PC410

Compact, Surface Mount

PC410 Ultra-high Speed Response
OPIC Photocoupler
■ Features ■ Outline Dimensions ( Unit : mm )
1. Mini-flat package
2. Ultra-high speed response
( t PLH , t PHL : TYP. 50ns at R L = 350Ω ) 1.27 ± 0.25 Internal connection
diagram
3. Isolation voltage between input and output 6 5 4

( Viso : 2 500 V rms ) 6 5 4

PC410

4.4 ± 0.2
4. Instantaneous common mode rejection
voltage CM H : TYP. 500V/ µ s Anode mark
5. Recognized by UL(No.64380) 1 3
2.54 ± 0.25
0.4 ± 0.1
■ Applications 1 3
3.6 ± 0.3 C0.4 5.3 ± 0.3

0.2 ± 0.05
1. Hybrid substrate which requires high den- ( Input Side)

0.1 ± 0.1 2.6 ± 0.2

sity mounting
2. Personal computers, office computers and 0.5 +- 0.4
0.2
7.0 +- 0.2
0.7
peripheral equipment
6˚
3. Electronic musical instruments
1 Anode 4 GND
4. Audio equipment 3 Cathode 5 Vo
6 Vcc

* “ OPIC ” ( Optical IC ) is a trademark of the SHARP Corporation.

■ Package Specifications An OPIC consists of a light-detecting element and signal-
Model No. Package specifications Diameter of reel Tape width processing circuit integrated onto a single chip.
PC410 Taping package ( Net:3 000pcs. ) 370 mm 12 mm
PC410T Taping package ( Net: 750pcs.) 180 mm 12 mm
PC410Z Sleeve package ( Net: 100pcs.) - -

■ Absolute Maximum Ratings ( Ta = 25˚C )

Parameter Symbol Rating Unit
*1
Forward current IF 20 mA
Input Reverse voltage VR 5 V
0.2mm or more

Power dissipation P 40 mW
*2
Supply voltage V CC 7 V
High level output voltege V OH 7 V
Output
Low level output current I OL 50 mA
Output collector power dissipation PO 85 mW
*3
Isolation voltege V iso 2 500 V rms
Operating temperature T opr 0 to + 70 ˚C Soldering area

Storage temperature T stg - 40 to + 125 ˚C

*4
Soldering temperature T sol 260 ˚C
*1 Ta = 0 to + 70˚C
*2 For 1 minute MAX.
*3 AC for 1 minute, 40 to 60% RH. Apply the specified voltage between the whole of the
electrode pins on the input side and the whole of the electrode pins on the output side.
*4 For 10 seconds.

“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
 PC410

■ Electro-optical Characteristics ( Ta = 0 to + 70˚C unless otherwise specified )

Parameter Symbol Conditions MIN. TYP. MAX. Unit
Forward voltage VF Ta = 25˚C, I F = 10mA - 1.6 1.9 V
Input Reverse current IR Ta = 25˚C, V R = 5V - - 10 µA
Terminal capacitance Ct Ta = 25˚C, V = 0, f = 1MH Z - 60 150 pF
Low level output voltage V OL I OL = 13mA, V CC = 5.5V, I F = 5mA - 0.4 0.6 V
High level output current I OH V CC = V O = 5.5V, I F = 250 m A - 2 250 µA
Output Low level supply current I CCL V CC = 5.5V, I F = 10mA - 13 18 mA
High level supply current I CCH V CC = 5.5V, I F = 0 - 7 15 mA
“ H→L ” threshold input current I FHL V CC = 5V, V O = 0.8V, R L = 350Ω - 2.5 5 mA
Isolation resistance R ISO Ta = 25˚C, DC500V, 40 to 60% RH 5 x 1010 1011 - Ω
Floating capacitance Cf Ta = 25˚C, V = 0, f = 1MHz - 0.6 - pF
“ H→L ” propagation
t PHL Ta = 25˚C - 50 120
delay time
Response

“ L→H ” propagation V CC = 5V, I F = 7.5mA

t PLH - 50 120 ns
delay time
time

R L = 350Ω , C L = 15pF
Transfer Fall time tf - 30 60
charac- Fig. 1
Rise time tr - 30 60
teristics
Instantaneous common IF = 0
mode rejection Ta = 25˚C
CM H V O( MIN. ) = 2V 100 500 -
voltage “ High level V CC = 5V
CMR

output ”
V CM = 10V ( Peak ) V/ µ s
Instantaneous common I F = 5mA
mode rejection R L = 350Ω
CM L V O( MAX. ) = 0.8V - 100 - 500 -
voltage “ Low level Fig. 2
output ”
Note ) All typical values : at Ta = 25˚C, VCC = 5V
Each characteristics shall be measured under opaque condition.

