4.4.3 Thermal analysis
4.4.4 Design conformance (design package)
4.4.4.1 Change control
4.4.5 Periodic check (cross reference matrix)
4.4.5.2 Noncontinuousproduction
4.4.7 Corrective action
4.4.9 Quality assurance requirements
4.4.9.1 Manufacturingflow chart
4.4.9.2 Manufacturinginstructions
4.4.9.3 Processes requiring certification
4.4.11 Maintenance data
10.5, appendix Notification
50.3, appendix Test procedure documentation
60.4, appendix Correlationrequirements
70.2, appendix Recorrelationcriteria

6.3.1.1 Riqhts in technical data. All data and informationprovided

for use or specified to be delivered for qualificationpurposes will be
furnished for use by the APSP-QAA only. This data must be delivered to the
requirements of SD-6, “ProvisionsGoverning Qualification”and therefore no
DID’s are required.

6.4 Qualification. With respect to products requiring qualification,

awards will be made only to power supply contractors (1) whose products are,
at the time set for opening of bids, qualified for inclusion in Qualified
Products List QPL No. 29590 or (2) who have at least one power supply listed
on the QPL-29590 at the time set for opening of bids and deliver with their
bid a statement of certificationthat the procured item(s) will be qualified
prior to the required delivery date. The attention of the power supply
contractor is called to these requirements,and manufacturers are urged to
arrange to have the products that they propose to offer to the Federal
Government tested for qualification in order that they may be eligible to be
awarded contracts of purchase orders for the products covered by this
specification. The activity responsiblefor the Qualified Products List is
the Naval Avionics Center, Code 812, 6000 East 21st Street, Indianapolis, IN
46219-2189. Application for qualificationtests should be made in accordance
with SD-6, “Provisions Governing Qualification.”

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6.5 Definitions. The fallowlng definitions are applicable to terms

used herein.

6.5.1 Command or aqency concerned. The comnand or agency concerned is

the organizational element of the Governmentwhich contracts for articles,
supplies or services, or it may be a supplier or subcontractorwhen the
organizational element of the Government has given specific written
authorization to such a contractor or subcontractorto serve as agent of the
conxnandor agency concerned. A contractoror subcontractorserving as agent
of the camnand or agency concerned should not have the authorfty to grant
waivers, dev$atlons, or exceptions to thfs spectf~catlonunless speciftc
written authorization to do so has also been given by the Government.

6.5.2 APSP-QAA. The APSP-QAA performs airborne power supply products

QPL maintenance and support. These functtons are being performed by the
Naval Avionics Center, Code 812, 6000 East 21st Street, Indianapolis, Indiana
46219-2189, telephone 317-353-7812.

6.5.3 Power SUDUIY swmller. A power supply suppl~er !s any person,

partnership, company, corporation,or associatewho owns, operates, or
maintains a factory or establishmentthat produces, on the premises, the
power supply required under a contract with the command or agency concerned.
If a power supply is manufactured by an organizationwithtn the command or
agency concerned, that organization should be considered a power supply
supplier. Supplier and manufacturer are used Interchangeablythroughout this
specification.

6.5.4 Material Revlew80ard (MRB~. The FiR8will be comprised of at

least three members as follows:

(a) A member of the Government InspectionAgency. Thls member, or his

designated representative,wII1 be the chairman and may approve the
qualificationof all other members and alternates.

(b) A power supply supplier’s representativewhose primary

responsibility is the quality of the product.

(c) A power supply supplier’s representativewhose primary

responsibility Is the design of the product.

Any concurrence of a disposition by the board must be unanimous. A member

may have alternates approved by the chairman. An APSP-QAA representativemay
constitute the fourth 14RBmember at the discretion of the APSP-QAA.

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6.5.5 Specified ~erformance. The terms “specified performance”,

“spec fied requirements”,and “specified limits” are used interchangeablyand
refer to all applicable power supply requirements specified herein and “n the
associated detail specification.

6.5.6 MIL-STD-1389 and MIL-M-28787. References herein to MIL-STD-1389

and MIL-M-28787 are made for requirementsas applicable to the power
supplies. When these documents are used for family Al, the term “Standard
Electronic Module (SEM)” shall be interpretedas Airborne Power Supply
Products (APSP), and the term “module” shall be interpretedas power supply.

6.5.7 Power SUEMIIYthermal interface. For family Al the thermal

interface shall be the mounting surface. For family A2, the thermal
interface shall be the fin or rib cooling surface.

6.6 Subcontractedmaterial and Darts. The packaging requirements of

reference documents listed in section 2 do not apply when material and parts
are acquired by the manufacturer for incorporationinto the power supplies
and lose their separate identity when the equipment is shipped.

6.7 SEM Desiqn Review Activity (SEM-DRA). The SEM activity which is
currently responsible for the review and classificationof module designs and
assigns manufacturers’ designations is the Naval Avionics Center, Code 814,
6000 East 21st Street, Indianapolis,IN 46219-2189, telephone 317-353-7814.

6.8 Examples of Plans and additional requirements. Test plans,

documentation and additional requirementsthat may be required by the
statement of work or contract may include but are limited to the examples
specified in 6.8.1 through 6.8.6.

6.8.1 Reliability roqram plan. A reliability program plan should be

prepared that identifies and ties together all program management tasks
required to achieve the reliability requirement of 3.7.1. The task
description section of MIL-STD-785, task 101, Reliability Program Plan,
should be considered in developing the plan. The plan should be submitted to
the command or agency concerned for approval.

