MC10H176

Hex D Master−Slave
Flip−Flop
Description
The MC10H176 contains six master slave type D flip−flops with a
common clock. This MECL 10H™ part is a functional/pinout http://onsemi.com
duplication of the standard MECL 10K™ family part, with 100%
improvement in clock frequency and propagation delay and no MARKING DIAGRAMS*
increase in power−supply current.

Features 16
• Propagation Delay, 1.7 ns Typical MC10H176L
• Power Dissipation, 460 mW Typical AWLYYWW
• Improved Noise Margin 150 mV (Over Operating Voltage and 1
Temperature Range) CDIP−16
• Voltage Compensated L SUFFIX
CASE 620A
• MECL 10K Compatible
• Pb−Free Packages are Available*
16
CLOCKED TRUTH TABLE 16 MC10H176P
AWLYYWWG
C Q Qn+1 1
1
L X Qn PDIP−16
H* L L P SUFFIX
CASE 648
H* H H

* A clock H is a clock transition from 10H176

a low to a high state. ALYWG

DIP
PIN ASSIGNMENT SOEIAJ−16
CASE 966
1 20
VCC1 1 16 VCC2

Q0 2 15 Q5
20 1 10H176G
Q1 3 14 Q4 AWLYYWW
Q2 4 13 Q3 PLLC−20
D0 D5 FN SUFFIX
5 12
CASE 775
D1 6 11 D4
A = Assembly Location
D2 7 10 D3 WL, L = Wafer Lot
YY, Y = Year
VEE 8 9 CLOCK WW, W = Work Week
G = Pb−Free Package
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
*For additional marking information, refer to
Application Note AND8002/D.

*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques ORDERING INFORMATION
Reference Manual, SOLDERRM/D. See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.

© Semiconductor Components Industries, LLC, 2006 1 Publication Order Number:

February, 2006 − Rev. 7 MC10H176/D
 MC10H176

Table 1. MAXIMUM RATINGS

Symbol Characteristic Rating Unit
VEE Power Supply (VCC = 0) −8.0 to 0 Vdc
VI Input Voltage (VCC = 0) 0 to VEE Vdc
Iout Output Current − Continuous 50 mA
− Surge 100
TA Operating Temperature Range 0 to +75 °C
Tstg Storage Temperature Range − Plastic −55 to +150 °C
− Ceramic −55 to +165 °C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.

Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1)

0° 25° 75°
Symbol Characteristic Min Max Min Max Min Max Unit
IE Power Supply Current − 123 − 112 − 123 mA
IinH Input Current High mA
Pins 5,6,7,10,11,12 − 425 − 265 − 265
Pin 9 − 670 − 420 − 420
IinL Input Current Low 0.5 − 0.5 − 0.3 − mA
VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc
VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc
VIH High Input Voltage −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc
VIL Low Input Voltage −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc
1. Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is
maintained. Outputs are terminated through a 50 W resistor to −2.0 V.

Table 3. AC PARAMETERS
tpd Propagation Delay 0.9 2.1 0.9 2.2 1.0 2.4 ns
tset Set−up Time 1.5 − 1.5 − 1.5 − ns
thold Hold Time 0.9 − 0.9 − 1.0 − ns
tr Rise Time 0.5 1.8 0.5 1.9 0.5 2.0 ns
tf Fall Time 0.5 1.8 0.5 1.9 0.5 2.0 ns
ftog Toggle Frequency 250 − 250 − 250 − MHz

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.

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 MC10H176

APPLICATION INFORMATION

The MC10H176 contains six high−speed, master slave change only on a positive−going Clock transition. A change
type “D” flip−flops. Data is entered into the master when the in the information present at the data (D) input will not affect
clock is low. Master−to−slave data transfer takes place on the output information any other time due to the
the positive−going Clock transition. Thus, outputs may master−slave construction of this device.

LOGIC DIAGRAM

D0 5 2 Q0

D1 6 3 Q1

D2 7 4 Q2

D3 10 13 Q3

VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8

D4 11 14 Q4

D5 12 15 Q5

CLOCK 9

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 MC10H176

ORDERING INFORMATION
Device Package Shipping †
MC10H176FN PLLC−20 46 Units / Rail
MC10H176FNG PLLC−20 46 Units / Rail
(Pb−Free)

MC10H176FNR2 PLLC−20 500 / Tape & Reel

MC10H176FNR2G PLLC−20 500 / Tape & Reel
(Pb−Free)

MC10H176L CDIP−16 25 Unit / Rail

MC10H176M SOEIAJ−16 50 Unit / Rail
MC10H176MG SOEIAJ−16 50 Unit / Rail
(Pb−Free)

MC10H176MEL SOEIAJ−16 2000 / Tape & Reel

MC10H176MELG SOEIAJ−16 2000 / Tape & Reel
(Pb−Free)

MC10H176P PDIP−16 25 Unit / Rail

MC10H176PG PDIP−16 25 Unit / Rail
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.

