Jan-19 Feb-19

Type of Defects Location Qty Type of Defects Location

Missing Component D3 1 Billboard R348
Wrong Orientation D2 1 Tombstone C75
Billboard R4 1 Billboard D11
Tombstone C39 1 Billboard R347
Billboard D25 1 Billboard R29
Missing Component D25 1 Billboard C70
Billboard R21 1 Billboard R21
Inverted Component D8 1 Billboard R19
Tombstone L6 1 Billboard R11
Tombstone R40 1 Billboard R11
Billboard R14 1 Misalignment L30
Misalignment D8 1 Lifted Lead T2
Tombstone R18 1 Overhang R20
Billboard R11 1 Tombstone L20
Billboard C70 1 Billboard R85
Tombstone R66 1 Billboard R9
Inverted Component D8 1 Billboard R295
Billboard R41 1 Billboard R295
Inverted Component D8 1 Billboard R295
Inverted Component D8 1 Misalignment D2
Billboard R18 1 Billboard R294
Billboard R18 1 Billboard R294
Misalignment T3 1 Billboard R32
Tombstone C19 1 Billboard R85
Billboard R31 1 Billboard R9
Billboard R21 1 Overhang C69
Billboard R31 1 Non Wetting L1
Billboard R16 1 Billboard R85
Billboard R299 1 Missing Component D7
Billboard R18 1 Overhang C69
Tombstone L4 1 Billboard R347
Billboard R18 1
Billboard R18 1
Billboard R31 1
Billboard R348 1
Tombstone C21 1
Billboard R16 1
Misalignment T2 1
Tombstone L20 1
Billboard R295 1
Billboard R11 1
Billboard R297 1
Billboard R31 1
Misalignment T3 1
Overhang L6 1
 Missing Component L31 1
Missing Component L31 1
Tombstone L6 1
Non Wetting L6 1
Inverted Component D18 1
Billboard R11 1
Overhang C73 1
Tombstone C46 1
Billboard R18 1
Tombstone C28 1
Billboard C70 1
Billboard R10 1
Billboard X1 1
Misalignment D2 1
Inverted Component D6 1
Under Debug NA 1

Total Produced 1482 Total Produced 1001

Total Fail 61 Total Fail 31
% Fail 4.12 % Fail 3.10

Billboard 56 Billboard
Inverted Component 6 Inverted Component
Lifted Lead 0 Lifted Lead
Misalignment 5 Misalignment
Missing Component 4 Missing Component
Non Wetting 1 Non Wetting
Overhang 2 Overhang
Tombstone 12 Tombstone
Under Debug 1 Under Debug
Wrong Orientation 1 Wrong Orientation

Billboard Location Ocurrence Billboard Location Ocurrence

* R4 1 R348
D25 1 D11
* R21 2 R347
* R14 1 R29
* R11 3 C70
C70 2 R21
* R41 1 R19
* R18 4 R11
* R31 4 R85
* R16 2 R9
* R299 1 R295
* R348 1 R294
* R295 1 R32
* R297 1
* R10 1
X1 1
19
Qty What causing misalignment in SMT?
1 1 May occur during reflow due to the componenets may realign themselves due to the su
1 2 Nozzle tip wear can cause less vacuum to be generated, allowing parts to shift during tra
1
1 Machines Cause
1 1 Improper nozzle maintenance
1 2 Use of poor quality nozzle
1
1 What causing billboard/tombstone in SMT?
1 1 Thermal inequalities between solder joints, where one solder joint warms up faster than
1 This creates a force that pulls the component and flips it into a tombstone condition.
1 2 Solder paste that isn’t applied evenly, or with too much paste on the ends.
1 3 Pad designs that incorporate pads that are too large for the chip component.
1 4 Component placement is important since less centering will occur during reflow.
1
1 Remedy
1 1 Increase duration of soak cycle to insure all parts of the PCB are at uniform temperature
1
1
1 What causing non wetting in SMT?
1 1 Poor activation of paste resulting from reflow profile.
1
1
1 # Mostly defect components are for 0402 size. Location starred * for January data.
1
1
1
1
1
1
1
1
20
0
1
2
1
1
3
2
0
0

1
1
2
1
1
1
1
2
3
2
3
2
1
 realign themselves due to the surface tension of the molten solder.
d, allowing parts to shift during transport.

solder joint warms up faster than the other and melts first.
it into a tombstone condition.
h paste on the ends.
r the chip component.
g will occur during reflow.

e PCB are at uniform temperature.

starred * for January data.

