Datasheet

Operational Amplifiers

Low Noise Operational Amplifier

LM4565xxx

Key Specifications

General Description
Operating Supply Voltage: ±2V to ±18V

The LM4565xxx are low nose operational amplifiers
Temperature Range: -40°C to +85°C

with high voltage gain and wide bandwidth. They have
Voltage Gain (RL=2kΩ): 100dB(Typ)

good performance of input referred noise voltage
Slew Rate: 5.0V/μs (Typ)

(5 nV/ Hz ) and total harmonic distortion (0.0002%).
Gain Bandwidth: 10MHz (Typ)

These are suitable for audio applications and active
filter. Input Referred Noise Voltage: 5 nV/ Hz (Typ)

Features Package W(Typ) xD(Typ) xH(Max)

 High Voltage Gain SOP-8 5.00mm x 6.20mm x 1.71mm
 High Slew Rate SOP-J8 4.90mm x 6.00mm x 1.65mm
 Low Input Referred Noise Voltage SSOP-B8 3.00mm x 6.40mm x 1.35mm
 Low Total Harmonic Distortion TSSOP-B8 3.00mm x 6.40mm x 1.20mm
 Wide Gain Bandwidth MSOP8 2.90mm x 4.00mm x 0.90mm
TSSOP-B8J 3.00mm x 4.90mm x 1.10mm

Application
 Audio Application
 Consumer Equipment
 Active Filter

Pin Configuration

LM4565F : SOP8
LM4565FJ : SOP-J8
LM4565FV : SSOP-B8
LM4565FVT : TSSOP-B8
LM4565FVM : MSOP8
LM4565FVJ : TSSOP-B8J

Pin No. Pin Name

OUT1 1 8 VCC 1 OUT1

2 -IN1
-IN1 2 CH1 7 OUT2
- + 3 +IN1

+IN1 3 6 -IN2 4 VEE

CH2
+ - 5 +IN2
VEE 4 5 +IN2
6 -IN2
7 OUT2
8 VCC

Figure1. Pin Configuration

○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 1/24 15.Apr.2014 Rev.003
TSZ22111･14･001
Downloaded from: http://www.datasheetcatalog.com/
 LM4565xxx Datasheet

Ordering Information

L M 4 5 6 5 x x x - x x

Part Number Package Packaging and forming specification

LM4565xxx F : SOP8 E2: Embossed tape and reel
FJ : SOP-J8 (SOP8/SOP-J8/SSOP-B8/TSSOP-B8/TSSOP-B8J)
FV : SSOP-B8
TR: Embossed tape and reel
FVT : TSSOP-B8
FVM : MSOP8 (MSOP8)
FVJ : TSSOP-B8J

Line-up
Topr Package Orderable Part Number

SOP8 Reel of 2500 LM4565F-E2

SOP-J8 Reel of 2500 LM4565FJ-E2

SSOP-B8 Reel of 2500 LM4565FV-E2

-40°C to +85°C
TSSOP-B8 Reel of 3000 LM4565FVT-E2

MSOP8 Reel of 3000 LM4565FVM-TR

TSSOP-B8J Reel of 2500 LM4565FVJ-E2

Absolute Maximum Ratings (TA=25°C)

Parameter Symbol Rating Unit

Supply Voltage VCC - VEE +36 V

(Note 1,5)
SOP8 0.68
SOP-J8 0.67(Note 2,5)
SSOP-B8 0.62(Note 3,5)
Power Dissipation PD W
TSSOP-B8 0.62(Note 3,5)
MSOP8 0.58(Note 4,5)
TSSOP-B8J 0.58(Note 4,5)
(Note 6)
Differential Input Voltage VID +36 V
Input Common-mode
VICM (VEE - 0.3) to (VEE + 36) V
Voltage Range
Operating Voltage Vopr ±2 to ±18 V
Operating Temperature Topr - 40 to +85 °C
Storage Temperature Tstg - 55 to +150 °C
Maximum
TJmax +150 °C
Junction Temperature
(Note 1) When used at temperature above TA=25°C, reduce by 5.5mW/°C.
(Note 2) When used at temperature above TA=25°C, reduce by 5.4mW/°C.
(Note 3) When used at temperature above TA=25°C, reduce by 5.0mW/°C.
(Note 4) When used at temperature above TA=25°C, reduce by 4.7mW/°C.
(Note 5) Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).
(Note 6) The differential input voltage is the voltage difference between inverting input and non-inverting input.
Input terminal voltage is set to more than VEE.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 2/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Electrical Characteristics:
○LM4565xxx (Unless otherwise specified VCC = +15V, VEE = -15V)