6.8.2 Failure reportinq, analysis, and corrective action. A closed

loop system should be established for reporting deficienciesfound in
accordance with MIL-Q-9858, for analysis of failures to determine cause (see
4.5.4), and for recording corrective action taken. Classificationof
failures should be in accordance with MIL-STD-2074.

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6.8.3 Electronic parts/circuitstolerance analyses. Parts/c~rcults

tolerance analyses should be conducted on each power supply type. These
analyses should verify that, given reasonable combinationsof speclflcatlon
characteristics and parts tolerance buildup, the power supply being analyzed
will perfmn within specificationrequirements. Component characteristics
(1ife-drift and temperature) should be factored Into the analyses. Results
of these analyses and actions taken should be made available to the consnand
or agency concerned.

6.8.4 Environmental stress screenin~ Dlan. A detailed environmental

stress screening test plan should be prepared as part of the reliability
program plan and should consider the requirementsof task 301 of #iIL-ST&785
and NAV14ATP-9492. The test plan should include the 100 percent screening
requirements defined herein as thermal cycling (see 4.7.5.2) and random
vibration (see 4.7.3.3].

6.8.5 Reliability develomenthrowth test (RDGT) mmram. A ROGT

program should be Implemented In accordance with task 302 of HIL-STO-785.

6.8.6 EMI test plan. An EMI test plan should be prepared to implement
the testing requirements and procedures of 141L-STO-462as defined in 3.6.
Formal testing Is mot to conmnencewithout approval of the test plan by the
APSP-QAA.

6.8.7 Government source inspection. The command or agency concerned

should notify the Defense Contract Management AdministrationOffice (OChiAO)
representative servfctng the cwmnand or agency prior to placement of an order
invoking this specification. The reconwnendedOC$lAOactions should include
review of the supplier’s quality program and the means employed to control
quality and to comply with contract requirements,initiation of required
corrective action, and the inspectionof the power supplies.

6.9 Nonconfmminq materials. Aqy variance of material from this

specification and from the associated detail specificationshould be disposed
of in accordance with the decision reached by the 14RB(see 6.5.4). The
supplier may use in-house established procedures documented In his control
plan for such disposition. Records of all such variances and disposition
should be retained on file and available for Government review. The APSP-QAA
should be notified of 14RBdecisions which result in the use of nonconforming
materials In the manufacture of power supplies and which cause the power
supplies to not meet the requirements specified herein or fn the associated
detail specification.

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6.9.1 Disposition of nonconformingmaterial. The disposition of

nonconforming material should be in accordancewith the decisions reached by
the MRB. The dispositionswill generally fall into the following categories.

(a) Use as is. Material that, in its present condition, can be used
without compromising form, fit, function, performance,reliability, safety,
and so forth. The dispositionwill be made by the MRB.
(b) Repair. Material, after repair, which meets the definition of (a)
but does not fully meet drawing and specificationrequirements. This
disposition, including approval of the repair procedure, will be made by the
MRB.
(c) Rework. Material which can economicallybe restored to a
conforming condition. This dispositiondoes not require MRB approval.
(d) Scrap. Material not usable in its present condition and which
cannot be economically reworked or repaired. This disposition does not
require MRB approval.
6.9.2 Shipment of nonconformingmaterial. Power supplies containing
nonconforming material should not be shipped until the applicable waiver or
deviation has been approved by the command or agency involved or the final
MRB disposition has been received. Power supplies requiring a waiver or
deviation should not be marked with the qualificationcertificationmark
“QUAL”.

6.10 Part or identifyingnumber [PIN). The PIN to be used for power

supplies acquired to this specificationis created as follows:

M 29590 /1:3 A (1/

II : { Ii I
II ; 1I II II
II I1 I II II
II II II II II

Military Specifi- Detai1 Detai1 Detai1

specifi- cation specifi- specifica- specifica-
cation number cation tion revi- tion amend-
number sion letter ment number

For example, a power supply could be marked M29590/123A(l). The associated

detail specification revision letter and amendment number are not a part of
the power supply part number and shall be left blank if none exists. The
example part number is not intended to designate a length of field require-

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ment. The length of the part number will vary according to the applicable
associated detail specification.

6.11 @AL markinq. TlieAPSP-QAA will notify inwrlting each power

supply supplier on a military part number basis when ~tQIJAL”
may be marked on
a power supply. Conversely,when a power supply supplier fails to meet all
of the requirements herein, and In the associated detail speciflcatlon,the
vendor wI1l be notified 4n writing to stop marking “QIJAL”. Such notification
will come from the APSP-QAA.
6.12 Sub.iectterm [keyword) listlnq.
Airborne Power Supply Products (APSP)
APSP
Converter, AC to OC
Converter, DC to OC
Standard Hardware Acquisition and RelIabl1ity Program (SHARP)
SHARP
Standard Power SUpplies [SPS)
m

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APPENDIX

AIRBORNE POWER SUPPLY PRODUCTS TESTER CORRELATION

10. SCOPE

10.1 Scoi3e. Correlation is the method of m-ovina. for a Dower sur.mly

of a specific military part numbered power supply, that all production
testers shall yield test data which matches the correlation data within close
tolerance and determines if the power supply meets the requirements of the
power supply associated detail specification. This appendix is a mandatory
part of this specification. The informationcontained herein is intended for
compliance.

10.2 Performance. Correlation shall be performed on all production

testers used to accept, qualify, or recertify APSP. Successful correlation
shall be required to certify the use of a tester and its peripheral equipment
(adapter, switching cards).

