OxygenTM Express CM8826

High Performance PCI Express Audio Processor

FEATURES
DESCRIPTION
 Compatible with PCI Express 1.1 interface with
The Oxygen Express™ HD CM8826 is a high quality
bus mastering and burst modes
PCI express multi-channel audio processor that not
 Embedded an 8051-based MCU to transcode HD
only an Intel HD Audio specification compatible
Audio command s(An external 4 or 8KB serial
audio single chip, but also can be a controller
EEPROM is required
which can link HDA codec. CM8826 can be built in
Build in HD Audio controller.
the home audio electronics or personal computer
Audio format supports 96K/48K/44.1K and
to provide high fidelity sound and become a
16/24bits resolution
professional audio processing center in your life. It
 integrated 96K/48K/44.1K, and 16/24-bit S/PDIF
supports up to 8 outgoing channels and 4 ingoing
transmitter
channels. The 8 outgoing channels are composed of
 Supports SPI/I2C control interface
2 playback DMA’s, which are multi-channel DMA
 24.576MHz crystal input required with embedded
(24 bits, 6 channels, 96k), S/PDIF (each 24 bits, 2
PLL for adaptive clock rate
channels, 96k). The 6 ingoing channels are spread
 Win7/8 WHQL compatible
in 2 recording DMA’s , which are 2 channel line in,
2 channel mic (up to 24 bits, 96k)

BLOCK DIAGRAM

Block Diagram

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OxygenTM Express CM8826
High Performance PCI Express Audio Processor

TABLE OF CONTENTS

Revision History....................................................................................................................................... 3
1. Description and Overview ................................................................................................................ 4
2. Features ............................................................................................................................................ 5
3. Applications ..................................................................................................................................... 7
4. Software and Features ...................................................................................................................... 7
5. Block Diagram ................................................................................................................................. 8
6. Pin Assignment ................................................................................................................................. 9
6.1 Pin-Out Diagram ........................................................................................................... 9
7. Electrical Characteristics ................................................................................................................ 14
7.1 Maximum Ratings ....................................................................................................... 14
7.2 Recommended Operation Conditions ......................................................................... 14
7.3 Power Consumption .................................................................................................... 14
7.4 DC Characteristics....................................................................................................... 14
7.5 AC Timing Characteristics .......................................................................................... 15
7.5.1 I2S Signal Timing................................................................................................... 15
7.5.2 Control Interface Timing - 3 - Wire Mode ............................................................. 16
7.5.3 EEPROM Interface Timing .................................................................................... 18
7.5.4 EEPROM AC Timing Characteristics .................................................................... 19
7.5.5 HD Audio-Link Timing Characteristics: ................................................................ 20
8. Mechanical Specification ............................................................................................................... 22

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OxygenTM Express CM8826
High Performance PCI Express Audio Processor

Revision History

Date Rev. Release Note

2011/12/22 Rev. 0.9 First release

2012/02/02 Rev. 0.91 -modify 3.3v power range

-add power consumption

2012/05/07 Rev. 0.92 -modify pin definition table

-modify block diagram

-modify software and features

2013/09/13 Rev. 1.0 Formal Release

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 OxygenTM Express CM8826
High Performance PCI Express Audio Processor

1. Description and Overview

The Oxygen Express™ HD CM8826 is a high quality PCI express multi-channel audio processor
that not only an Intel HD Audio specification compatible audio single chip, but also can be a
controller which can connect HDA codec. CM8826 can be built in the home audio electronics or
personal computer to provide high fidelity sound and become a professional audio processing
center in your life. It supports up to 8 outgoing channels and 4 ingoing channels. The 8 outgoing
channels are composed of 2 playback DMA’s, which are multi-channel DMA (24 bits, 8 channels,
96k), S/PDIF DMA (each 24 bits, 2 channels, 96k). The 4 ingoing channels are spread in 2
recording DMA’s, which are 2 channel Line in, 2 channel Mic in (up to 24 bits, 192k).
The Oxygen Express™ HD CM8826 is a MCU-based audio processor which can co-work with all
the usual HDA codecs. The audio topology for HDA spec. can be flexible by only changing the
Firmware. This ability gives customers the flexibility to design their products. The HDA-Link,
2-wire master bus, and SPI interfaces are used to transfer audio data and control data between the
CM8826 and codecs. To facilitate the connection with the existing home audio electronics, the
CM8826 has incorporated the S/PDIF transmitter with 96k sampling rate in it.
A master I2C interface is built in to connect with the serial EEPROM to store and retrieve the
non-evaporable data for firmware code and the customer applications, such as board configuration,
sub-vender and sub-system IDs, or any dynamic data that customers want to save for the next
power-on to restore.
The Oxygen Express™ HD CM8826 has an independent 2-wire slave bus to communicate
with micro control unit (MCU). Strictly speaking, this interface is used as a media for system
driver and MCU to talk. There are nine GPIOs pins, which can be used to distinguish if a device is
plugged in the phone jack or other purpose.

