GAL20XV10: Features Functional Block Diagram
GAL20XV10: Features Functional Block Diagram
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• 50% to 75% REDUCTION IN POWER FROM BIPOLAR OLMC I/O/Q
— 90mA Maximum Icc I
— 75mA Typical Icc 4
OLMC I/O/Q
• ACTIVE PULL-UPS ON ALL PINS I
PROGRAMMABLE
• E2 CELL TECHNOLOGY 4
I OLMC I/O/Q
— Reconfigurable Logic
AND-ARRAY
— Reprogrammable Cells
(40 X 40)
— 100% Tested/100% Yields 4
I I/O/Q
— High Speed Electrical Erasure (<100 ms) OLMC
• APPLICATIONS INCLUDE: I 4
— High Speed Counters OLMC I/O/Q
— Graphics Processing
— Comparators I
4
OLMC I/O/Q
• ELECTRONIC SIGNATURE FOR IDENTIFICATION
Description I/OE
I/O/Q
I/O/Q
I I/O/Q
I
I
NC
GND
I/O/Q
I/O/Q
I/OE
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. July 1997
Tel. (503) 681-0118; 1-888-ISP-PLDS; FAX (503) 681-3037; http://www.latticesemi.com
20xv10_02 1
Specifications GAL20XV10
Tpd (ns) Tsu (ns) Tco (ns) Icc (mA) Ordering # Package
10 6 7 90 GAL20XV10B-10LP 24-Pin Plastic DIP
XXXXXXXX _ XX X X X
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Specifications GAL20XV10
3
Specifications GAL20XV10
Input Mode
OE
XOR Registered Configuration
- SYN = 1.
- AC0 = 0.
D Q - AC1 = 0.
- OLMC 1 and OLMC10 do not have the
Q feedback path.
- Pin 1(2) can be CLK and/or Input.
- Pin 13(16) can be OE and/or Input.
CLK
Registered Configuration
- SYN = 1.
- AC0 = 1.
- AC1 = 0.
D Q - XOR = 1 defines Active Low Output.
- XOR = 0 defines Active High Output.
XOR Q - OLMC 1 and OLMC10 do not have the
feedback path.
- Pin 1(2) can be CLK and/or Input.
- OE controlled by product term.
CLK
OE
XOR Combinatorial Configuration
- SYN = 1.
- AC0 = 0.
- AC1 = 1.
- OLMC 1 and OLMC10 do not have the
feedback path.
- Pin 13(16) can be OE and/or Input.
Combinatorial Configuration
- SYN = 1.
- AC0 = 1.
- AC1 = 1.
- XOR = 1 defines Active Low Output.
- XOR = 0 defines Active High Output.
XOR - OLMC 1 and OLMC10 do not have the
feedback path.
- OE controlled by product term.
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Specifications GAL20XV10
2(3)
160 OLMC
280
XOR - 1601 22(26)
AC0 - 1611
3(4) AC1 - 1621
320 OLMC
440
XOR - 1602 21(25)
AC0 - 1612
4(5) AC1 - 1622
480 OLMC
600 XOR - 1603 20(24)
AC0 - 1613
5(6) AC1 - 1623
640 OLMC
760 XOR - 1604 19(23)
AC0 - 1614
6(7) AC1 - 1624
800 OLMC
920 XOR - 1605 18(21)
AC0 - 1615
7(9) AC1 - 1625
960 OLMC
1080 XOR - 1606 17(20)
AC0 - 1616
8(10) AC1 - 1626
1120 OLMC
1240 XOR - 1607 16(19)
AC0 - 1617
9(11) AC1 - 1627
1280 OLMC
XOR - 1608 15(18)
1400
AC0 - 1618
10(12) AC1 - 1628
1440 OLMC
1560 XOR - 1609 14(17)
AC0 - 1619
AC1 - 1629
11(13) 13(16)
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Specifications GAL20XV10
Feedback Mode
OE
CLK
Registered Configuration
- SYN = 0.
- AC0 = 1.
- AC1 = 0.
D Q
- XOR = 1 defines Active Low Output.
XOR Q
- XOR = 0 defines Active High Output.
- Dedicated CLK input on Pin 1(2).
- OE controlled by product term.
- Pin 13(16) is not connected to this configura-
CLK tion.
OE
Combinatorial Configuration
- SYN = 0.
- AC0 = 1.
- AC1 = 1.
- XOR = 1 defines Active Low Output.
- XOR = 0 defines Active High Output.
XOR
- OE controlled by product term.
- Both pin1(2) and pin 13(16) are not con -
nected to this configuration.