10.3 Method. Correlation is accomplishedby using a common medium

between the production tester and the quality assurance provision of the
power supply associated detail specification. This medium provides a means
of comparing the results of a specific power supply having known recorded
parameters with the results of the production testers. This cormnonmedium is
a power supply hereinafter termed “correlationpower supply”.

10.4 Responsibility. The APSP-QAA shall be responsible for

correlation and shall determine the need for correlation of production
testers associated with a given power supply military part number. The APSP- ~
QAA shal1 also maintain control over the correlation power supplies and only
take them to the vendor’s facility during the correlation attempts.

10.5 Notification. The testing facility or acquisition activity

should notify the APSP-QAA in writing of a correlation requirement as soon as
it becomes known.

20. APPLICABLE DOCUMENTS. This section is not applicable to this

appendix.

30. CORRELATION CRITERIA

30.1 Correlation criteria. The following are criteria to be used in

determining the need for correlationof a production tester for a specific
power supply part number.

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(a) QUAL certification. QUAL certificationfor a standard electrtmlc

power supply requfres that all test systems be correlated.

(b) Accuracy reaulrements. The associated detail speclflcatfon has

cr~tical parameters with close tolerances requiring accurate
measurements.
~c) Environmental sensitivity. Power supply types which are sensitive
to parasltlc resistance,capacitance,or Inductance requiring
control of power supply/testerinterface.

(d) Test method deviations. Power suppltes whkh are being tested by a
tester with a method which deviates from procedures specified fn
the associated detail power supply drawing or specification.

(e) Factory or field failure. Power supply types which have

experienced excessive factory or field failures.

40. CORRELATION ANO PROOF POWER SUPPLIES

40.1 Acauisit~on. The initial developer or supplier shall provtde the

APSP-QAA with four.productionpower supplies of a specific military part
number for correlation and proof power supplies. Or, when agreed to by the
APSP-QAA, power supplies submitted for qualificationmay be used for
correlation samples. Prior to the availabilityof production power supplies,
prototype power supplies meeting the above requirementsmay be submitted.
Each power supply shall meet the product design configuration of the drawing
or specifications.

40.2 Oevelo~ment. The APSP-QAA shall test the four power supplies to
the requirements of the power supply specification. The data shall be
recorded and a data file shall be maintained and updated. When the power
suppl$es are tested by a bench setup, all test equipment and associated
information shall be recorded. Nhen the power supplies are tested by.
automatic test equipment (ATE), a copy of the program and a drawing of any
required interface circuitry shall be maintained. All data shall be
referenced to the a.ppllcabletest conditions of the power supply
specification. The determinationto use bench or ATE shall be made by the
correlation activity.

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40.2.1 Correlation power suimlies. The two power supplies for which
correlation sheets are made shall be designated as correlation power
supplies. The purpose of the correlationpower supplies shall be to obtain
comparison data for use in correlating an existing tester. The correlation
power supplies shall display a conspicuous identificationsticker marked
“CORRELATION POWER SUPPLIES”.

40.2.2 Proof power supplies. The remaining two power supplies which
were tested on a bench test setup or a correlated tester shall be designated
as proof power supplies. The proof power supplies shall be used to check out
new or modified testers in preparation for correlationtesting. The proof
power supplies protect the correlationpower supplies from damage and are
used for laboratory investigationof requested tester deviations. The proof
power supplies shall display a conspicuous identificationsticker marked
“PROOF POWER SUPPLY”.

40.3 Rer.)airand retestinq of correlation and proof power supplies. A

Government designated facility shall be responsiblefor repairs or
modifications to correlation and proof test power supplies. Correlation and
proof test power supplies which have been repaired, modified, or otherwise
adjusted shall require retesting in a correlation activity laboratory in
order to obtain new correlation power supply data which shall supersede
previous data.

40.4 Storaqe and control. Correlation and proof power supplies and
their associated data sheets shall be stored by and be under control of the
APSP-QAA.

50. TESTER FACILITY REQUIREMENTS

50.1 Facility requirements. A tester facility shall be considered

ready to test a correlation power supply and to record correlation data when
the facility has compliedwith the following and received approval from the
APSP-QAA.

(a) The tester test document has been written to the required revision
of the power supply associated detail specification.

(b) The tester is compatible with its own documentation,which includes

a top assembly drawing available to the APSP-QAA upon request.

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(c) The top assembly drawing number and the revls~on status of the
production tester and Its peripheralequipment Is dlspl~ed on
the applicable equipment.

(d) The production tester and its associated equipment have been
serialized and the serial number displayed on each ttem along with
the current calibration tag.

50.2 Tester documentation. The tester documentation shall contatn the

followlng:

(a) 14a4af
acturer and model number of each piece of test equipment
.

(b) Serial number of tester to be correlated.

(c] Tester measurement offsets and associatedparas~tlc Impedance data,

along w~th an explanation of the derivations.

(d) Test system configurat~onwhich Includes equipment used, equipment

specifications, location of equfpment In the test system, and any
optional equipment used.

50.3 Test procedure documentation. The tester facllfty shall prepare

a test procedure for each power supply military part number to be correla!ed.
The test procedure shall be submitted to the APSP-QAA for review at least 2
weeks prfor to the correlation attempt. The test procedure shall contain the
following:

[a) Power supply drawing or specificationnumber and revision to wh ch

tester Is testing power supplies.

