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TAS5733L
SLASE77A – MARCH 2016 – REVISED MARCH 2016

TAS5733L - Digital Input Audio Power Amplifier with EQ and 3-Band AGL
1 Features 2 Applications
1• Audio Input/Output • LCD TV, LED TV
– One-Stereo Serial Audio Input • Low-Cost Audio Equipment
– Supports 44.1-kHz and 48-kHz Sample Rates
(LJ/RJ/I²S) 3 Description
– Supports 3-Wire I²S Mode (no MCLK required) The TAS5733L device is an efficient, digital-input
audio amplifier for driving stereo speakers configured
– Automatic Audio Port Rate Detection as a bridge tied load (BTL). In parallel bridge tied
– Supports BTL and PBTL Configuration load (PBTL) in can produce higher power by driving
– POUT = 10 W @ 10% THD+N the parallel outputs into a single lower impedance
load. One serial data input allows processing of up to
– PVDD = 12 V, 8 Ω, 1 kHz two discrete audio channels and seamless integration
• Audio/PWM Processing to most digital audio processors and MPEG
– Independent Channel Volume Controls With decoders. The device accepts a wide range of input
Gain of 24 dB to Mute in 0.125-dB Steps data and data rates. A fully programmable data path
routes these channels to the internal speaker drivers.
– Programmable Three-Band Automatic Gain
Limiting (AGL) The TAS5733L device is a slave-only device
receiving all clocks from external sources. The
– 20 Programmable Biquads for Speaker EQ
TAS5733L device operates with a PWM carrier
and Other Audio-Processing Features between a 384-kHz switching rate and a 288-kHz
• General Features switching rate, depending on the input sample rate.
– 104-dB SNR, A-Weighted, Referenced to Full Oversampling combined with a fourth-order noise
Scale (0 dB) shaper provides a flat noise floor and excellent
dynamic range from 20 Hz to 20 kHz.
– I²C Serial Control Interface w/ two Addresses
– Thermal, Short-Circuit, and Undervoltage Device Information(1)
Protection PART NUMBER PACKAGE BODY SIZE (NOM)
– Up to 90% Efficient TAS5733L HTSSOP (48) 12.50 mm × 6.10 mm
– AD, BD, and Ternary Modulation (1) For all available packages, see the orderable addendum at
– PWM Level Meter the end of the data sheet.
Power vs PVDD
30
Simplified Block Diagram
RL = 4 Ω DVDD AVDD PVDD

RL = 8 Ω
25 Power-On Reset
Internal Regulation and Power Distribution Internal Voltage Supplies
(POR)

MCLK Monitoring
and Watchdog Digital to PWM Open Loop Stereo
Converter Stereo PWM Amplifier
20 (DPC)
Output Power (W)

Serial Audio Port Sensing & Protection AMP_OUT_A

MCLK (SAP) AMP_OUT_B
LRCK Digital Audio Sample Rate 2 Ch. PWM
Temperature
Sample Rate Processor Converter Modulator
Short Circuits
15 SCLK Auto-Detect (DAP) (SRC)
PVDD Voltage
Noise Shaping Output Current
SDIN PLL
AMP_OUT_C
Click & Pop
Fault Notification AMP_OUT_D
Suppression
10

5
Internal Register/State Machine Interface

I²C Control Port

0
8 9 10 11 12 13 14 15
PVDD (V) SCL SDA DR_SD PDN RST

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features .................................................................. 1 7.1 Overview ................................................................. 15
2 Applications ........................................................... 1 7.2 Functional Block Diagram ....................................... 15
3 Description ............................................................. 1 7.3 Audio Signal Processing Overview ......................... 16
7.4 Feature Description................................................. 17
4 Revision History..................................................... 2
7.5 Device Functional Modes........................................ 19
5 Pin Configuration and Functions ......................... 3
7.6 Programming........................................................... 20
6 Specifications......................................................... 5
7.7 Register Maps ......................................................... 31
6.1 Absolute Maximum Ratings ...................................... 5
8 Application and Implementation ........................ 49
6.2 ESD Ratings ............................................................ 5
8.1 Application Information............................................ 49
6.3 Recommended Operating Conditions....................... 5
8.2 Typical Applications ............................................... 50
6.4 Thermal Characteristics ............................................ 6
6.5 Electrical Characteristics........................................... 6 9 Power Supply Recommendations...................... 55
6.6 Speaker Amplifier Characteristics............................. 7 10 Layout................................................................... 56
6.7 Protection Characteristics ......................................... 7 10.1 Layout Guidelines ................................................. 56
6.8 Master Clock Characteristics .................................... 7 10.2 Layout Example .................................................... 57
6.9 I²C Interface Timing Requirements ........................... 8 11 Device and Documentation Support ................. 59
6.10 Serial Audio Port Timing Requirements.................. 8 11.1 Trademarks ........................................................... 59
6.11 Typical Characteristics - Stereo BTL Mode .......... 11 11.2 Electrostatic Discharge Caution ............................ 59
6.12 Typical Characteristics - Mono PBTL Mode ......... 13 11.3 Glossary ................................................................ 59
7 Detailed Description ............................................ 15 12 Mechanical, Packaging, and Orderable
Information ........................................................... 60

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Original (March 2016) to Revision A Page

• Moved from Product Preview to Production Data release. ................................................................................................... 1

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5 Pin Configuration and Functions

DCA Package
48-Pin HTSSOP With PowerPAD™
Top View

BSTRP _B 1 48 BSTRP _C
AMP_OUT _B 2 47 AMP_OUT _C
AMP_OUT _B 3 46 AMP_OUT _C
PGND 4 45 PGND
PGND 5 44 PGND
AMP_OUT _A 6 43 AMP_OUT _D
PVDD 7 42 PVDD
PVDD 8 41 PVDD
BSTRP _A 9 40 BSTRP _D
SSTIMER 10 39 GVDD _REG
PBTL 11 38 AVDD_ REG
NC 12 37 NC
NC 13 36 NC
PLL _GND 14 35 AGND
PLL _FLTM 15 34 DGND
PLL _FLTP 16 33 DVDD
AVDD _REF 17 32 TEST
AVDD 18 TM 31 RST
PowerPAD
ADR / FAULT 19 30 NC
MCLK 20 29 SCL
OSC_RES 21 28 SDA
OSC _GND 22 27 SDIN
DVDD_REG 23 26 SCLK
PDN 24 25 LRCLK

Pin Functions
PIN
TYPE (1) DESCRIPTION
NAME NO.
Dual function terminal which sets the LSB of the I²C Address to 0 if pulled to GND, 1 if
ADR/FAULT 19 DI/DO pulled to AVDD. Also, if configured to be a fault output by the methods described in the
Fault Indication section, this terminal will be pulled low when an internal fault occurs.
Ground reference for analog circuitry (NOTE: This terminal should be connected to the
AGND 35 P
system ground)
AMP_OUT_A 6
2
AMP_OUT_B
3
AO Speaker amplifier outputs
46
AMP_OUT_C
47
AMP_OUT_D 43
AVDD 18 P Power supply for internal analog circuitry
Internal power supply (NOTE: This terminal is provided as a connection point for filtering
AVDD_REF 17 P
capacitors for this supply and must not be used to power any external circuitry)
Voltage regulator derived from AVDD supply (NOTE: This terminal is provided as a
AVDD_REG 38 P connection point for filtering capacitors for this supply and must not be used to power
any external circuitry)
BSTRP_A 9
BSTRP_B 1 Connection points to for the bootstrap capacitors, which are used to create a power
P
BSTRP_C 48 supply for the gate drive for the high-side device
BSTRP_D 40
Ground reference for digital circuitry (NOTE: This terminal should be connected to the
DGND 34 P
system ground)
DVDD 33 P Power supply for the internal digital circuitry
Voltage regulator derived from DVDD supply (NOTE: This terminal is provided as a
DVDD_REG 23 P connection point for filtering capacitors for this supply and must not be used to power
any external circuitry)
Voltage regulator derived from PVDD supply (NOTE: This terminal is provided as a
GVDD_REG 39 P connection point for filtering capacitors for this supply and must not be used to power
any external circuitry)
Word select clock for the digital signal that is active on the input data line of the serial
LRCLK 25 DI
port

(1) TYPE: A = analog; D = 3.3-V digital; P = power/ground/decoupling; I = input; O = output

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Pin Functions (continued)

PIN
TYPE (1) DESCRIPTION
NAME NO.
MCLK 20 DI Master clock used for internal clock tree and sub-circuit/state machine clocking
12
13
(2) Not connected inside the device (all "no connect" terminals should be connected to
NC 30 P
system ground)
36
37
Ground reference for oscillator circuitry (NOTE: These terminals should be connected to
OSC_GND 22 P
the system ground)
Connection point for precision resistor used by internal oscillator circuit. Details for this
OSC_RES 21 AO
resistor are shown in the Typical Applications section
Places the power stage in BTL mode when pulled low, or in PBTL mode when pulled
PBTL 11 DI
high
PDN 24 DI Places the device in power down when pulled low
4
5 Ground reference for power device circuitry (NOTE: This terminal should be connected
PGND —
44 to the system ground)
45
PLL_FLTM 15 AO Negative connection point for the PLL loop filter components
PLL_FLTP 16 AO Positive connection point for the PLL loop filter components
Ground reference for PLL circuitry (NOTE: This terminal should be connected to the
PLL_GND 14 P
system ground)
7
8
PVDD P Power supply for internal power circuitry
41
42
RST 31 DI Places the devices in reset when pulled low
SCL 29 DI I²C serial control port clock
SCLK 26 DI Bit clock for the digital signal that is active on the input data line of the serial data port
SDA 28 DI/DO I²C serial control port data
SDIN 27 DI Data line to the serial data port
Connection point for the capacitor that is used by the ramp timing circuit, as described in
SSTIMER 10 AO
the SSTIMER Pin Functionality section
Used by TI for testing during device production (NOTE: This terminal should be
TEST 32 —
connected to system ground)
Exposed metal pad on the underside of the device, which serves as an electrical
connection point for ground as well as a heat conduction path from the device into the
PowerPAD — P
board (NOTE: This terminal should be connected to ground through a land pattern
defined in the Mechanical Data section)

(2) Although these pins are not connected internally, optimum thermal performance is realized when these pins are connected to the ground
plane. Doing so allows copper on the PCB to fill up to and including these pins, providing a path for heat to conduct away from the
device and into the surrounding PCB area.

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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VALUE UNIT
DVDD, AVDD –0.3 to 3.6 V
Supply voltage
PVDD –0.3 to 20
3.3-V digital input –0.5 to DVDD + 0.5
Input voltage 5-V tolerant (2) digital input (except MCLK) –0.5 to DVDD + 2.5 (3) V
(3)
5-V tolerant MCLK input –0.5 to AVDD + 2.5
AMP_OUT_x to GND 22 (4) V
BSTRP_x to GND 29 (4) V
Operating free-air temperature 0 to 85 °C
Storage temperature range, Tstg –40 to 125 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum conditions for extended periods may affect device reliability.
(2) 5-V tolerant inputs are PDN, RST, SCLK, LRCK, MCLK, SDIN, SDA, and SCL.
(3) Maximum pin voltage should not exceed 6 V.
(4) DC voltage + peak ac waveform measured at the pin should be below the allowed limit for all conditions.

6.2 ESD Ratings

VALUE UNIT
(1)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 ±4000
V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22- V
±1500
C101 (2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
DVDD, AVDD Digital, analog supply voltage 3 3.3 3.6 V
PVDD Output power devices supply voltage 8 16.5 (1) V
(2)

VIH High-level input voltage 5-V tolerant 2 V

VIL Low-level input voltage 5-V tolerant 0.8 V
TA Operating ambient temperature range 0 85 °C
(2)
TJ Operating junction temperature range 0 125 °C
RL Load impedance 4 8 Ω
RL Load impedance in PBTL 2 Ω
Minimum output inductance under
LO Output-filter inductance 10 μH
short-circuit condition

(1) For operation at PVDD levels greater than 14.5 V, the modulation limit must be set to 96.1% or lower via the control port register 0x10.
(2) 16.5 V is the maximum recommended voltage for continuous operation of the TAS5733L device. Testing and characterization of the
device is performed up to and including 16.5 V to ensure “in system” design margin. However, continuous operation at these levels is
not recommended. Operation above the maximum recommended voltage may result in reduced performance, errant operation, and
reduction in device reliability.

