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B M T Am/Fm/Sw R R: Roadcast Echanical Uning Adio Eceiver

Chip am / fm

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0% found this document useful (0 votes)
166 views20 pages

B M T Am/Fm/Sw R R: Roadcast Echanical Uning Adio Eceiver

Chip am / fm

Uploaded by

Andrew
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 20

Si4831/35-B30

B R O A D C A S T M E C H A N I C A L TU N I N G A M / F M / S W R A D I O R EC EIVER

Features
 Worldwide FM band support  Automatic frequency control (AFC)
(64–109 MHz)  Integrated LDO regulator
 Worldwide AM band support  2.0 to 3.6 V supply voltage
(504–1750 kHz)  Wide range of ferrite loop sticks and air
 SW band support (Si4835 only) loop antennas supported
(5.6–22 MHz)  24-pin SSOP
 Excellent real-world performance  RoHS-compliant
 EN55020-compliant  Supports station and stereo LED
 No manual alignment necessary indicators
 Flexible band selections Ordering Information:
 Direct volume control
See page 13.
 Bass and treble tone control

Applications
Pin Assignments
 Table and portable radios  Modules
 Stereos  Clock radios
 Mini/micro systems  Mini HiFi Si4831/35-B30 (SSOP)
 CD/DVD players  Entertainment systems
 Boom boxes STEREO 1 24 LOUT
STATION 2 23 ROUT
Description TUNE1 3 22 DBYP
TUNE2 4 21 VDD2
The Si4831/35-B30 is the 2nd generation mechanical-tuned digital CMOS BAND 5 20 VDD1
AM/FM/SW radio receiver IC that integrates the complete receiver function from NC 6 19 XTALI
antenna input to audio output. Like other successful audio products from Silicon NC 7 18 XTALO
Labs, Si4831/35-B30 offers unmatched integration and PCB space savings with FMI 8 17 VOL-/BASS
minimum external components and a small board area. The Si4831/35-B30 RFGND 9 16 VOL+/TREBLE
requires a simple application circuit and removes any requirements for manually NC 10 15 RST

tuning components during the manufacturing process. The Si4831/35-B30 is a NC 11 14 GND


AMI GND
very simple product to design, manufacture, and support across multiple product 12 13

lines. The receiver has very low power consumption, runs off two AAA batteries,
and delivers the performance benefits of digital tuning to the analog radio market.
Functional Block Diagram This product, its features, and/or its
architecture is covered by one or more of
Si4831/35 the following patents, as well as other
Si4830/34 patents, pending and issued, both
AMI ADC DAC LOUT foreign and domestic: 7,127,217;
AM
LNA DSP 7,272,373; 7,272,375; 7,321,324;
ANT RFGND
ADC DAC
7,355,476; 7,426,376; 7,471,940;
ROUT
FM/SW 7,339,503; 7,339,504.
ANT AGC
FMI
0/90
TUNE 1/2
ADC

XTALI AFC BAND


CONTROL
INTERFACE
2.0~3.6V VDD1/2
XTAL
REG
OSC
VOL/TONE
STATION
STEREO
RST

Rev. 1.0 1/11 Copyright © 2011 by Silicon Laboratories Si4831/35-B30


Si4831/35-B30

2 Rev. 1.0
Si4831/35-B30
TABLE O F C ONTENTS

Section Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.2. FM Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
4.3. AM Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
4.4. SW Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.5. Frequency Tuning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.6. Band Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
4.7. Bass and Treble . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
4.8. Volume Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5. Pin Descriptions: Si4831/35-B30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7. Package Markings (Top Marks) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
7.1. Si4831/35-B30 Top Mark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
7.2. Top Mark Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
8. Package Outline: Si4831/35-B30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
9. PCB Land Pattern: Si4831/35-B30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
10. Additional Reference Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

Rev. 1.0 3
Si4831/35-B30
1. Electrical Specifications

Table 1. Recommended Operating Conditions1,2

Parameter Symbol Test Condition Min Typ Max Unit


Supply Voltage3 VDD 2 — 3.6 V
Power Supply Powerup Rise Time VDDRISE 10 — — µs
Ambient Temperature TA –15 25 85 C
Note:
1. Typical values in the data sheet apply at VDD = 3.3 V and 25 °C unless otherwise stated.
2. All minimum and maximum specifications in the data sheet apply across the recommended operating conditions for
minimum VDD = 2.7 V.
3. Operation at minimum VDD is guaranteed by characterization when VDD voltage is ramped down to 2.0 V. Part
initialization may become unresponsive below 2.3 V.