(b) Top assembly drawing number and revision of tester and power supply
related peripheral equipment (adapters,switch cards, test tapes,
load boards). Ilrawtngsof peripheral equipment will be ava!lable
to APSP-QAA on request.

(c) ATE test program documentationwhich fncludes:

(1) System software revision.

(2] List of all files and sub-files.

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(3) Test measurement routines.

(4) Order of testing.

(5) Flow charts for particular test sequences, that is, algorithms.

(6) Programming constraints.

(7) Data logging and operator routines.

(8) Test pattern documentalion including fault coverage, method used

(simulatoror manual), test plan description, description of
timing associated with each pattern file, and list of all tester
pattern files.

(d) A definition of each deviation from the associated detail

specificationtest method which is made in the tester test
procedure.

(e) Measurement limits to which tester is testing power supplies.

(f) Determinationof tests as sample, 100 percent, or qualification.

(9) Proper order of testing per the associated detail specification.

(h) Comparison of the tester obtained accuracies and required accuracies

for each unique test condition of the associated detail
specification (this is not required if the method and test equipment
used are the same as in the associated detail specification).

(i) Schematic drawing of the test fixture(s) for bench test systems.

60. CORRELATION TESTING

60.1 Correlation testinq. The APSP-QAA shall require the following

items for correlation testing at the location of the applicable tester
facility.

(a) The correlation data sheet for each correlation power supply with
the informationof section 40. already recorded (supplied by the
APSP-QAA).

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(b) l$copy of the PIN associated detail spec?flcatlonforwhlch the

tester Is to be correlated.

(c) Tester documentation as specified jn section 50.

(d) Two correlation power suppltes and two proof power suppl Ies of the
military part number for which the tester Is to be correlated
(supplled by the APSP-QAA).

60.2 Uslrtathe Proof test Dower supply. Prior to Inserting a

correlation power supply into the tester,,a proof power supply of the same
military part number shall be tnserted into the tester to protect the
correlation power supply. lihenautomatic testers are used, a proof power
supply shall be tested twice to verify the power supply has not been damaged.
If this requirement is not met, then the responsible tester facillty
personnel shall take the necessary corrective action. If the corrective
actton requires that changes be made In tester documentation,then these
changes shall be sent in writ4ng to the APSP-QAA. Mhen the tester test
results on the proof power supplies have met the requirementsof thfs
appendix, the tester Is ready to have a correlation power supply inserted.
Correlation testing shall be done by tester faclllty personnel at the tester
factllty andwitriessedby the APSP-QAA.

60.3 Recordinq informationon the correlation data sheet. The

correlation personnel shall properly complete the data and information
required on the correlation data sheets correspondingto the two correlation
power supplies of the mllltary part number for which the tester is being
correlated.

60.4 Correlation reaulremetits.The tester test results shall be

considered to have met the correlation requirementswhen they agree with the
requirements of 90.3 through 90.4.

60.4.1 Discrepancies. Test fac~lity personnel shall be responsible

for taking corrective action on each discrepancy found. Before correlation
data is retakenon the tester, tester facility personnel shall exp~aln to the
APSP-@A in writing the reason for and action takenon each discrepancy. All
changes and revisions to tester documentationshall be subarittedInwrttlng
to the APSP-QAA. Upon approval of these changes by the APSP-QAA, correlation
data shall be takenon those test conditions deemed necessary by the APSP-
QAA.

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APPENDIX

60.4.2 Failure on one correlationpower SUDIIIY. If a tester

measurement fails the correlationcriterion on one correlation power supply
only, this measurement shall be repeated on both correlation power supplies.
If the same results are obtained, the measurementwill not be considered to
have failed correlation until the data of the failed power supply has been
verified on the APSP-QAA laboratorybench test setup.

60.5 Correlation not successful. When correlation is not successful,

the reason and planned corrective action shall be entered in the tester
correlation report (see figure 22) and forwarded to the acquisition activity.

60.6 Correlation successful. When correlation is successfully

completed, the APSP-QAA shall be required to fill out a correlation report
(see figure 22). Upon completion,this report shall be signed by the APSP-
QAA. The tester is now ready for official certificationwhich shal1 be the
responsibility of the APSP-QAA.

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TESTERCORREMTUW REPORT
AIRMMME STANDARD POWER SUPPLY
M[L-P-29S90
MODULE
KEY CODE MibP-29590 SHEET NO. REV.LWL AMEMOMENT UO.

EQUIVALENT OR SPECIFICATION CONTROL

DWG NO. REV. LTR,

B 1

VENDOR AMD LOCATION CORRELATION

a uanu
~ RKollmArlom
mTA RETAKEM)

TEST PROCEDURE fJ wcoaKEMlloM

VA?H U?OATEJ
MIJMBER REVISION
Mm
(OATA
TAKEN)

M“aulmmm
couREiAIEo

UJTwRmo oEvmnOMs

AKP-QAA APPROVAL DATE

-IA- ENOtNEER

4PSP-QAA APPROVAL

Data sheetsavailable lhrm CommandhgOEker,Naval AvionicsCenter (Cock812), hdiam@irA U4 46219-2189.

FIGURE22. Tester correlation report format.

131

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60.7 ReDort. The APSP-QAA shall send copies of the completed

correlation report to the cognizant Government activity at the tester
facility and to the acquisition activity.

70. RECORRELATION

70.1 Res~onsibility. The APSP-QAA shall be responsible for

recorrelation of a tester design or any part thereof.