Temperature Limit
Parameter Symbol Unit Conditions
Range Min Typ Max

Input Offset Voltage (Note 7) VIO 25°C - 0.5 1.5 mV RS≤10kΩ

Input Offset Current (Note 7) IIO 25°C - 2 50 nA -

Input Bias Current (Note 7) IB 25°C - 70 250 nA -

25°C - 4.5 7
(Note 8) RL=∞, All Op-Amps
Supply Current ICC mA
+IN=0V
Full range - - 8.5

Large Signal Voltage Gain AV 25°C 86 100 - dB RL≥2kΩ, OUT=±10V

25°C ±12 ±14 - V RL≥2kΩ

Maximum Output Voltage VOM
25°C ±11 ±12.5 - V IO=25mA

Input Common-mode Voltage Range VICM 25°C ±12 ±14 - V -

+IN=1V, -IN=0V
Output Source Current (Note 9) ISOURCE 25°C - 130 - mA OUT=-15V
1CH is short circuit
+IN=0V, -IN=1V
Output Sink Current (Note 9) ISINK 25°C - 160 - mA OUT=+15V
1CH is short circuit

Common-mode Rejection Ratio CMRR 25°C 80 100 - dB RL≤10kΩ

Power Supply Rejection Ratio PSRR 25°C 82 100 - dB RL≤10kΩ

Slew Rate SR 25°C - 5 - V/μs RL=2kΩ, CL=100pF

Unity Gain Frequency fT 25°C 4 MHz RL=2kΩ

Gain Bandwidth GBW 25°C - 10 - MHz RL=2kΩ, f=100kHz

Phase Margin θ 25°C - 40 - deg RL=2kΩ

AV=40dB
- 0.6 - µVrms RS=100Ω
Input Referred Noise Voltage VN 25°C DIN-AUDIO
AV=40dB, VICM=0V
- 5 - nV/ Hz
RS=100Ω, f=1kHz

Av=20dB, f=1kHz
Total Harmonic Distortion + Noise THD+N 25°C - 0.0002 - %
OUT=5Vrms

AV=40dB, f=1kHz
Channel Separation CS 25°C - 110 - dB
OUT=1Vrms
(Note 7) Absolute value.
(Note 8) Full range: TA=-40°C to +85°C
(Note 9) Please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 3/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Description of Electrical Characteristics

Described here are the terms of electric characteristics used in this datasheet. Items and symbols used are also shown.
Note that item name, symbol and their meaning may differ from those on other manufacturer’s document or general
documents.

1. Absolute maximum ratings

Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
(1) Supply Voltage (VCC/VEE)
Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power
supply terminal without deterioration or destruction of characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
(3) Input Common-mode Voltage Range (VICM)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Power dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25℃
(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.

2. Electrical characteristics item

(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
(2) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
(3) Input Bias Current (IB)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
(4) Supply Current (ICC)
Indicates the current that flows within the IC under specified no-load conditions.
(5) Large Signal Voltage Gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
Av = (Output voltage) / (Differential Input voltage)
(6) Maximum Output Voltage (VOM)
Indicates the voltage range that the IC can output under specified load condition. It is typically divided into high-level
output voltage and low-level output voltage. High-level output voltage indicates the upper limit of output voltage.
Low-level output voltage indicates the lower limit.
(7) Input Common-mode Voltage Range (VICM)
Indicates the input voltage range where IC operates normally.
(8) Output Source Current/ Output Sink Current (ISOURCE / ISINK)
The maximum current that can be output from the IC under specific output conditions. The output source current
indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC.
(9) Common-mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common-mode voltage is changed. It is
normally the fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
(10) Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.
It is normally the fluctuation of DC.
PSRR= (Change of power supply voltage)/(Input offset fluctuation)
(11) Slew Rate (SR)
Indicates the ratio of the change in output voltage with time when a step input signal is applied.
(12) Unity Gain Frequency (fT)
Indicates a frequency where the voltage gain of operational amplifier is 1.
(13) Gain Bandwidth (GBW)
Indicates to multiply by the frequency and the gain where the voltage gain decreases 6dB/octave.
(14) Phase Margin (θ)
Indicates the margin of phase from 180 degree phase lag at unity gain frequency.
(15) Input Referred Noise Voltage (VN)
Indicates a noise voltage generated inside the operational amplifier reflected back to an ideal voltage source
connected in series with the input terminal.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 4/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

