QuickSpecs HP ProBook 640 G5 Notebook PC

Overview
HP ProBook 640 G5 Notebook PC

Left

1. Webcam (Select models) 6. Smart Card Reader (Select models)

2. Internal Microphones (2) 7. Audio Combo Jack
3. Camera Privacy Shutter 8. USB 3.1 Gen 1 Port
4. Webcam LED (Select models) 9. Security Lock Slot (Lock sold separately)
5. Clickpad 10. Power Button

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QuickSpecs HP ProBook 640 G5 Notebook PC

Overview

Right

1. Micro SD Card Slot 7. USB 3.1 Gen 1 port

2. Power Connector 8. USB 3.1 Gen 1 Charging Port
3. Docking Connector 9. USB Type-C™ Charging Port (PD+DP 1.2, Gen1)
4. VGA Port 10. HDD LED Indicator
5. Ethernet Port 11. Fingerprint Reader (Select models)
6. HDMI Port (Cable not included)

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QuickSpecs HP ProBook 640 G5 Notebook PC

Overview
AT A GLANCE

• Windows 10 versions and FreeDOS

• Precision-crafted slim design with fingerprint resistant modern, fresh and comfortable natural silver finish
• Choice of 8th Generation Intel® Core™ processors, with integrated graphics or optional AMD Radeon™ 540X 64 bit
Discrete Graphics
• HP Advanced keyboard, spill resistant with optional backlit design
• Large Clickpad with gestures support
• Enhanced security features including TPM2.0, HP Privacy Camera, Optional HP Sure View Gen3, optional Smart Card
Reader, optional Touch FingerPrint Reader3 (select models), HP Sure Sense2 and HP Sure Start Gen5.
• LED-backlit display 35.56 cm (14") diagonal HD, FHD, Touch FHD or FHD with HP Sure View Gen3.
• Optional WWAN
• HDMI port for connecting to high-resolution displays
• Optional HD webcam with dual-microphone array for video conferencing
• Three USB 3.1 Gen1 ports (1 charging) and one USB-C™ port (PD+DP 1.2, Gen1)
• Flexible wireless connectivity options, including 802.11 AX WLAN module and CAT9 WWAN module
• Battery hours up to 15 hours and 30 minutes with fast charging technology
• Dual storage combines SSD fast boot up and app access with cost effective HDD mass storage
• Passed MIL-STD 810G test1
• Compliance with FCC (Class B)

1. MIL-STD 810G is not intended to demonstrate fitness of U.S. Department of Defense contract requirements or for military
use. Test results are not a guarantee of future performance under these test conditions. Accidental damage requires an
optional HP Accidental Damage Protection Care Pack.
2. HP Sure Sense requires Windows 10. See product specifications for availability.
3. HP Fingerprint Sensor is an optional feature and requires configuration at purchase.

NOTE: See important legal disclosures for all listed specs in their respective features sections.

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Technical Specifications
PRODUCT NAME
HP ProBook 640 G5 Notebook PC

OPERATING SYSTEM
Preinstalled Windows 10 Pro 641
Windows 10 Pro 64 (National Academic only)2
Windows 10 Home 641
Windows 10 Home Single Language 641
Windows 10 Pro (Windows 10 Enterprise available with a Volume Licensing Agreement)1
FreeDOS
1. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately
purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is
automatically updated, which is always enabled. ISP fees may apply and additional requirements may apply over time for
updates. See http://www.windows.com/.
2. Some devices for academic use will automatically be updated to Windows 10 Pro Education with the Windows 10
Anniversary Update. Features vary; see https://aka.ms/ProEducation for Windows 10 Pro Education feature information.

PROCESSORS
Intel® Core™ i7-8665U vPro™ with Intel® UHD graphics 620 (1.9 GHz base frequency, up to 4.8 GHz with Intel® Turbo Boost
Technology, 8 MB L3 cache, 4 cores)3,4,5
Intel® Core™ i7-8565U with Intel® UHD graphics 620 (1.8 GHz base frequency, up to 4.6 GHz with Intel® Turbo Boost
Technology, 8 MB L3 cache, 4 cores)3,4,5
Intel® Core™ i5-8365U vPro™ with Intel® UHD Graphics 620 (1.6 GHz base frequency, up to 4.1 GHz with Intel® Turbo Boost
Technology, 6 MB L3 cache, 4 cores)3,4,5
Intel® Core™ i5-8265U with Intel® UHD Graphics 620 (1.6 GHz base frequency, up to 3.9 GHz with Intel® Turbo Boost
Technology, 6 MB L3 cache, 4 cores)3,4,5
Intel® Core™ i3-8145U with Intel® UHD Graphics 620 (2.1 GHz base frequency, up to 3.9 GHz with Intel® Turbo Boost
Technology, 4 MB cache, 2 cores)3,4,5

Processor Family
8th Generation Intel® Core™ i7 processor (i7-8665U, i7-8565U models)5
8th Generation Intel® Core™ i5 processor (i5-8365U, i5-8265U models)5
8th Generation Intel® Core™ i3 processor (i3-8145U model)5

3. Multicore is designed to improve performance of certain software products. Not all customers or software applications will
necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application
workload and your hardware and software configurations. Intel’s numbering, branding and/or naming is not a measurement
of higher performance.
4. Processor speed denotes maximum performance mode; processors will run at lower speeds in battery optimization mode.
5. In accordance with Microsoft’s support policy, HP does not support the Windows 8 or Windows 7 operating system on
products configured with Intel and AMD 7th generation and forward processors or provide any Windows 8 or Windows 7
drivers on http://www.support.hp.com.