Table 2. Absolute Maximum Ratings1,2


Parameter Symbol Value Unit
Supply Voltage VDD –0.5 to 5.8 V
3
Input Current IIN 10 mA
Operating Temperature TOP –40 to 95 C
Storage Temperature TSTG –55 to 150 C
RF Input Level4 0.4 VPK
Notes:
1. Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation
should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure beyond
recommended operating conditions for extended periods may affect device reliability.
2. The Si4831/35-B30 devices are high-performance RF integrated circuits with certain pins having an ESD rating of
< 2 kV HBM. Handling and assembly of these devices should only be done at ESD-protected workstations.
3. For input pins RST, VOL+/TREBLE, VOL–/BASS, XTALO, XTALI, BAND, TUNE2, TUNE1, STATION, and STEREO.
4. At RF input pins, FMI and AMI.

4 Rev. 1.0
Si4831/35-B30

Table 3. DC Characteristics
(VDD = 2.7 to 3.6 V, TA = –15 to 85 °C)

Parameter Symbol Test Condition Min Typ Max Unit


FM Mode

Supply Current1 IFM — 21.0 — mA


Supply Current2 IFM Low SNR level — 21.5 — mA
AM/SW Mode

Supply Current1 IAM — 17.0 — mA


Supplies and Interface
VDD Powerdown Current IDDPD — 10 — µA
Notes:
1. Specifications are guaranteed by characterization.
2. LNA is automatically switched to higher current mode for optimum sensitivity in weak signal conditions.

Table 4. Reset Timing Characteristics


(VDD = 2.7 to 3.6 V, TA = –15 to 85 °C)

Parameter Symbol Min Typ Max Unit

RST Pulse Width and TUNE1, TUNE2 Setup to RST tSRST 100 — — µs

TUNE1, TUNE2 Hold from RST tHRST 30 — — ns

tSRST tHRST

70%
RST
30%

70%
TUNE1
30%

70%
TUNE2
30%

Figure 1. Reset Timing

Rev. 1.0 5
Si4831/35-B30

Table 5. FM Receiver Characteristics1,2


(VDD = 2.7 to 3.6 V, TA = –15 to 85 °C)

Parameter Symbol Test Condition Min Typ Max Unit


Input Frequency fRF 64 — 109 MHz
Sensitivity with Headphone (S+N)/N = 26 dB — 2.2 — µV EMF
Network3
LNA Input Resistance4,5 — 4 — k
LNA Input Capacitance4,5 — 5 — pF

AM Suppression4,5,6,7 m = 0.3 — 50 — dB
Input IP34,8 — 105 — dBµV EMF

Adjacent Channel Selectivity4 ±200 kHz — 50 — dB

Alternate Channel Selectivity4 ±400 kHz — 65 — dB

Audio Output Voltage5,6,7 — 80 — mVRMS

Audio Mono S/N5,6,7,9,10 — 55 — dB

Audio Stereo S/N3,4,5,7,9,10, — 55 — dB


Audio Frequency Response Low –3 dB — — 30 Hz
Audio Frequency Response High –3 dB 15 — — kHz

Audio Stereo Separation5,11 — 42 — dB

Audio THD6,5,11 — 0.1 0.5 %

Audio Output Load Resistance4,10 RL Single-ended 10 — — k

Audio Output Load Capacitance4,10 CL Single-ended — — 50 pF


Powerup/Band Switch Time4 — — 110 ms
Notes:
1. Additional testing information is available in “AN569: Si4831/35-DEMO Board Test Procedure.” Volume = maximum
for all tests. Tested at RF = 98.1 MHz.
2. To ensure proper operation and receiver performance, follow the guidelines in “AN555: Si483x-B Antenna, Schematic,
Layout, and Design Guidelines.” Silicon Laboratories will evaluate schematics and layouts for qualified customers.
3. Frequency is 76~109 MHz.
4. Guaranteed by characterization.
5. VEMF = 1 mV.
6. FMOD = 1 kHz, MONO, and L = R unless noted otherwise.
7. f = 22.5 kHz.
8. |f2 – f1| > 2 MHz, f0 = 2 x f1 – f2.
9. BAF = 300 Hz to 15 kHz, A-weighted.
10. At LOUT and ROUT pins.
11. f = 75 kHz.