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 MC10H176

PACKAGE DIMENSIONS

20 LEAD PLLC
CASE 775−02
ISSUE E

B 0.007 (0.180) M T L−M S N S

−N− Y BRK 0.007 (0.180) M T L−M S N S

U
D
−L− −M− Z

D
20 1
X G1 0.010 (0.250) S T L−M S N S

V VIEW D−D

A 0.007 (0.180) M T L−M S N S

Z
R 0.007 (0.180) M T L−M S N S
H 0.007 (0.180) M T L−M S N S

C
E K1

0.004 (0.100) K
G J −T− SEATING
PLANE F 0.007 (0.180) M T L−M S N S
VIEW S
G1 VIEW S
0.010 (0.250) S T L−M S N S
NOTES:
INCHES MILLIMETERS
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982. DIM MIN MAX MIN MAX
2. DIMENSIONS IN INCHES. A 0.385 0.395 9.78 10.03
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP B 0.385 0.395 9.78 10.03
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD C 0.165 0.180 4.20 4.57
PARTING LINE. E 0.090 0.110 2.29 2.79
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT F 0.013 0.019 0.33 0.48
DATUM −T−, SEATING PLANE. G 0.050 BSC 1.27 BSC
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. H 0.026 0.032 0.66 0.81
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. J 0.020 −−− 0.51 −−−
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER K 0.025 −−− 0.64 −−−
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). R 0.350 0.356 8.89 9.04
DIMENSIONS R AND U ARE DETERMINED AT THE U 0.350 0.356 8.89 9.04
OUTERMOST EXTREMES OF THE PLASTIC BODY
V 0.042 0.048 1.07 1.21
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY W 0.042 0.048 1.07 1.21
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE X 0.042 0.056 1.07 1.42
PLASTIC BODY. Y −−− 0.020 −−− 0.50
7. DIMENSION H DOES NOT INCLUDE DAMBAR Z 2_ 10 _ 2_ 10 _
PROTRUSION OR INTRUSION. THE DAMBAR G1 0.310 0.330 7.88 8.38
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION K1 0.040 −−− 1.02 −−−
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).

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 MC10H176

PACKAGE DIMENSIONS

SOEIAJ−16
CASE 966−01
ISSUE A NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
16 9 LE FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
Q1 PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
E HE M_ 4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
1 8 L DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DETAIL P DIMENSION AT MAXIMUM MATERIAL CONDITION.
Z DAMBAR CANNOT BE LOCATED ON THE LOWER
D RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
VIEW P
e A MILLIMETERS INCHES
c DIM MIN MAX MIN MAX
A −−− 2.05 −−− 0.081
A1 0.05 0.20 0.002 0.008
b 0.35 0.50 0.014 0.020
c 0.10 0.20 0.007 0.011
A1 D 9.90 10.50 0.390 0.413
b E 5.10 5.45 0.201 0.215
e 1.27 BSC 0.050 BSC
0.13 (0.005) M 0.10 (0.004) HE 7.40 8.20 0.291 0.323
L 0.50 0.85 0.020 0.033
LE 1.10 1.50 0.043 0.059
M 0_ 10 _ 0_ 10 _
Q1 0.70 0.90 0.028 0.035
Z −−− 0.78 −−− 0.031

CDIP−16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A−01 NOTES:
ISSUE O 1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
B 2. CONTROLLING DIMENSION: INCH.
A A 3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
M 4. DIMENSION F MAY NARROW TO 0.76 (0.030)
16 9 WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
B L CASE OUTLINE 620−10.

1 8 INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93
16X J B 0.240 0.295 6.10 7.49
C −−− 0.200 −−− 5.08
0.25 (0.010) M T B D 0.015 0.020 0.39 0.50
E E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
F G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC 7.62 BSC
C M 0_ 15 _ 0_ 15 _
N 0.020 0.040 0.51 1.01

K
SEATING
T PLANE
N
G

16X D
0.25 (0.010) M T A

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 MC10H176

PACKAGE DIMENSIONS

PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
NOTES:
−A− CASE 648−08 1. DIMENSIONING AND TOLERANCING PER ANSI
ISSUE R Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
16 9 3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
B 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1 8 5. ROUNDED CORNERS OPTIONAL.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
F C L A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
S C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
SEATING F 0.040 0.70 1.02 1.77
−T− PLANE G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
H K M J 0.008 0.015 0.21 0.38
J K 0.110 0.130 2.80 3.30
G L 0.295 0.305 7.50 7.74
D 16 PL
M 0_ 10 _ 0_ 10 _
0.25 (0.010) M T A M S 0.020 0.040 0.51 1.01

MECL 10H and MECL 10K are trademarks of Motorola, Inc.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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