CHIPSET
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Technical Specifications
Chipset is integrated with processor

GRAPHICS
Integrated
Intel® UHD graphics 6207

Discrete
AMD Radeon™ 540X (2 GB GDDR5 dedicated)6

Supports
Support HD decode, DX12, HDMI 1.4b

7. HD content required to view HD images.

6. AMD Dynamic Switchable Graphics technology requires an Intel processor, plus an AMD Radeon™ discrete graphics
configuration and is not available on FreeDOS and Linux OS. With AMD Dynamic Switchable Graphics technology, full
enablement of all discrete graphics video and display features may not be supported on all systems (e.g. OpenGL applications
will run on the integrated GPU or the APU as the case may be).

DISPLAY
Non-Touch HD
35.56 cm (14") diagonal HD SVA eDP anti-glare LED-backlit, 220 cd/m², 45% NTSC (1366 x 768)7,8
35.56 cm (14") diagonal HD SVA eDP anti-glare LED-backlit, 220 cd/m², 45% NTSC, for HD camera (1366 x 768)7,8
35.56 cm (14") diagonal HD SVA eDP anti-glare LED-backlit, 220 cd/m², 45% NTSC, for WWAN (1366 x 768)7,8
35.56 cm (14") diagonal HD SVA eDP anti-glare LED-backlit, 220 cd/m², 45% NTSC, for HD camera and WWAN
(1366 x 768)7,8

Non-Touch FHD
35.56 cm (14") diagonal FHD IPS eDP anti-glare LED-backlit, 250 cd/m², 45% NTSC (1920 x 1080)7,8
35.56 cm (14") diagonal FHD IPS eDP anti-glare LED-backlit, 250 cd/m², 45% NTSC, for HD camera (1920 x 1080)7,8
35.56 cm (14") diagonal FHD IPS eDP anti-glare LED-backlit, 250 cd/m², 45% NTSC, for WWAN (1920 x 1080)7,8
35.56 cm (14") diagonal FHD IPS eDP anti-glare LED-backlit, 250 cd/m², 45% NTSC, for HD camera and WWAN (1920 x
1080)7,8

Touch FHD
35.56 cm (14") diagonal FHD IPS eDP LED-backlit touch screen, 250 cd/m², 45% NTSC, for HD camera and WWAN (1920 x
1080)7,8

Non-Touch FHD Privacy Panel

HP Sure View Gen3 Integrated Privacy Screen 35.56 cm (14") diagonal FHD IPS eDP anti-glare LED-backlit, 1000 cd/m², 72%
NTSC, for HD camera and WWAN (1920 x 1080)*
7. HD content required to view HD images.
8. Resolutions are dependent upon monitor capability, and resolution and color depth settings.
*Touch-enabled display and Sure View privacy panel will lower actual brightness
Docking station Total Max. resolutions Dock Connectors Technical limitations
model number of supported
supported

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QuickSpecs HP ProBook 640 G5 Notebook PC

Technical Specifications
displays
(incl. the
notebook
display)
HP UltraSlim 3 Dual 2.5K @ 60Hz 2xDP, 1xVGA Dual 2.5k only with both displays into DP
Docking Station
HP Thunderbolt 3 Single 4K@60Hz 2xDP, 1xVGA, System will perform at USB 3.0 Gen1 speeds
Dock G2 (3840 x 2160) 1xTB,1xUSB-C when connected to the dock (5Gbits)
alt-mode Thunderbolt port will function as a USB 2.0
port with data and power out (15W) only.
HP USB-C Dock G4 3 Dual 2K @ 60Hz 1xHDMI, 2xDP
Single 4K @ 60Hz
(3840 x 1440)
HP USB-C Universal 3 Dual 4K @ 60Hz 2xDP
Dock Single 5K @ 60Hz
HP USB-C Travel 2 Single 2K @ 60Hz 1xHDMI, 1xVGA Single external display
Dock Only HDMI or VGA at the time
HP USB-C Mini Dock 2 Single 4K @ 30Hz 1xHDMI, 1xVGA Single external display
Only HDMI or VGA at the time

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Technical Specifications
STORAGE AND DRIVES

Primary Storage
500 GB 7200 rpm SATA9
500 GB 7200 rpm SATA FIPS 140-2 SED9
1 TB 7200 rpm SATA9

Primary M.2 Storage

128 GB SATA-3 SS TLC9
256 GB PCIe® NVMe™ SS Value9
256 GB PCIe® Gen3x4 NVMe™ SS TLC9
256 GB SATA-3 TLC FIPS9
256 GB SATA-3 SS TLC (Opal 2)9
256 GB Intel® PCIe® NVMe™ QLC M.2 SSD with 16 GB Intel® Optane™ memory H10 (Available Q4 2019)9,10,11
512 GB PCIe® NVMe™ Value9
512 GB PCIe® Gen3x4 NVMe™ SS TLC9
512 GB PCIe® Gen3x4 NVMe™ SS TLC (Opal 2)9
512 GB SATA- 3 SS TLC (FIPS)9
512 GB Intel® PCIe® NVMe™ QLC M.2 SSD with 32 GB Intel® Optane™ memory H10 9,10,11
1 TB PCIe® Gen3x4 NVMe™ SS TLC9
256GB SATA-3 SS TLC (for Brazil only)

Cache Memory
16 GB PCIe® NVMe™ Intel® Optane™ Memory for storage acceleration 9

9. For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows 10)
is reserved for system recovery software.
10. Intel® Optane™ memory system acceleration does not replace or increase the DRAM in your system. Requires 8th Gen or
higher Intel® Core™ processor, BIOS version with Intel® Optane™ supported, Windows 10 64-bit, and an Intel® Rapid
Storage Technology (Intel® RST) driver.
11. Intel® Optane™ memory H10 only for Intel® PCIe® NVMe™ QLC M.2 SSD.