6 Rev. 1.0
Si4831/35-B30

Table 6. AM/SW Receiver Characteristics1, 2


(VDD = 2.7 to 3.6 V, TA = –15 to 85 °C)

Parameter Symbol Test Condition Min Typ Max Unit


Input Frequency fRF Medium Wave (AM) 504 — 1750 kHz
Short Wave (SW) 5.60 — 22.0 MHz

Sensitivity3,4,5 (S+N)/N = 26 dB — 30 — µV EMF

Large Signal Voltage Handling5 THD < 8% — 300 — mVRMS

Power Supply Rejection Ratio5 ∆VDD = 100 mVRMS, 100 Hz — 40 — dB

Audio Output Voltage3,6 — 60 — mVRMS

Audio S/N3,4,6 — 55 — dB

Audio THD3,6 — 0.1 0.5 %

Antenna Inductance5,7 180 — 450 µH

Powerup/Band Switch Time5 From powerdown — — 110 ms

Notes:
1. Additional testing information is available in “AN569: Si4831/35-DEMO Board Test Procedure.” Volume = maximum
for all tests. Tested at RF = 520 kHz.
2. To ensure proper operation and receiver performance, follow the guidelines in “AN555: Si483x-B Antenna, Schematic,
Layout, and Design Guidelines.” Silicon Laboratories will evaluate schematics and layouts for qualified customers.
3. FMOD = 1 kHz, 30% modulation, 2 kHz channel filter.
4. BAF = 300 Hz to 15 kHz, A-weighted.
5. Guaranteed by characterization.
6. VIN = 5 mVrms.
7. Stray capacitance on antenna and board must be < 10 pF to achieve full tuning range at higher inductance levels.

Table 7. Reference Clock and Crystal Characteristics


(VDD = 2.7 to 3.6 V, TA = –15 to 85 °C)

Parameter Symbol Test Condition Min Typ Max Unit


Reference Clock
XTALI Supported Reference Clock — 32.768 — kHz
Frequencies
Reference Clock Frequency –100 — 100 ppm
Tolerance for XTALI
Crystal Oscillator
Crystal Oscillator Frequency — 32.768 — kHz
Crystal Frequency Tolerance –100 — 100 ppm
Board Capacitance — — 3.5 pF

Rev. 1.0 7
Si4831/35-B30
2. Typical Application Schematic

FMI TUNE1

TUNE1
R3

2.5k/100M
253k
S2
(Si4835 only) VR1

B1
100k
BAND 1 2
AM
3
AM antenna

R2 R4

VDD
ANT1

180k
10k
C5

BAND
AMI STATION_LED
FM
STEREO_LED
0.47u

12

11

10

1
RFGND

BAND

STATION
AMI

TUNE2

TUNE1
NC

NC

FMI

NC

NC

STEREO
R5
67k

C5

VOL+/TREBLE
AMI U1

VOL-/BASS
0.47u

XTAL0

XTALI

ROUT
VDD1

VDD2

LOUT
ANT2

DBYP
GND

GND

RST
RFGND
13

14

15

16

17

18

19

20

21

22

23

24
T1
LOUT
C4
Optional: AM air loop antenna ROUT
0.1u
VDD
R1 2.0 TO 3.6V
VDD

VDD
2.0 TO 3.6V
100k

C1 Y1
0.1u
32.768KHz

C3 C2
22p 22p

Optional

Notes:
1. Place C4 close to VDD2 and DBYP pins.
2. All grounds connect directly to GND plane on PCB.
3. Pin 6 and 7 leave floating.
4. To ensure proper operation and receiver performance, follow the guidelines in "AN555: Si483x-B Antenna, Schematic,
Layout, and Design Guidelines." Silicon Labs will evaluate the schematics and layouts for qualified customers.
5. Pin 8 connects to the FM antenna interface and pin 12 connects to the AM antenna interface.
6. Place Si483x as close as possible to antenna jack and keep the FMI and AMI traces as short as possible.