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6.4 Thermal Characteristics

DCA (48 PINS)
THERMAL METRIC (1) JEDEC JEDEC TAS5733LEVM UNITS
Special Test
Standard 2- Standard 4-
Case
Layer PCB Layer PCB
θJA Junction-to-ambient thermal resistance (2) 50.7 27.6 25.0 °C/W
θJCtop Junction-to-case (top) thermal resistance (3) 14.9 16.7 °C/W
θJB Junction-to-board thermal resistance (4) 6.9 7.9 °C/W
(5)
ψJT Junction-to-top characterization parameter 1.2 0.8 0.7 °C/W
ψJB Junction-to-board characterization parameter (6) 11.8 7.8 5.8 °C/W
θJCbot Junction-to-case (bottom) thermal resistance (7) 1.7 2.2 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer

6.5 Electrical Characteristics

TA = 25°, PVDD_x = 12 V, DVDD = AVDD = 3.3 V, RL= 8 Ω, BTL BD mode, fS = 48 kHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IOH = –4 mA
VOH High-level output voltage 2.4 V
DVDD = AVDD = 3 V
ADR/FAULT and SDA
IOL = 4 mA
VOL Low-level output voltage 0.5 V
DVDD = AVDD = 3 V
VI < VIL
IIL Low-level input current 75 μA
DVDD = AVDD = 3.6 V
Digital Inputs
VI > VIH
IIH High-level input current 75 μA
DVDD = AVDD = 3.6 V
Normal mode 49 68
3.3-V supply voltage
IDD 3.3-V supply current Reset (RST = low, PDN = mA
(DVDD, AVDD) 23 38
high)

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6.6 Speaker Amplifier Characteristics

PVDD = 12 V, BTL BD mode, AVDD = DVDD = 3.3 V, fS = 48 KHz, RL = 8 Ω, audio frequency = 1 kHz, AES17 filter, fPWM =
384 kHz, TA = 25°C (unless otherwise specified). All performance is in accordance with recommended operating conditions
and as tested on the TAS5733L EVM.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PVDD = 12 V, 10% THD, 1-kHz input signal 10
PVDD = 12 V, 7% THD, 1-kHz input signal 9
PVDD = 12 V, 1% THD, 1-kHz input signal 7.5
PO Power output per channel W
PVDD = 13.2 V, 10% THD, 1-kHz input signal 12
PVDD = 13.2 V, 7% THD, 1-kHz input signal 11
PVDD = 13.2 V, 1% THD, 1-kHz input signal 9
Total harmonic distortion + PVDD = 12 V, PO = 1 W 0.25
THD+N %
noise PVDD = 13.2 V, PO = 1 W 0.3
Vn Output integrated noise (rms) A-weighted 30 μV
PO = 1 W, f = 1 kHz (BD Mode), PVDD = 12 V –79 dB
Crosstalk
PO =1 W, f = 1 kHz (AD Mode), PVDD = 12 V –62 dB
11.025, 22.05, 44.1-kHz data rate ±2% 288
Output switching frequency kHz
48, 24, 12, 8, 16, 32-kHz data rate ±2% 384
Normal mode 16 25
IPVDD Supply current No load (PVDD) mA
Reset (RST = low, PDN = high) 3 8
Drain-to-source resistance,
TJ = 25°C, includes metallization resistance 120
low side
rDS(on) (1) mΩ
Drain-to-source resistance,
TJ = 25°C, includes metallization resistance 120
high side
Internal pulldown resistor at Connected when drivers are in the high-impedance
RPD 3 kΩ
the output of each half-bridge state to provide bootstrap capacitor charge.

(1) This does not include bond-wire or pin resistance.

6.7 Protection Characteristics

TA = 25°, PVDD_x = 12 V, DVDD = AVDD = 3.3 V, RL= 8 Ω, BTL BD mode, fS = 48 kHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Vuvp(fall) Undervoltage protection limit PVDD falling 5.4 V
Vuvp(rise) Undervoltage protection limit PVDD rising 5.8 V
OTE Overtemperature error 150 °C
IOC Overcurrent limit protection 4 A
IOCT Overcurrent response time 150 ns

6.8 Master Clock Characteristics (1)

PVDD = 12 V, BTL BD mode, AVDD = DVDD = 3.3 V, fS = 48 kHz, RL = 8 Ω, audio frequency = 1 kHz, AES17 filter, fPWM =
384 kHz, TA = 25°C (unless otherwise specified). All performance is in accordance with recommended operating conditions
(unless otherwise specified).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PLL INPUT PARAMETERS
fMCLKI MCLK frequency 2.8224 24.576 MHz
MCLK duty cycle 40% 50% 60%
tr / tf(MCLK) Rise/fall time for MCLK 5 ns

(1) For clocks related to the serial audio port, please see Serial Audio Port Timing Requirements.

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6.9 I²C Interface Timing Requirements

MIN NOM MAX UNIT
tw(RST) Pulse duration, RST active 100 μs
td(I²C_ready) Time to enable I²C after RST goes high 13.5 ms
fSCL Frequency, SCL 400 kHz
tw(H) Pulse duration, SCL high 0.6 μs
tw(L) Pulse duration, SCL low 1.3 μs
tr Rise time, SCL and SDA 300 ns
tf Fall time, SCL and SDA 300 ns
tsu1 Setup time, SDA to SCL 100 ns
th1 Hold time, SCL to SDA 0 ns
t(buf) Bus free time between stop and start conditions 1.3 μs
tsu2 Setup time, SCL to start condition 0.6 μs
th2 Hold time, start condition to SCL 0.6 μs
tsu3 Setup time, SCL to stop condition 0.6 μs
CL Load capacitance for each bus line 400 pF

6.10 Serial Audio Port Timing Requirements

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fSCLKIN Frequency, SCLK 32 × fS, 48 × fS, 64 × fS CL ≤ 30 pF 1.024 12.28 MHz
8
tsu1 Setup time, LRCK to SCLK rising edge 10 ns
th1 Hold time, LRCK from SCLK rising edge 10 ns
tsu2 Setup time, SDIN to SCLK rising edge 10 ns
th2 Hold time, SDIN from SCLK rising edge 10 ns
LRCK frequency 8 48 48 kHz
SCLK duty cycle 40% 50% 60%
LRCK duty cycle 40% 50% 60%
SCLK
SCLK rising edges between LRCK rising edges 32 64
edges
t(edge) SCLK
LRCK clock edge with respect to the falling edge of SCLK –1/4 1/4
period
tr/tf Rise/fall time for SCLK/LRCK 8 ns
LRCK allowable drift before LRCK reset 4 MCLKs

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RST

tw(RST)

2 2
I C Active I C Active

td(I2C_ready)

System Initialization.
2
Enable via I C.
T0421-01

NOTE: On power up, hold the TAS5733L RST LOW for at least 100 μs after DVDD has reached 3 V.
NOTE: If RST is asserted LOW while PDN is LOW, then RST must continue to be held LOW for at least 100 μs after PDN is
deasserted (HIGH).

Figure 1. Reset Timing

tw(H) tw(L) tr tf

SCL

tsu1 th1

SDA

T0027-01

Figure 2. SCL and SDA Timing

SCL

th2 t(buf)

tsu2 tsu3

SDA

Start Stop
Condition Condition
T0028-01

Figure 3. Start and Stop Conditions Timing

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tr tf

SCLK
(Input)
t(edge)
th1
tsu1

LRCLK
(Input)

th2
tsu2

SDIN

T0026-04

Figure 4. Serial Audio Port Timing

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6.11 Typical Characteristics - Stereo BTL Mode

30 50
THD+N = 10%; 8 Ohms 8 Ohms
THD+N = 1%; 8 Ohms 45 6 Ohms
25 THD+N = 10%; 6 Ohms 4 Ohms
40
THD+N = 1%; 6 Ohms

Idle Channel Noise (µV)

THD+N = 10%; 4 Ohms 35
Output Power (W)

20 THD+N = 1%; 4 Ohms

30
15 25
20
10
15
10
5
5
0 0
8 9 10 11 12 13 14 15 8 9 10 11 12 13 14 15
PVDD (V) D007
PVDD (V) D012

Figure 5. Output Power vs Supply Voltage - BTL Figure 6. Idle Channel Noise vs Supply Voltage - BTL
10 10
1W 1W
2.5 W 2.5 W
5W 5W
1 1
THD+N (%)

THD+N (%)

0.1 0.1

0.01 0.01

0.002 0.002
20 100 1k 10k 20k 10 100 1k 10k 20k
Frequency (Hz) D001
Frequency (Hz) D002
PVDD = 12 V RL = 8 Ω PVDD = 12 V RL = 6 Ω

Figure 7. THD+N vs Frequency - BTL Figure 8. THD+N vs Frequency - BTL

5 10
1W 20 Hz
2.5 W 1 kHz
1 5W 7 kHz

1
THD+N (%)
THD+N (%)

0.1

0.1
0.01

0.001 0.01
20 100 1k 10k 20k 0.01 0.1 1 10 50
Frequency (Hz) D003
Output Power (W) D001
PVDD = 12 V RL = 4 Ω PVDD = 12 V RL = 8 Ω

Figure 9. THD+N vs Frequency - BTL Figure 10. THD+N vs Output Power - BTL

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Typical Characteristics - Stereo BTL Mode (continued)

20 10
10 20 Hz 20 Hz
1 kHz 1 kHz
7 kHz 7 kHz

1
1
THD+N (%)

THD+N (%)
0.1

0.1
0.01

0.001 0.01
0.01 0.1 1 10 50 0.01 0.1 1 10 50
Output Power (W) D001
Output Power (W) D006
PVDD = 12 V RL = 6 Ω PVDD = 12 V RL = 4 Ω

Figure 11. THD+N vs Output Power - BTL Figure 12. THD+N vs Output Power - BTL
100 100
90 90
80 80
70 70
Efficiency (%)

Efficiency (%)

60 60
50 50
40 40
30 30
20 PVDD = 8 V 20 PVDD = 8 V
10 PVDD = 12 V 10 PVDD = 12 V
PVDD = 13.2 V PVDD = 13.2 V
0 0
0 5 10 15 20 25 0 5 10 15 20 25 30 35 40 45 50
Total Output Power (W) D008
Output Power (W) D009
RL = 8 Ω RL = 4 Ω
Total Output Power includes power delivered from both amplifier Total Output Power includes power delivered from both amplifier
outputs. For instance, 40 W of total output power means 2 × 20 W, outputs. For instance, 40 W of total output power means 2 × 20 W,
with 20 W delivered by one channel and 20 W delivered by the with 20 W delivered by one channel and 20 W delivered by the
other channel. other channel.

Figure 13. Efficiency vs Total Output Power - BTL Figure 14. Efficiency vs Total Output Power - BTL
0 0
Right to Left Right to Left
-10 Left to Right -10 Left to Right
-20 -20
-30 -30
Crosstalk (dB)

Crosstalk (dB)

-40 -40
-50 -50
-60 -60
-70 -70
-80 -80
-90 -90
-100 -100
20 100 1k 10k 20k 20 100 1k 10k 20k
Frequency (Hz) D010
Frequency (Hz) D011
PVDD = 12 V RL = 8 Ω PVDD = 12 V RL = 4 Ω

Figure 15. Crosstalk vs Frequency - BTL Figure 16. Crosstalk vs Frequency - BTL

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6.12 Typical Characteristics - Mono PBTL Mode

10 5
1W 1W
2.5 W 2.5 W
5W 1 5W
1
THD+N (%)

THD+N (%)
0.1
0.1

0.01 0.01

0.001 0.001
20 100 1k 10k 20k 20 100 1k 10k 20k
Frequency (Hz) D013
Frequency (Hz) D014
PVDD = 12 V RL = 4 Ω PVDD = 12 V RL = 3 Ω

Figure 17. THD+N vs Frequency - PBTL Figure 18. THD+N vs Frequency - PBTL
10 20
1W 20 Hz
10
2.5 W 1 kHz
5W 7 kHz
1
THD+N (%)

THD+N (%)

0.1

0.1
0.01

0.001 0.01
20 100 1k 10k 20k 0.001 0.01 0.1 1 10 50
Frequency (Hz) D015
Output Power (W) D016
PVDD = 12 V RL = 2 Ω PVDD = 12 V RL = 4 Ω

Figure 19. THD+N vs Frequency - PBTL Figure 20. THD+N vs Output Power - PBTL
20 20
20 Hz 20 Hz
10 10
1 kHz 1 kHz
7 kHz 7 kHz
THD+N (%)

THD+N (%)

1
1

0.1
0.1

0.01 0.02
0.001 0.01 0.1 1 10 50 0.002 0.01 0.1 1 10 60
Output Power (W) D017
Output Power (W) D018
PVDD = 12 V RL = 3 Ω PVDD = 12 V RL = 2 Ω

Figure 21. THD+N vs Output Power - PBTL Figure 22. THD+N vs Output Power - PBTL

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Typical Characteristics - Mono PBTL Mode (continued)

60 100
THD+N = 10%; RL = 4R
THD+N = 1%; RL = 4R
50 THD+N = 10%; RL = 3R 80
THD+N = 1%; RL = 3R
THD+N = 10%; RL = 2R
Output Power (W)

40 THD+N = 1%; RL = 2R

Efficiency (%)
60
30
40
20

20 PVDD = 8 V
10
PVDD = 12 V
PVDD = 13.2 V
0 0
8 9 10 11 12 13 14 15 0 5 10 15 20 25
Supply Voltage (V) D019
Output Power (W) D020
RL = 4 Ω
Total Output Power includes power delivered from both amplifier
Figure 23. Output Power vs PVDD - PBTL outputs. For instance, 40 W of total output power means 2 × 20 W,
with 20 W delivered by one channel and 20 W delivered by the
other channel.

Figure 24. Efficiency vs Output Power - PBTL

100 60
RL = 4 R
90 RL = 3 R
50 RL = 2 R
80
Idle Channel Noise (µV)

70
40
Efficiency (%)

60
50 30
40
20
30
20 PVDD = 8 V 10
10 PVDD = 12 V
PVDD = 13.2 V
0 0
0 5 10 15 20 25 30 35 40 45 8 9 10 11 12 13 14 15
Output Power (W) D021
PVDD (V) D022
RL = 2 Ω
Total Output Power includes power delivered from both amplifier
outputs. For instance, 40 W of total output power means 2 × 20 W, Figure 26. Idle Channel Noise vs PVDD - PBTL
with 20 W delivered by one channel and 20 W delivered by the
other channel.

Figure 25. Efficiency vs Output Power - PBTL

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7 Detailed Description

7.1 Overview
The TAS5733L device is an efficient, digital-input audio amplifier for driving stereo speakers configured as a
bridge tied load (BTL). In parallel bridge tied load (PBTL) in can produce higher power by driving the parallel
outputs into a single lower impedance load. One serial data input allows processing of up to two discrete audio
channels and seamless integration to most digital audio processors and MPEG decoders. The device accepts a
wide range of input data and data rates. A fully programmable data path routes these channels to the internal
speaker drivers.
The TAS5733L device is a slave-only device receiving all clocks from external sources. The TAS5733L device
operates with a PWM carrier between a 384-kHz switching rate and a 288-kHz switching rate, depending on the
input sample rate. Oversampling combined with a fourth-order noise shaper provides a flat noise floor and
excellent dynamic range from 20 Hz to 20 kHz.