MEMORY
Maximum Memory
64 GB DDR4-2400 SDRAM12

Memory
4 GB Total System Memory (4 GB x 1)
8 GB Total System Memory (4 GB x 2)
8 GB Total System Memory (8 GB x 1)
12 GB Total System Memory (8 GB + 4 GB)
16 GB Total System Memory (16 GB x 1)
16 GB Total System Memory (8 GB x 2)
32 GB Total System Memory (16 GB x2)
48 GB Total System Memory (32 GB + 16 GB) (available Q4 2019)
64 GB Total System Memory (32 GB x2) (available Q4 2019)

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Technical Specifications
Memory Slots
2 SODIMM
Both slots are customer accessible / upgradeable
DDR4 SODIMMS, System runs at: 2400
Supports Dual Channel Memory

12. Due to the non-industry standard nature of some third-party memory modules, we recommend HP branded memory to
ensure compatibility. If you mix memory speeds, the system will perform at the lower memory speed.

NETWORKING/COMMUNICATIONS
WLAN
Intel® Wireless-AC 9560 802.11 ac (2x2) Wi-Fi® and Bluetooth® 5, vPro™13
Intel® Wireless-AC 9560 802.11 ac (2x2) Wi-Fi® and Bluetooth® 5, non-vPro™13
Intel® Wi-Fi 6** AX200 + Bluetooth® 5 (802.11ax 2x2, vPro, supporting gigabit file transfer speeds)
Intel® Wi-Fi 6** AX200 + Bluetooth® 5 (802.11ax 2x2, non-vPro, supporting gigabit file transfer speeds)

WWAN
LTE CAT6: Intel® XMM™ 7262 LTE-Advanced, Fibocom LTE/HSPA+ w/GPS14
LTE CAT9: Intel® XMM™ 7360 LTE-Advanced, Fibocom LTE/HSPA+ w/GPS14

NFC
NXP NPC300 Near Field Communication Module15

WPAN Bluetooth
BT 5.0 supported via all supported WLAN modules

Ethernet
Intel® Ethernet Connection I219-LM 10/100/1000 vPro™16
Intel® Ethernet Connection I219-V 10/100/1000 Non-vPro™16
13. Wireless access point and Internet service required and sold separately. Availability of public wireless access points
limited.
14. WWAN module requires separately purchased service contract. Check with service provider for coverage and availability
in your area. Connection speeds will vary due to location, environment, network conditions, and other factors. 4G LTE not
available on all products, in all regions.
15. Sold separately or as an optional feature.
16. The term "10/100/1000" or "Gigabit" Ethernet indicates compatibility with IEEE standard 802.3ab for Gigabit Ethernet,
and does not connote actual operating speed of 1 Gb/s. For high-speed transmission, connection to a Gigabit Ethernet server
and network infrastructure is required.
**Wireless access point and internet service required and sold separately. Availability of public wireless access points limited.
Wi-Fi 6 is backwards compatible with prior 802.11 specs. The specifications for Wi-Fi 6 (802.11ax) are draft and are not final.
If the final specifications differ from the draft specifications, it may affect the ability of the notebook to communicate with
other 802.11ax devices. Only available in countries where 802.11ax is supported.

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Technical Specifications
AUDIO/MULTIMEDIA
Audio
2 Integrated stereo speakers
Integrated dual array microphone

Webcam
720p HD HP Privacy Camera7,15,17

7. HD content required to view HD images.

15. Sold separately or as an optional feature.
17. Internet access required.

KEYBOARDS/POINTING DEVICES/BUTTONS & FUNCTION KEYS

Keyboard
HP Advanced Keyboard

Pointing Device
ClickPad, Spill-resistant with drain15
ClickPad, Spill-resistant with drain, DuraKeys & Backlit15
Dual Point, Spill-resistant with drain, DuraKeys & Backlit15
Dual Point, Spill-resistant with drain, DuraKeys & Backlit Privacy15

Function Keys
ESC: system information
F1 - Display Switching
F2 - Blank or Privacy
F3 - Brightness Down
F4 - Brightness Up
F5 - Speaker Mute
F6 - Volume Down
F7 – Volume Up
F8 - Mic Mute
F9 - Backlight Toggle (for backlit keyboard) or Blank
F10 - NumLock
F11 - Wi-fi® Toggle
F12 - Sleep

Clickpad requirements:
On/off control by driver
Taps enabled as default

Gestures:
Win 10:
Disabled by default:
3 Finger Flick
2 Finger Rotate
Momentum Motion

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QuickSpecs HP ProBook 640 G5 Notebook PC

Technical Specifications
1 Finger Vertical Scroll
Win 10:
Support PTP with Miniport driver
Settings enabled by default by MSFT:
2 Finger Scrolling
2 Finger Zoom (Pinch)
OSD (enable/disable)
3 finger tap - Cortana
3 finger flick –App switch
4 finger tap – Action Center