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 OxygenTM Express CM8826
High Performance PCI Express Audio Processor

2. Features

Bus
 Compatible with PCI Express 1.1 interface with bus mastering and burst modes

Architecture
 Build in HD Audio controller

 Embedded an 8051-based MCU to transcode HD Audio command to accommodate various

external HDA codecs (An external 4 or 8KB serial EEPROM is required]

 Embedded ROM code for MCU to transcode HD Audio command to control embedded HDA

codecs

 Analog mixer to mix all input data to output streams through HDA codecs

DMA Controller
 Two playback DMAs and two recording DMAs following Vista/Win7 HD Audio controller

requirements and to be WaveRT-port-friendly:

 Playback DMA#A supports up to 8ch audio output (2,4,6 CH configurable by SW driver

control)

 Playback DMA#B supports independent 2ch audio output for S/PDIF

 Recording DMA#A supports up to 2ch audio input

 Recording DMA#B supports independent 2ch audio input

 Sampling rates: all DMA channels support: 96K/48K/44.1K PCM data

 Resolution (Word-length): all DMA channels support: 16/24bit PCM data transfer modes

Audio I/O
 Intel HD Audio Link supports 1 external HDA codec

 Integrated 96K/48K/44.1K, and 16/24-bit S/PDIF transmitter

 All input data can be analog mixed to output streams

Control Interface

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High Performance PCI Express Audio Processor

 SPI control interfaces

 I2C Interface supports both Master and Slave mode

 Interrupt pin for external MCU read transaction

 Serial EEPROM programming interface for customizing Sub-VendorID/Sub-DeviceID (and even

Vendor/Device IDs as well), storing HDA power-on pin configuration (replacing MB BIOS

function) and 8051 ROM-codes (HDA command transcoder)

 Maximum 9 GPIO pins for external devices control and various purposes

General
 Compliant with Microsoft Win7/8 UAA design guideline and driver

 Pass Windows 7 Premium Audio logo certification

 24.576MHz crystal input required with embedded PLL for adaptive clock rate

 Single 3.3V power supply

 3.3 V digital I/O pads with 5V tolerance

 Package and Pin Number: LQFP-80

 Default target codec: CM9862A

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 OxygenTM Express CM8826
High Performance PCI Express Audio Processor

3. Applications
 High Definition PCIe sound cards for retailer market

 Pro-Audio / High-End studio applications

 Gaming audio devices

 Bundle selling with high-profile VGA cards or motherboard

 Embedded system / Industrial computer audio

4. Software and Features

 Xear™ Living 1.1

 Adaptive Volume

 EAX 2.0 / 3D supported on XP

 Xear™ surround to support surround speakers(not including headphones)

 Xear™ SingFX

 Xear™ MagicVoice

 Face Lift UI (APO driver architecture on 7/8)

 Stereo mix (Line-in, Mic-in and Wave files)

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 OxygenTM Express CM8826
High Performance PCI Express Audio Processor

5. Block Diagram

Figure 1. Block Diagram of OxygenTM Express CM8826

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 OxygenTM Express CM8826
High Performance PCI Express Audio Processor

6. Pin Assignment
6.1 Pin-Out Diagram

XMCU_INT
XGPIO_5
XGPIO_4
XGPIO_8
XGPIO_7
XGPIO_6

XPWDN
XMSDA

VDD18
XMSCL

DVCC
DVCC

DVCC

GND
N.C
N.C

N.C
N.C

N.C
N.C
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
N.C 61 40 XSCI_0
N.C 62 39 XSCO_0
GND 63 38 GND
N.C 64 37 XOSC49
N.C 65 36 XOSC45
N.C 66 35 XGPIO_3
N.C 67 34 XGPIO_2
DVCC
N.C
68
69 CM8826 33
32
XGPIO_1
XGPIO_0
N.C 70 31 XSPDIFI_0
N.C 71 30 DVCC

