EMT 357/3
FUNDAMENTAL OF
MICROELECTRONIC FABRICATION
Academic Staff
1. Dr. Safizan Shaari
Coordinator (0139445032)
safizan@unimap.edu.my
2. Dr. Muhammad Mahyiddin Ramli
mmahyiddin@unimap.edu.my
3. En. Haffiz Abd Razak
Class (3rd year students)
Evaluation
• Examination 70%
Final Examination 50%
Mid Term Examination 20%
• Course Work 30%
Lab Report 10%
Assignment/Quiz 20%
Condition for passing the course
Program Educational Objective (PEO)
UniMAP
Program
Outcomes
(PO)
Course Outcome
CO1:
• Ability to appraise the fundamental concept of the semiconductor
fabrication technology which include materials, devices,
processes, facilities and standard practices.
CO2:
• Ability to evaluate and manipulate appropriate parameters of
wafer cleaning, photolithography, etching and thermal processes
using microelectronic fabrication equipment.
CO3:
• Ability to engage and conclude the technological change in
microelectronic fabrication technology.
Course Outcomes Assessments Matrix
Assessments
Examinations (70%) Continual Assessment (30%)
Programme
Level of
Course Outcome (CO) Outcome
Complexity Mid Term Laboratory
(PO) Final Exam Assignments
Exam Assessments
(50%) (20%)
(20%) (10 %)
CO1:
Ability to appraise the
fundamental concept of the
Cognitive:C6
semiconductor fabrication Assignment 1
technology which include
PO1 Evaluation Q1-Q5 MTE -
materials, devices, processes,
facilities and standard practices.
CO2:
Ability to evaluate and
manipulate appropriate
parameters of wafer cleaning, Cognitive:C6
Rubric PO5
photolithography, etching and PO5 Evaluation - - -
thermal processes using (Lab Report)
microelectronic fabrication
equipment.
CO3:
Ability to engage and conclude Cognitive:C6
the technological change in Evaluation
microelectronic fabrication
PO11 - - - Assignment 2
technology.
Laboratories
• List of experiments
Lab 1 Cleanroom Protocol
Lab 2 Tour of Microfabrication facilities
• Lab
4 to 5 students/Group
Lab report (Group)
PO5 Assessment (individual assessment)
The Syllabus
1. Fundamental to Microelectronic Fabrication
History and evolution of integrated circuits and overview of
microelectronic fabrication
2. Cleanroom Technology, Safety & Protocol
Classes of cleanroom, sources of contamination, contamination control
and the needs of cleanroom environment, purpose of cleanroom protocol,
gowning and de-gowning procedures, chemical handling and safety
procedures
3. Basics of Semiconductor
Semiconductor materials and compounds, resistivity and band gap, crystal
properties of semiconductor, doping process and explain intrinsic and
extrinsic semiconductors, relationships between dopant concentration
and resistivity, conductivity.
4. Wafer Manufacturing
Advantages of silicon, crystal defects, single-crystal silicon wafer
manufacturing
5. Semiconductor Materials
6. Wafer Cleaning
Wafer cleaning process & cleaning solutions and chemicals
7. Thermal Processes I: Oxidation
Thermal processes and oxidation, mechanisms of oxidation and oxidation
process, two types of oxidation, oxidation parameters
8. Thermal Processes II: Diffusion
Diffusion process & diffusion parameters
9. Thermal Processes III: Annealing and Ion Implantation
Annealing and ion implantation process & annealing and ion implantation
parameters
10. Photolithography I
Photolithography process and photolithography parameters
11. Photolithography II
Photolithography process and photolithography parameters
12. Metallization I: CVD
CVD process and parameters
13. Metallization II: PVD
PVD process and parameters
14. Etching
Etching process and parameters
References
1.Introduction to Semiconductor Manufacturing Technology. Hong Xiao
(2001). Prentice Hall.
2.Microchip Fabrication: A Practical Guide to Semiconductor Processing.
Peter Van Iant. (2000). McGraw Hill
3.Science and Engineering of Microelectronics Fabrication. S. A.
Campbell, (2001). New York: Oxford University Press
4.Handbook of Contamination Control in Microelectronics – Principle,
Applications and Technology. Edited by D. Tolliver, (1998). Noyes
Publication
5.Introduction to Microelectronic Fabrication, Vol. V, 2nd Edition. Richard C.
Jaegar, Prentice Hall 2002.
6.Semiconductor Devices, Physics and Technology, 2nd Edition, S.M. Sze,
John Wiley & Son, Inc. 2002
7.Silicon VLSI Technology: Fundamentals, Practice and Modeling, James
D. Plummer, Michael D. Deal and Peter B. Griffin, Prentice Hall, 2000
References
Previous Performance (2016/17)
Previous Performance (2017/18)
Previous Performance (2018/19)