15. Sold separately or as an optional feature.

SOFTWARE AND SECURITY

Preinstalled Software
BIOS
HP BIOSphere Gen518
HP Drive Lock & Automatic Drive Lock19
BIOS Update via Network
Master Boot Record Security
Power On Authentication
Secure Erase20
Absolute Persistence Module21
Pre-boot Authentication

Software
HP Native Miracast Support22
HP Connection Optimizer
HP Image Assistant
HP Hotkey Support
HP JumpStart
HP Support Assistant23
HP Noise Cancellation Software
Buy Office (sold separately)

Manageability Features
HP Driver Packs24
HP System Software Manager (SSM)
HP BIOS Config Utility (BCU)
HP Client Catalog

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Technical Specifications
HP Manageability Integration Kit Gen325
HP Cloud Recovery26

Client Security Software

HP Client Security Suite Gen527
Power On Authentication
HP Fingerprint Sensor28 (select models)
HP Power On Authentication
Windows Defender29

Security Management
Pre-boot Authentication
TPM 2.0 Embedded Security Chip shipped with Windows 10 (Common Criteria EAL4+ Certified)30
Serial, USB enable/disable (via BIOS)
Power-on password (via BIOS)
Setup password (via BIOS)
Support for chassis padlocks and cable lock devices
HP Sure Click31
HP Sure Start Gen532
HP Sure Sense33

Security
TPM
Model: Infineon SLB9670
Version: 7.85
Revision: TPM 2.0
FIPS 140-2 Compliant: Yes

Smartcard Reader
Model number: Alcor AU9560
FIPS 201 Compliant: Yes

IPv6 Compliance
Yes

MD5 Hash: Please follow the instructions below to access MD5 Hash.
Log-on to http://hp.com/suppot, enter your product name, select software and drivers, select OS, select driver. After
selecting the driver, click on “Associated files” and then click on “Download”. When opening the file, under “Purpose” you
should see the appropriate “SOFTPAQ MD5:” Field

Is the BIOS on this notebook ISO/IEC 19678:2015 (formerly NIST 800-147) compliant?:
Yes
UEFI version: 2.6

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Technical Specifications

18. HP BIOSphere Gen5 is available on select HP Pro and Elite PCs. See product specifications for details. Features may vary
depending on the platform and configurations.
19. HP Drive Lock & Automatic Drive Lock is not supported on NVMe drives
20. For the methods outlined in the National Institute of Standards and Technology Special Publication 800-88 "Clear"
sanitation method. HP Secure Erase does not support platforms with Intel® Optane™.
21. Absolute agent is shipped turned off, and will be activated when customers activate a purchased subscription.
Subscriptions can be purchased for terms ranging multiple years. Service is limited, check with Absolute for availability
outside the U.S. The Absolute Recovery Guarantee is a limited warranty. Certain conditions apply. For full details visit:
http://www.absolute.com/company/legal/agreements/ computrace-agreement. Data Delete is an optional service provided
by Absolute Software. If utilized, the Recovery Guarantee is null and void. In order to use the Data Delete service, customers
must first sign a Pre-Authorization Agreement and either obtain a PIN or purchase one or more RSA SecurID tokens from
Absolute Software.
22. Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming.
23. HP Support Assistant requires Windows and Internet access.
24. HP Driver Packs not preinstalled, however available for download at http://www.hp.com/go/clientmanagement.
25. HP Manageability Integration Kit can be downloaded from http://www.hp.com/go/clientmanagement.
26. HP Cloud Recovery is available for HP Elite and Pro desktops and laptops PCs with Intel® or AMD processors and requires
an open, wired network connection. Note: You must back up important files, data, photos, videos, etc. before use to avoid
loss of data. Detail please refer to: https://support.hp.com/us-en/document/c05115630
27. HP Client Security Manager Gen5 requires Windows and is available on the select HP Pro and Elite PCs. See product
specifications for details.
28. HP Fingerprint Sensor is an optional feature and requires configuration at purchase.
29. Windows Defender Opt in and internet connection required for updates.
30. Firmware TPM is version 2.0. Hardware TPM is v1.2, which is a subset of the TPM 2.0 specification version v0.89 as
implemented by Intel Platform Trust Technology (PTT).re TPM is version 2.0. Hardware TPM is v1.2, which is a subset of the
TPM 2.0 specification version v0.89 as implemented by Intel Platform Trust Technology (PTT).
31. HP Sure Click is available on most HP PCs and supports Microsoft® Internet Explorer and Chromium™. Supported
attachments include Microsoft Office (Word, Excel, PowerPoint) and PDF files in read only mode, when Microsoft Office or
Adobe Acrobat are installed.
32. HP Sure Start Gen5 is available on select HP PCs with Intel processors. See product specifications for availability.
33. HP Sure Sense requires Windows 10. See product specifications for availability.

