STTH6003

High frequency secondary rectifier

Datasheet - production data

A1 Description
K
A2 Dual rectifier suited for switch mode power supply
and high frequency DC to DC converters.
Packaged in TO-247, this device is intended for
use in low voltage, high frequency inverters, free
wheeling operation, welding equipment and
telecom power supplies.
Table 1: Device summary
A2 Symbol Value
K
A1 IF(AV) 2 x 30 A
VRRM 300 V
TO-247 VF (max.) 1V
trr (max.) 55 ns

Features
 Combines highest recovery and voltage
performance
 Ultrafast, soft and noise-free recovery
 Low inductance and low capacitance allow
simplified layout

November 2016 DocID6144 Rev 7 1/9

This is information on a product in full production. www.st.com
Characteristics STTH6003

1 Characteristics
Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 300 V
IF(RMS) Forward rms current 60 A
Average forward current Per diode 30
IF(AV) Tc = 135 °C A
δ = 0.5, square wave Per device 60
IFSM Surge non repetitive forward current tP = 10 ms sinusoidal 300 A
IRSM Non repetitive peak reverse current tP = 100 μs square 4 A
Tstg Storage temperature range -65 to +175 °C
Tj Maximum operating junction temperature +175 °C

Table 3: Thermal parameters

Symbol Parameter Maximum Unit
Per diode 1
Rth(j-c) Junction to case
Total 0.55 °C/W
Rth(c) Coupling 0.1

When the diodes 1 and 2 are used simultaneously:

Δ Tj (diode1) = P(diode1) x Rth(j-c)(per diode) + P(diode2) x Rth(c)
Table 4: Static electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
Tj = 25 °C - 60
IR(1) Reverse leakage current VR = 300 V µA
Tj = 125 °C - 60 600
Tj = 25 °C - 1.25
VF(2) Forward voltage drop IF = 30 A V
Tj = 125 °C - 0.85 1

Notes:
(1)Pulse test: tp = 5 ms, δ < 2 %
(2)Pulse test: tp = 380 μs, δ < 2 %

To evaluate the maximum conduction losses, use the following equation:

P = 0.75 x IF(AV) + 0.008 x IF2(RMS)

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STTH6003 Characteristics
Table 5: Dynamic characteristics
Symbol Parameters Test conditions Min. Typ. Max. Unit
IF = 0.5 A;
Irr = 0.25 A, - 40
IR = 1 A
trr Reverse recovery time Tj = 25 °C ns
IF = 1 A,
dIF/dt = -50 A/μs, - 55
VR = 30 V
tfr Forward recovery time IF = 30 A; - 350 ns
dlF/dt = 200 A/µs,
Tj = 25 °C
VFP Forward recovery voltage VFR = 1.1 x VF - 5 V
max.

Sfactor Softness factor VCC = 200 V, - 0.3 -

Tj = 125 °C IF = 30 A,
IRM Reverse recovery current - 11 A
dIF/dt = 200 A/μs

DocID6144 Rev 7 3/9

Characteristics STTH6003
1.1 Characteristics (curves)
Figure 2: Forward voltage drop versus forward
Figure 1: Conduction losses versus average
current (maximum values, per diode)
current (per diode)
P(W)
40
δ = 0.1 δ = 0.2 δ = 0.5
35 δ = 0.05

30
δ=1
25

20

15

10 T

5
I F(AV) (A) δ =tp/T tp
0
0 5 10 15 20 25 30 35 40

Figure 3: Relative variation of thermal impedance Figure 4: Peak reverse recovery current versus
junction to case versus pulse duration (TO-247) dIF/dt (90% confidence, per diode)

Zth(j-c) /Rth(j-c)
1. 0

0. 8

δ = 0.5
0. 6

0. 4 δ = 0.2

δ = 0.1 T
0. 2
S in gle puls e
tp(s) δ =tp/T tp
0. 0
1E -3 1E -2 1E -1 1E +0 1E +1

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STTH6003 Characteristics
Figure 5: Reverse recovery time versus dIF/dt Figure 6: Softness factor (tb/ta) versus dIF/dt
(90% confidence, per diode) (typical values, per diode)

trr(ns) Sfactor
180 0.6
VR = 200 V VR = 200 V
160 Tj = 125 °C Tj = 125 °C
0.5
140
IF = 2 x IF(AV)
120 0.4

100
IF = IF(AV) 0.3
80

60 0.2

40
IF = 0.5 x IF(AV) 0.1
20 dlF/dt(A/µs)
dlF/dt(A/µs) 0.0
0 0 50 100 150 200 250 300 350 400 450 500
0 50 100 150 200 250 300 350 400 450 500

Figure 7: Relative variation of dynamic parameters Figure 8: Transient peak forward voltage versus
versus junction temperature (Tj = 125 °C) dIF/dt (90% confidence, per diode)

VFP(V)
10
IF = IF(AV)
Tj = 125 °C
8

dlF/dt(A/µs)
0
0 50 100 150 200 250 300 350 400 450 500

Figure 9: Forward recovery time versus dIF/dt (90% confidence, per diode)

tfr(ns)
500
IF = IF(AV)
VFR = 1.1 x VFmax
Tj = 125 °C
400

300

200

100

dlF/dt(A/µs)
0
0 50 100 150 200 250 300 350 400 450 500

DocID6144 Rev 7 5/9

Package information STTH6003

2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
 Epoxy meets UL94, V0
 Cooling method: by conduction (C)
 Recommended torque values: 0.55 N·m
 Maximum torque value: 1.0 N·m

2.1 TO-247 package information

Figure 10: TO-247 package outline

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STTH6003 Package information
Table 6: TO-247 package mechanical data
Dimensions
Ref. Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.85 5.15 0.191 0.203
A1 2.20 2.60 0.086 0.102
b 1.00 1.40 0.039 0.055
b1 2.00 2.40 0.078 0.094
b2 3.00 3.40 0.118 0.133
c 0.40 0.80 0.015 0.031
D(1) 19.85 20.15 0.781 0.793
E 15.45 15.75 0.608 0.620
e 5.30 5.45 5.60 0.209 0.215 0.220
L 14.20 14.80 0.559 0.582
L1 3.70 4.30 0.145 0.169
L2 18.50 0.728
ØP(2) 3.55 3.65 0.139 0.143
ØR 4.50 5.50 0.177 0.217
S 5.30 5.50 5.70 0.209 0.216 0.224

Notes:
(1)Dimension D plus gate protusion does not exceed 20.5 mm
(2)Resin thickness around the mounting hole is not less than 0.9 mm.

DocID6144 Rev 7 7/9

Ordering information STTH6003

3 Ordering information
Table 7: Ordering information
Order code Marking Package Weight Base qty. Delivery mode
STTH6003CW STTH6003CW TO-247 4.36 g 30 Tube

4 Revision history
Table 8: Document revision history
Date Revision Changes
Oct-1999 5C Previous revision.
Removed ISOTOP package.
18-Jun-2014 6
Updated Section 2: Package information.
Updated Table 7: "Ordering information".
21-Nov-2016 7
Minor text changes.

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STTH6003

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DocID6144 Rev 7 9/9