■ Recommended Operation Conditions

Parameter Symbol MIN. MAX. Unit
Low level input current I FL 0 250 µA
High level input current I FH 7 15 mA
Supply voltage V CC 4.5 5.5 V
Fanout ( TTL load ) N - 8 -
Operating temperature T opr 0 70 ˚C
Connect a by-pass ceramic capacitor ( 0.01 to 0.1 µ F ) between V CC and GND at the
position within 1cm from lead pin.
 PC410

Fig. 1 Test Circuit for t PHL , t PLH , t r and t f

7.5mA
IF
IF 3.75mA
Pulse input 1 6 5V
0mA
350 Ω t PHL t PLH
5 VO

0.01 µ F
5V
90%
CL VO
3 4 1.5V
10%
47Ω VOL

*C L includes the probe tf tr

and wiring capacitance.

Fig. 2 Test Circuit for Instantaeus Common Mode Rejection Voltage

IF
GL SW
1 6 5V 10V

350 Ω
5 VO VCM
B A 0V
0.01 µ F

CL
3 4
when GL SW is A
VCM VO 5V
+ - (IF = 0mA) VO(MIN.)

VO(MAX.)
When GL SW is B
VO VOL
(IF = 5mA)

Fig. 3 Collector Power Dissipation vs. Fig. 4 Forward Current vs.

Ambient Temperature Forward Voltage
100 100

90
Collector power dissipation P C ( mW )

85
Forward current I F ( mA )

80
10
70

60
T a = 0˚C
50 1
25˚C
40
50˚C
30 70˚C
0.1
20

10
0 0.01
0 25 50 70 75 100 1.0 1.2 1.4 1.6 1.8 2.0 2.2

Ambient temperature T a ( ˚C ) Forward voltage V F ( V )

 PC410

Fig. 5 High Level Output Current vs. Fig. 6 Low Level Output Voltage vs.
Ambient Temperature Ambient Temperature
4 0.5
I F = 250 µ A
I F = 5mA
VCC = 5.5V
High level output current I OH ( µ A )

VCC = 5.5V

Low level output voltage V OL ( V )

VO = 5.5V
3 0.4

I O = 16mA
12.8mA
2 0.3 9.6mA
6.4mA

1 0.2

0 0.1
0 25 50 75 100 0 25 50 75 100
Ambient temperature T a ( ˚C ) Ambient temperature T a ( ˚C )

Fig. 7-a Output Voltage vs. Fig. 7-b Output Voltage vs. Forward Current
Forward Current ( Ambient Temp. Characteristics )
6 6
VCC = 5V VCC = 5V
T a = 25˚C T a = 0 to 70˚C
5 5
Output voltage VO ( V )

Output voltage VO ( V )

4 4
RL = 350 Ω
RL = 350 Ω
3 1k Ω 3
4k Ω
RL = 1k Ω
2 2

1 1

0 0
0 1 2 3 4 5 6 0 1 2 3 4 5 6
Forward current I F ( mA ) Forward current I F ( mA )

Fig. 8 Propagation Delay Time vs. Fig. 9 Propagation Delay Time vs.
Forward Current Ambient Temperature
120 120
VCC = 5V I F = 7.5mA
kΩ
R L= 4 VCC = 5V
( ns )

( ns )

T a = 25˚C t PLH
100
100 4k Ω
R L=
PLH

PLH

1k Ω
t PLH
Propagation delay time t PHL , t

Propagation delay time t PHL , t

80 t PLH
1k Ω
350 Ω 80
t PLH

350 Ω
60

t PHL 60
40 t PHL

RL = 350 Ω RL = 350 Ω
40
20 1k Ω 1k Ω
4k Ω 4k Ω
0 20
5 10 15 20 0 25 50 75 100
Forward current I F ( mA ) Ambient temperature T a ( ˚C )
 PC410

Fig.10 Rise Time,Fall Time vs.

Ambient Temperature
320
I F =7.5mA
VCC = 5V
280
RL = 4k Ω
Rise time, fall time t r , t f (ns)

240 tr

200

160

120

80 tr 1k Ω
RL = 350 Ω
40 tr 350 Ω
tf 1k Ω
4k Ω
0 25 50 75 100
Ambient temperature T a ( ˚C )

■ Precautions for Use

( 1 ) Handle this product the same as with other integrated circuits against static electricity.
( 2 ) As for other general cautions, refer to the chapter “ Precautions for Use.”
Application Circuits

NOTICE
●The circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
●Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
●Observe the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
●Contact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
●If the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
●This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
●Contact and consult with a SHARP representative if there are any questions about the contents of this
publication.

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