(16) Total Harmonic Distortion + Noise (THD+N)

Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
(17) Channel Separation (CS)
Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of
the channel which is not driven.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 5/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Typical Performance Curves

○LM4565xxx

1.0 8

7
0.8
-40°C
LM4565F 6
Power Dissipation [W]

Supply Current [mA]

LM4565FJ
0.6 5
LM4565FV
LM4565FVT 25°C
4
LM4565FVM
LM4565FVJ
0.4
3 85°C

2
0.2
1

0.0 0
85
0 25 50 75 100 125 150 ±0 ±3 ±6 ±9 ±12 ±15 ±18
Ambient Temperature [°C] Supply Voltage [V]

Figure 2. Figure 3.
Power Dissipation vs Ambient Temperature Supply Current vs Supply Voltage
(Derating Curve)

8 20

7 15
-40°C
25°C
Maximum Output Voltage [V]

6 10
85°C
Supply Current [mA]

5 5

4 0
85°C

25°C
3 -5
-40°C

2 -10

1 -15

0 -20
-50 -25 0 25 50 75 100 ±0 ±5 ±10 ±15 ±20
Ambient Temperature [°C] Supply Voltage [V]

Figure 4. Figure 5.
Supply Current vs Ambient Temperature Maximum Output Voltage vs Supply Voltage
(VCC/VEE=±15V) (RL=2kΩ, TA=25°C)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 6/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Typical Performance Curves (Reference data) – continued

○LM4565xxx

20 20

15 15
-40°C
25°C
Maximum Output Voltage [V]

Maximum Output Voltage [V]

10 10 85°C

5 5

0 0
85°C
25°C
-5 -5
-40°C

-10 -10

-15 -15

-20 -20
-50 -25 0 25 50 75 100 ±0 ±5 ±10 ±15 ±20
Supply Voltage [V]
Ambient Temperature [°C]
Figure 6. Figure 7.
Maximum Output Voltage vs Ambient Temperature Maximum Output Voltage vs Supply Voltage
(VCC/VEE=±15V, RL=2KΩ) (IO=25mA, TA=25°C)

20 3

15
2
Maximum Output Voltage [V]

10
Input Offset Voltage [mV]

1
5

0 0

-5
-1
-10
-2
-15

-20 -3
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Ambient Temperature [°C]
Ambient Temperature [°C]

Figure 8. Figure 9.
Maximum Output Voltage vs Ambient Temperature Input Offset Voltage vs Ambient Temperature
(VCC/VEE=±15V, IO=25mA) (VCC/VEE=±15V)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 7/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Typical Performance Curves (Reference data) – continued

○LM4565xxx

3 150

2 125
Input Offset Voltage [mV]

Input Bias Current [nA]

1 100
-40°C

0 85°C 25°C 75

-1 50

-2 25

-3 0
-15 -10 -5 0 5 10 15 -50 -25 0 25 50 75 100
Input Common Mode Voltage [V] Ambient Temperature [°C]

Figure 10. Figure 11.

Input Offset Voltage vs Input Common mode Voltage Input Bias Current vs Ambient Temperature
(VCC/VEE=±15V) (VCC/VEE=±15V)

140 130
Common Mode Rejection Ratio [dB]

130 120
Large Signal Voltage Gain [dB] .

120 110

110 100

100 90

90 80

80 70
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Ambient Temperature [°C] Ambient Temperature [°C]

Figure 12. Figure 13.

Large Signal Voltage Gain vs Ambient Temperature Common Mode Rejection Ratio vs Ambient Temperature
(VCC/VEE=±15V, RL=2kΩ) (VCC/VEE=±15V)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 8/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Typical Performance Curves (Reference data) - continued

○LM4565xxx

140 10
Power Supply Rejection Ratio [dB]

8
120

Slew Rate L-H [V/µs]

6

100

80
2

60 0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Ambient Temperature [°C]
Ambient Temperature [°C]

Figure 14. Figure 15.

Power Supply Rejection Ratio vs Ambient Temperature Slew Rate L-H vs Ambient Temperature
(VCC/VEE=±15V, RL=2kΩ, CL=100pF)

10 100 200
Phase

8 80
150
Slew Rate H-L [V/µs]

Voltage Gain [dB]

Phase [deg]
60

100
Gain
4 40

50
2 20

0 0 0
-50 -25 0 25 50 75 100 102 103 104 105 106 107 108
Frequency [Hz]
Ambient Temperature [°C]

Figure 16. Figure 17.