LQFP-80
GND 72 29 XTEST
XSPI_CLK 73 28 XPERSTN
XSPI_DIN 74 27 XSPI_CEN4
XSPI_DOUT 75 26 XSPI_CEN5
XSPI_CEN0 76 25 XSPI_CEN6
XSPI_CEN1 77 24 XSPI_CEN7
XSPI_CEN2 78 23 XHDA_RSTN
XSPI_CEN3 79 22 XHDA_SYNC
XSPDIFO_0 80 21 XHDA_SDI
10
11
12
13
14
15
16
17
18
19
20
1
2
3
4
5
6
7
8
9
VDDRX

VDDTX
HSIN
GNDRX
REFCLK_P
REFCLK_N

V_MBIAS
HSIP

HSOP
HSON
GNDPLL

IBREF
G_MBIAS
VDD18
DVCC

VDD18
V3D3_PLL
XHDA_SDO
XHDA_BCLK
GND

Figure 2. Pin-Out Diagram of OxygenTM Express CM8826

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OxygenTM Express CM8826
High Performance PCI Express Audio Processor

Pin Descriptions
The following table gives the pin descriptions for the Oxygen ExpressTM HD CM8826. The
abbreviations used in the pin description table are explained below.

DI: digital input signal

DO: digital output signal
DIO: digital bidirectional signal
AI: analog input
PU: pull-up with 75KΩ resistor
PD: pull-down with 75KΩ resistor
#: low active signal

Table 5.1 Pin description table of Oxygen ExperssTM HD CM8826

Pin No. Pin Name Type Description
1 VDDRX P PHY VDD
2 HSIP AI PHY Signal
3 HSIN AI PHY Signal
4 GNDRX G PHY GND
5 REFCLK_P AI PHY Signal
6 REFCLK_M AI PHY Signal
7 VDDPLL / VDDTX P PHY VDD
8 HSOP AO PHY Signal
9 HSON AO PHY Signal

10 GNDPLL / GNDTX G PHY GND

11 VDDBIAS P PHY VDD

12 IBREF AO PHY Signal

13 GNDBIAS G PHY GND

14 VDD18 P Digital 1.8V Power

15 DVCC P Digital Core power

16 GND G Digital Ground

17 VDD18 P Digital 1.8V Power

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High Performance PCI Express Audio Processor

18 DVCC P Digital Core Power

19 XHDA_SDO DO HDA serial data output to codec

20 XHDA_BCLK DO HDA 24MHz serial clock output

XHDA_SDI
st
21 DIO,PD 1 HDA serial data input from codec

22 XHDA_SYNC DO HDA frame synchronization

23 XHDA_RSTN DO HDA codec reset 0

SPI chip enable, which select the codec #7 to be

24 XSPI_CEN7 DIO,PU
controlled
SPI chip enable, which select the codec #6 to be
25 XSPI_CEN6 DIO,PU
controlled
SPI chip enable, which select the codec #5 to be
26 XSPI_CEN5 DIO,PU
controlled
SPI chip enable, which select the codec #4 to be
27 XSPI_CEN4 DIO,PU
controlled

28 XPERSTN DI,PU PCIe PHY Reset#

29 XTEST DI,PD Test mode enable

30 DVCC P Digital Core Power

XSPDIFI_0
st
31 DI 1 S/PDIF input

32 XGPIO_0 DIO,PD GPIO0, default input

33 XGPIO_1 DIO,PD GPIO1, default input

34 XGPIO_2 DIO,PD GPIO2, default input

35 XGPIO_3 DIO,PD GPIO3, default input

36 XOSC45 DI,PD 45.1584 MHz Osc in

37 XOSC49 DI,PD 49.1520 MHz Osc in

38 GND G Digital Ground

39 XSCO_0 DIO 24.576 Crystal out

40 XSCI_0 DIO 24.576 Crystal in

41 DVCC P Digital Core Power

42 GND G Digital Ground
43 N.C
44 N.C

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High Performance PCI Express Audio Processor

45 N.C
46 N.C
47 XMCU_INT DIO,PD 2-wire serial bus interrupt
48 N.C
49 DVCC P Digital Core Power
50 XPWDN DIO,PU Codec Reset (Low active)
51 XGPIO_4 DIO,PD GPIO4, default input
52 XGPIO_5 DIO,PD GPIO5, default input
53 VDD18 P Digital 1.8V Power
54 XGPIO_6 DIO,PD GPIO6, default input
55 XGPIO_7 DIO,PD GPIO7, default input
56 XGPIO_8 DIO,PD GPIO8, default input
57 DVCC P Digital Core Power
58 XMSDA DIO,PU 2-wire serial bus data
59 XMSCL DIO,PU 2-wire serial bus clock
60 N.C
61 N.C
62 N.C
63 GND G Digital Ground
64 N.C
65 N.C
66 N.C
67 N.C
68 DVCC P Digital Core Power
69 N.C
70 N.C
71 N.C
72 GND G Digital Ground
73 XSPI_CLK DIO,PD SPI clock output
74 XSPI_DIN DIO,PD SPI data input
75 XSPI_DOUT DIO,PD SPI data output(master) / data input (slave)
SPI chip enable, which select the codec #0 to be
76 XSPI_CEN0 DIO,PU
controlled
SPI chip enable, which select the codec #1 to be
77 XSPI_CEN1 DIO,PU
controlled