7.2 Functional Block Diagram

DVDD AVDD PVDD

Power-On Reset Internal Voltage Supplies

Internal Regulation and Power Distribution
(POR)

MCLK Monitoring
and Watchdog Digital to PWM Open Loop Stereo
Converter Stereo PWM Amplifier
(DPC)
Serial Audio Port Sensing & Protection AMP_OUT_A
MCLK (SAP) AMP_OUT_B
LRCK Digital Audio Sample Rate 2 Ch. PWM
Temperature
Sample Rate Processor Converter Modulator
Short Circuits
SCLK Auto-Detect (DAP) (SRC)
PVDD Voltage
Noise Shaping Output Current
SDIN PLL
AMP_OUT_C
Click & Pop
Fault Notification AMP_OUT_D
Suppression

Internal Register/State Machine Interface

I²C Control Port

SCL SDA DR_SD PDN RST

Figure 27. TAS5733L Functional Block Diagram

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7.3 Audio Signal Processing Overview

DC Block and LR Mixer Equalizer Multi Band AGL Full Band AGL Master Volume
0x59 0x3B - 0x3C, 0x40

Biquad
AGL 1
0x5E Low Band 0x8 0x51
0x72, 0x73
Biquad
0x26 0x27 - 0x2F, 0x58 0x44 - 0x45, 0x48 0x07 - 0x57, 0x56
Input
L Biquad
Mixer L
10 Biquads
0x5A 0x3E - 0x3F, 0x43 Vol 1
Mixer L L

Biquad

AGL 2 AGL 4
0x5F
Master Volume,
High Band 0x9 0x52 Full Band
0x76, 0x77 Pre Scale,
Biquad Post Scale
0x30 0x31 - 0x39, 0x5D R
Input
R Biquad
Mixer R
10 Biquads 0x5B, 0x5C 0x42 - 0x41, 0x47 Vol 2
Mixer R

2 Biquads

AGL 3
0x60, 0x61 Mid Band
2 Biquads

Figure 28. TAS5733L Audio Process Flow

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7.4 Feature Description

7.4.1 Clock, Autodetection, and PLL
The TAS5733L device is an I²S slave device. The TAS5733L device accepts MCLK, SCLK, and LRCK. The
digital audio processor (DAP) supports all the sample rates and MCLK rates that are defined in the Clock Control
Register.
The TAS5733L device checks to verify that SCLK is a specific value of 32 fS, 48 fS, or 64 fS. The DAP only
supports a 1 × fS LRCK. The timing relationship of these clocks to SDIN is shown in subsequent sections. The
clock section uses MCLK or the internal oscillator clock (when MCLK is unstable, out of range, or absent) to
produce the internal clock (DCLK) running at 512 times the PWM switching frequency.
The DAP can autodetect and set the internal clock control logic to the appropriate settings for all supported clock
rates as defined in the Clock Control Register.
The TAS5733L device has robust clock error handling that uses the built-in trimmed oscillator clock to quickly
detect changes/errors. Once the system detects a clock change/error, the system mutes the audio (through a
single-step mute) and then forces PLL to limp using the internal oscillator as a reference clock. Once the clocks
are stable, the system autodetects the new rate and reverts to normal operation. During this process, the default
volume is restored in a single step (also called hard unmute). The ramp process can be programmed to ramp
back slowly (also called soft unmute) as defined in the Volume Configuration Register.

7.4.2 PWM Section

The TAS5733L DAP device uses noise-shaping and customized nonlinear correction algorithms to achieve high
power efficiency and high-performance digital audio reproduction. The DAP uses a fourth-order noise shaper to
increase dynamic range and SNR in the audio band. The PWM section accepts 24-bit PCM data from the DAP
and outputs two BTL PWM audio output channels.
The PWM section has individual-channel dc-blocking filters that can be enabled and disabled. The filter cutoff
frequency is less than 1 Hz.
The PWM section has an adjustable maximum modulation limit of 93.8% to 99.2%. For PVDD > 14.5 V the
modulation index must be limited to 96.1% for safe and reliable operation.

7.4.3 PWM Level Meter

The structure in Figure 29 shows the PWM level meter that can be used to study the power profile.
Post-DAP Processing
1–a

–1
Z 32-Bit Level
rms
Ch1 ABS a ADDR = 0x6B

2
1–a I C Registers
(PWM Level Meter)
–1
Z 32-Bit Level
rms
Ch2 ABS a ADDR = 0x6C

B0396-01

Figure 29. PWM Level Meter Structure

7.4.4 Automatic Gain Limiter (AGL)

The AGL scheme has three AGL blocks. One ganged AGL exists for the high-band left/right channels, the mid-
band left/right channels, and the low-band left/right channels.
The AGL input/output diagram is shown in Figure 30.

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Feature Description (continued)

Output Level (dB)

1:1 Transfer Function

Implemented Transfer Function

T
Input Level (dB)
M0091-04

Professional-quality dynamic range compression automatically adjusts volume to flatten volume level.
• Each AGL has adjustable threshold levels.
• Programmable attack and decay time constants
• Transparent compression: compressors can attack fast enough to avoid apparent clipping before engaging,
and decay times can be set slow enough to avoid pumping.

Figure 30. Automatic Gain Limiter

Alpha Filter Structure

S
a –1
w
Z

T = 9.23 format, all other AGL coefficients are 3.23 format

Figure 31. AGL Structure

Table 1. AGL Structure

α, ω T αa, ωa / αd, ωd
AGL 1 0x3B 0x40 0x3C
AGL 2 0x3E 0x43 0x3F
AGL 3 0x47 0x41 0x42
AGL 4 0x48 0x44 0x45

7.4.5 Fault Indication

ADR/FAULT is an input pin during power up. This pin can be programmed after RST to be an output by writing 1
to bit 0 of I²C register 0x05. In that mode, the ADR/FAULT pin has the definition shown in Table 2.
Any fault resulting in device shutdown is signaled by the ADR/FAULT pin going low (see Table 2). A latched
version of this pin is available on D1 of register 0x02. This bit can be reset only by an I²C write.

Table 2. ADR/FAULT Output States

ADR/FAULT DESCRIPTION
0 Overcurrent (OC) or undervoltage (UVP) error or overtemperature error (OTE) or overvoltage
error
1 No faults (normal operation)

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7.4.6 SSTIMER Pin Functionality

The SSTIMER pin uses a capacitor connected between this pin and ground to control the output duty cycle when
exiting all-channel shutdown. The capacitor on the SSTIMER pin is slowly charged through an internal current
source, and the charge time determines the rate at which the output transitions from a near-zero duty cycle to the
desired duty cycle. This allows for a smooth transition that minimizes audible pops and clicks. When the part is
shut down, the drivers are placed in the high-impedance state and transition slowly down through an internal 3-
kΩ resistor, similarly minimizing pops and clicks. The shutdown transition time is independent of the SSTIMER
pin capacitance. Larger capacitors increase the start-up time, while smaller capacitors decrease the start-up
time. The SSTIMER pin can be left floating for BD modulation.

7.4.7 Device Protection System

7.4.7.1 Overcurrent (OC) Protection With Current Limiting

The TAS5733L device has independent, fast-reacting current detectors on all high-side and low-side power-stage
FETs. The detector outputs are closely monitored to prevent the output current from increasing beyond the
overcurrent threshold defined in the Protection Characteristics table.
If the output current increases beyond the overcurrent threshold, the device shuts down and the outputs
transition to the off or high impedance (Hi-Z) state. The device returns to normal operation once the fault
condition (i.e., a short circuit on the output) is removed. Current-limiting and overcurrent protection are not
independent for half-bridges. That is, if the bridge-tied load between half-bridges A and B causes an overcurrent
fault, half-bridges A, B, C, and D shut down.

7.4.7.2 Overtemperature Protection

The TAS5733L device has an overtemperature-protection system. If the device junction temperature exceeds
150°C (nominal), the device enters thermal shutdown, where all half-bridge outputs enter the high-impedance
(Hi-Z) state, and ADR/FAULT asserts low if the device is configured to function as a fault output. The TAS5733L
device recovers automatically once the junction temperature of the device drops approximately 30°C.

7.4.7.3 Undervoltage Protection (UVP) and Power-On Reset (POR)

The UVP and POR circuits of the TAS5733L device fully protect the device in any power-up/down and brownout
situation. While powering up, the POR circuit resets the overload circuit (OLP) and ensures that all circuits are
fully operational when the PVDD and AVDD supply voltages reach 7.6 V and 2.7 V, respectively. Although PVDD
and AVDD are independently monitored. For PVDD, if the supply voltage drops below the UVP threshold, the
protection feature immediately sets all half-bridge outputs to the high-impedance (Hi-Z) state and asserts
ADR/FAULT low.

7.5 Device Functional Modes

The TAS5733L device is a digital input class-d amplifier with audio processing capabilities. The TAS5733L
device has numerous modes to configure and control the device.

7.5.1 Serial Audio Port Operating Modes

The serial audio port in the TAS5733L device supports industry-standard audio data formats, including I²S, Left-
justified(LJ) and Right-justified(RJ) formats. To select the data format that will be used with the device can
controlled by using the serial data interface registers 0x04. The default is 24bit, I²S mode. The timing diagrams
for the various serial audio port are shown in the Serial Interface Control and Timing section

7.5.2 Communication Port Operating Modes

The TAS5733L device is configured via an I²C communication port. The I²C communication protocol is detailed in
the 7.7 I²C Serial Control Port Requirements and Specifications section.

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Device Functional Modes (continued)

7.5.3 Speaker Amplifier Modes
The TAS5733L device can be configured as:
• Stereo Mode
• Mono Mode

7.5.3.1 Stereo Mode

Stereo mode is the most common option for the TAS5733L. TAS5733L can be connected in 2.0 mode to drive
stereo channels. Detailed application section regarding the stereo mode is discussed in the Stereo Bridge Tied
Load Application section.

7.5.3.2 Mono Mode

Mono mode is described as the operation where the two BTL outputs of amplifier are placed in parallel with one
another to provide increase in the output power capability. This mode is typically used to drive subwoofers, which
require more power to drive larger loudspeakers with high-amplitude, low-frequency energy. Detailed application
section regarding the mono mode is discussed in the Mono Parallel Bridge Tied Load Application section.

7.6 Programming
7.6.1 I²C Serial Control Interface
The TAS5733L device has a bidirectional I²C interface that is compatible with the Inter IC (I²C) bus protocol and
supports both 100-kHz and 400-kHz data transfer rates for single- and multiple-byte write and read operations.
This is a slave-only device that does not support a multimaster bus environment or wait-state insertion. The
control interface is used to program the registers of the device and to read device status.
The DAP supports the standard-mode I²C bus operation (100 kHz maximum) and the fast I²C bus operation
(400 kHz maximum). The DAP performs all I²C operations without I²C wait cycles.

7.6.1.1 General I²C Operation

The I²C bus employs two signals, SDA (data) and SCL (clock), to communicate between integrated circuits in a
system. Data is transferred on the bus serially, one bit at a time. The address and data can be transferred in byte
(8-bit) format, with the most-significant bit (MSB) transferred first. In addition, each byte transferred on the bus is
acknowledged by the receiving device with an acknowledge bit. Each transfer operation begins with the master
device driving a start condition on the bus and ends with the master device driving a stop condition on the bus.
The bus uses transitions on the data pin (SDA) while the clock is high to indicate start and stop conditions. A
high-to-low transition on SDA indicates a start and a low-to-high transition indicates a stop. Normal data-bit
transitions must occur within the low time of the clock period. These conditions are shown in Figure 32. The
master generates the 7-bit slave address and the read/write (R/W) bit to open communication with another
device and then waits for an acknowledge condition. The TAS5733L device holds SDA low during the
acknowledge clock period to indicate an acknowledgment. When this occurs, the master transmits the next byte
of the sequence. Each device is addressed by a unique 7-bit slave address plus R/W bit (1 byte). All compatible
devices share the same signals via a bidirectional bus using a wired-AND connection. An external pullup resistor
must be used for the SDA and SCL signals to set the high level for the bus.

R/ 8-Bit Register Data For 8-Bit Register Data For

SDA 7-Bit Slave Address A 8-Bit Register Address (N) A A A
W Address (N) Address (N)

7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0

SCL

Start Stop
T0035-01

Figure 32. Typical I²C Sequence

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Programming (continued)
No limit exists for the number of bytes that can be transmitted between start and stop conditions. When the last
word transfers, the master generates a stop condition to release the bus. A generic data transfer sequence is
shown in Figure 32.
The 7-bit address for the TAS5733L device is 0101 010 (0x54) or 0101 011 (0x56) as defined by ADR/FAULT
(external pulldown for 0x54 and pullup for 0x56).

7.6.1.2 I²C Slave Address

The ADR/FAULT is an input pin during power-up and after each toggle of RST, which is used to set the I²C sub-
address of the device. The ADR/FAULT can also operate as a fault output after power-up is complete and the
address has been latched in.
At power-up, and after each toggle of RST, the pin is read to determine its voltage level. If the pin is left floating,
an internal pull-up will set the I²C sub-address to 0x56. This will also be the case if an external resistor is used to
pull the pin up to AVDD. To set the sub-address to 0x54, an external resistor (specified in Typical Applications )
must be connected to the system ground.
As mentioned, the pin can also be reconfigured as an output driver via I²C for fault monitoring. Use System
Control Register 2 (0x05) to set ADR/FAULT pin to be used as a fault output during fault conditions.
I²C Device Address Change Procedure
1. Write to device address change enable register, 0xF8 with a value of 0xF9A5 A5A5.
2. Write to device register 0xF9 with a value of 0x0000 00XX, where XX is the new address.
3. Any writes after that should use the new device address XX.