70.2 Recorrelationcriteria. The fol”owing criteria shall be used to

determine the necessity for recorrelation.

(a) The tester or any part thereof has undergone modification which
directly influencesthe electrical testing of power supplies.

(b) Repeated failures of a specific power supply military part number

are indicated by tester measurements.

(c) Repeated failures of a power supply of a specific military part

number are indicated by system usage.

(d) A power supply of a specific military part number has undergone

modification which results in a change in the test procedure, the
test results, or the tester, or any part thereof.

(e) Elapse of qualificationstatus criteria as specified in this

specification.

The APSP-QAA shall be notified when recorrelationis required.

80. CORRELATION CONTROL DOCUMENTATION

80.1 Information required. For every APSP power supply military part
number, the following information shall be documented and maintained by the
APSP-QAA.

(a) Tester correlation data.

(b) Tester test equipment data.

(c) Test procedure documentation (see 50.3).

(d) Tester documentation (see 50.2).

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(e) Tester correlation report (see figure 22).

90. CALCULATION ANllApplicationOF TESTER OFFSETS AND CORRELATION

TOLERANCES

90.1 General. The tester test results shall be compared to the

correlation power supply bench test data plus known tester offsets. The
tester results wtll be considered correlated if they agree with the
correlation power supply bench test data plus known tester offsets wlthln the
correlation tolerances.

90.2 Tester offsets. A tester measurement offset Is a constant

quantity with a known physical explanation associated with that tester’s
measurement of a particular electricalparameter. An offset may be caused by
parasitic loading of the power supply by the tester or by adev~atlon In test
method.

(a) Example 1. Power supply transition time is found to be equal to

125 ns as measured in the laboratorywith an oscilloscope. On a
production tester, the transition time measurement on the same
power supply is found to be equal to 145 ns due to 95 pf of
parasitic capacitance associatedwith the tester adapter output
ptns into which the power supply is plugged. The resultant offset
is therefore 20 ns (145 nsminus 125 ns).

(b) Example 2. A power supply test speclf~catlon states that a voltage

Is to be measured at a test point. At the test po4nt, this voltage
is found to be 9.8 volts (V) as measured in the laboratory. The
production tester cannot make measurements at the test point. It
must make the voltage measurement at a power supply pin on the
other side of a conducting diode. The diode voltage drop is found I
to be equal toO.6V. The output measured by the tester Is
therefore equal to9.2V (9.8 Vmlnus O.6V). The tester offset IS
~imUS 0.6 V.

(c) Offset. The offset Is used for two purposes. First, it serves in
the correlation between the bench test data and the tester data on
the correlation power supplies. Second, the final programed
tester pass/fail limits are calculated using the offset. ~hls Is
shown as follows:

Final minimum limit equals the minimum test

specification ltmit plus offset.

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APPENDIX

Final maximum limit equals the maximum test

specification limit plus offset.

90.3 Correlation tolerance. The tester results from the correlation

power supply are compared to the results obtained by adding the appropriate
tester offsets to the bench test data (taken to power supply test
specification)on this same power supply. These results should be identical
within a tolerance called the correlation tolerance. Either of two methods
is used to calculate the correlation tolerance depending upon the power
supply specificationparameter requirement. The methods are as follows.

90.3.1Parameter tolerance euual to or qreater than 3 r)ercent. In

cases where the parameter tolerance is greater than or equal to 3 percent of
the parameter, 22 percent of the parameter tolerance shall determine the
correlation tolerance. This can be expressed as follows:

Correlation tolerance

= +/-(0.22/2) max test specificationlimit - min

Correlation tolerance [
test specificationlimit
2 1
. = +/-0.11 [ max test specificationlimit - min
test specificationlimit
1

(a) Example. A test specificationstates that the requirements for a

parameter are tr equals 125 ns plus or minus 15 percent. The
maximum limit would be 143.8 ns (125 ns plus 0.15*(125 ns)). The
minimum limit would be 106.2 ns (125 ns minus 0.15*(125 ns)). The
correlation tolerance is plus or minus 4.14 ns (+/-0.11*(143.8-
106.2)). Therefore, the tester measured tr should agree with the
bench test measured tr plus tester offset (if applicable)within
4.14 ns. If the upper or lower limit is plus or minus infinity or
undefined, then the parameter will not be correlated.

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APPENDIX

90.3.2 Parameter tolerance less than 3 percent. In cases where the

parameter tolerance Is less than 3 percent of the parameter, 25 percent of
the parameter tolerance plus the bench test equtpment accuracy will detennlne
the correlation tolerance. This can be expressed as follows:

Correlation tolerance =

max test specificationIimtt bench test

+
-{
0.25
[
- min test speclflcattonlimlt +
2 1[ 1/
equipment accuracy

(a) Exanmle. A test speclflcattonstates that the requirements for a

power supply parameter are Vp equals 10 V plus ormfnus 1 percent.
Themaxlmum limit %s 10.1 V (lOV plus O.O1(IO V)). Themlrafmum
limit Is 9.9 V (10 V minus 0.01(10 V)). In additfon, the voltmeter
used to measure Vp in the laboratoryduring the recording of
correlatllondata has an accuracy of plus or m$nus 0.1 percent of
full scale as specified by the manufacturer. The accuracy of a 10
V reading ts, therefore, plus or minus 0.1 V (plus ormlnus 0.1
percent times 10V).

Correlation tolerance = +/- 0.25 ((10.1-9.9)/2)+ 0.01

Correlation tolerance =+/-0.035 volt.