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SPI chip enable, which select the codec #2 to be

78 XSPI_CEN2 DIO,PU
controlled
SPI chip enable, which select the codec #3 to be
79 XSPI_CEN3 DIO,PU
controlled
XSPDIFO_0
st
80 DO 1 S/PDIF transmitter

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 OxygenTM Express CM8826
High Performance PCI Express Audio Processor

7. Electrical Characteristics
7.1 Maximum Ratings

Test Conditions
DVDD = 3.3V, DGND =0V,TA=+25oC
Parameter Symbol Min Typ Max Units
Storge temperature - -25 - +120
o
C

Operating ambient temperature - 0 25 70

o
C

DC supply voltage(DVCC) - 3.1 3.3 3.6 V

DC supply voltage(VDD18) 1.62 1.8 1.98 V

I/O pin voltage - GND - VDD Vrms

Power dissipation - - - W

7.2 Recommended Operation Conditions

Test Conditions
DVDD = 3.3V, DGND =0V,TA=+25oC
Parameter Symbol Min Typ Max Units
DVDD Input voltage range - VDD-0.2 VDD VDD+0.3 Vrms

DVDD Output voltage range - 0 - VDD Vrms

AVDD Input voltage range Vavdd-5% Vavdd Vavdd+5% Vrms

7.3 Power Consumption

Test Conditions
DVDD = 3.3V, DGND =0V,TA=+25oC
Parameter Symbol Min Typ Max Units
Supply current : power up - - 203 - mA

Supply current : power down - - 0.2 - uA

7.4 DC Characteristics

Test Conditions
DVDD = 3.3V, DGND =0V,TA=+25oC
Parameter Symbol Min Typ Max Units
Input voltage range Vin V DD -0.2 V DD V DD +0.3 V

Output voltage range Vout 0 - V DD V

High level input voltage Vih 0.7V DD - - V

Low level input voltage Vil - - 0.3V DD V

High level output voitage Voh 2.4 - - V

Low level output voltage Vol - 0.4 V

Input leakage current Iil -10 - 10 uA

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High Performance PCI Express Audio Processor

Output leakage current Iol -10 - 10 uA

Output buffer driver current - - 8 - mA

SPDIF transmit output driver current - - 8 - mA

7.5 AC Timing Characteristics

7.5.1 I2S Signal Timing
a. System Clock Timing

System Clock Timing Diagram

Test Conditions
DVDD = 3.3V, DGND =0V,TA=+25oC,fs=96KHz,MCLK=512fs,24 bit data,unless otherwise stated

System Clock Timing Parameters

Parameter Symbol Min Typ Max Units
MCLK clock cycle time tmclk 20 - - ns

MCLK pulse width high tmclkh 10 - - ns

MCLK pulse width high tmclkl 10 - - ns

MCLK duty cycle 40 50 60 %

b. Audio Interface Timing

Audio Interface Timing Diagram

Test Conditions
DVDD = 3.3V, DGND =0V,TA=+25oC,fs=96KHz,MCLK=512fs,24 bit data, unless otherwise stated

Audio Interface Timing Parameters

Parameter Symbol Min Typ Max Units

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High Performance PCI Express Audio Processor

LRCK propagation delay from BCLK falling edge Tdl 5 - - ns

SDOUT propagation delay from BCLK falling edge Tdd 5 - - ns

7.5.2 Control Interface Timing - 3 - Wire Mode

Control Interface Timing -3- Wire Diagram

Note: latch data at XSPI_CEN clock low mode, XSPI_CEN clock can be low or high mode

Test Conditions

DVDD = 3.3V, DGND =0V, TA=+25oC, SPI clock 160 ns, unless otherwise stated

Control Interface Timing -3- Wire Parameters

Parameter Symbol Min Typ Max Units
XSPI_CLK rising edge to XSPI_CEN rising edge Tscs 120 - - ns