 Jul-19 Jun-19
NA - R18 TS - TOMBSTONE R214
BB - BILLBOARD R295 LL - LIFTED LEAD Q1
BB - BILLBOARD R11 NA - R19
BB - BILLBOARD R32 NA - C21
IC - INVERTED COMPONENT TVS1 NA - C19
TS - TOMBSTONE C30 NA - R41
MA - MISALIGNMENT C64 NA - R31
IS - INSUFFICIENT SOLDER U2 NA - R14
BB - BILLBOARD R299 BB - BILLBOARD R11
TS - TOMBSTONE C70 BB - BILLBOARD R4
BB - BILLBOARD R9 NA - R19
BB - BILLBOARD R16 BB - BILLBOARD R10
BB - BILLBOARD R16 BB - BILLBOARD R85
TS - TOMBSTONE C40 NA - C29
BB - BILLBOARD R18 NA - C29
BB - BILLBOARD R295 NA - C25
BB - BILLBOARD R294 NA - C56
IC - INVERTED COMPONENT D1
BB - BILLBOARD R297 NA - C30
BB - BILLBOARD R18 BB - BILLBOARD D25
NW - NON WETTING C13 NA - C40
TS - TOMBSTONE L6 NA - C26
BB - BILLBOARD R299 SS - SOLDER SHORT U2
BB - BILLBOARD R40 NA - C26
MA - MISALIGNMENT L1 OH - OVERHANG L1
BB - BILLBOARD R85 MA - MISALIGNMENT C64
MA - MISALIGNMENT T3 NA - C27
MA - MISALIGNMENT U2 NA - C26
EX - EXTRA COMPONENT U2 NA - R11
BB - BILLBOARD R294 NA - C55
BB - BILLBOARD C70 NA - C30
BB - BILLBOARD R13 NA - C30
OH - OVERHANG C3 NA - C27
MA - MISALIGNMENT C3 NA - C25
MA - MISALIGNMENT C3 BB - BILLBOARD R109
BB - BILLBOARD R10 BB - BILLBOARD R29
BB - BILLBOARD R85 NA - C25
TS - TOMBSTONE R85 NA - C325
BB - BILLBOARD C70 NA - C324
MA - MISALIGNMENT C3 NA - C55
BB - BILLBOARD R16 NA - C46
BB - BILLBOARD R32 OH - OVERHANG L1
MA - MISALIGNMENT T3 NA - C25
MA - MISALIGNMENT C148 NA - C29
MA - MISALIGNMENT C3 BB - BILLBOARD R11
BB - BILLBOARD R14 NA - C259
BB - BILLBOARD R19 NA - L1
BB - BILLBOARD R40 NA - C30
BB - BILLBOARD R4 TS - TOMBSTONE C57
BB - BILLBOARD R294 NA - C67
BB - BILLBOARD R294 BB - BILLBOARD R349
BB - BILLBOARD R297 EX - EXTRA COMPONENT R348
BB - BILLBOARD R18 MS - MISSING R348
IC - INVERTED COMPONENT D8 MS - MISSING R20
MA - MISALIGNMENT T3 BB - BILLBOARD R39
BB - BILLBOARD R10 BB - BILLBOARD R4
BB - BILLBOARD R4 BB - BILLBOARD R39
BB - BILLBOARD R18 BB - BILLBOARD R39
BB - BILLBOARD R39
Total Produced 1482 BB - BILLBOARD R347
Total Fail 58 BB - BILLBOARD R39
% Fail 3.91 MS - MISSING R31
MS - MISSING L32
MS - MISSING R11
MS - MISSING L8
MS - MISSING R109
BB - BILLBOARD R11
MA - MISALIGNMENT C64
MA - MISALIGNMENT C64
MA - MISALIGNMENT C64
NW - NON WETTING L1
BB - BILLBOARD R22
MS - MISSING L32
MA - MISALIGNMENT T3
BB - BILLBOARD R13
MA - MISALIGNMENT U2
BB - BILLBOARD R18
BB - BILLBOARD R18
MS - MISSING R22
TS - TOMBSTONE L6
TS - TOMBSTONE L9
MA - MISALIGNMENT C64
BB - BILLBOARD R347
BB - BILLBOARD R18
BB - BILLBOARD R7
NA - D9
BB - BILLBOARD R7
TS - TOMBSTONE L20
BB - BILLBOARD R347
MA - MISALIGNMENT T3
NA - C56
MA - MISALIGNMENT T3
MA - MISALIGNMENT T3
BB - BILLBOARD R21
NA - R85
BB - BILLBOARD R32
IS - INSUFFICIENT SOLDER U2
BB - BILLBOARD C70
OH - OVERHANG C87
TS - TOMBSTONE C6
OH - OVERHANG C57
BB - BILLBOARD R4
TS - TOMBSTONE C57
BB - BILLBOARD R40
BB - BILLBOARD R24
BB - BILLBOARD R13
BB - BILLBOARD R24