7.6.1.3 Single- and Multiple-Byte Transfers

The serial control interface supports both single-byte and multiple-byte read/write operations for subaddresses
0x00 to 0x1F. However, for the subaddresses 0x20 to 0xFF, the serial control interface supports only multiple-
byte read/write operations (in multiples of 4 bytes).
During multiple-byte read operations, the DAP responds with data, a byte at a time, starting at the subaddress
assigned, as long as the master device continues to respond with acknowledges. If a particular subaddress does
not contain 32 bits, the unused bits are read as logic 0.
During multiple-byte write operations, the DAP compares the number of bytes transmitted to the number of bytes
that are required for each specific subaddress. For example, if a write command is received for a biquad
subaddress, the DAP must receive five 32-bit words. If fewer than five 32-bit data words have been received
when a stop command (or another start command) is received, the received data is discarded.
Supplying a subaddress for each subaddress transaction is referred to as random I²C addressing. The
TAS5733L device also supports sequential I²C addressing. For write transactions, if a subaddress is issued
followed by data for that subaddress and the 15 subaddresses that follow, a sequential I²C write transaction has
taken place, and the data for all 16 subaddresses is successfully received by the TAS5733L device. For I²C
sequential-write transactions, the subaddress then serves as the start address, and the amount of data
subsequently transmitted before a stop or start is transmitted determines how many subaddresses are written.
As was true for random addressing, sequential addressing requires that a complete set of data be transmitted. If
only a partial set of data is written to the last subaddress, the data for the last subaddress is discarded. However,
all other data written is accepted; only the incomplete data is discarded.

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Programming (continued)
7.6.1.4 Single-Byte Write
As shown in Figure 33, a single-byte data-write transfer begins with the master device transmitting a start
condition followed by the I²C device address and the read/write bit. The read/write bit determines the direction of
the data transfer. For a data-write transfer, the read/write bit is a 0. After receiving the correct I²C device address
and the read/write bit, the DAP responds with an acknowledge bit. Next, the master transmits the address byte or
bytes corresponding to the internal memory address being accessed. After receiving the address byte, the
TAS5733L device again responds with an acknowledge bit. Next, the master device transmits the data byte to be
written to the memory address being accessed. After receiving the data byte, the TAS5733L device again
responds with an acknowledge bit. Finally, the master device transmits a stop condition to complete the single-
byte data-write transfer.
Start
Condition Acknowledge Acknowledge Acknowledge

A6 A5 A4 A3 A2 A1 A0 R/W ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK

2 Stop
I C Device Address and Subaddress Data Byte
Read/Write Bit Condition

T0036-01

Figure 33. Single-Byte Write Transfer

7.6.1.5 Multiple-Byte Write

A multiple-byte data-write transfer is identical to a single-byte data-write transfer except that multiple data bytes
are transmitted by the master device to the DAP as shown in Figure 34. After receiving each data byte, the
TAS5733L device responds with an acknowledge bit.
Start
Condition Acknowledge Acknowledge Acknowledge Acknowledge Acknowledge

A6 A5 A1 A0 R/W ACK A7 A6 A5 A4 A3 A1 A0 ACK D7 D0 ACK D7 D0 ACK D7 D0 ACK

2 Stop
I C Device Address and Subaddress First Data Byte Other Data Bytes Last Data Byte
Read/Write Bit Condition

T0036-02

Figure 34. Multiple-Byte Write Transfer

7.6.1.6 Single-Byte Read

As shown in Figure 35, a single-byte data-read transfer begins with the master device transmitting a start
condition, followed by the I²C device address and the read/write bit. For the data read transfer, both a write
followed by a read are actually done. Initially, a write is done to transfer the address byte or bytes of the internal
memory address to be read. As a result, the read/write bit becomes a 0. After receiving the TAS5733L address
and the read/write bit, TAS5733L device responds with an acknowledge bit. In addition, after sending the internal
memory address byte or bytes, the master device transmits another start condition followed by the TAS5733L
address and the read/write bit again. This time, the read/write bit becomes a 1, indicating a read transfer. After
receiving the address and the read/write bit, the TAS5733L device again responds with an acknowledge bit.
Next, the TAS5733L device transmits the data byte from the memory address being read. After receiving the
data byte, the master device transmits a not-acknowledge followed by a stop condition to complete the single-
byte data-read transfer.

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Programming (continued)

Repeat Start
Condition
Start Not
Condition Acknowledge Acknowledge Acknowledge Acknowledge

A6 A5 A1 A0 R/W ACK A7 A6 A5 A4 A0 ACK A6 A5 A1 A0 R/W ACK D7 D6 D1 D0 ACK

2 2
I C Device Address and Subaddress I C Device Address and Data Byte Stop
Read/Write Bit Read/Write Bit Condition
T0036-03

Figure 35. Single-Byte Read Transfer

7.6.1.7 Multiple-Byte Read

A multiple-byte data-read transfer is identical to a single-byte data-read transfer except that multiple data bytes
are transmitted by the TAS5733L device to the master device as shown in Figure 36. Except for the last data
byte, the master device responds with an acknowledge bit after receiving each data byte.
Repeat Start
Condition
Start Not
Condition Acknowledge Acknowledge Acknowledge Acknowledge Acknowledge Acknowledge

A6 A0 R/W ACK A7 A6 A5 A0 ACK A6 A0 R/W ACK D7 D0 ACK D7 D0 ACK D7 D0 ACK

2 2
I C Device Address and Subaddress I C Device Address and First Data Byte Other Data Bytes Last Data Byte Stop
Read/Write Bit Read/Write Bit Condition
T0036-04

Figure 36. Multiple-Byte Read Transfer

7.6.2 Serial Interface Control and Timing

7.6.2.1 Serial Data Interface

Serial data is input on SDIN. The PWM outputs are derived from SDIN. The TAS5733L DAP accepts serial data
in 16-bit, 20-bit, or 24-bit left-justified, right-justified, and I²S serial data formats.

7.6.2.2 I²S Timing

I²S timing uses LRCK to define when the data being transmitted is for the left channel and when the data is for
the right channel. LRCK is low for the left channel and high for the right channel. A bit clock running at 32 × fS,
48 × fS, or 64 × fS is used to clock in the data. A delay of one bit clock exists from the time the LRCK signal
changes state to the first bit of data on the data lines. The data is written MSB-first and is valid on the rising edge
of bit clock. The DAP masks unused trailing data bit positions.

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Programming (continued)

2
2-Channel I S (Philips Format) Stereo Input

32 Clks 32 Clks

LRCLK (Note Reversed Phase) Left Channel Right Channel

SCLK SCLK

MSB LSB MSB LSB

24-Bit Mode

23 22 9 8 5 4 1 0 23 22 9 8 5 4 1 0

20-Bit Mode

19 18 5 4 1 0 19 18 5 4 1 0

16-Bit Mode

15 14 1 0 15 14 1 0

T0034-01

NOTE: All data presented in two's-complement form with MSB first.

Figure 37. I²S 64-fS Format

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Programming (continued)

2
2-Channel I S (Philips Format) Stereo Input/Output (24-Bit Transfer Word Size)

24 Clks 24 Clks

LRCLK Left Channel Right Channel

SCLK SCLK

MSB LSB MSB LSB

24-Bit Mode

23 22 17 16 9 8 5 4 3 2 1 0 23 22 17 16 9 8 5 4 3 2 1

20-Bit Mode

19 18 13 12 5 4 1 0 19 18 13 12 5 4 1 0

16-Bit Mode

15 14 9 8 1 0 15 14 9 8 1 0

T0092-01

NOTE: All data presented in two's-complement form with MSB first.

Figure 38. I²S 48-fS Format

2
2-Channel I S (Philips Format) Stereo Input

16 Clks 16 Clks

LRCLK Left Channel Right Channel

SCLK SCLK

MSB LSB MSB LSB

16-Bit Mode

15 14 13 12 11 10 9 8 5 4 3 2 1 0 15 14 13 12 11 10 9 8 5 4 3 2 1

T0266-01

NOTE: All data presented in two's-complement form with MSB first.

Figure 39. I²S 32-fS Format

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Programming (continued)
7.6.2.3 Left-Justified
Left-justified (LJ) timing uses LRCK to define when the data being transmitted is for the left channel and when
the data is for the right channel. LRCK is high for the left channel and low for the right channel. A bit clock
running at 32 × fS, 48 × fS, or 64 × fS is used to clock in the data. The first bit of data appears on the data lines at
the same time LRCK toggles. The data is written MSB-first and is valid on the rising edge of the bit clock. The
DAP masks unused trailing data bit positions.
2-Channel Left-Justified Stereo Input

32 Clks 32 Clks
LRCLK

Left Channel Right Channel

SCLK SCLK

MSB LSB MSB LSB

24-Bit Mode

23 22 9 8 5 4 1 0 23 22 9 8 5 4 1 0

20-Bit Mode

19 18 5 4 1 0 19 18 5 4 1 0

16-Bit Mode

15 14 1 0 15 14 1 0

T0034-02

NOTE: All data presented in two's-complement form with MSB first.

Figure 40. Left-Justified 64-fS Format

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Programming (continued)

2-Channel Left-Justified Stereo Input (24-Bit Transfer Word Size)

24 Clks 24 Clks
LRCLK

Left Channel Right Channel

SCLK SCLK

MSB LSB MSB LSB

24-Bit Mode

23 22 21 17 16 9 8 5 4 1 0 23 22 21 17 16 9 8 5 4 1 0

20-Bit Mode

19 18 17 13 12 5 4 1 0 19 18 17 13 12 5 4 1 0

16-Bit Mode

15 14 13 9 8 1 0 15 14 13 9 8 1 0

T0092-02

NOTE: All data presented in two's-complement form with MSB first.

Figure 41. Left-Justified 48-fS Format

2-Channel Left-Justified Stereo Input

16 Clks 16 Clks
LRCLK

Left Channel Right Channel

SCLK SCLK

MSB LSB MSB LSB

16-Bit Mode

15 14 13 12 11 10 9 8 5 4 3 2 1 0 15 14 13 12 11 10 9 8 5 4 3 2 1 0

T0266-02

NOTE: All data presented in two's-complement form with MSB first.

Figure 42. Left-Justified 32-fS Format

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Programming (continued)
7.6.2.4 Right-Justified
Right-justified (RJ) timing uses LRCK to define when the data being transmitted is for the left channel and when
the data is for the right channel. LRCK is high for the left channel and low for the right channel. A bit clock
running at 32 × fS, 48 × fS, or 64 × fS is used to clock in the data. The first bit of data appears on the data 8 bit-
clock periods (for 24-bit data) after LRCK toggles. In RJ mode, the LSB of data is always clocked by the last bit
clock before LRCK transitions. The data is written MSB-first and is valid on the rising edge of bit clock. The DAP
masks unused leading data bit positions.
2-Channel Right-Justified (Sony Format) Stereo Input

32 Clks 32 Clks
LRCLK

Left Channel Right Channel

SCLK SCLK

MSB LSB MSB LSB

24-Bit Mode

23 22 19 18 15 14 1 0 23 22 19 18 15 14 1 0

20-Bit Mode

19 18 15 14 1 0 19 18 15 14 1 0

16-Bit Mode

15 14 1 0 15 14 1 0

T0034-03

All data presented in two's-complement form with MSB first.

Figure 43. Right-Justified 64-fS Format

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Programming (continued)

2-Channel Right-Justified Stereo Input (24-Bit Transfer Word Size)

24 Clks 24 Clks
LRCLK

Left Channel Right Channel

SCLK SCLK

MSB LSB MSB LSB

24-Bit Mode

23 22 19 18 15 14 6 5 2 1 0 23 22 19 18 15 14 6 5 2 1 0

20-Bit Mode

19 18 15 14 6 5 2 1 0 19 18 15 14 6 5 2 1 0

16-Bit Mode

15 14 6 5 2 1 0 15 14 6 5 2 1 0

T0092-03

All data presented in two's-complement form with MSB first.

Figure 44. Right-Justified 48-fS Format

All data presented in two's-complement form with MSB first.

Figure 45. Right-Justified 32-fS Format

7.6.3 26-Bit 3.23 Number Format

All mixer gain coefficients are 26-bit coefficients using a 3.23 number format. Numbers formatted as 3.23
numbers mean that the binary point has 3 bits to the left and 23 bits to the right. This is shown in Figure 46.