8 Rev. 1.0
Si4831/35-B30
3. Bill of Materials

Table 8. Si4831/35-B30 Bill of Materials


Component(s) Value/Description Supplier

C1 Reset capacitor 0.1 uF, ±20%, Z5U/X7R Murata


C4 Supply bypass capacitor, 0.1 uF, ±20%, Z5U/X7R Murata
C5 Coupling capacitor, 0.47 µF, ±20%, Z5U/X7R Murata
B1 Ferrite bead 2.5k/100 MHz Murata
VR1 Variable resistor (POT), 100k, ±10% Kennon
R1 Reset timing resistor, 100k, ±5% Venkel
R2 Resistor, 10k, ±5% Venkel
R3 Resistor, 253k, ±1% Venkel
R4 Resistor, 180k, ±1% Venkel
R5 Resistor, 67k, ±1% Venkel
U1 Si4831/35-B30 Mechanical Tuning Radio Receiver Silicon Laboratories

S2 Band switch Any, depends on


customer
ANT1 Ferrite stick,180-450 µH Jiaxin
Optional Components

C2, C3 Crystal load capacitors, 22 pF, ±5%, COG Venkel


(Optional: for crystal oscillator option)
Y1 32.768 kHz crystal (Optional: for crystal oscillator option) Epson or equivalent
ANT2 Air loop antenna, 10–20 µH Various

Rev. 1.0 9
Si4831/35-B30
4. Functional Description

Si4831/35
Si4830/34
AMI ADC DAC LOUT
AM
LNA DSP
ANT RFGND
ADC DAC ROUT
FM/SW
ANT AGC
FMI
0/90
TUNE 1/2
ADC

XTALI AFC BAND


CONTROL
INTERFACE
2.0~3.6V VDD1/2
XTAL
REG
OSC

VOL/TONE
STATION
STEREO
RST
Figure 2. Si4831/35-B30 Functional Block Diagram
4.1. Overview 4.2. FM Receiver
The Si4831/35-B30 is the industry's most advanced The Si4831/35-B30 integrates a low noise amplifier
fully integrated, mechanical-tuned 100% CMOS (LNA) supporting the worldwide FM broadcast band (64
AM/FM/SW radio receiver IC. Offering unmatched to 109 MHz).
integration and PCB space savings, the Si4831/35-B30 Pre-emphasis and de-emphasis is a technique used by
requires minimum external components and a small FM broadcasters to improve the signal-to-noise ratio of
board area. The Si4831/35-B30 AM/FM/SW radio FM receivers by reducing the effects of high frequency
provides space savings and low power consumption interference and noise. When the FM signal is
while delivering the high performance and design transmitted, a pre-emphasis filter is applied to
simplicity desired for all AM/FM/SW solutions. accentuate the high audio frequencies. All FM receivers
Leveraging Silicon Laboratories' proven and patented incorporate a de-emphasis filter which attenuates high
digital low intermediate frequency (low-IF) receiver frequencies to restore a flat frequency response. Two
architecture, the Si4831/35-B30 delivers superior RF time constants are used in various regions. The de-
performance and interference rejection in AM, FM, and emphasis time constant can be chosen to be 50 or
SW bands. The high integration and complete system 75 µs. Refer to "AN555: Si483x-B Antenna, Schematic,
production test simplifies design-in, increases system Layout, and Design Guidelines."
quality, and improves manufacturability. The Si4831/35-B30 also has advanced stereo blending
that employs adaptive noise suppression. As a signal
quality degrades, the Si4831/35-B30 gradually
combines the stereo left and right audio channels to a
mono audio signal to maintain optimum sound fidelity
under varying reception conditions. The Si4831/35-B30
can drive a stereo light with the stereo/mono information
so that the user can easily discern the signal quality.