Slew Rate H-L vs Ambient Temperature Voltage Gain・Phase vs Frequency
(VCC/VEE=±15V, RL=2kΩ, CL=100pF) (VCC/VEE=±15V, RL=2kΩ)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 9/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Typical Performance Curves (Reference data) - continued

○LM4565xxx

1 30

Input Referred Noise Voltage [nV/√Hz]

25
Total Harmonic Distortion [%]

0.1
20

0.01 15

10
0.001
20Hz
1kHz 5
20kHz

0.0001 0
0.01 0.1 1 10 100 1 10 102 103 104 105
Frequency [Hz]
Output Voltage [Vrms]
Figure 18. Figure 19.
Total Harmonic Distortion vs Output Voltage Input Referred Noise Voltage vs Frequency
(VCC/VEE=±15V, RL=2kΩ, f=1kHz) (VCC/VEE=±15V, TA=25°C, AV=40dB)

1.0

0.9
Input Referred Noise Voltage [µVrms]

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0
±0 ±5 ±10 ±15 ±20
Supply Voltage [V]

Figure 20.
Input Referred Noise Voltage vs Supply Voltage
(TA=25°C, DIN-AUDIO)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 10/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Application Information
NULL method condition for Test Circuit 1
VCC, VEE, EK, VICM Unit:V
Parameter VF S1 S2 S3 VCC VEE EK VICM Calculation

Input Offset Voltage VF1 ON ON OFF 15 -15 0 0 1

VF2 -10
Large Signal Voltage Gain ON ON ON 15 -15 0 2
VF3 10

VF4 -10
Common Mode Rejection Ratio
ON ON OFF 15 -15 0 3
(Input Common-mode Voltage Range)
VF5 10

VF6 4 -4
Power Supply Rejection Ratio ON ON OFF 0 0 4
VF7 18 -18

－ Calculation－
|VF1|
VIO = [V]
1. Input Offset Voltage (VIO) 1+RF/RS

∆EK × (1+RF/RS)
2. Large Signal Voltage Gain (AV) AV = 20Log [dB]
|VF2-VF3|

3. Common-mode Rejection Ratio (CMRR) ∆VICM × (1+RF/RS)

CMRR = 20Log [dB]
|VF4 - VF5|

4. Power Supply Rejection Ratio (PSRR) ∆VCC × (1+ RF/RS)

PSRR = 20Log [dB]
|VF6 - VF7|

0.1µF

RF=50kΩ
500kΩ 0.1µF
SW1 VCC
EK 15V
RS=50Ω RI=10kΩ VO
500kΩ
0.1µF 0.1µF DUT
SW3 NULL
RS=50Ω RI=10kΩ 1000pF
RL VF
VICM
50kΩ VRL
VEE -15V

Figure21. Test Circuit 1

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 11/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Switch Condition for Test Circuit 2

SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12

Supply Current OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF
Maximum Output Voltage RL=2kΩ OFF ON OFF OFF ON OFF OFF ON OFF OFF ON OFF
Slew Rate OFF OFF ON OFF OFF OFF ON OFF ON OFF OFF ON
Maximum Frequency ON OFF OFF ON ON OFF OFF OFF ON OFF OFF ON

SW3 Input voltage

SW4 R2 100kΩ
●
VCC=30V VH

－
VL
SW1 SW2
＋ t
SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 Input wave
R1 Output voltage
1kΩ
VEE
90% SR=ΔV/Δt
VH
RL CL
VIN- VIN+
VO
ΔV
10%
VL
Δt
Figure 22. Test Circuit2 t
Output wave

Figure 23. Slew Rate Input Output Wave

R2=100kΩ R2=100kΩ

VCC
VCC R1=1kΩ
R1=1kΩ

OUT1
R1//R2 OUT2
R1//R2 =1Vrms
VEE VEE
VIN

100×OUT1
CS=20Log
OUT2

Figure 24. Test Circuit 3 (Channel Separation)

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 12/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Application Example
○Voltage Follower

Voltage gain is 0dB.

Using this circuit, the output voltage (OUT) is controlled
VCC to be equal to the input voltage (IN). This circuit also
stabilizes OUT due to high input impedance and low
output impedance. Computation for OUT is shown
below.
OUT OUT=IN
IN

VEE

Figure 25. Voltage Follower

○Inverting Amplifier

R2

VCC For inverting amplifier, IN is amplified by a voltage gain

decided by the ratio of R1 and R2.The out-of-phase
R1 output voltage is shown in the next expression.
IN OUT=-(R2/R1)・IN
OUT This circuit has input impedance equal to R1.