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Programming (continued)

–23
2 Bit

–5
2 Bit

–1
2 Bit
0
2 Bit
1
2 Bit
Sign Bit

S_xx.xxxx_xxxx_xxxx_xxxx_xxxx_xxx
M0125-01

Figure 46. 3.23 Format

The decimal value of a 3.23 format number can be found by following the weighting shown in Figure 46. If the
most significant bit is logic 0, the number is a positive number, and the weighting shown yields the correct
number. If the most significant bit is a logic 1, then the number is a negative number. In the case every bit must
be inverted, a 1 added to the result, and then the weighting shown in Figure 47 applies to obtain the magnitude
of the negative number.
1 0 –1 –4 –23
2 Bit 2 Bit 2 Bit 2 Bit 2 Bit

1 0 –1 –4 –23
(1 or 0) ´ 2 + (1 or 0) ´ 2 + (1 or 0) ´ 2 + ....... (1 or 0) ´ 2 + ....... (1 or 0) ´ 2
M0126-01

Figure 47. Conversion Weighting Factors—3.23 Format to Floating Point

Gain coefficients, entered via the I²C bus, must be entered as 32-bit binary numbers. The format of the 32-bit
number (4-byte or 8-digit hexadecimal number) is shown in Figure 48.
Sign Fraction
Bit Digit 6

Fraction Fraction Fraction Fraction Fraction

Integer Digit 1 Digit 2 Digit 3 Digit 4 Digit 5
Digit 1

u u u u u u S x x. x x x x x x x x x x x x x x x x x x x x x x x 0

Coefficient Coefficient Coefficient Coefficient Coefficient Coefficient Coefficient Coefficient

Digit 8 Digit 7 Digit 6 Digit 5 Digit 4 Digit 3 Digit 2 Digit 1

u = unused or don’t care bits

Digit = hexadecimal digit
M0127-01

Figure 48. Alignment of 3.23 Coefficient in 32-Bit I²C Word

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Table 3. Sample Calculation for 3.23 Format

db Linear Decimal Hex (3.23 Format)
0 1 8,388,608 80 0000
5 1.77 14,917,288 00E3 9EA8
–5 0.56 4,717,260 0047 FACC
X L = 10(X / 20) D = 8,388,608 × L H = dec2hex (D, 8)

Table 4. Sample Calculation for 9.17 Format

db Linear Decimal Hex (9.17 Format)
0 1 131,072 2 0000
5 1.77 231,997 3 8A3D
–5 0.56 73,400 1 1EB8
(X / 20)
X L = 10 D = 131,072 × L H = dec2hex (D, 8)

7.7 Register Maps

7.7.1 Register Summary

NO. OF DEFAULT
SUBADDRESS REGISTER NAME CONTENTS
BYTES VALUE
A u indicates unused bits.
0x00 Clock control register 1 Description shown in subsequent section 0x6C
0x01 Device ID register 1 Description shown in subsequent section 0x40
0x02 Error status register 1 Description shown in subsequent section 0x00
0x03 System control register 1 1 Description shown in subsequent section 0xA0
0x04 Serial data interface register 1 Description shown in subsequent section 0x05
0x05 System control register 2 1 Description shown in subsequent section 0x40
0x06 Soft mute register 1 Description shown in subsequent section 0x00
0x07 Master volume 2 Description shown in subsequent section 0x03FF (mute)
0x08 Channel 1 vol 2 Description shown in subsequent section 0x00C0 (0 dB)
0x09 Channel 2 vol 2 Description shown in subsequent section 0x00C0 (0 dB)
0x0A Channel 3 vol 2 Description shown in subsequent section 0x00C0 (0 dB)
0x0B Reserved 2 Reserved (1) 0x03FF
(1)
0x0C 2 Reserved 0x00C0
0x0D 1 Reserved (1) 0xC0
0x0E Volume configuration register 1 Description shown in subsequent section 0xF0
0x0F Reserved 1 Reserved (1) 0x97
0x10 Modulation limit register 1 Description shown in subsequent section 0x01
0x11 IC delay channel 1 1 Description shown in subsequent section 0xAC
0x12 IC delay channel 2 1 Description shown in subsequent section 0x54
0x13 IC delay channel 3 1 Description shown in subsequent section 0xAC
0x14 IC delay channel 4 1 Description shown in subsequent section 0x54
0x15 Reserved 1 Reserved (1) 0xAC
0x16 0x54
0x17 0x00
0x18 PWM Start 0x0F
0x19 PWM Shutdown Group Register 1 Description shown in subsequent section 0x30
0x1A Start/stop period register 1 Description shown in subsequent section 0x68
0x1B Oscillator trim register 1 Description shown in subsequent section 0x82

(1) Do not access reserved registers.

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Register Maps (continued)

NO. OF DEFAULT
SUBADDRESS REGISTER NAME CONTENTS
BYTES VALUE
0x1C BKND_ERR register 1 Description shown in subsequent section 0x57
(1)
0x1D–0x1F 1 Reserved 0x00
0x20 Input MUX register 4 Description shown in subsequent section 0x0001 7772
0x21 Reserved 4 Reserved (1) 0x0000 4303
0x22 4 0x0000 0000
0x23 4 0x0000 0000
0x24 4 0x0000 0000
0x25 PWM MUX register 4 Description shown in subsequent section 0x0102 1345
0x26 ch1_bq[0] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x27 ch1_bq[1] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x28 ch1_bq[2] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x29 ch1_bq[3] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x2A ch1_bq[4] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x2B ch1_bq[5] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x2C ch1_bq[6] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000

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Register Maps (continued)

NO. OF DEFAULT
SUBADDRESS REGISTER NAME CONTENTS
BYTES VALUE
0x2D ch1_bq[7] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x2E ch1_bq[8] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x2F ch1_bq[9] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x30 ch2_bq[0] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x31 ch2_bq[1] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x32 ch2_bq[2] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x33 ch2_bq[3] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x34 ch2_bq[4] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x35 ch2_bq[5] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000

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Register Maps (continued)

NO. OF DEFAULT
SUBADDRESS REGISTER NAME CONTENTS
BYTES VALUE
0x36 ch2_bq[6] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x37 ch2_bq[7] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x38 ch2_bq[8] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x39 ch2_bq[9] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x3A Reserved 4 Reserved (1) 0x0080 0000 0000
0000
0x3B AGL1 softening filter alpha 8 u[31:26], ae[25:0] 0x0008 0000
AGL1 softening filter omega u[31:26], oe[25:0] 0x0078 0000
0x3C AGL1 attack rate 8 Description shown in subsequent section 0x0000 0100
AGL1 release rate Description shown in subsequent section 0xFFFF FF00

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Register Maps (continued)

NO. OF DEFAULT
SUBADDRESS REGISTER NAME CONTENTS
BYTES VALUE
0x3D 8 Reserved (1)
0x3E AGL2 softening filter alpha 8 u[31:26], ae[25:0] 0x0008 0000
AGL2 softening filter omega u[31:26], oe[25:0] 0x0078 0000
0x3F AGL2 attack rate 8 u[31:26], at[25:0] 0x0008 0000
AGL2 release rate u[31:26], rt[25:0] 0xFFF8 0000
0x40 AGL1 attack threshold 4 T1[31:0] (9.23 format) 0x0800 0000
0x41 AGL3 attack threshold 4 T1[31:0] (9.23 format) 0x0074 0000
0x42 AGL3 attack rate 8 Description shown in subsequent section 0x0008 0000
AGL3 release rate Description shown in subsequent section 0xFFF8 0000
0x43 AGL2 attack threshold 4 T2[31:0] (9.23 format) 0x0074 0000
0x44 AGL4 attack threshold 4 T1[31:0] (9.23 format) 0x0074 0000
0x45 AGL4 attack rate 8 0x0008 0000
AGL4 release rate 0xFFF8 0000
0x46 AGL control 4 Description shown in subsequent section 0x0002 0000
0x47 AGL3 softening filter alpha 8 u[31:26], ae[25:0] 0x0008 0000
AGL3 softening filter omega u[31:26], oe[25:0] 0x0078 0000
0x48 AGL4 softening filter alpha 8 u[31:26], ae[25:0] 0x0008 0000
AGL4 softening filter omega u[31:26], oe[25:0] 0x0078 0000
(1)
0x49 Reserved 4 Reserved
0x4A 4 0x1212 1010 E1FF
FFFF F95E 1212
0x4B 4 0x0000 296E
0x4C 4 0x0000 5395
0x4D 4 0x0000 0000
0x4E 4 0x0000 0000
0x4F PWM switching rate control 4 u[31:4], src[3:0] 0x0000 0008
0x50 Bank switch control 4 Description shown in subsequent section 0x0F70 8000
0x51 Ch 1 output mixer 12 Ch 1 output mix1[2] 0x0080 0000
Ch 1 output mix1[1] 0x0000 0000
Ch 1 output mix1[0] 0x0000 0000
0x52 Ch 2 output mixer 12 Ch 2 output mix2[2] 0x0080 0000
Ch 2 output mix2[1] 0x0000 0000
Ch 2 output mix2[0] 0x0000 0000
0x53 16 Reserved (1) 0x0080 0000 0000
0000 0000 0000
0x54 16 Reserved (1) 0x0080 0000 0000
0000 0000 0000
0x56 Output post-scale 4 u[31:26], post[25:0] 0x0080 0000
0x57 Output pre-scale 4 u[31:26], pre[25:0] (9.17 format) 0x0002 0000
0x58 ch1_bq[10] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000

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Register Maps (continued)

NO. OF DEFAULT
SUBADDRESS REGISTER NAME CONTENTS
BYTES VALUE
0x59 ch1_cross_bq[0] 20 u[31:26], b0[25:0] 0x0080 0000
ch1_cross_bq[1] 0x0000 0000
ch1_cross_bq[2] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x5A ch1_cross_bq[1] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x5B ch1_cross_bq[2] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x5C ch1_cross_bq[3] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x5D ch2_bq[10] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x5E ch2_cross_bq[0] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x5F ch2_cross_bq[1] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x60 ch2_cross_bq[2] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x61 ch2_cross_bq[3] 20 u[31:26], b0[25:0] 0x0080 0000
u[31:26], b1[25:0] 0x0000 0000
u[31:26], b2[25:0] 0x0000 0000
u[31:26], a1[25:0] 0x0000 0000
u[31:26], a2[25:0] 0x0000 0000
0x62 IDF post scale 4 Description shown in subsequent section 0x0000 0080

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Register Maps (continued)

NO. OF DEFAULT
SUBADDRESS REGISTER NAME CONTENTS
BYTES VALUE
0x63–0x69 Reserved 4 Reserved (1) 0x0000 0000
0x6A 4 0x0000 8312
0x6B Left channel PWM level meter 4 Data[31:0] 0x007F 7CED
0x6C Right channel PWM level meter 4 Data[31:0] 0x0000 0000
0x6D Reserved 8 Reserved (1) 0x0000 0000 0000
0000
0x6E–0x6F 4 0x0000 0000
0x70 ch1 inline mixer 4 u[31:26], in_mix1[25:0] 0x0080 0000
0x71 inline_AGL_en_mixer_ch1 4 u[31:26], in_mixagl_1[25:0] 0x0000 0000
0x72 ch1 right_channel mixer 4 u[31:26], right_mix1[25:0] 0x0000 0000
0x73 ch1 left_channel_mixer 4 u[31:26], left_mix_1[25:0] 0x0080 0000
0x74 ch2 inline mixer 4 u[31:26], in_mix2[25:0] 0x0080 0000
0x75 inline_AGL_en_mixer_ch2 4 u[31:26], in_mixagl_2[25:0] 0x0000 0000
0x76 ch2 left_chanel mixer 4 u[31:26], left_mix1[25:0] 0x0000 0000
0x77 ch2 right_channel_mixer 4 u[31:26], right_mix_1[25:0] 0x0080 0000
(1)
0x78–0xF7 Reserved 0x0000 0000
0xF8 Update device address key 4 Dev Id Update Key[31:0] (Key = 0x0000 0054
0xF9A5A5A5)
0xF9 Update device address 4 u[31:8],New Dev Id[7:0] (New Dev Id = 0x54 0x0000 0054
for TAS5733L)
0xFA–0xFF 4 Reserved (1) 0x0000 0000

All DAP coefficients are 3.23 format unless specified otherwise.

Registers 0x3B through 0x46 should be altered only during the initialization phase.

7.7.2 Detailed Register Descriptions

7.7.2.1 Clock Control Register (0x00)

The clocks and data rates are automatically determined by the TAS5733L. The clock control register contains the
autodetected clock status. Bits D7–D5 reflect the sample rate. Bits D4–D2 reflect the MCLK frequency.

Table 5. Clock Control Register (0x00)

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 0 0 – – – – – fS = 32-kHz sample rate
0 0 1 – – – – – Reserved
0 1 0 – – – – – Reserved
0 1 1 – – – – – fS = 44.1/48-kHz sample rate (1)
1 0 0 – – – – – fS = 16-kHz sample rate
1 0 1 – – – – – fS = 22.05/24-kHz sample rate
1 1 0 – – – – – fS = 8-kHz sample rate
1 1 1 – – – – – fS = 11.025/12-kHz sample rate
– – – 0 0 0 – – MCLK frequency = 64 × fS (2)
– – – 0 0 1 1 – MCLK frequency = 128 × fS (2)
0 0 0 0 1 0 0 0 MCLK frequency = 192 × fS (3)
– – – 0 1 1 – – MCLK frequency = 256 × fS (1) (4)

(1) Default values are in bold.

(2) Only available for 44.1-kHz and 48-kHz rates
(3) Rate only available for 32/44.1/48-KHz sample rates
(4) Not available at 8 kHz
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Table 5. Clock Control Register (0x00) (continued)

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
– – – 1 0 0 – – MCLK frequency = 384 × fS
– – – 1 0 1 – – MCLK frequency = 512 × fS
– – – 1 1 0 – – Reserved
– – – 1 1 1 – – Reserved
– – – – – – 0 – Reserved
– – – – – – – 0 Reserved

7.7.2.2 Device ID Register (0x01)

The device ID register contains the ID code for the firmware revision.

Table 6. General Status Register (0x01)

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
(1)
0 0 0 0 0 0 0 0 Identification code

(1) Default values are in bold.

7.7.2.3 Error Status Register (0x02)

The error bits are sticky and are not cleared by the hardware. This means that the software must clear the
register (write zeroes) and then read them to determine if they are persistent errors.
Error definitions:
• MCLK error: MCLK frequency is changing. The number of MCLKs per LRCLK is changing.
• SCLK error: The number of SCLKs per LRCLK is changing.
• LRCLK error: LRCLK frequency is changing.
• Frame slip: LRCLK phase is drifting with respect to internal frame sync.