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Specifications GAL20XV10
Feedback Mode Logic Diagram
DIP (PLCC) Package Pinouts
1(2)
0 4 8 12 16 20 24 28 32 36
0 OLMC
120
XOR - 1600 23(27)
AC0 - 1610
2(3) AC1 - 1620
160 OLMC
280 XOR - 1601 22(26)
AC0 - 1611
3(4) AC1 - 1621
320 OLMC
440 XOR - 1602 21(25)
AC0 - 1612
4(5) AC1 - 1622
480 OLMC
600 XOR - 1603 20(24)
AC0 - 1613
5(6) AC1 - 1623
640 OLMC
760 XOR - 1604 19(23)
AC0 - 1614
6(7) AC1 - 1624
800 OLMC
920 XOR - 1605 18(21)
AC0 - 1615
7(9) AC1 - 1625
960 OLMC
1080 XOR - 1606 17(20)
AC0 - 1616
8(10) AC1 - 1626
1120 OLMC
1240 XOR - 1607 16(19)
AC0 - 1617
9(11) AC1 - 1627
1280 OLMC
1400 XOR - 1608 15(18)
AC0 - 1618
10(12) AC1 - 1628
1440 OLMC
1560 XOR - 1609 14(17)
AC0 - 1619
11(13) AC1 - 1629
13(16)
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Specifications GAL20XV10
Absolute Maximum Ratings(1) Recommended Operating Conditions
Supply voltage Vcc ....................................... –0.5 to+7V Commercial Devices:
Input voltage applied .......................... –2.5 to VCC +1.0V Ambient Temperature (TA) ............................. 0 to +75°C
Off-state output voltage applied ......... –2.5 to VCC +1.0V Supply voltage (VCC)
Storage Temperature ............................... –65 to 150°C with Respect to Ground ..................... +4.75 to +5.25V
Ambient Temperature with
Power Applied .......................................... –55 to 125°C
1.Stresses above those listed under the “Absolute Maximum
Ratings” may cause permanent damage to the device. These
are stress only ratings and functional operation of the device at
these or at any other conditions above those indicated in the
operational sections of this specification is not implied (while pro-
gramming, follow the programming specifications).
DC Electrical Characteristics
Over Recommended Operating Conditions (Unless Otherwise Specified)
IIL1 Input or I/O Low Leakage Current 0V ≤ VIN ≤ VIL (MAX.) — — –100 µA
VOL Output Low Voltage IOL = MAX. Vin = VIL or VIH — — 0.5 V
VOH Output High Voltage IOH = MAX. Vin = VIL or VIH 2.4 — — V
IOS2 Output Short Circuit Current VCC = 5V VOUT = 0.5V TA= 25°C –50 — –150 mA
COMMERCIAL
ICC Operating Power VIL = 0.5V VIH = 3.0V L -10/-15/-20 — 75 90 mA
Supply Current ftoggle = 15MHz Outputs Open
1) The leakage current is due to the internal pull-up on all input and I/O pins. See Input Buffer section for more information.
2) One output at a time for a maximum duration of one second. Vout = 0.5V was selected to avoid test problems by tester
ground degradation. Characterized but not 100% tested.
3) Typical values are at VCC = 5V and TA = 25 °C
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Specifications GAL20XV10
AC Switching Characteristics
Over Recommended Operating Conditions
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Specifications GAL20XV10
Switching Waveforms
INPUT or
I/O FEEDBACK VALID INPUT
INPUT or
I/O FEEDBACK VALID INPUT ts u th
t pd CLK
COMBINATORIAL tc o
OUTPUT REGISTERED
OUTPUT
1 / fm a x
Combinatorial Output (external fdbk)
Registered Output
INPUT or OE
I/O FEEDBACK
OUTPUT OUTPUT
CLK
tw h tw l
1/ fmax (internal fdbk)
CLK t cf tsu
1 / fm a x REGISTERED
(w/o fdbk) FEEDBACK
Clock Width
fmax with Feedback
PIN
PIN
Feedback
ESD
Protection Feedback
Circuit (To Input Buffer)
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Specifications GAL20XV10
fmax Descriptions
CLK
LOGIC
REGISTER
ARRAY CLK
LOGIC
ARRAY
tsu tco REGISTER
LOGIC
Note: tcf is a calculated value, derived by subtracting tsu from
REGISTER the period of fmax w/internal feedback (tcf = 1/fmax - tsu). The
ARRAY
value of tcf is used primarily when calculating the delay from
clocking a register to a combinatorial output (through registered
feedback), as shown above. For example, the timing from clock
tsu + th
to a combinatorial output is equal to tcf + tpd.
fmax with No Feedback
Note: fmax with no feedback may be less than 1/(twh + twl). This
is to allow for a clock duty cycle of other than 50%.
