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Common Tablet Defects Explained

This document lists common defects that can occur during tablet manufacturing including capping/chipping where the top or bottom separates or a small portion is removed, cracking/double impression due to expansion or punch rotation, lamination where the tablet separates into layers, and mottling/picking/sticking where color is uneven or the tablet adheres to equipment.

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Mayrigen Dominguez
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70 views1 page

Common Tablet Defects Explained

This document lists common defects that can occur during tablet manufacturing including capping/chipping where the top or bottom separates or a small portion is removed, cracking/double impression due to expansion or punch rotation, lamination where the tablet separates into layers, and mottling/picking/sticking where color is uneven or the tablet adheres to equipment.

Uploaded by

Mayrigen Dominguez
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Partial or complete

Capping separation of top and bottom

Removal of small portion


Chipping
Due to rapid expansion of
Cracking tablets

Due to free rotation of


Double Impression
punches

Separation into 2 or more


Lamination layers

Uneven color distribution


Mottling
Adhesion to punch faces
Picking
Sticking Adhesion to die wall

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