XSPI_CLK pulse cycle time Tscy 160 - - ns

XSPI_CLK pulse width low Tscl 80 - - ns

XSPI_CLK pulse width high Tsch 80 - - ns

XSPI_DOUT to XSPI_CLK set-up time Tdsu 40 - - ns

XSPI_DOUT to XSPI_CLK hold time Tdho 40 - - ns

XSPI_CEN rising to SCLK rising Tcss 40 - - ns

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OxygenTM Express CM8826
High Performance PCI Express Audio Processor

Control Interface Timing - 2 – Wire Mode

Control Interface Timing -2- Wire Diagram

Test Conditions
DVDD = 3.3V, DGND =0V, TA=+25oC, 2 wire, Fast speed mode, unless otherwise stated

Control Interface Timing -2- Wire Parameters

Parameter Symbol Min Typ Max Units
XMSCL frequency 400 - - KHz

XMSCL pulse width low t1 650 - - ns

XMSCL pulse width high t2 1.3 - - us

Hold time (start condition) t3 650 - - ns

Set-up time (start condition) t4 650 - - ns

Data set-up time t5 650 - - ns

XMSDI,XMSCL rise time t6 100 - - ns

XMSDI,XMSCL fall time t7 100 - - ns

Set-up time (stop condition) t8 650 - - ns

Data hold time t9 650 - - ns

Note: test parameters at 2 wire, Fast speed mode

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OxygenTM Express CM8826
High Performance PCI Express Audio Processor

7.5.3 EEPROM Interface Timing

EEPROM Interface Timing Diagram

Test Conditions
DVDD = 3.3V, DGND =0V, TA=+25oC, unless otherwise stated

EEPROM Interface Timing Parameters

Parameter Symbol Min Typ Max Units
XEESK clock frequency tsk 555 - - KHz

XEESK high time tskh 900 - - ns

XEESK low time tskl 900 - - ns

XEECS setup time tcss 900 - - ns

XEEDI setup time tdis 900 - - ns

XEECS hold time tcsh 900 - - ns

XEEDI hold time tdih 2 - - ns

Output delay to “1” tpd1 900 - - ns

Output delay to “0” tpd0 30 - - ns

XEECS to status valid tsv 30 - - ns

XEECS to XEEDO in high impedance tdf 30 - - ns

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High Performance PCI Express Audio Processor

7.5.4 EEPROM AC Timing Characteristics

Symbol Description Min Max Units

fsk SK Clock Frequency 0 0.5 MHz

tskh SK High Time 500 ns

tskl SK Low Time 500 ns

tcss CS Setup Time 100 ns

tcsh CS Hold Time 0 ns

tdis DI Setup Time 200 ns

tdih DI Hold Time 200 ns

tpd0 Output Delay to “0” 500 ns

tpd1 Output Delay to “1” 500 ns

tsv CS to Status Valid 500 ns

tdf CS to DO High Impedance 200 ns

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High Performance PCI Express Audio Processor

7.5.5 HD Audio-Link Timing Characteristics:

Test Conditions
DVDD = 3.3V, DGND =0V,TA=+25oC ,unless otherwise stated

1. Link Reset and Initialization Timing

Link Reset and Initialization Timing Parameters

Parameter Symbol Min Typ Max Units

RESET#Active Low Pulse Width Trst 1.0 - - us

RESET#Inactive to BCLK Startup delay time for PLL

Tpll 20 - - us
ready

SDI Initialization Request time Tframe - - 1 FrameTime

2. Link Timing Parameters

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High Performance PCI Express Audio Processor

Link Timing Parameters

Parameter Symbol Min Typ Max Units

BCLK Frequency - - 24 - MHz

BCLK out Period Tcycle - 41.67 - ns

BCLK Jitter - - - 2.0 ns

BCLK High,Low Level Width Thigh/Tlow 18.75 - 22.91 ns

SDO Setup Time at Rising,Falling Edge of BCLK Tsetup 2.0 - - ns

SDO Hold Time at Rising,Falling Edge of BCLK Thold 2.0 - - ns

SDI Valid Time after Rising Edge of BCLK Ttco - 7.5 - ns

SDI Flight Time Tflight - 2.0 - ns

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High Performance PCI Express Audio Processor

8. Mechanical Specification
8.1 Package Dimension

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OxygenTM Express CM8826
High Performance PCI Express Audio Processor

－End of Specifications－

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FAX：+886-2-8773-2211

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Disclaimer:
Information furnished by C-Media Electronics Inc. is believed to be accurate and reliable. However, no responsibility is assumed by C-Media Electronics Inc. for its use, nor for any
infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or
otherwise under any patent or patent rights of C-Media. Trademark and registered trademark are the property of their respective owners.

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