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Technical Specifications
POWER
Power Supply
HP Smart 45 W External AC power adapter34
HP Smart 45 W External AC power adapter - Argentina34
HP Smart 45 W 2-prong External AC power adapter34
HP Smart 45 W USB Type-C™ adapter34
HP Smart 65 W External AC power adapter34,35
HP Smart 65 W EM External AC power adapter34,35
HP Smart 65 W USB Type-C™ adapter34,35

Primary Battery
HP Long Life 3-cell, 48 Wh Li-ion36,37
HP Fast Charge Technology - 90% in 90minutes35,38

Battery Life
Up to 15 hours and 30 minutes

Power Cord
2-wire plug, 1.0m, Conventional34
3-wire plug, 1.0m, Conventional34
3-wire plug, 1.8m, Conventional34
Duckhead power cord, 1.0m, Premium34
Duckhead power cord, 1.8m, Premium34

34. Availability may vary by country.

35. Supports HP Fast Charging.
36. Battery is internal and not replaceable by customer. Serviceable by warranty.
37. Windows 10 MM14 battery life will vary depending on various factors including product model, configuration, loaded
applications, features, use, wireless functionality, and power management settings. The maximum capacity of the battery
will naturally decrease with time and usage. See http://www.bapco.com for additional details.
38. Recharges the battery up to 90% within 90 minutes when the system is off or in standby mode. Power adapter with a
minimum capacity of 65 watts is required. After charging has reached 90% capacity, charging will return to normal. Charging
time may vary +/-10% due to System tolerance.

WEIGHTS & DIMENSIONS

Weight
Starting at 3.8 lb (non-touch); Starting at 4.3 lb (touch)39
Starting at 1.73 kg (non-touch); Starting at 1.95 kg (touch)39

Dimensions (w x d x h)
13.4 x 9.5 x 0.83 in (non-touch); 13.4 x 9.5 x 0.87 in (touch)
34 x 24 x 2.09 cm (non-touch); 34 x 24 x 2.19 cm (touch)

39. Weight will vary by configuration.

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QuickSpecs HP ProBook 640 G5 Notebook PC

Technical Specifications
PORTS/SLOTS
Ports
1 USB 3.1 Type-C™ Gen 1 (Power delivery, DisplayPort™ 1.2)
3 USB 3.1 Gen 1 (1 charging)
1 HDMI 1.440
1 RJ-45
1 VGA
1 headphone/microphone combo
1 AC power

Expansion Slots
1 docking connector
1 microSD (multi-format digital media reader)

40. HDMI cable sold separately.

SERVICE AND SUPPORT

HP Services offers 3-year and 1-year limited warranties and 90 day software support options depending on country and the
SKU selected by the customer. Batteries have a default one year limited warranty except for Long Life batteries which will
have same 1-year or 3-year limited warranty as the platform. On-site service and extended coverage is also available with
HP Care Pack Services, optional extended service contracts that go beyond the standard limited warranties. To choose the
right level of service for your HP product, use the HP Care Pack Services Lookup Tool at: http://www.hp.com/go/cpc.41

41. HP Care Packs are sold separately. Service levels and response times for HP Care Packs may vary depending on your
geographic location. Service starts on date of hardware purchase. Restrictions and limitations apply. For details, visit
http://www.hp.com/go/cpc. HP services are governed by the applicable HP terms and conditions of service provided or
indicated to Customer at the time of purchase. Customer may have additional statutory rights according to applicable local
laws, and such rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty
provided with your HP Product.

CERTIFICATION AND COMPLIANCE

ENERGY STAR® certified
EPEAT® 2019 Silver42
Low halogen43
TCO 5.0 Certified
42. Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit
http://www.epeat.net for more information.
43. External power supplies, power cords, cables and peripherals are not Low Halogen. Service parts obtained after purchase
may not be Low Halogen.

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Technical Specifications
SYSTEM UNIT
Stand-Alone Power Nominal Operating 19.5 V
Requirements (AC Power) Voltage
Average Operating Power Win 10
Integrated Graphics 10 W
Discrete Graphics 15 W
Max Operating Power Discrete < 65W
UMA < 45W
Temperature Operating 32° to 95° F (0° to 35° C) (not writing optical)
Non-operating 41° to 95° F (5° to 35° C) (writing optical)
Relative Humidity Operating 10% to 90%, non-condensing
Non-operating 5% to 95%, 101.6° F (38.7° C) maximum wet bulb temperature
Shock Operating 40 G, 2 ms, half-sine
Non-operating 200 G, 2 ms, half-sine
Random Vibration Operating 0.75 grms
Non-operating 1.50 grms
Altitude (unpressurized) Operating -50 to 10,000 ft (-15.24 to 3,048 m)
Non-operating -50 to 40,000 ft (-15.24 to 12,192 m)
Planned Industry Standard UL Yes
Certifications CSA Yes
FCC Compliance Yes
®
ENERGY STAR Select models44
EPEAT® 2019 Yes, Silver in U.S.45
ICES Yes
Australia / Yes
NZ A-Tick Compliance
CCC Yes
Japan VCCI Compliance Yes
KC Yes
BSMI Yes
CE Marking Compliance Yes
BNCI or BELUS Yes
CIT Yes
GOST Yes
Saudi Arabian Compliance Yes
(ICCP)
SABS Yes

44. Configurations of the HP ProBook 640 G5 that are ENERGY STAR® qualified are identified as HP ProBook 640 G5 ENERGY
STAR on HP websites and on http://www.energystar.gov.
45. Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit
http://www.epeat.net for more information.