ES - EXTRA SOLDER R22

OH - OVERHANG C256
ES - EXTRA SOLDER R22
ES - EXTRA SOLDER R22
BB - BILLBOARD R13
BB - BILLBOARD R347
TS - TOMBSTONE L6
BB - BILLBOARD R39
BB - BILLBOARD R39
TS - TOMBSTONE L6
TS - TOMBSTONE L6
MA - MISALIGNMENT U2
TS - TOMBSTONE C70
MS - MISSING C327
MS - MISSING C323
TS - TOMBSTONE C70
BB - BILLBOARD R349
TS - TOMBSTONE R14
TS - TOMBSTONE R14
LL - LIFTED LEAD U32
LL - LIFTED LEAD U32
BB - BILLBOARD D5
BB - BILLBOARD R7
MS - MISSING C25
BB - BILLBOARD R109
OH - OVERHANG C57
BB - BILLBOARD R10
IS - INSUFFICIENT SOLDER U32
MS - MISSING R41
BB - BILLBOARD R7
BB - BILLBOARD R7
BB - BILLBOARD C70
MS - MISSING R14
MS - MISSING C56
MS - MISSING C57
MS - MISSING C41
BB - BILLBOARD D25
MS - MISSING C57
BB - BILLBOARD R348

MS - MISSING C25
BB - BILLBOARD R349
EX - EXTRA COMPONENT C66
MS - MISSING C56
BB - BILLBOARD D5
OH - OVERHANG C70
TS - TOMBSTONE C70
MA - MISALIGNMENT U2
OH - OVERHANG C21
OH - OVERHANG C70
BB - BILLBOARD R347
BB - BILLBOARD R347
BB - BILLBOARD R10

TS - TOMBSTONE C70
MA - MISALIGNMENT C89
NA - C89
MS - MISSING C89
IC - INVERTED COMPONENT D9
IC - INVERTED COMPONENT D8
BB - BILLBOARD R347
BB - BILLBOARD R4
BB - BILLBOARD R347
MA - MISALIGNMENT U2
BB - BILLBOARD R347
OH - OVERHANG C70

IC - INVERTED COMPONENT D8
BB - BILLBOARD R10
BB - BILLBOARD R10
BB - BILLBOARD R347
NA - C89
BB - BILLBOARD R348
BB - BILLBOARD R10
OH - OVERHANG C70
OH - OVERHANG C70
OH - OVERHANG C70
OH - OVERHANG C70
OH - OVERHANG C70
BB - BILLBOARD R4
IS - INSUFFICIENT SOLDER U2
BB - BILLBOARD C70
NA - R10
BB - BILLBOARD R10
BB - BILLBOARD R299
BB - BILLBOARD R347
BB - BILLBOARD R10
BB - BILLBOARD R347
BB - BILLBOARD R347
BB - BILLBOARD R347
BB - BILLBOARD R13
OH - OVERHANG L1
MA - MISALIGNMENT U2
BB - BILLBOARD C70
BB - BILLBOARD R10
NA - C89
BB - BILLBOARD C70
MS - MISSING C70
MS - MISSING C70
MS - MISSING C70
MS - MISSING C70
MS - MISSING C70
MS - MISSING C70

Total Produced 3495

Total Fail 211
% Fail 6.04
 Sep-19
IS - INSUFFICIENT SOLDER U2
BB - BILLBOARD R18
BB - BILLBOARD C70
NA - C317
IS - INSUFFICIENT SOLDER U2