+5V
Input Pulse Levels GND to 3.0V
Input Rise and Fall Times 3ns 10% – 90%
Input Timing Reference Levels 1.5V R1
Output Timing Reference Levels 1.5V
Output Load See Figure
3-state levels are measured 0.5V from steady-state active FROM OUTPUT (O/Q)
TEST POINT
level. UNDER TEST
C L*
Output Load Conditions (see figure) R2
Test Condition R1 R2 CL
A 300Ω 390Ω 50pF
Active High ∞ 390Ω 50pF
B
Active Low 300Ω 390Ω 50pF
Active High ∞ 390Ω 5pF *C L INCLUDES TEST FIXTURE AND PROBE CAPACITANCE
C
Active Low 300Ω 390Ω 5pF
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Specifications GAL20XV10
Electronic Signature Latch-Up Protection
An electronic signature word is provided in every GAL20XV10 GAL20XV10 devices are designed with an on-board charge pump
device. It contains 40 bits of reprogrammable memory that con- to negatively bias the substrate. The negative bias is of sufficient
tains user defined data. Some uses include user ID codes, revi- magnitude to prevent input undershoots from causing the circuitry
sion numbers, pattern identification or inventory control codes. The to latch. Additionally, outputs are designed with n-channel pullups
signature data is always available to the user independent of the instead of the traditional p-channel pullups to eliminate any pos-
state of the security cell. sibility of SCR induced latching.
NOTE: The electronic signature bits, if programmed to any value Input Buffers
other then zero(0) will alter the checksum of the device.
GAL20XV10 devices are designed with TTL level compatible in-
Security Cell put buffers. These buffers have a characteristically high imped-
ance, and present a much lighter load to the driving logic than bi-
A security cell is provided in every GAL20XV10 device as a deter- polar TTL devices.
rent to unauthorized copying of the device pattern. Once pro-
grammed, this cell prevents further read access of the device GAL20XV10 input buffers have active pull-ups within their input
pattern information. This cell can be only be reset by reprogram- structure. This pull-up will cause any un-terminated input or
ming the device. The original pattern can never be examined once I/O to float to a TTL high (logical 1). Lattice Semiconductor
this cell is programmed. The Electronic Signature is always avail- recommends that all unused inputs and tri-stated I/O pins be
able regardless of the security cell state. connected to another active input, Vcc, or GND. Doing this will tend
to improve noise immunity and reduce Icc for the device.
Device Programming
Typical Input Pull-up Characteristic
GAL devices are programmed using a Lattice Semiconductor-
approved Logic Programmer, available from a number of manu- 0
facturers. Complete programming of the device takes less than a
Input Current (µA)
second. Erasing of the device is transparent to the user, and is done -20
automatically as part of the programming cycle.
-40
-60
0 1.0 2.0 3.0 4.0 5.0
Power-Up Reset
Circuitry within the GAL20XV10 provides a reset signal to all reg- of system power-up, some conditions must be met to provide a valid
isters during power-up. All internal registers will have their Q outputs power-up reset of the GAL20XV10. First, the VCC rise must be
set low after a specified time (tpr, 1µs MAX). As a result, the state monotonic. Second, the clock input must be at static TTL level as
on the registered output pins (if they are enabled) will always be shown in the diagram during power up. The registers will reset
high on power-up, regardless of the programmed polarity of the within a maximum of tpr time. As in normal system operation, avoid
output pins. This feature can greatly simplify state machine design clocking the device until all input and feedback path setup times
by providing a known state on power-up. The timing diagram for have been met. The clock must also meet the minimum pulse width
power-up is shown below. Because of the asynchronous nature requirements.
Vcc (min.)
Vcc
t su
CLK t wl
t pr
INTERNAL REGISTER Internal Register
Q - OUTPUT Reset to Logic "0"
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Specifications GAL20XV10
Normalized Tsu
Normalized Tco
1.1 1.1 1.1
PT L->H FALL PT L->H
1 1 1
Normalized Tsu
Normalized Tpd
1.2
1.1 PT L->H 1.1 FALL PT L->H
1.1
1 1
1
0.9 0.9
0.9
0.8 0.8 0.8
-0.5 -0.5
-1 -1
RISE RISE
-1.5 -1.5
FALL FALL
-2 -2
1 2 3 4 5 6 7 8 9 10 1 2 3 4 5 6 7 8 9 10
12 12
10 RISE 10 RISE
Delta Tco (ns)
Delta Tpd (ns)
8 FALL 8 FALL
6 6
4 4
2 2
0 0
-2 -2
0 50 100 150 200 250 300 0 50 100 150 200 250 300
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Specifications GAL20XV10
Typical AC and DC Characteristic Diagrams
3 5 4.5
2.5
4
4.25
2
Voh (V)
Voh (V)
Vol (V)
3
1.5 4
2
1
3.75
1
0.5
0 0 3.5
0.00 20.00 40.00 60.00 80.00 100.00 0.00 10.00 20.00 30.00 40.00 50.00 60.00 0.00 1.00 2.00 3.00 4.00
Normalized Icc
Normalized Icc
1.10 1.1
1.40
1.30
1.00 1 1.20
1.10
1.00
0.90 0.9
0.90
0.80
0.80 0.8 0.70
4.50 4.75 5.00 5.25 5.50 -55 -25 0 25 50 75 100 125 0 25 50 75 100
10 0
20
8
Delta Icc (mA)
40
Iik (mA)
6
60
4
80
2
100
0 120
0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 -2.00 -1.50 -1.00 -0.50 0.00
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This datasheet has been downloaded from:
www.DatasheetCatalog.com