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Technical Specifications
ENVIRONMENTAL & INDUSTRY
Environmental Eco-Label Certifications This product has received or is in the process of being certified to the following
Data & declarations approvals and may be labeled with one or more of these marks:

• IT ECO declaration
• US ENERGY STAR®
• US Federal Energy Management Program (FEMP)
• EPEAT® 2019 Silver registered in the United States. Based on EPEAT®
registration according to IEEE 1680.1-2018 EPEAT®. Status varies by
country. See http://www.epeat.net for registration status in your
country.
• TCO Certified Edge
• China Energy Conservation Program (CECP)
• China State Environmental Protection Administration (SEPA)
• Taiwan Green Mark
• Korea Eco-label
• Japan PC Green label*

System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions
data for the Notebook model is based on a “Typically Configured Notebook”.

Energy Consumption
(in accordance with US
ENERGY STAR® test
method) 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz

Normal Operation 4.9 5.4 5.1

(Sort idle)

Normal Operation 2.5 3 2.7

(Long idle)

Sleep 0.7 0.8 0.8

Off 0.3 0.3 0.3

Note:

Energy efficiency data listed is for an ENERGY STAR® compliant product if offered
within the model family. HP computers marked with the ENERGY STAR® Logo are
compliant with the applicable U.S. Environmental Protection Agency (EPA) ENERGY
STAR® specifications for computers. If a model family does not offer ENERGY
STAR® compliant configurations, then energy efficiency data listed is for a typically

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QuickSpecs HP ProBook 640 G5 Notebook PC

Technical Specifications
configured PC featuring a hard disk drive, a high efficiency power supply, and a
Microsoft Windows® operating system.

Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz

Normal Operation 17 18 17
(Short idle)

Normal Operation 9 10 9
(Long idle)

Sleep 2 3 3

Off 1 1 1

*NOTE: Heat dissipation is calculated based on the measured watts, assuming the
service level is attained for one hour.

Declared Noise Sound Power Sound Pressure

Emissions (LWAd, bels) (LpAm, decibels)
(in accordance with
ISO 7779 and ISO 9296)

Typically Configured – 2.5 14

Idle

Fixed Disk – Random 3 23

writes

Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years.
Upgradeable features and/or components contained in the product may include:

• 3 USB ports
• 1 PC card slot (type I/II)
• 1 ExpressCard/54 slot
• 1 IEEE 1394 Port
• 2 SODIMM memory slots
• Optional expansion base docking station
• 1 multi-bay II storage port
• Interchangeable HDD

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Spare parts are available throughout the warranty period and or for up to “5”
years after the end of production.
Batteries This battery(s) in this product comply with EU Directive 2006/66/EC

Batteries used in the product do not contain:

Mercury greater the1ppm by weight
Cadmium greater than 20ppm by weight

Battery description: CR2032 (coin cell) / SS03050

Battery type: Lithium / Li-Ion/Li-Ion Polymer
Battery description: 6-cell high capacity Lithium-Ion battery (optional 8 cell
available)
Battery type:

Additional Information • This product is in compliance with the Restrictions of Hazardous

Substances (RoHS) directive - 2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and
Electronic Equipment (WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of
California; Safe Drinking Water and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680.1 (EPEAT) standard at
the Silver level, see http://www.epeat.net
• Plastics parts weighing over 25 grams used in the product are marked
per ISO11469 and ISO1043.
• This product contains 5.69% post-consumer recycled plastic (by wt.)
according to IEEE 1680.1-2018 standard, criterion 4.2.1.1.
• This product is 96.4% recycle-able when properly disposed of at end of
life.

Packaging Materials External: PAPER/Corrugated 261

Internal: PLASTIC/EPE (Expanded Polyethylene) 62
PLASTIC/Polyethylene low density - LDPE 14
PLASTIC/Polypropylene - PP 4
Material Usage This product does not contain any of the following substances in excess of
regulatory limits (refer to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_spe
cifications.html):

• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame
retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Bis(2-Ethylhexyl) phthalate (DEHP)
• Benzyl butyl phthalate (BBP)

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Technical Specifications
• Dibutyl phthalate (DBP)
• Diisobutyl phthalate (DIBP)
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to
be frequently handled or carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail
packaging has been voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging Usage HP follows these guidelines to decrease the environmental impact of product
packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and
cadmium in packaging materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging
materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in
packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated
materials.
• Reduce size and weight of packages to improve transportation fuel
efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN
6120 standards.

End-of-life Management Hewlett-Packard offers end-of-life HP product return and recycling programs in
and Recycling many geographic areas. To recycle your product, please go to:
http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office.
Products returned to HP will be recycled, recovered or disposed of in a
responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide

treatment information for each product type for use by treatment facilities. This
information (product disassembly instructions) is posted on the Hewlett Packard

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QuickSpecs HP ProBook 640 G5 Notebook PC

Technical Specifications
web site at: http://www.hp.com/go/recyclers. These instructions may be used
by recyclers and other WEEE treatment facilities as well as HP OEM customers
who integrate and re-sell HP equipment.