Table 7. Error Status Register (0x02)

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
1 - – – – – – – MCLK error
– 1 – – – – – – PLL autolock error
– – 1 – – – – – SCLK error
– – – 1 – – – – LRCLK error
– – – – 1 – – – Frame slip
– – – – – 1 – – Clip indicator
– – – – – – 1 – Overcurrent, overtemperature, overvoltage, or undervoltage error
0 0 0 0 0 0 0 0 Reserved
(1)
0 0 0 0 0 0 0 0 No errors

(1) Default values are in bold.

7.7.2.4 System Control Register 1 (0x03)

System control register 1 has several functions:

Bit D7: If 0, the dc-blocking filter for each channel is disabled.

If 1, the dc-blocking filter (–3 dB cutoff <1 Hz) for each channel is enabled.
Bit D5: If 0, use soft unmute on recovery from a clock error. This is a slow recovery. Unmute takes the
same time as the volume ramp defined in register 0x0E.
If 1, use hard unmute on recovery from clock error. This is a fast recovery, a single-step volume
ramp.
Bits D1–D0: Select de-emphasis

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Table 8. System Control Register 1 (0x03)

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 – – – – – – – PWM high-pass (dc blocking) disabled
(1)
1 – – – – – – – PWM high-pass (dc blocking) enabled
(1)
– 0 – – – – – – Reserved
(1)
– – 1 – – – – – Soft unmute on recovery from clock error
– – 1 – – – – – Hard unmute on recovery from clock error
(1)
– – – 0 – – – – Reserved
(1)
– – – – 0 – – – Reserved
(1)
– – – – – 0 – – Reserved
(1)
– – – – – – 0 0 No de-emphasis
– – – – – – 0 1 De-emphasis for fS = 32 kHz
– – – – – – 1 0 De-emphasis for fS = 44.1 kHz
– – – – – – 1 1 De-emphasis for fS = 48 kHz

(1) Default values are in bold.

7.7.2.5 Serial Data Interface Register (0x04)

As shown in Table 9, the TAS5733L supports nine serial data modes. The default is 24-bit, I2S mode.

Table 9. Serial Data Interface Control Register (0x04) Format

RECEIVE SERIAL DATA WORD
D7–D4 D3 D2 D1 D0
INTERFACE FORMAT LENGTH
Right-justified 16 0000 0 0 0 0
Right-justified 20 0000 0 0 0 1
Right-justified 24 0000 0 0 1 0
I2S 16 000 0 0 1 1
I2S 20 0000 0 1 0 0
2 (1)
I S 24 0000 0 1 0 1
Left-justified 16 0000 0 1 1 0
Left-justified 20 0000 0 1 1 1
Left-justified 24 0000 1 0 0 0
Reserved 0000 1 0 0 1
Reserved 0000 1 0 1 0
Reserved 0000 1 0 1 1
Reserved 0000 1 1 0 0
Reserved 0000 1 1 0 1
Reserved 0000 1 1 1 0
Reserved 0000 1 1 1 1

(1) Default values are in bold.

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7.7.2.6 System Control Register 2 (0x05)

When bit D6 is set low, the system exits all-channel shutdown and starts playing audio; otherwise, the outputs
are shut down (hard mute).

Table 10. System Control Register 2 (0x05)

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
(1)
0 – – – – – – – Mid-Z ramp disabled
1 – – – – – – – Mid-Z ramp enabled
– 0 – – – – – – Exit all-channel shutdown (normal operation)
(1)
– 1 – – – – – – Enter all-channel shutdown (hard mute)
(1)
– – 0 0 – – – – Reserved
(1)
0 – – – Ternary modulation disabled
– – – – 1 – – – Ternary modulation enabled
(1)
– – – – – 0 – – Reserved
– – – – – – 0 – configured as input
– – – – – – 1 – configured configured as output to function as fault output pin.
(1)
– – – – – – – 0 Reserved

(1) Default values are in bold.

Ternary modulation is disabled by default. To enable ternary modulation, the following writes are required before
bringing the system out of shutdown:
1. Set bit D3 of register 0x05 to 1.
2. Write the following ICD settings:
(a) 0x11= 80
(b) 0x12= 7C
(c) 0x13= 80
(d) 0x14 =7C
3. Set the input mux register as follows:
(a) 0x20 = 00 89 77 72

7.7.2.7 Soft Mute Register (0x06)

Writing a 1 to any of the following bits sets the output of the respective channel to 50% duty cycle (soft mute).

Table 11. Soft Mute Register (0x06)

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
(1)
0 0 0 0 0 – – – Reserved
– – – – – 1 – – Soft mute channel 3
(1)
– – – – – 0 – – Soft unmute channel 3
– – – – – – 1 – Soft mute channel 2
(1)
– – – – – – 0 – Soft unmute channel 2
– – – – – – – 1 Soft mute channel 1
(1)
– – – – – – – 0 Soft unmute channel 1

(1) Default values are in bold.

7.7.2.8 Volume Registers (0x07, 0x08, 0x09)

The volume register 0x07, 0x08, and 0x09 correspond to master volume, channel 1 volume, and channel 2
volume, respectively. Step size is 0.125 dB and volume registers are 2 bytes.

Master volume – 0x07 (default is mute, 0x03FF)

Channel-1 volume – 0x08 (default is 0 dB, 0x00C0)

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Channel-2 volume – 0x09 (default is 0 dB, 0x00C0)

Table 12. Master Volume

Table
Value Level
0x0000 24.000
0x0001 23.875
... (0.125 dB steps)
0x03FE –103.750
0x03FF Mute

7.7.2.9 Volume Configuration Register (0x0E)

Bits Volume slew rate (used to control volume change and MUTE ramp rates). These bits control the
D2–D0: number of steps in a volume ramp. Volume steps occur at a rate that depends on the sample rate of
the I2S data as follows:
Sample rate (kHz) Approximate ramp rate
8/16/32 125 μs/step
11.025/22.05/44.1 90.7 μs/step
12/24/48 83.3 μs/step

In two-band AGL, register 0x0A should be set to 0x30 and register 0x0E bits 6 and 5 should be set to 1.

Table 13. Volume Configuration Register (0x0E)

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
(1)
1 – – – – – – – Reserved
– 0 – – – – – – AGL2 volume 1 (ch4) from I2C register 0x08
– 1 – – – – – – AGL2 volume 1 (ch4) from I2C register 0x0A (1)
– – 0 – – – – – AGL2 volume 2 (ch3) from I2C register 0x09
– – 1 – – – – – AGL2 volume 2 (ch3) from I2C register 0x0A (1)
(1)
– – – 1 0 – – – Reserved
(1)
– – – – – 0 0 0 Volume slew 512 steps (43 ms volume ramp time at 48 kHz)
– – – – – 0 0 1 Volume slew 1024 steps (85-ms volume ramp time at 48 kHz)
– – – – – 0 1 0 Volume slew 2048 steps (171-ms volume ramp time at 48 kHz)
– – – – – 0 1 1 Volume slew 256 steps (21-ms volume ramp time at 48 kHz)
– – – – – 1 X X Reserved

(1) Default values are in bold.

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7.7.2.10 Modulation Limit Register (0x10)

Table 14. Modulation Limit Register (0x10)

D7 D6 D5 D4 D3 D2 D1 D0 MODULATION LIMIT
0 0 0 0 0 – – – Reserved
– – – – – 0 0 0 Reserved
– – – – – 0 0 1 98.4% (1)
– – – – – 0 1 0 97.7%
– – – – – 0 1 1 96.9%
– – – – – 1 0 0 96.1%
– – – – – 1 0 1 95.3%
– – – – – 1 1 0 94.5%
– – – – – 1 1 1 93.8%

(1) Default values are in bold.

7.7.2.11 Interchannel Delay Registers (0x11, 0x12, 0x13, and 0x14)

Internal PWM channels 1, 2, 1, and 2 are mapped into registers 0x11, 0x12, 0x13, and 0x14.

Table 15. Channel Interchannel Delay Register Format

BITS DEFINITION D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 0 0 0 0 0 – – Minimum absolute delay, 0 DCLK cycles
0 1 1 1 1 1 – – Maximum positive delay, 31 × 4 DCLK cycles
1 0 0 0 0 0 – – Maximum negative delay, –32 × 4 DCLK cycles
0 0 Reserved

SUBADDRESS D7 D6 D5 D4 D3 D2 D1 D0 Delay = (value) × 4 DCLKs

(1)
0x11 1 0 1 0 1 1 – – Default value for channel 1
(1)
0x12 0 1 0 1 0 1 – – Default value for channel 2
(1)
0x13 1 0 1 0 1 1 – – Default value for channel 1
(1)
0x14 0 1 0 1 0 1 – – Default value for channel 2

(1) Default values are in bold.

ICD settings have high impact on audio performance (e.g., dynamic range, THD, crosstalk, etc.) Therefore,
appropriate ICD settings must be used. By default, the device has ICD settings for the AD mode. If used in BD
mode, then update these registers before coming out of all-channel shutdown.

MODE AD MODE BD MODE

0x11 AC B8
0x12 54 60
0x13 AC A0
0x14 54 48

7.7.2.12 PWM Shutdown Group Register (0x19)

Settings of this register determine which PWM channels are active. The functionality of this register is tied to the
state of bit D5 in the system control register.
This register defines which channels belong to the shutdown group. If a 1 is set in the shutdown group register,
that particular channel is not started following an exit out of all-channel shutdown command (if bit D5 is set to 0
in system control register 2, 0x05).

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Table 16. PWM Shutdown Group Register (0x19)

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
(1)
0 – – – – – – – Reserved
(1)
– 0 – – – – – – Reserved
(1)
– – 1 – – – – – Reserved
(1)
– – – 1 – – – – Reserved
(1)
– – – – 0 – – – PWM channel 4 does not belong to shutdown group.
– – – – 1 – – – PWM channel 4 belongs to shutdown group.
(1)
– – – – – 0 – – PWM channel 3 does not belong to shutdown group.
– – – – – 1 – – PWM channel 3 belongs to shutdown group.
(1)
– – – – – – 0 – PWM channel 2 does not belong to shutdown group.
– – – – – – 1 – PWM channel 2 belongs to shutdown group.
(1)
– – – – – – – 0 PWM channel 1 does not belong to shutdown group.
– – – – – – – 1 PWM channel 1 belongs to shutdown group.

(1) Default values are in bold.

7.7.2.13 Start/Stop Period Register (0x1A)

This register is used to control the soft-start and soft-stop period following an enter/exit all-channel shutdown
command or change in the PDN state. This helps reduce pops and clicks at start-up and shutdown. The times
are only approximate and vary depending on device activity level and I2S clock stability.

Table 17. Start/Stop Period Register (0x1A)

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
(1)
0 – – – – – – – SSTIMER enabled
1 – – – – – – – SSTIMER disabled
(1)
– 1 1 – – – – – Reserved
– – – 0 0 – – – No 50% duty cycle start/stop period
– – – 0 1 0 0 0 16.5-ms 50% duty cycle start/stop period
– – – 0 1 0 0 1 23.9-ms 50% duty cycle start/stop period
– – – 0 1 0 1 0 31.4-ms 50% duty cycle start/stop period
– – – 0 1 0 1 1 40.4-ms 50% duty cycle start/stop period
– – – 0 1 1 0 0 53.9-ms 50% duty cycle start/stop period
– – – 0 1 1 0 1 70.3-ms 50% duty cycle start/stop period
– – – 0 1 1 1 0 94.2-ms 50% duty cycle start/stop period
– – – 0 1 1 1 1 125.7-ms 50% duty cycle start/stop period (1)
– – – 1 0 0 0 0 164.6-ms 50% duty cycle start/stop period
– – – 1 0 0 0 1 239.4-ms 50% duty cycle start/stop period
– – – 1 0 0 1 0 314.2-ms 50% duty cycle start/stop period
– – – 1 0 0 1 1 403.9-ms 50% duty cycle start/stop period
– – – 1 0 1 0 0 538.6-ms 50% duty cycle start/stop period
– – – 1 0 1 0 1 703.1-ms 50% duty cycle start/stop period
– – – 1 0 1 1 0 942.5-ms 50% duty cycle start/stop period
– – – 1 0 1 1 1 1256.6-ms 50% duty cycle start/stop period
– – – 1 1 0 0 0 1728.1-ms 50% duty cycle start/stop period
– – – 1 1 0 0 1 2513.6-ms 50% duty cycle start/stop period
– – – 1 1 0 1 0 3299.1-ms 50% duty cycle start/stop period
– – – 1 1 0 1 1 4241.7-ms 50% duty cycle start/stop period
– – – 1 1 1 0 0 5655.6-ms 50% duty cycle start/stop period
– – – 1 1 1 0 1 7383.7-ms 50% duty cycle start/stop period

(1) Default values are in bold.

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Table 17. Start/Stop Period Register (0x1A) (continued)

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
– – – 1 1 1 1 0 9897.3-ms 50% duty cycle start/stop period
– – – 1 1 1 1 1 13,196.4-ms 50% duty cycle start/stop period

7.7.2.14 Oscillator Trim Register (0x1B)

The TAS5733L PWM processor contains an internal oscillator to support autodetect of I2S clock rates. This
reduces system cost because an external reference is not required. A reference resistor must be connected
between pin 16 and 17, as shown in Table 18.
Writing 0x00 to register 0x1B enables the trim that was programmed at the factory.
Note that trim must always be run following reset of the device.

Table 18. Oscillator Trim Register (0x1B)

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
(1)
1 – – – – – – – Reserved
(1)
– 0 – – – – – – Oscillator trim not done (read-only)
– 1 – – – – – – Oscillator trim done (read only)
(1)
– – 0 0 0 0 – – Reserved
– – – – – – 0 – Select factory trim (Write a 0 to select factory trim; default is 1.)
(1)
– – – – – – 1 – Factory trim disabled
(1)
– – – – – – – 0 Reserved

(1) Default values are in bold.