10 Rev. 1.0
Si4831/35-B30
The stereo light up criteria is defined using both RSSI 4.5. Frequency Tuning
and the Left and Right separation levels as these two
A valid channel can be found by tuning the
specifications are the primary factors for stereo
potentiometer that is connected to the TUNE1 and
listening. The criteria can be set between two
TUNE2 pin of the Si4831/35-B30 chip.
conditions: the Left and Right channels are separated
by more than 6 dB with RSSI at >20 dB or Left and To offer easy tuning, the Si4831/35-B30 also supports a
Right channels are separated by more than 12 dB with station LED light. It will light up the LED if the RF signal
RSSI at >28 dB. The selection can be set up using quality passes the LED sensitivity threshold when tuned
different values of the external resister. Refer to to a valid station.
"AN555: Si483x-B Antenna, Schematic, Layout, and 4.6. Band Select
Design Guidelines."
The Si4831/35-B30 supports worldwide AM band with
4.3. AM Receiver five sub-bands, US/Europe/Japan/China FM band with
The highly integrated Si4831/35-B30 supports five sub-bands, and SW band with 16 sub-bands. For
worldwide AM band reception from 504 to 1750 kHz details on band selection, refer to "AN555: Si483x-B
with five sub-bands using a digital low-IF architecture Antenna, Schematic, Layout, and Design Guidelines."
with a minimum number of external components and no 4.7. Bass and Treble
manual alignment required. This patented architecture
allows for high-precision filtering, offering excellent The Si4831/35-B30 further supports bass and treble
selectivity and SNR with minimum variation across the tone control for superior sound quality. Pins 16 and 17
AM band. Similar to the FM receiver, the Si4831/35-B30 can be configured for tone control, allowing customers
optimizes sensitivity and rejection of strong interferers, to use either two buttons or one slide-switch to adjust
allowing better reception of weak stations. the bass and treble. For further configuration details,
refer to "AN555: Si483x-B Antenna, Schematic, Layout,
To offer maximum flexibility, the receiver supports a
and Design Guidelines."
wide range of ferrite loop sticks from 180–450 µH. An
air loop antenna is supported by using a transformer to 4.8. Volume Control
increase the effective inductance from the air loop.
The Si4831/35-B30 not only allows customers to use
Using a 1:5 turn ratio inductor, the inductance is
the traditional PVR wheel volume control through an
increased by 25 times and easily supports all typical AM
external speaker amplifier, it also supports direct digital
air loop antennas, which generally vary between 10 and
volume control through pins 16 and pin 17 by using
20 µH.
volume up and down buttons. Refer to "AN555: Si483x-
4.4. SW Receiver B Antenna, Schematic, Layout, and Design Guidelines."
The Si4835 supports 16 short wave (SW) band
receptions from 5.60 to 22.0 MHz. Si4835 supports
extensive short wave features such as minimal discrete
components and no factory adjustments. The Si4835
supports using the FM antenna to capture short wave
signals.

Rev. 1.0 11
Si4831/35-B30
5. Pin Descriptions: Si4831/35-B30

STEREO 1 24 LOUT
STATION 2 23 ROUT
TUNE1 3 22 DBYP
TUNE2 4 21 VDD2
BAND 5 20 VDD1
NC 6 19 XTALI
NC 7 18 XTALO
FMI 8 17 VOL-/BASS
RFGND 9 16 VOL+/TREBLE
NC 10 15 RST
NC 11 14 GND
AMI 12 13 GND

Pin Number(s) Name Description


1 STEREO Stereo indicator
2 STATION Station indicator
3 TUNE1 Frequency tuning
4 TUNE2 Frequency tuning
5 BAND Band selection and De-emphasis/Stereo separation selection
6,7 NC No connect. Leave floating.
8 FMI FM RF inputs. FMI should be connected to the antenna trace.
9 RFGND RF ground. Connect to ground plane on PCB.
10,11 NC Unused. Tie these pins to GND.
12 AMI AM RF input. AMI should be connected to the AM antenna.
13,14 GND Ground. Connect to ground plane on PCB.
15 RST Device reset (active low) input
16 VOL+/TREBLE Volume button up/Treble
17 VOL–/BASS Volume button down/Bass
18 XTALO Crystal oscillator output
19 XTALI Crystal oscillator input
20 VDD1 Supply voltage. May be connected directly to battery.
21 VDD2 Supply voltage. May be connected directly to battery.
22 DBYP Dedicated bypass for VDD
23 ROUT Right audio line output in analog output mode
24 LOUT Left audio line output in analog output mode