R1//R2 VEE

Figure 26. Inverting Amplifier Circuit

○Non-inverting amplifier

R1 R2 For non-inverting amplifier, IN is amplified by a voltage

gain decided by the ratio of R1 and R2. OUT is in-phase
with Vin and is shown in the next expression.
VCC OUT=(1+R2/R1)・IN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational
amplifier.
OUT
IN

VEE

Figure 27. Non-inverting Amplifier Circuit

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 13/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA °C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 28(a) shows the model of the thermal resistance of the package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation
(PD).
θJA = (TJmax－TA) / PD °C/W ・・・・・ (Ⅰ)
The derating curve in Figure 28(b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 28(c) shows an example of the derating curve for LM4565xxx.

LSIの 消 費
Power dissipation of 電 力 [W]
LSI

θJA=(TJmax-TA)/ PD °C/W P
Pd (max)
Dmax

P2 θθja2
JA2 << θ
θja1
JA1

Power Dissipation of IC
Ambient temperature TA [ °C ]

θ’
θ'JA2
ja2
P1 θJA2
ja2

TJ’max
Tj ' (max)TJmax
Tj (max)
θ’θ'JA1ja1 θθJA1
ja1

Chip surface temperature TJ [ °C ]

0 25 50 75 100 125 150
周 囲 温 度TTa
Ambient temperature [℃]]
A [ °C

(a) Thermal Resistance (b) Derating Curve

1.0

0.8
Power Dissipation [W]

LM4565F (Note 10)

0.6 LM4565FJ (Note11)

LM4565FV (Note 12)

LM4565FVT (Note 12)

0.4

LM4565FVM (Note 13)

LM4565FVJ (Note 13)
0.2

0.0
0 25 50 75 100 125 150
Ambient Temperature [°C]
(c) LM4565xxx

(Note 10) (Note 11) (Note 12) (Note 13) Unit

5.5 5.4 5.0 4.7 mW/°C

When using the unit above TA=25°C, subtract the value above per °C. Permissible dissipation is the value
when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area below 3%) is mounted

Figure 28. Thermal Resistance and Derating Curve

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 14/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the PD rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 15/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Operational Notes – continued

11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.

Figure 29. Example of monolithic IC structure

12. Unused Circuits VCC

It is recommended to apply the connection (see Figure 30.) and set the
non-inverting input terminal at a potential within the Input Common-mode
Voltage Range (VICM) for any unused circuit. Keep this potential
in VICM
13. Input Voltage VICM
Applying VEE +36V to the input terminal is possible without causing
deterioration of the electrical characteristics or destruction, regardless of
the supply voltage. However, this does not ensure normal circuit operation.
VEE
Please note that the circuit operates normally only when the input voltage
is within the common mode input voltage range of the electric
characteristics. Figure 30. Example of Application Circuit
for Unused Op-amp
14. Power Supply(single/dual)
The operational amplifier operates when the voltage supplied is between VCC and VEE. Therefore, the single supply
operational amplifier can be used as dual supply operational amplifier as well.

15. IC Handling
When pressure is applied to the IC through warp on the printed circuit board, the characteristics may fluctuate due to
the piezo effect. Be careful with the warp on the printed circuit board.

16. The IC Destruction Caused by Capacitive Load

The IC may be damaged when VCC terminal and VEE terminal is shorted with the charged output terminal capacitor.
When IC is used as an operational amplifier or as an application circuit where oscillation is not activated by an output
capacitor, output capacitor must be kept below 0.1μF in order to prevent the damage mentioned above.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 16/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Physical Dimensions Tape and Reel Information

Package Name SOP8

(Max 5.35 (include.BURR))

(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1

<Tape and Reel information>

Tape Embossed carrier tape
Quantity 2500pcs
E2
Direction
The direction is the 1pin of product is at the upper left when you hold
of feed
( reel on the left hand and you pull out the tape on the right hand )

Direction of feed
1pin
Reel ∗ Order quantity needs to be multiple of the minimum quantity.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 17/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Physical Dimension Tape and Reel Information - continued