7.7.2.15 BKND_ERR Register (0x1C)

When a back-end error signal is received from the internal power stage, the power stage is reset, stopping all
PWM activity. Subsequently, the modulator waits approximately for the time listed in Table 19 before attempting
to re-start the power stage.

Table 19. BKND_ERR Register (0x1C) (1)

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 1 0 1 x x x X Reserved
– – – – 0 0 1 0 Set back-end reset period to 299 ms (2)
– – – – 0 0 1 1 Set back-end reset period to 449 ms
– – – – 0 1 0 0 Set back-end reset period to 598 ms
– – – – 0 1 0 1 Set back-end reset period to 748 ms
– – – – 0 1 1 0 Set back-end reset period to 898 ms
– – – – 0 1 1 1 Set back-end reset period to 1047 ms
– – – – 1 0 0 0 Set back-end reset period to 1197 ms
– – – – 1 0 0 1 Set back-end reset period to 1346 ms
– – – – 1 0 1 X Set back-end reset period to 1496 ms
– – – – 1 1 1 X Set back-end reset period to 1496 ms

(1) This register can be written only with a non-reserved value. The RSTz pin must be toggled between subsequent writes to this register.
(2) Default values are in bold.

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7.7.2.16 Input Multiplexer Register (0x20)

This register controls the modulation scheme (AD or BD mode) as well as the routing of I2S audio to the internal
channels.

Table 20. Input Multiplexer Register (0x20)

D31 D30 D29 D28 D27 D26 D25 D24 FUNCTION
(1)
0 0 0 0 0 0 0 0 Reserved

D23 D22 D21 D20 D19 D18 D17 D16 FUNCTION

(1)
0 – – – – – – – Channel-1 AD mode
1 – – – – – – – Channel-1 BD mode
(1)
– 0 0 0 – – – – SDIN-L to channel 1
– 0 0 1 – – – – SDIN-R to channel 1
– 0 1 0 – – – – Reserved
– 0 1 1 – – – – Reserved
– 1 0 0 – – – – Reserved
– 1 0 1 – – – – Reserved
– 1 1 0 – – – – Ground (0) to channel 1
– 1 1 1 – – – – Reserved
(1)
– – – – 0 – – – Channel 2 AD mode
– – – – 1 – – – Channel 2 BD mode
– – – – – 0 0 0 SDIN-L to channel 2
(1)
– – – – – 0 0 1 SDIN-R to channel 2
– – – – – 0 1 0 Reserved
– – – – – 0 1 1 Reserved
– – – – – 1 0 0 Reserved
– – – – – 1 0 1 Reserved
– – – – – 1 1 0 Ground (0) to channel 2
– – – – – 1 1 1 Reserved

D15 D14 D13 D12 D11 D10 D9 D8 FUNCTION

(1)
0 1 1 1 0 1 1 1 Reserved

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
(1)
0 1 1 1 0 0 1 0 Reserved

(1) Default values are in bold.

7.7.2.17 PWM Output MUX Register (0x25)

This DAP output mux selects which internal PWM channel is output to the external pins. Any channel can be
output to any external output pin.

Bits D21–D20: Selects which PWM channel is output to AMP_OUT_A

Bits D17–D16: Selects which PWM channel is output to AMP_OUT_B
Bits D13–D12: Selects which PWM channel is output to AMP_OUT_C
Bits D09–D08: Selects which PWM channel is output to AMP_OUT_D

Note that channels are encoded so that channel 1 = 0x00, channel 2 = 0x01, …, channel 4 = 0x03.

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Table 21. PWM Output MUX Register (0x25)

D31 D30 D29 D28 D27 D26 D25 D24 FUNCTION
(1)
0 0 0 0 0 0 0 1 Reserved

D23 D22 D21 D20 D19 D18 D17 D16 FUNCTION

(1)
0 0 – – – – – – Reserved
(1)
– – 0 0 – – – – Multiplex channel 1 to AMP_OUT_A
– – 0 1 – – – – Multiplex channel 2 to AMP_OUT_A
– – 1 0 – – – – Multiplex channel 1 to AMP_OUT_A
– – 1 1 – – – – Multiplex channel 2 to AMP_OUT_A
(1)
– – – – 0 0 – – Reserved
– – – – – – 0 0 Multiplex channel 1 to AMP_OUT_B
– – – – – – 0 1 Multiplex channel 2 to AMP_OUT_B
(1)
– – – – – – 1 0 Multiplex channel 1 to AMP_OUT_B
– – – – – – 1 1 Multiplex channel 2 to AMP_OUT_B

D15 D14 D13 D12 D11 D 10 D9 D8 FUNCTION

(1)
0 0 – – – – – – Reserved
– – 0 0 – – – – Multiplex channel 1 to AMP_OUT_C
(1)
– – 0 1 – – – – Multiplex channel 2 to AMP_OUT_C
– – 1 0 – – – – Multiplex channel 1 to AMP_OUT_C
– – 1 1 – – – – Multiplex channel 2 to AMP_OUT_C
(1)
– – – – 0 0 – – Reserved
– – – – – – 0 0 Multiplex channel 1 to AMP_OUT_D
– – – – – – 0 1 Multiplex channel 2 to AMP_OUT_D
– – – – – – 1 0 Multiplex channel 1 to AMP_OUT_D
(1)
– – – – – – 1 1 Multiplex channel 2 to AMP_OUT_D

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
(1)
0 1 0 0 0 1 0 1 Reserved

(1) Default values are in bold.

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7.7.2.18 AGL Control Register (0x46)

Table 22. AGL Control Register (0x46)

D31 D30 D29 D28 D27 D26 D25 D24 FUNCTION
(1)
0 0 0 0 0 0 0 0 Reserved

D23 D22 D21 D20 D19 D18 D17 D16 FUNCTION

(1)
0 0 0 0 0 0 0 0 Reserved

D15 D14 D13 D12 D11 D10 D9 D8 FUNCTION

(1)
0 0 0 0 0 0 0 0 Reserved

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
(1)
0 0 – – – – – – Reserved
– – 0 – – – – – Reserved
– – 1 – – – – – Reserved
(1)
– – – 0 – – – – Reserved
(1)
– – – – 0 – – – AGL4 turned OFF
– – – – 1 – – – AGL4 turned ON
(1)
– – – – – 0 – – AGL3 turned OFF
– – – – – 1 – – AGL3 turned ON
(1)
– – – – – – 0 – AGL2 turned OFF
– – – – – – 1 – AGL2 turned ON
(1)
– – – – – – – 0 AGL1 turned OFF
– – – – – – – 1 AGL1 turned ON

(1) Default values are in bold.

7.7.2.19 PWM Switching Rate Control Register (0x4F)

PWM switching rate should be selected through the register 0x4F before coming out of all-channnel shutdown.

Table 23. PWM Switching Rate Control Register (0x4F)

D31 D30 D29 D28 D27 D26 D25 D24 FUNCTION
(1)
0 0 0 0 0 0 0 0 Reserved

D23 D22 D21 D20 D19 D18 D17 D16 FUNCTION

(1)
0 0 0 0 0 0 0 0 Reserved

D15 D14 D13 D12 D11 D10 D9 D8 FUNCTION

(1)
0 0 0 0 0 0 0 0 Reserved

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
– – 0 0 – – – – Reserved (1)
– – – – 0 1 1 0 SRC = 6
– – – – 0 1 1 1 SRC = 7
– – – – 1 0 0 0 SRC = 8 (1)
– – – – 1 0 0 1 SRC = 9
– – – – 1 0 1 0 Reserved
– – – – 1 1 – – Reserved

(1) Default values are in bold.

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7.7.2.20 Bank Switch and EQ Control (0x50)

Table 24. Bank Switching Command (0x50)

D31 D30 D29 D28 D27 D26 D25 D24 FUNCTION
(1)
0 0 0 0 1 1 1 1 Reserved

D23 D22 D21 D20 D19 D18 D17 D16 FUNCTION

(1)
0 1 1 1 0 0 0 0 Reserved

D15 D14 D13 D12 D11 D10 D9 D8 FUNCTION

(1)
0 0 0 0 0 0 0 0 Reserved

D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
(1)
0 EQ ON
1 – – – – – – – EQ OFF (bypass BQ 1–11 of channels 1 and 2)
(1)
– 0 – – – – – – Reserved
(1)
– – 0 – – – – – Ignore bank-mapping in bits D31–D8. Use default mapping.
1 Use bank-mapping in bits D31–D8.
(1)
– – – 0 – – – – L and R can be written independently.
L and R are ganged for EQ biquads; a write to the left-channel
– – – 1 – – – – biquad is also written to the right-channel biquad. (0x29–0x2F is
ganged to 0x30–0x36. Also, 0x58–0x5B is ganged to 0x5C–0x5F.
(1)
– – – – 0 – – – Reserved
(1)
– – – – – 0 0 0 No bank switching. All updates to DAP
– – – – – 0 0 1 Configure bank 1 (32 kHz by default)
– – – – – 0 1 X Reserved
– – – – – 1 X X Reserved

(1) Default values are in bold.

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8 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

8.1 Application Information

As mentioned previously, the TAS5733L device can be used in stereo and mono mode. This section describes
the information required to configure the device for several popular configurations and for integrating the
TAS5733L device into the larger system.

8.1.1 External Component Selection Criteria

The Supporting Component Requirements table in each application description section lists the details of the
supporting required components in each of the System Application Schematics. Where possible, the supporting
component requirements have been consolidated to minimize the number of unique components which are used
in the design. Component list consolidation is a method to reduce the number of unique part numbers in a
design. Consolidation is done to ease inventory management and reduce the manufacturing steps during board
assembly. For this reason, some capacitors are specified at a higher voltage than what would normally be
required. An example of this is a 50-V capacitor can be used for decoupling of a 3.3-V power supply net.
In this example, a higher voltage capacitor can be used even on the lower voltage net to consolidate all caps of
that value into a single component type. Similarly, several unique resistors, all having the same size and value
but different power ratings can be consolidated by using the highest rated power resistor for each instance of that
resistor value.
While this consolidation can seem excessive, the benefits of having fewer components in the design can far
outweigh the trivial cost of a higher voltage capacitor. If lower voltage capacitors are already available elsewhere
in the design, they can be used instead of the higher voltage capacitors. In all situations, the voltage rating of the
capacitors must be at least 1.45 times the voltage of the voltage which appears across them. The power rating of
the capacitors should be 1.5 times to 1.75 times the power dissipated in the capacitors during normal use case.

8.1.1.1 Component Selection Impact on Board Layout, Component Placement, and Trace Routing
Because the layout is important to the overall performance of the circuit, the package size of the components
shown in the component list were intentionally chosen to allow for proper board layout, component placement,
and trace routing. In some cases, traces are passed in between two surface mount pads or ground plane
extends from the TAS5733L device between two pads of a surface mount component and into to the surrounding
copper for increased heat-sinking of the device. While components can be offered in smaller or larger package
sizes, the package size should remain identical to that used in the application circuit as shown. This consistency
ensures that the layout and routing can be matched very closely, optimizing thermal, electromagnetic, and audio
performance of the TAS5733L device in circuit in the final system.

8.1.1.2 Amplifier Output Filtering

The TAS5733L device is often used with a low-pass filter, which is used to filter out the carrier frequency of the
PWM modulated output. This filter is frequently referred to as the L-C Filter, due to the presence of an inductive
element L and a capacitive element C to make up the 2-pole filter. The L-C filter removes the carrier frequency,
reducing electromagnetic emissions and smoothing the current waveform which is drawn from the power supply.
The presence and size of the L-C filter is determined by several system level constraints. In some low-power use
cases that do not have other circuits which are sensitive to EMI, a simple ferrite bead or ferrite bead and
capacitor can replace the traditional large inductor and capacitor that are commonly used. In other high-power
applications, large toroid inductors are required for maximum power and film capacitors can be preferred due to
audio characteristics. Refer to the application report Class-D Filter Design (SLOA119) for a detailed description
of proper component selection and design of an L-C filter based upon the desired load and response.

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8.2 Typical Applications

These typical connection diagrams highlight the required external components and system level connections for
proper operation of the device in several popular use cases. Each of these configurations can be realized using
the Evaluation Module (EVM) for the device. These flexible modules allow full evaluation of the device in the
most common modes of operation. Any design variation can be supported by TI through schematic and layout
reviews. Visit http://e2e.ti.com for design assistance and join the audio amplifier discussion forum for additional
information.

8.2.1 Stereo Bridge Tied Load Application

A stereo system generally refers to a system inside which are two full range speakers without a separate
amplifier path for the speakers that reproduce the low-frequency content. In this system, two channels are
presented to the amplifier via the digital input signal. These two channels are amplified and then sent to two
separate speakers.
Most commonly, the two channels are a pair of signals called a stereo pair, with one channel containing the
audio for the left channel and the other channel containing the audio for the right channel. While the two
channels can contain any two audio channels, such as two surround channels of a multi-channel speaker
system, the most popular occurrence in two channels systems is a stereo pair.
The Stereo BTL Configuration is shown in Figure 49.

Figure 49. Stereo Bridge Tied Load Application

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Typical Applications (continued)

8.2.1.1 Design Requirements
The design requirements for the Stereo Bridge Tied Load Application of the TAS5733L device is found in
Table 25

Table 25. Design Requirements for Stereo Bridge Tied Load Application
PARAMETER EXAMPLE
Low Power Supply 3.3 V
High Power Supply 8 V to 15 V
I²S Compliant Master
Digital I²C Compliant Master
GPIO Control
(1)
Output Filters Inductor-Capacitor Low Pass Filter
Speaker 4 Ω minimum.

(1) Refer to SLOA119 for a detailed description on the filter design.