90.4 Parameter tolerance undefined in terms of percent. In cases

where the parameter tolerance cannot be defined In terms of percent due to
the parameter requirement being centered about zero, 22 percent of the
parameter tolerance shall determine the correlation tolerance. In cases
where the parameter tolerance cannot be def$ned tn terms of percent due to
the reading being taken in dfl,1.1 times the sumof the bench test equipment
accuracy and the tester test equipment accuracy shall determine the
correlation tolerance.

(a) Exanmle. A test specificationstates that the requirements for a

power supply parameter areV offset equals OVplus ormlnus 10mV.
The maximum Ilmit Is 10mV (OVplus 10mV). The minimum limlt is
minus 10 mV (0 V minus 10 mV).

correlation tolerance = +/-0.22 ((10-(-10))/2)

= +/-2.2 mv.

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APPENDIX

(b) Exam~le. A test specificationstates that the requirements for a

power supply parameter are gain equals 20 dB plus or minus 2dB (in ‘
the electrical requirementstable and in the test table). The test
equipment used in the laboratoryand the tester test equipment has
an accuracy of plus or minus 0.2 dB.

Correlation tolerance = +/-1.1 (0.2 + 0.2)

= +/-44 dB.
For those test conditions where the electrical requirements table limits are
specified in dB and the test table limits are specified in volts, the
correlation limits shall be determined in volts.

90.5 Test equipment accurac.vdeviation. In the case where a deviation

from the test equipment accuracy requirementsspecified herein and MIL-STO-
165 has been granted either through the power supply specificationor through
waiver acceptance, 1.1 times the sum of the bench test equipment accuracy and
the tester test equipment accuracy shall determine the correlation tolerance.
This can be expressed as follows:

Correlation tolerance equals plus or minus 1.1 times (bench test

accuracy plus tester test equipment accuracy).

(a) Example. A test specificationstates that the requirements for a

power supply parameter are 8 nA plus or minus 25 percent. The
required test accuracy is plus or minus 2.5 percent (plus or minus
25/10). The power supply specificationstates that the test
accuracy may be as great as plus or minus 5 percent. The test
equipment used in the laboratory has an accuracy of plus or minus 3
percent on the 10 nA scale. The accuracy of this reading is
therefore plus or minus 0.3 nA (plus or minus 0.03 times 10). The
test equipment used at the tester facility has an accuracy of plus
or minus 4 percent on the 10 nA scale. The accuracy of this
reading is therefore plus or minus 0.4 nA (plus or minus 0.04 times
10) .
Correlation tolerance = +/-1.1 ( 0.3 +0.4)
= +/- 0.77 nA.

136
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MIL-P-29590

INDEX

Paracirash

Nonformal coating . . . . . . . . . . . . . . 3.11.4

Connector 3.11.9.5
Connector co~t~c~ ~d;n~i~i~a~i~n”(~~iiy”A~)*I 3.14.1.15
Connector contact integrity . . . . . . . . . 3.11.9.5.4
Connector contact integrity . . . . . . . . . 4.7.6.7
Connector integrity 4.7.6.6
Connector integrity, f;r;a~ ~ “ I I I I I I I 1 3.11.9.5.1
Connector integrity, formats C and E . . . . . 3.11.9.5.2
Connector locations and contact assignments . 3.4.2
Connectorized 3.11.2.1
Consideration of”d~t~ ~e~u~r~m~n~s” 1 1 1 1 1 1 6.3
Contact material . . . . . . . . . . . . . . . 3.11.9.5.5
Contact plating . . . ..o. . . . . . . . . 3.11.9.5.6
Contacts . . . . . . . . . . . . . . . . . . . 3.11.9.5.3
Control signals . . . . . . . . . . . . . . . 3.3.3
Control turn-on/turn-offresponse . . . . . . 3.3.2.12
Corrective action . . . . . . . . . . . . . . 4.4.7
Correlation 4.4.8
Correlation an; ~r;o; ~o;e; ;u~pii;s” 1 I 1 I 1
Correlation control documentation . . . . . . :::
Correlation criteria . . . . . . . . . . . . . 30.
Correlation criteria . . . . . . . . . . . . . 30.1 124
Correlation not successful . . . . . . . . . . 60.5 127
Correlation power supplies . . . . . . . . . . 40.2.1 126
Correlation requirements . . . . . . . . . . . 60.4 129
Correlation successful . . . . . . . . . . . . 60.6 130
Correlation testing . . . . . . . . . . . . . 60. 128
Correlation testing . . . . . . . . . . . . . 128
Correlation tolerance %: 134
Critical component tempe~a~u~e~ ~C~Ti “ u 1 I I 3.12.1.1
Cushioning . . . . . . . . . . . . . . . . . . 5.3.1 1:;
Date code . . . . . . 3.14.1.7
Data require;e;t; ;o; ~u;l;fic;t{o; .***. 6.3.1
DC line overvoltage transient test . ..0.. 4.7.2.9.3
DC line undervoltage transient test ● ***. 4.7.2.9.4
Definitions . . . . . . . . . . . ● .*,.. 3.1.2
Depth . . . . . . . . . . . . . . ..***. 3.11.9.1
Desiccants and humidity indicators ● ..*.. 5.2.4
Design conformance . . . . . . . . . . . . . . 4.4.4