Package Name SOP-J8

<Tape and Reel information>

Tape Embossed carrier tape
Quantity 2500pcs
E2
Direction
The direction is the 1pin of product is at the upper left when you hold
of feed
( reel on the left hand and you pull out the tape on the right hand )

Direction of feed
1pin
Reel ∗ Order quantity needs to be multiple of the minimum quantity.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 18/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Physical Dimension Tape and Reel Information - continued

Package Name SSOP-B8

<Tape and Reel information>

Tape Embossed carrier tape
Quantity 2500pcs
E2
Direction
The direction is the 1pin of product is at the upper left when you hold
of feed
( reel on the left hand and you pull out the tape on the right hand )

Direction of feed
1pin
Reel ∗ Order quantity needs to be multiple of the minimum quantity.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 19/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Physical Dimension Tape and Reel Information - continued

Package Name TSSOP-B8

<Tape and Reel information>

Tape Embossed carrier tape
Quantity 3000pcs
E2
Direction
The direction is the 1pin of product is at the upper left when you hold
of feed ( reel on the left hand and you pull out the tape on the right hand )

Direction of feed
1pin
Reel ∗ Order quantity needs to be multiple of the minimum quantity.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 20/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Physical Dimension Tape and Reel Information - continued

Package Name MSOP8

<Tape and Reel information>

Tape Embossed carrier tape
Quantity 3000pcs
TR
Direction
The direction is the 1pin of product is at the upper right when you hold
of feed ( reel on the left hand and you pull out the tape on the right hand )
1pin

Direction of feed
Reel ∗ Order quantity needs to be multiple of the minimum quantity.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 21/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Physical Dimension Tape and Reel Information - continued

Package Name TSSOP-B8J

<Tape and Reel information>

Tape Embossed carrier tape
Quantity 2500pcs
E2
Direction
The direction is the 1pin of product is at the upper left when you hold
of feed ( reel on the left hand and you pull out the tape on the right hand )

Direction of feed
1pin
Reel ∗ Order quantity needs to be multiple of the minimum quantity.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 22/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Marking Diagram

SOP8(TOP VIEW) TSSOP-B8(TOP VIEW)

Part Number Marking
Part Number Marking

LOT Number

LOT Number
1PIN MARK

1PIN MARK

SOP-J8(TOP VIEW) MSOP8(TOP VIEW)

Part Number Marking Part Number Marking

LOT Number LOT Number

1PIN MARK 1PIN MARK

SSOP-B8(TOP VIEW) TSSOP-B8J(TOP VIEW)

Part Number Marking Part Number Marking

LOT Number LOT Number

1PIN MARK 1PIN MARK

Product Name Package Type Marking

F SOP8 4565
FJ SOP-J8 L4565
FV SSOP-B8 4565
LM4565
FVT TSSOP-B8 L4565
FVM MSOP8 L4565
FVJ TSSOP-B8J L4565

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 23/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 LM4565xxx Datasheet

Land Pattern Data

All dimensions in mm
Land pitch Land space Land length Land width
PKG
e MIE ≥ℓ 2 b2
SOP8 1.27 4.60 1.10 0.76
SOP-J8 1.27 3.90 1.35 0.76
SSOP-B8 0.65 4.60 1.20 0.35
TSSOP-B8 0.65 4.60 1.20 0.35
MSOP8 0.65 2.62 0.99 0.35
TSSOP-B8J 0.65 3.20 1.15 0.35

MIE
e
b2

ℓ 2

Revision History
Date Revision Changes
30.Nov.2012 001 New Release
2.Sep.2013 002 Added LM4565FV, LM4565FJ,LM4565FVT,LM4565FVM,LM4565FVJ
15.Apr.2014 003 The Operating Supply Voltage Range is changed.

www.rohm.com TSZ02201-0RAR0G200590-1-2
©2012 ROHM Co., Ltd. All rights reserved. 24/24 15.Apr.2014 Rev.003
TSZ22111･15･001

Downloaded from: http://www.datasheetcatalog.com/

 Datasheet

Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSΥ CLASSΤb
CLASSΥ CLASSΥ
CLASSΦ CLASSΥ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice – GE Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.

Downloaded from: http://www.datasheetcatalog.com/

 Datasheet

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.

Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.

Notice – GE Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.

Downloaded from: http://www.datasheetcatalog.com/

 Datasheet

General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.

Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.

Downloaded from: http://www.datasheetcatalog.com/

 This datasheet has been downloaded from:

www.DatasheetCatalog.com

Datasheets for electronic components.

Downloaded from: http://www.datasheetcatalog.com/