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CE CGR: This Datasheet Has Been Downloaded From at This

The document provides specifications for an IGBT (insulated-gate bipolar transistor) chip called the BUP 203. The summary is: 1. The BUP 203 IGBT chip has a maximum voltage of 1000V, current of 23A, and power dissipation of 165W. 2. It has low forward voltage drop, high switching speed, low tail current, is latch-up free and avalanche rated. 3. The document provides detailed maximum ratings, electrical characteristics, switching characteristics and graphs of power dissipation, collector current, safe operating area, and transient thermal impedance.

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Farooq Ahmed
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0% found this document useful (0 votes)
106 views7 pages

CE CGR: This Datasheet Has Been Downloaded From at This

The document provides specifications for an IGBT (insulated-gate bipolar transistor) chip called the BUP 203. The summary is: 1. The BUP 203 IGBT chip has a maximum voltage of 1000V, current of 23A, and power dissipation of 165W. 2. It has low forward voltage drop, high switching speed, low tail current, is latch-up free and avalanche rated. 3. The document provides detailed maximum ratings, electrical characteristics, switching characteristics and graphs of power dissipation, collector current, safe operating area, and transient thermal impedance.

Uploaded by

Farooq Ahmed
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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BUP 203

IGBT
Preliminary data

• Low forward voltage drop


• High switching speed
• Low tail current
• Latch-up free
• Avalanche rated

Pin 1 Pin 2 Pin 3


G C E

Type VCE IC Package Ordering Code


BUP 203 1000V 23A TO-220 AB Q67078-A4402-A2

Maximum Ratings
Parameter Symbol Values Unit
Collector-emitter voltage VCE 1000 V
Collector-gate voltage VCGR
RGE = 20 kΩ 1200
Gate-emitter voltage VGE ± 20
DC collector current IC A
TC = 25 °C 23
TC = 90 °C 15
Pulsed collector current, tp = 1 ms ICpuls
TC = 25 °C 46
TC = 90 °C 30
Avalanche energy, single pulse EAS mJ
IC = 10 A, VCC = 24 V, RGE = 25 Ω
L = 3 mH, Tj = 25 °C 20
Power dissipation Ptot W
TC = 25 °C 165
Chip or operating temperature Tj -55 ... + 150 °C
Storage temperature Tstg -55 ... + 150

Semiconductor Group 1 Dec-06-1995


This datasheet has been downloaded from http://www.digchip.com at this page
BUP 203

Maximum Ratings
Parameter Symbol Values Unit
DIN humidity category, DIN 40 040 - E -
IEC climatic category, DIN IEC 68-1 - 55 / 150 / 56

Thermal Resistance
IGBT thermal resistance, chip case RthJC ≤ 0.63 K/W

Electrical Characteristics, at Tj = 25 °C, unless otherwise specified


Parameter Symbol Values Unit
min. typ. max.

Static Characteristics
Gate threshold voltage VGE(th) V
VGE = VCE, IC = 0.7 mA 4.5 5.5 6.5
Collector-emitter saturation voltage VCE(sat)
VGE = 15 V, IC = 10 A, Tj = 25 °C - 2.8 3.3
VGE = 15 V, IC = 10 A, Tj = 125 °C - 3.8 4.3
VGE = 15 V, IC = 10 A, Tj = 150 °C - 4 4.5
Zero gate voltage collector current ICES µA
VCE = 1000 V, VGE = 0 V, Tj = 25 °C - - 150
VCE = 1000 V, VGE = 0 V, Tj = 125 °C - - 700
Gate-emitter leakage current IGES nA
VGE = 20 V, VCE = 0 V - 0.1 100

AC Characteristics
Transconductance gfs S
VCE = 20 V, IC = 10 A 3.5 5.5 -
Input capacitance Ciss pF
VCE = 25 V, VGE = 0 V, f = 1 MHz - 1300 1750
Output capacitance Coss
VCE = 25 V, VGE = 0 V, f = 1 MHz - 100 150
Reverse transfer capacitance Crss
VCE = 25 V, VGE = 0 V, f = 1 MHz - 50 75

Semiconductor Group 2 Dec-06-1995


BUP 203

Electrical Characteristics, at Tj = 25 °C, unless otherwise specified


Parameter Symbol Values Unit
min. typ. max.

Switching Characteristics, Inductive Load at Tj = 125 °C


Turn-on delay time td(on) ns
VCC = 600 V, VGE = 15 V, IC = 10 A
RGon = 47 Ω - 40 60
Rise time tr
VCC = 600 V, VGE = 15 V, IC = 10 A
RGon = 47 Ω - 30 50
Turn-off delay time td(off)
VCC = 600 V, VGE = -15 V, IC = 10 A
RGoff = 47 Ω - 200 300
Fall time tf
VCC = 600 V, VGE = -15 V, IC = 10 A
RGoff = 47 Ω - 20 30
Total turn-off loss energy Eoff mWs
VCC = 600 V, VGE = -15 V, IC = 10 A
RGoff = 47 Ω - 1.3 -

Semiconductor Group 3 Dec-06-1995


BUP 203

Power dissipation Collector current


Ptot = ƒ(TC) IC = ƒ(TC)
parameter: Tj ≤ 150 °C parameter: VGE ≥ 15 V , Tj ≤ 150 °C

170 24

W A

140 20
Ptot IC
18
120
16

100 14

12
80
10
60
8

40 6

4
20
2
0 0
0 20 40 60 80 100 120 °C 160 0 20 40 60 80 100 120 °C 160
TC TC

Safe operating area Transient thermal impedance IGBT


IC = ƒ(VCE) Zth JC = ƒ(tp)
parameter: D = 0, TC = 25°C , Tj ≤ 150 °C parameter: D = tp / T

10 2 10 0

t = 16.0µs
p

A K/W
IC ZthJC

10 1 10 -1
100 µs

D = 0.50
1 ms 0.20
10 0 10 -2 0.10
0.05
10 ms 0.02
single pulse
0.01

DC
10 -1 10 -3
0 1 2 3 -5 -4 -3 -2 -1 0
10 10 10 V 10 10 10 10 10 10 s 10
VCE tp

Semiconductor Group 4 Dec-06-1995


BUP 203

Typ. output characteristics Typ. transfer characteristics


IC = f(VCE) IC = f (VGE)
parameter: tp = 80 µs, Tj = 125 °C parameter: tP = 80 µs, VCE = 20 V, Tj = 25 °C

Typ. saturation characteristics Typ. saturation characteristics


VCE(sat) = f (VGE) VCE(sat) = f (VGE)
parameter: Tj = 25 °C parameter: Tj = 125 °C

Semiconductor Group 5 Dec-06-1995


BUP 203

Typ. gate charge Typ. capacitances


VGE = ƒ(QGate) C = f (VCE)
parameter: IC puls = 10 A parameter: VGE = 0 V, f = 1 MHz

20

VGE 16
400 V 800 V
14

12

10

0
0 20 40 60 80 100 nC 130
Q Gate

Typ. switching time


t = f (RG), inductive load, Tj = 125 °C
parameter: VCE = 600 V, VGE = ± 15 V, IC = 10 A

Semiconductor Group 6 Dec-06-1995


BUP 203

Package Outlines
Dimensions in mm
Weight: 8 g

Semiconductor Group 7 Dec-06-1995

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