138
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MIL-P-29590

INDEX
Parauravh

Environmental stress screening . . . . . . . . 3.7.2

Environmental stress screening plan . . . . . 6.8.4 1:!!
Environmental requirements . . . . . . . . . . 3.5 23
Environmental stress screening . . . . . . . . 4.7.5.2
Environmental test procedures 4.7.3
Examples of plans and additional”r~q~i~e~e~t~“ 6*8
Explosive conditions . . . . . . . . . . . . . 3.5.2.6
Explosive conditions . . . . . . . . . . . . . 4.7.3.8
Exterior package . . . . . . . . . . . . . . . 5.3.2
External connections . . . . . . . . . . . . . 3.11.5
External input filter 3.3.1.15
Extractor fin identifica~i~n”(~~iiy”A~)” 1 I 1 3.14.1.16

Facility requirements . . . . . . . . . . . . 50.1 126

Failure analysis . . . . . . . . . . . . . . . 4.5.4 84
Failure limitation . . . . . . . . . . . . . . 3.10.7
Failure on one correlation power supply 60.4.2 l%
Failure rate prediction and parts derating” I I 4.4.2
Failure reporting, analysis/correctiveaction 6.8.2 1%
Fin/header cantilever load . . . . . . . . . . 3.11.9.4.3
Fin/header cantilever load . . . . . . . . . . 4.7.6.5 lE
Fin and header structure . . . . . . . . . . . 3.11.9.4
Fin/header cantilever load . . . . . . . . . . 3.11.9.4.3 ::
Finishes and protective treatments . . . . . . 3.11.7 53
Flammability . . . . . . . . . . . . . . . . . 3.9*5.3 42
Flexible printed-wiring and assemblies . . . . 3.10.4.3 50
Frame surface . . . . . . . . . . . . . . . . 3.11.7.2.1 54
Gauges . . . . . . . . . . . . . . . . . . . . 4.3.4 76
General design features . . . . . . . . . 3.11.1
Generated acoustical noise” I . . . . . . ● ☛✎ 3.5.2.7 z;
Generated acoustical noise . ● ✎ ✎ ✎ ✎ ✎ ● ☛✎ 4.7.3.9 98
Germanium semiconductors . . ● ☛✎☛✎✎ ✎ ✎ ✎ 3.10.1.1 43
Government documents . . . . ● ✎☛☛✎✎ ✎ ✎ ✎ 2.1 3
Government source inspection ✎ ✎ ✎ ✎ ✎ ✎ ✎ ✎ ✎ 4.8 113
Government source inspection ✎☛☛✎✎✎ ✎ ✎ ✎ 6.8.7 121
Government plane interference ✎ ✎ ✎ ✎ ✎ ✎ ✎ ✎ 3.6.1.1 33
Harmonic current limitation . . . . . . . . . 3.3.1.12 11

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MIL-P-29590

INDEX

ParaclraDh

Recording informationon the correlation

data sheet . . . . . . . . . . . . . . . 60.3 129
Recorrelation . . . . . . . . . . . . . . . . 70 132
Recorrelation criteria . . . . . . . . . . . . 70.2 132
Recovered materials . . . . . . . . . . . . . 3.9.5.8 43
Reliability . . . . . . . . . . . . . . . . . 3.7
Reliability 4.7.5 1:!
Reliabilityde~e;o~m~n{/~r~w~h”t~s~~RfiG6)”~ I 6.8.5 121
program.
Reliability prediction . . . . . . . . . . . . 4.7.5.1 102
Reliability program plan . . . . . . . . . . . 6.8.1 120
Reliability requirement . . . . . . . . . . . 3.7.1 40
Remote voltage sensing . . . . . . . . . . . . 3.3.2.15 16
Repair and retesting of correlation
and proof power supplies . . . . . . . . 40.3 126
Report . . . . . . . . . . . . . . . . . . . . 60.7 132
Request for deviation or waiver . . . . . . . 3.18 74
Requirements . . . . . . . . . . . . . . . . . 3.
Responsibility . . . . . . . . . . . . . . . . 10.4 12:
Responsibility . . . . . . . . . . . . . . . . 70.1 132
Responsibility for compliance . . . . . . . . 4.1*1 74
Responsibility for inspection . . . . . . . . 4.1
Retention of qualification . . . . . . . . . . 4.4.12 H
Reverse voltage protection . . . . . . . . . . 3.3.2.19 17
Rib strength . . . . . . . . . . . . . . . . . 3.11.9.2.1
Rib strength . . . . . . . . . . . . . . . . . 4.7.6.1 1::
Rib structure 3.11.9.2
Rights in techni~a; ~a~a” I I J 1 1 1 I 1 1 1 1 6.3.1.1 1:;
Rigid printed-wiring boards . . . . . . . . . 3.10.4.1 50
Safety (personnel hazard) . . . . . . . . . . 3.15 73
Salt fog . . . . . . . . . . . . . . . . . . . 3.5.3.4
Salt fog . . . . . . . . . . . . . . . . . . . 4.7.3.13 1%
Sampled quality conformance inspection . . . . 4.5.2 84
Scratches . . . . . . . . . . . . . . . . . . 3.16.1.1 73
Scope 1.
Scope(A~p~n~i~)”JllllJ;lll 1:::: 10. 12:
SelectIon . . . . . . . . . . . . . . . . . . 3.9.1 41
Selection requirements . . . . . . . . . . . . 3.10.1.3.2 45