BB - BILLBOARD R347
TS - TOMBSTONE R10
BB - BILLBOARD R14
BB - BILLBOARD R10
TS - TOMBSTONE C329
BB - BILLBOARD R10
EX - EXTRA COMPONENT C57
TS - TOMBSTONE C51
TS - TOMBSTONE C57
BB - BILLBOARD R32
BB - BILLBOARD R348
TS - TOMBSTONE C6
TS - TOMBSTONE C57
NA - C56
BB - BILLBOARD R297
FC - FLIP CHIP Q1
BB - BILLBOARD R348
BB - BILLBOARD R349
TS - TOMBSTONE C6
NA - R31
BB - BILLBOARD R349
BB - BILLBOARD R66
TS - TOMBSTONE C27
TS - TOMBSTONE C56
BB - BILLBOARD R348
TS - TOMBSTONE C70
NA - C57
NA - C2
BB - BILLBOARD R10
TS - TOMBSTONE C70
NA - R10
BB - BILLBOARD R10
NA - C32
NA - C32
BB - BILLBOARD R10
IC - INVERTED COMPONENT D8
TS - TOMBSTONE C25
NA - C57
NA - C53
LL - LIFTED LEAD NA
BB - BILLBOARD R13
NA - C6
TS - TOMBSTONE L20
IS - INSUFFICIENT SOLDER D4
TS - TOMBSTONE C57
NA - C3
NA - L1
NA - C257
NA - C87
OH - OVERHANG L1
IC - INVERTED COMPONENT D8
NA - TVS2
NW - NON WETTING R348
NA - C317
NA - C33
NA - D2
NW - NON WETTING L1
BB - BILLBOARD R295

WO - WRONG ORIENTATION D2
TS - TOMBSTONE C6
IC - INVERTED COMPONENT D7
BB - BILLBOARD R349
IC - INVERTED COMPONENT D8
IC - INVERTED COMPONENT D6
IC - INVERTED COMPONENT D8
IC - INVERTED COMPONENT D7
BB - BILLBOARD R295
BB - BILLBOARD R295
BB - BILLBOARD R66
TS - TOMBSTONE R4
IC - INVERTED COMPONENT D1
BB - BILLBOARD R349
MA - MISALIGNMENT U2
BB - BILLBOARD R349
BB - BILLBOARD R349
BB - BILLBOARD R39
BB - BILLBOARD R348
BB - BILLBOARD R349
WO - WRONG ORIENTATION D11
BB - BILLBOARD R66

BB - BILLBOARD R349

TS - TOMBSTONE C6
BB - BILLBOARD D11

Total Produced 2002

Total Fail 113
% Fail 5.64
 Machines Materials Methods
Lack of Maintenance Wrong Component Grade Uneven Applied Solder Paste
Outdated Machine Wrong Pad Size Component Placement
Poor Quality Nozzle PCB Design Reflow Parameters Setting

Manpower Method

Lack of Training Uneven Applied

Solder Paste

Lack of Component
Concentration Placement

Reflow Parameters
Setting

Wrong
Component Grade

Wrong Pad Size

PCB Design Bad Lighting System

Material
 Manpower Environment Measurements
Lack of Training Humidity Count errors
Lack of Concentration Temperature Lack of accountability
Bad Lighting System

Machine

Lack of
Maintenance

nent Outdated Machine

nt

Reflow Parameters Poor Quality Nozzle

Setting

SMT
Defects
Humidity

Temperature

Bad Lighting System

Environment
 START

DESCRIBE THE PROBLEM

LITERATURE REVIEW

DATA COLLECTION

ANALYZE DATA USING

QUALITY TOOLS

IDENTIFY POTENTIAL
CAUSES

SELECT LIKELY CAUSES

DISCOVER
ROOT
NO CAUSE?

YES

IDENTIFY POSSIBLE
CORRECTIVE ACTIONS

IMPLEMENT
CORRECTIVE ACTIONS

VALIDATE DATA AFTER

IMPROVEMENT
CONCLUSION AND FUTURE
RECOMMENDATIONS

REPORT WRITING

END
 START

DESCRIBE THE PROBLEM

LITERATURE REVIEW

DATA COLLECTION

ANALYZE DATA USING QUALITY TOOLS

IDENTIFY POTENTIAL CAUSES

SELECT LIKELY CAUSES

 SELECT LIKELY CAUSES

DISCOVER
ROOT CAUSE?
NO

YES
IDENTIFY POSSIBLE CORRECTIVE ACTIONS

IMPLEMENT CORRECTIVE ACTIONS

VALIDATE DATA AFTER IMPROVEMENT

CONCLUSION AND FUTURE RECOMMENDATIONS

REPORT WRITING

END