12 Rev. 1.0
Si4831/35-B30
6. Ordering Guide

Part Number* Description Package Operating


Type Temperature/Voltage
Si4831-B30-GU AM/FM Broadcast Radio Receiver 24L SSOP –15 to 85 °C
Pb-free 2.0 to 3.6 V
Si4835-B30-GU AM/FM/SW Broadcast Radio Receiver 24L SSOP –15 to 85 °C
Pb-free 2.0 to 3.6 V
*Note: Add an “(R)” at the end of the device part number to denote tape and reel option. The devices will typically operate at
25 °C with degraded specifications for VDD voltage ramped down to 2.0 V.

Rev. 1.0 13
Si4831/35-B30
7. Package Markings (Top Marks)
7.1. Si4831/35-B30 Top Mark

4831B30GU
YYWWTTTTTT

4835B30GU
YYWWTTTTTT
7.2. Top Mark Explanation

Mark Method: YAG Laser


4831B30GU = Si4831-B30
Line 1 Marking: Device identifier
4835B30GU = Si4835-B30
YY = Year
Line 2 Marking: WW = Work week Assigned by the Assembly House.
TTTTTT = Manufacturing code

14 Rev. 1.0
Si4831/35-B30
8. Package Outline: Si4831/35-B30
The 24-pin SSOP illustrates the package details for the Si4831/35-B30. Table 9 lists the values for the dimensions
shown in the illustration.

Figure 3. 24-Pin SSOP

Table 9. Package Dimensions


Dimension Min Nom Max
A — — 1.75
A1 0.10 — 0.25
b 0.20 — 0.30
c 0.10 — 0.25
D 8.65 BSC
E 6.00 BSC
E1 3.90 BSC
e 0.635 BSC
L 0.40 — 1.27
θ 0° — 8°
aaa 0.20
bbb 0.18
ccc 0.10
ddd 0.10
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-137, Variation AE.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification
for Small Body Components.

Rev. 1.0 15
Si4831/35-B30
9. PCB Land Pattern: Si4831/35-B30
Figure 4, “PCB Land Pattern,” illustrates the PCB land pattern details for the Si4831/35-B30-GU SSOP. Table 10
lists the values for the dimensions shown in the illustration.

Figure 4. PCB Land Pattern

Table 10. PCB Land Pattern Dimensions


Dimension Min Max
C 5.20 5.40
E 0.65 BSC
X1 0.35 0.45
Y1 1.55 1.75
General:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
Solder Mask Design:
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.
Stencil Design:
4. A stainless steel, laser-cut, and electro-polished stencil with trapezoidal walls
should be used to assure good solder paste release.
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
Card Assembly:
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.

16 Rev. 1.0
Si4831/35-B30
10. Additional Reference Resources
Contact your local sales representatives for more information or to obtain copies of the following references:
 EN55020 Compliance Test Certificate
 AN555: Si483x-B Antenna, Schematic, Layout, and Design Guidelines
 AN569: Si4831/35-DEMO Board Test Procedure
 Si4831/35-DEMO Board User’s Guide

Rev. 1.0 17
Si4831/35-B30
DOCUMENT CHANGE LIST
Revision 0.1 to Revision 0.7
 Updated block diagram.
 Updated application schematic.
 Updated bill of materials.
 Updated Section “4.2. FM Receiver”.
 Updated Section “4.3. AM Receiver”.
 Updated Section “4.6. Band Select”.
Revision 0.7 to Revision 1.0
 Updated block diagram
 Updated Table 2, “Absolute Maximum Ratings1,2,”
on page 4
 Updated Table 5, “FM Receiver Characteristics1,2,”
on page 6
 Updated Table 6, “AM/SW Receiver Characteristics1,
2
,” on page 7
 Updated “4. Functional Description”
 Updated “10. Additional Reference Resources”

18 Rev. 1.0
Si4831/35-B30
NOTES:

Rev. 1.0 19
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