HP, Inc. Corporate For more information about HP’s commitment to the environment:
Environmental
Information Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-
information/environment/ecolabels.html
ISO 14001 certificates:

http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755
842

and

http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

DISPLAYS
Panel LCD 14 inch diagonal Outline Dimensions (W x H) 315.01 x 194.99 mm (typ.)
FHD (1920 x 1080) Anti-Glare
WLED UWVA 72 percent cg Active Area 309.31 x 173.98 mm (typ.)
1000 nits eDP 1.4+PSR2 flat
Privacy NWBZ Weight 265 g (max)
Diagonal Size 14 inch
Thickness 3.0 mm (max)
Interface eDP 1.4
Surface Treatment Anti-Glare
Touch Enabled No
Contrast Ratio 2000:1 (typ.)
Refresh Rate 60 Hz
Brightness* 1000 nits
Pixel Resolution 1920 x 1080 (FHD)
Format of LCD Pixel RGB
Arrangement
Backlight LED
Color Gamut Coverage 72% of NTSC
Color Depth 8 bit
Viewing Angle UWVA 85/85/85/85

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Technical Specifications
*Touch-enabled display and Sure View privacy panel will lower actual brightness

Panel LCD 14 inch diagonal Outline Dimensions (W x H) 316.17 x 197.98 mm (max)

FHD (1920 x 1080) Anti-Glare
WLED UWVA 45 percent cg Active Area 309.37 x 174.02 mm (typ.)
250 nits eDP slim NB
Weight 285 g (max)
Diagonal Size 14.0 inch
Thickness 3.0 mm (max)
Interface eDP 1.2 (2 lane)
Surface Treatment Anti-Glare
Touch Enabled No
Contrast Ratio 600:1 (typ.)
Refresh Rate 60 Hz
Brightness 250 nits
Pixel Resolution 1920 x 1080 (FHD)
Format of LCD Pixel RGB
Arrangement
Backlight LED
Color Gamut Coverage 45% of NTSC
Color Depth 6 bits
Viewing Angle UWVA 85/85/85/85

Panel LCD 14 inch diagonal Outline Dimensions (W x H) 316.112 x 197.98 mm (max)

FHD (1920 x 1080) Anti-Glare
WLED UWVA 45 percent cg Active Area 309.37 x 174.02 mm (typ.)
250 nits eDP slim Touch on
Panel NWBZ Weight 290 g (max)
Diagonal Size 14.0 inch
Thickness 3.0 mm (panel side) / 3.2 mm (PCBA Side) (max)
Interface eDP 1.2
Surface Treatment Anti-Glare On-cell
Touch Enabled Yes
Contrast Ratio 600:1 (typ.)
Refresh Rate 60 Hz
Brightness 250 nits

Pixel Resolution 1920 x 1080 (FHD)

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Technical Specifications
Format of LCD Pixel RGB
Arrangement
Backlight LED
Color Gamut Coverage 45% of NTSC
Color Depth 6 bits
Viewing Angle UWVA 85/85/85/85

14" diagonal HD SVA anti- Outline Dimensions (W x H) 320.9 x 205.6 (mm) max
glare LED-backlit non-touch;
220 cd/m2; 45% percent cg Active Area 309.40 x 173.95 (mm)
(1366 x 768)
Weight 290 g max
Diagonal Size 14 (inch)
Thickness 3.0 (mm) max
Interface eDP 1.2
Surface Treatment Anti-Glare (AG)
Touch Enabled None
Contrast Ratio 300:1 (typical)
Refresh Rate 60 Hz
Brightness 220 nits
Pixel Resolution 1366 x 768 (HD)
Format of LCD Pixel RGB
Arrangement
Backlight LED
Color Gamut Coverage 45% of NTSC
Color Depth 6 bits + Hi FRC
Viewing Angle SVA 40/40/15/30
NOTE: All specifications represent the typical specifications provided by HP's component manufacturers; actual
performance may vary either higher or lower.

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Technical Specifications
STORAGE

HDD 500 GB 7200 RPM 7 mm Drive Weight 0.21 lbs (95 g)

SATA
Rotation speed 7200RPM
Cache Buffer Up to 32MB
Height 0.28 in (7 mm)
Width 2.75 in (69.85 mm)
Interface ATA-8, SATA 3.0
Transfer Rate 600 MB/s
Seek Time Single Track: 2 ~ 1.5 ms
Average: 11 ~ 13 ms
Maximum: 18 ~ 22 ms
Logical Blocks 976773168
Operating Temperature 32° to 140°F (0° to 60°C) [ambient temp]
Security Features ATA Security
Features S.M.A.R.T., NCQ, Ultra DMA

HDD 500 GB 7200 RPM 7 mm Drive Weight 0.21 lbs (95 g)

FIPS SATA Opal2
Rotation speed 7200 rpm
Cache Buffer Up to 32MB
Width 0.28 in (7 mm)
Interface 2.75 in (69.85 mm)
Transfer Rate ATA-8, SATA 3.0
Seek Time Single Track: 2 ~ 1.5 ms
Average: 11 ~ 13 ms
Maximum: 18 ~ 22 ms
Logical Blocks 976,773,168
Operating Temperature 32° to 140°F (0° to 60°C) [ambient temp]
Security Features ATA Security; TCG Opal 2.x, FIPS
Features S.M.A.R.T., NCQ, Ultra DMA

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Technical Specifications
HDD 1 TB 7200 RPM 7 mm Drive Weight 90 g
SATA 2.5 in
Rotation speed 7200 rpm
Cache Buffer 128 MB
Height 7.2 mm Max.
Width 69.85 mm
Interface ATA-8, SATA 3.0
Transfer Rate 600 MB/s
Seek Time Single Track: 1.5 ms
Average: 13 ms
Maximum: 32 ms
Logical Blocks 1,953,525,168
Operating Temperature 0~60°C
Security Features ATA Security
Features S.M.A.R.T., NCQ, Ultra DMA, TRIM

SSD 128 GB 2280 M2 Form Factor 0.02 lb (10 g)