146
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141
L-P-29590

INDEX
Paraqrmh

SE?40eslgn Review Actlvfty . . . . . . . . . . 6.7

Semiconductors . . . . . . . . . . . . . . . . 3.12.1.1.1
Serial number 3.14.1.6
Serfal number se&&” : : : : : : : : : : : : 3.14.1.6.1
Servtceandaccess . . . . . . . . . . . . . . 3.8.2
Shelf life . . . . . . . . . . . . . . . . . . 3.5.4.1
Shipment of nonconformingmaterial . . . . . . 6.9.2
Single spectral line amplitude . . . . . . . . 3.3.2.3.3
Size and weight 3.4.1
Slowly rislnglnpu{ ”:::: :1::::::: 3.3.1.11.2
Solderlng and prflnted-wiringassembles . . . 3.16.3
Solvents . . . . . . . . . . . . . . . . . . . 3.5.3.8
Solvents 4.7.3.17
Speclficatio~ ;oh~t” : : : : : : : : 1 1 : : : 3.1.1.1
Speclftcations, standards, and handbooks . . . 2.1.1
Spec~fied performance . . . . . . . . . . . . 6.5.5
Spike voltage source impedance . . . . . . . . 4.7.2.4
Standard parts 3.9.2
Standard test co;d;t{o&” : : : : ~ : : : : ~ : 4.3.1
Static line and load regulation 3.3.2.5
Static line and load regulation te~t” : : : : : 4.7.2.6
Static regulation temperature effects . . . . 3.3.2.6
Status signal noise . . . . . . . . . . . . . 3.3.4.6
Status signals . . . . . . . . . . . . . . . . 3.3.4
Step ~nput . . . . . . . . . . . . . . . . . . 3.3.1.11.1
Step Input current test . . . . . . . . . . . 4.7.2.1
Storageandcontrol . . . . . . . . . . ..O 40.4
Storage temperature . . . . . . . . . . . . . 3.5.3.6
Storage temperature 4.7.3.15
Subcontracted mater!al*a;d”p&~s” : : ~ : : : : 6.6
Subject term (keyword) llsting . . . . . . . . 6.11
SubmissIon sche$ule 4.4.5.1
Susceptibilityto ccm&”~d; ;o;s; “ : : : : : 3.3*3.3
Susceptibility to conmm mode noise . . . . . 4.7.2.10
Synchronization . . . . . . . . . . . . . . . 3*3.3.4

4.7.7.1.2
4.7.7.2.2
3.5.2.1
4.7.3.2

147
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MIL-P-29590

INDEX

paraqraDh

Temperature shock . . . . . . . . . . . . . . 3.5.3.2

Temperature shock . . . . . . . . . . . . . . 4.7.3.11 1:
Test apparatus . . . . . . . . . . . . . . . . 4.7.3.9.1 98
Test data 4.4.1.1 80
Testequipme~t”Jllllllll 1:::::: 4*3.3
Test equipment accuracy deviation . . . . . . 90.5 lx
Test points . . . . . . . . . . . . . . . . 3.8.3
Test procedure~ . . . . . . . . . . . . . . . 4.7 :;
Test procedures . . . . . . . . . . . . . . . 4.7.3.1 90
Test procedures 4.7.3.9.2
Test procedure doc~m~n~a~i~n” ; ; ; ; ; ; ; ; I 50.3 1:;
Tester documentation . . . . . . . . . . . . . 50.2 127
Tester facility requirements . . . . . . . . . 126
Tester offsets . . . . . . . . . . . . . . . . ;:.2 133
Thermal analysis . . . . . . . . . . . . . . . 4.4.3
Thermal cycling (family Al) . . . . . . . . . 4.7.5.2.1 1:
Thermal cycling (family A2) . . . . . . . . . 4.7.5.2.2 106
Thermal design and construction . . . . . . . 3.12 65
Thermal grease . . . . . . . . . . . . . . . . 3.12.3
Thermal measurements . . . . . . . . . . . . . 4.7.7 1::
Thermal requirements . . . . . . . . . . . . . 3.12.2 65
Thermal test conditions . . . . . . . . . . . 4.3.2 75
Thick film MIB assemblies . . . . . . . . . . 3.10.5.2 51
Thick filmMIB’s . . . . . . . . . . . . . . . 3.10.5.1 51
Thick film multilayer interconnect
boards (MIB’s) and assemblies . . . . . . 3.10.5
Time elapsed meter (family Al) . . . . . . . . 3.3.7
Total ionizing dose . . . . . . . . . . . . 4.7.3.6.2
Total ripple and noise” . . . . . . . . . . . . 3.3.2.3
Total ripple and noise measurement . . . . . . 4.7.2.4
Transformers and inductors . . . . . . . . . . 3.12.1.1.2
Transient critical component temperature (TCCT) 3.12.1.2
Transient operation . . . . . . . . . . . . . 3.3.1.3
Turn-on current . , . . . . . . . . . . . . . 3.3.1.11
Turn-on threshold . . . . . . . . . . . . . 3.3.1.8
Turn-on threshold fo~ a DC or alternate,
input voltage . . . . . . . . . . . . . . 3.3.1.8.1 10
Turn-on to turn-off hysteresis . . . . . . . . 3.3.1.9 10
Turn-on to turn-off hysteresis for a DC
or alternate input voltage . . . . . . . 3.3.1.9.1 11

148
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MIL-P-29590

CONCLUDING MATERIAL

Custodians: Preparing actlvfty:

Army - ER Navy - AS
Navy - AS
Air Force - 99 Agent: NW
(Project 6130-0283)
Review activities:
DLA - GS

150