8.2.1.2 Detailed Design Procedure

8.2.1.2.1 Component Selection and Hardware Connections

The typical connections required for proper operation of the device can be found on the TAS5733L User’s Guide.
The device was tested with this list of components, deviation from this typical application components unless
recommended by this document can produce unwanted results, which could range from degradation of audio
performance to destructive failure of the device. The application report Class-D Filter Design (SLOA119) offers a
detailed description of proper component selection and design of the output filter based upon the modulation
used, desired load and response.

8.2.1.2.2 Control and Software Integration

The TAS5733L device has a bidirectional I²C used to program the registers of the device and to read device
status. The TAS5733LEVM and the PurePath Console GUI are powerful tools that allow the TAS5733L
evaluation, control and configuration. The Register Dump feature of the PurePath Console software can be used
to generate a custom configuration file for any end-system operating mode. Prior approval is required to
download PurePath Console GUI. Please request access at http://www.ti.com/tool/purepathconsole.

8.2.1.2.3 I²C Pullup Resistors

Customary pullup resistors are required on the SCL and SDA signal lines. They are not shown in the Typical
Application Circuits, because they are shared by all of the devices on the I²C bus and are considered to be part
of the associated passive components for the System Processor. These resistor values should be chosen per the
guidance provided in the I²C Specification.

8.2.1.2.4 Digital I/O Connectivity

The digital I/O lines of the TAS5733L are described in previous sections. As discussed, whenever a static digital
pin (that is a pin that is hardwired to be HIGH or LOW) is required to be pulled HIGH, it should be connected to
DVDD through a pull-up resistor to control the slew rate of the voltage presented to the digital I/O pins. However,
having a separate pull-up resistor for each static digital I/O line is not necessary. Instead, a single resistor can be
used to tie all static I/O lines HIGH to reduce BOM count.

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8.2.1.2.5 Recommended Startup and Shutdown Procedures

Initialization Normal Operation Shutdown Power Down

AVDD/DVDD 3V 3V
0 µs

8V 8V
PVDD 100 µs 6V 6V
2 µs

AMP Exit Volume and Mute Enter

I2C 10 µs Trim
Config SD Commands SD
2 µs

I2S 13.5 ms
1 ms + 1.3 tSTART
50 ms
1 ms + 1.3 tSTOP

RST 100 µs tPLL

PDN 2 µs

tPLL has to be greater than 240 ms + 1.3 tSTART, after the first trim command following AVDD/DVDD power-up. It does not apply to trim commands following subsequent resets.
tSTART/tSTOP = PWM start/stop time as defined in register 0x1A

Figure 50. Recommended Start-Up and Shutdown Sequence

8.2.1.2.5.1 Start-Up Sequence

Use the following sequence to power up and initialize the device:
1. Hold all digital inputs low and ramp up AVDD/DVDD to at least 3 V.
2. Initialize digital inputs and PVDD supply as follows:
– Drive RST = 0, PDN = 1, and other digital inputs to their desired state. Wait at least 100 µs, drive RST
high
– Wait ≥ 13.5 ms.
– Ramp up PVDD to at least 8 V while ensuring that it remains below 6 V for at least 100 µs after
AVDD/DVDD reaches 3 V.
– Wait ≥ 10 µs.
3. Trim oscillator (write 0x00 to register 0x1B) and wait at least 50 ms.
4. Configure the Digital Audio Processor of the Amplifier via I²C, refer to Section 8.5 Register Maps for more
information.
5. Configure remaining registers.
6. Exit shutdown (sequence defined in Shutdown Sequence).

8.2.1.2.5.2 Normal Operation

The following are the only events supported during normal operation:
1. Writes to master/channel volume registers.
2. Writes to soft-mute register.
3. Enter and exit shutdown (sequence defined in Shutdown Sequence).

NOTE
Event 3 is not supported for 240 ms + 1.3 × tstart after trim following AVDD/DVDD power-
up ramp (where tstart is specified by register 0x1A).

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8.2.1.2.5.3 Shutdown Sequence

Enter:
1. Write 0x40 to register 0x05.
2. Wait at least 1 ms + 1.3 × tstop (where tstop is specified by register 0x1A).
3. If desired, reconfigure by returning to step 4 of initialization sequence.
Exit:
1. Write 0x00 to register 0x05 (exit shutdown command can not be serviced for as much as 240 ms after trim
following AVDD/DVDD power-up ramp).
2. Wait at least 1 ms + 1.3 × tstart (where tstart is specified by register 0x1A).
3. Proceed with normal operation.

8.2.1.2.5.4 Power-Down Sequence

Use the following sequence to power down the device and its supplies:
1. If time permits, enter shutdown (sequence defined in Shutdown Sequence); else, in case of sudden power
loss, assert PDN = 0 and wait at least 2 ms.
2. Assert RST = 0.
3. Drive digital inputs low and ramp down PVDD supply as follows:
– Drive all digital inputs low after RST has been low for at least 2 µs.
– Ramp down PVDD while ensuring that it remains above 8 V until RST has been low for at least 2 µs.
4. Ramp down AVDD/DVDD while ensuring that it remains above 3 V until PVDD is below 6 V.

8.2.1.3 Application Performance Plots

CURVE TITLE FIGURE

Output Power Vs Supply Voltage Stereo BTL Mode Figure 5
Total Harmonic Distortion + Noise Vs Output Power Stereo BTL Mode Figure 10
Total Harmonic Distortion + Noise Vs Frequency Stereo BTL Mode Figure 7
Power Efficiency Vs Output Power Stereo BTL Mode Figure 13
Crosstalk Vs Frequency Stereo BTL Mode Figure 15

8.2.2 Mono Parallel Bridge Tied Load Application

A mono system refers to a system in which the amplifier is used to drive a single loudspeaker. Parallel Bridge
Tied Load (PBTL) indicates that the two full-bridge channels of the device are placed in parallel and drive the
loudspeaker simultaneously using an identical audio signal. The primary benefit of operating this device in PBTL
operation is to reduce the power dissipation and increase the current sourcing capabilities of the amplifier output.
In this mode of operation, the current limit of the audio amplifier is approximately doubled while the on-resistance
is approximately halved.
The loudspeaker can be a full-range transducer or one that only reproduces the low-frequency content of an
audio signal, as in the case of a powered subwoofer. Often in this use case, two stereo signals are mixed
together and sent through a low-pass filter to create a single audio signal which contains the low-frequency
information of the two channels.
The Mono PBTL Configuration is shown in Figure 51.

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Figure 51. Mono Parallel Bridge Tied Load Application

8.2.2.1 Design Requirements

The design requirements for the Mono Parallel Bridge Tied Load Appliction of the TAS5733L device is found in
Table 26

Table 26. Design Requirements for Mono Parallel Bridge Tied Load Application
PARAMETER EXAMPLE
Low Power Supply 3.3 V
High Power Supply 8 V to 15 V
I²S Compliant Master
Digital I²C Compliant Master
GPIO Control
(1)
Output Filters Inductor-Capacitor Low Pass Filter
Speaker 2 Ω minimum.

(1) Refer to the application report Class-D Filter Design (SLOA119) for a detailed description on the filter design.

8.2.2.2 Detailed Design Procedure

Refer to the Detailed Design Procedure section.

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8.2.2.3 Application Performance Plots

CURVE TITLE FIGURE

Output Power Vs Supply Voltage Mono PBTL Mode Figure 23
Total Harmonic Distortion + Noise Vs Output Power Mono PBTL Mode Figure 20
Total Harmonic Distortion + Noise Vs Frequency Mono PBTL Mode Figure 17
Power Efficiency Vs Output Power Mono PBTL Mode Figure 24

9 Power Supply Recommendations

To facilitate system design, the TAS5733L device requires only a 3.3-V supply in addition to the PVDD power-
stage supply. An internal voltage regulator provides suitable voltage levels for the gate drive circuitry.
Additionally, all circuitry requiring a floating voltage supply, e.g., the high-side gate drive, is accommodated by
built-in bootstrap circuitry requiring only a few external capacitors.
To provide good electrical and acoustical characteristics, the PWM signal path for the output stage is designed
as identical, independent half-bridges. For this reason, each half-bridge has separate bootstrap pins (BSTRP_x),
and power-stage supply pins (PVDD). The gate-drive voltage (GVDD_REG) is derived from the PVDD voltage.
Place all decoupling capacitors as close to their associated pins as possible. In addition, avoid inductance
between the power-supply pins and the decoupling capacitors.
For a properly functioning bootstrap circuit, a small ceramic capacitor must be connected from each bootstrap pin
(BSTRP_x) to the power-stage output pin (AMP_OUT_X). When the power-stage output is low, the bootstrap
capacitor is charged through an internal diode connected between the gate-drive regulator output pin
(GVDD_REG) and the bootstrap pin. When the power-stage output is high, the bootstrap capacitor potential is
shifted above the output potential and thus provides a suitable voltage supply for the high-side gate driver. The
capacitors shown in Typical Applications ensure sufficient energy storage, even during minimal PWM duty
cycles, to keep the high-side power-stage FET (LDMOS) fully turned on during the remaining part of the PWM
cycle.
Special attention should be paid to the power-stage power supply; this includes component selection, PCB
placement, and routing. As indicated, each half-bridge has independent power-stage supply pins (PVDD). For
optimal electrical performance, EMI compliance, and system reliability, each PVDD pin should be decoupled with
a 100-nF, X7R ceramic capacitor placed as close as possible to each supply pin.
The TAS5733L device is fully protected against erroneous power-stage turn-on due to parasitic gate charging.

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10 Layout

10.1 Layout Guidelines

Audio amplifiers which incorporate switching output stages must have special attention paid to their layout and
the layout of the supporting components used around them. The system level performance metrics, including
thermal performance, electromagnetic compliance (EMC), device reliability, and audio performance are all
affected by the device and supporting component layout. Ideally, the guidance provided in the Application
Information section with regard to device and component selection can be followed by precise adherence to the
layout guidance shown in Figure 52. The examples represent exemplary baseline balance of the engineering
trade-offs involved with laying out the device. The designs can be modified slightly as needed to meet the needs
of a given application. For example, in some applications, solution size can be compromised to improve thermal
performance through the use of additional contiguous copper near the device. Conversely, EMI performance can
be prioritized over thermal performance by routing on internal traces and incorporating a via picket-fence and
additional filtering components.

10.1.1 Decoupling Capacitors

Placing the bypassing and decoupling capacitors close to supply has been long understood in the industry. The
placement of the capacitors applies to AVDD and PVDD. However, the capacitors on the PVDD net for the
TAS5733L device deserve special attention. The small bypass capacitors on the PVDD lines of the DUT must be
placed as close the PVDD pins as possible. Not only does placing these devices far away from the pins increase
the electromagnetic interference in the system, but doing so can also negatively affect the reliability of the device.
Placement of these components too far from the TAS5733L device may cause ringing on the output pins that can
cause the voltage on the output pin to exceed the maximum allowable ratings shown in the Absolute Maximum
Ratings table, damaging the device. For that reason, the capacitors on the PVDD net must be no further away
from their associated PVDD pins than what is shown in the example layouts in the Layout Example section.

10.1.2 Thermal Performance and Grounding

Follow the layout examples shown in the Layout Example section of this document to achieve the best balance
of solution size, thermal, audio, and electromagnetic performance. In some cases, deviation from this guidance
may be required due to design constraints which cannot be avoided. In these instances, the system designer
should ensure that the heat can get out of the device and into the ambient air surrounding the device.
Fortunately, the heat created in the device naturally travels away from the device and into the lower temperature
structures around the device.
Primarily, the goal of the PCB design is to minimize the thermal impedance in the path to those cooler structures.
These tips should be followed to achieve that goal:
• Avoid placing other heat-producing components or structures near the amplifier (including above or below in
the end equipment).
• Use a higher layer count PCB if possible to provide more heat sinking capability for the TAS5733L device and
to prevent traces of copper signal and power planes from breaking up the contiguous copper on the top and
bottom layer.
• Place the TAS5733L device away from the edge of the PCB when possible to ensure that heat can travel
away from the device on all four sides.
• Avoid cutting off the flow of heat from the TAS5733L device to the surrounding areas with traces or via
strings. Instead, route traces perpendicular to the device and line up vias in columns which are perpendicular
to the device.
• Unless the area between two pads of a passive component is large enough to allow copper to flow in
between the two pads, orient it so that the narrow end of the passive component is facing the TAS5733L
device. Because the ground pins are the best conductors of heat in the package, maintain a contiguous
ground plane from the ground pins to the PCB area surrounding the device for as many of the ground pins as
possible.

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10.2 Layout Example

Figure 52. Layout Example (Stereo) - Top View Composite

Figure 53. Layout Example (Stereo) - Top Layer

Figure 54. Layout Example (Stereo) - Bottom Layer

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Layout Example (continued)

Figure 55. Layout Example (Mono) - Top View Composite

Figure 56. Layout Example (Mono) - Top Layer

Figure 57. Layout Example (Mono) - Bottom Layer

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11 Device and Documentation Support

11.1 Trademarks
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

11.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

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12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

TAS5733LDCA ACTIVE HTSSOP DCA 48 40 Green (RoHS CU NIPDAU Level-3-260C-168 HR 0 to 85 TAS5733L

& no Sb/Br)
TAS5733LDCAR ACTIVE HTSSOP DCA 48 2000 Green (RoHS CU NIPDAU Level-3-260C-168 HR 0 to 85 TAS5733L
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 1-Apr-2016

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 2-Apr-2016

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TAS5733LDCAR HTSSOP DCA 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 2-Apr-2016

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TAS5733LDCAR HTSSOP DCA 48 2000 367.0 367.0 45.0

Pack Materials-Page 2
 IMPORTANT NOTICE

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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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