SATA-3 TLC
Capacity 128 GB
NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface ATA-8, SATA 3.0
Maximum Sequential Read Up To 520 MB/s
Maximum Sequential Write Up To 450 MB/s
Logical Blocks 250,069,680
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features DIPM; TRIM; DEVSLP

256 GB 2280 PCIe NVMe Value Form Factor 0.02 lb (10 g)

Solid State Drive
Capacity 256 GB
NAND Type MLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface PCIe NVMe Gen3X4
Maximum Sequential Read Up To 1700 MB/s
Maximum Sequential Write Up To 600 MB/s
Logical Blocks 703,282,608

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Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features TRIM; L1.2

SSD 256 GB 2280 M2 Form Factor 0.02 lb (10 g)

PCIe-3x4 SS NVMe TLC
Capacity 256 GB
NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface PCIe NVMe Gen3X4
Maximum Sequential Read Up To 2600 MB/s
Maximum Sequential Write Up To 900 MB/s
Logical Blocks 500,118,192
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features TRIM; L1.2

SSD 256 GB 2280 M2 SATA-3 Form Factor M.2 2280

Three Layer Cell Federal
Capacity 256 GB
Information Processing
Standard NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Weight 0.02 lb (10 g)
Interface ATA-8, SATA 3.0
Maximum Sequential Read Up To 530 MB/s
Maximum Sequential Write Up To 550 MB/s
Logical Blocks 500,118,192
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features DIPM; TRIM; DEVSLP

SSD 256 GB 2280 M2 SATA-3 Form Factor M.2 2280

Self Encrypted OPAL2 Three
Capacity 256 GB
Layer Cell
NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Weight 0.02 lb (10 g)

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Technical Specifications
Interface ATA-8, SATA 3.0
Maximum Sequential Read Around 530 ~ 560 MB/s
Maximum Sequential Write Around 500 ~ 530 MB/s
Logical Blocks 500,118,192
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features ATA Security; TCG OPAL 2.0; DIPM; TRIM; DEVSLP

256 GB 2280 PCIe-3x2x2 Form Factor M.2 2280

NVMe+SSD 16 GB 3D Xpoint
Capacity 256 GB
NAND Type QLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Weight 0.02 lb (10 g)
Interface PCIe NVMe Gen3X4
Maximum Sequential Read Up To 1450 MB/s
Maximum Sequential Write Up To 650 MB/s
Logical Blocks 500,118,192
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features TRIM; L1.2, Optane Storage acceleration

SSD 512 GB 2280 PCIe Form Factor M.2 2280

NVMe Value
Capacity 512 GB
NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Weight 0.02 lb (10 g)
Interface PCIe NVMe Gen3X4
Maximum Sequential Read Around 1500 ~ 1700 MB/s
Maximum Sequential Write Around 860 ~ 1500 MB/s
Logical Blocks 1,000,215,215
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features ATA Security; TRIM; L1.2

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SSD 512 GB 2280 M2 Form Factor 0.02 lb (10 g)

PCIe-3x4 SS NVMe TLC
Capacity 512 GB
NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface PCIe NVMe Gen3X4
Maximum Sequential Read Up To 2600 MB/s
Maximum Sequential Write Up To 1400 MB/s
Logical Blocks 1,000,215,216
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features TRIM; L1.2

SSD 512 GB 2280 PCIe-3x4 Form Factor M.2 2280

NVMe Self Encrypted OPAL2
Capacity 512 GB
Three Layer Cell
NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface PCIe NVMe Gen3X4
Maximum Sequential Read Around 3000 ~ 3400 MB/s
Maximum Sequential Write Around 1800 ~ 2500 MB/s
Logical Blocks 1,000,215,216
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features ATA Security; TCG Opal 2.0; FIPS; DIPM; TRIM; DEVSLP

SSD 512 GB 2280 M2 SATA-3 Form Factor 0.02 lb (10 g)

TLC FIPS
Capacity 512 GB
NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface ACS-3, SATA 3.2
Maximum Sequential Read Up To 530 MB/s
Maximum Sequential Write Up To 400 MB/s
Logical Blocks 1,000,215,216
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]

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Features DIPM; TRIM; DEVSLP

SSD 512 GB 2280 PCIe-3x2x2 Form Factor M.2 2280

NVMe+SSD 32 GB 3D Xpoint
Capacity 512 GB
NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Weight 0.02 lb (10 g)
Interface PCIe NVMe Gen3X4
Maximum Sequential Read Up To 2400 MB/s
Maximum Sequential Write Up To 1300 MB/s
Logical Blocks 1,000,215,215
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features ATA Security, TRIM; L1.2

SSD 1 TB 2280 PCIe-3x4 Form Factor 0.02 lb (10 g)

NVMe TLC SS
Capacity 1TB
NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface PCIe NVMe Gen3X4
Maximum Sequential Read 2900
Maximum Sequential Write 2000
Logical Blocks 2000409263
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features TRIM; L1.2

SSD 16 GB 2280 PCIe-3x2 Form Factor M.2 2280

NVMe 3D Xpoint
Capacity 16 GB
NAND Type Xpoint
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface PCIe NVMe Gen3X2

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Maximum Sequential Read 1400
Maximum Sequential Write 300
Logical Blocks 28,181,188
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features L1.2

SSD 256 GB 2280 M2 Form Factor M.2 2280

SATA-3 TLC
Capacity 256 GB
NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Weight 0.02 lb (10 g)
Interface ATA-8, SATA 3.0
Maximum Sequential Read Up To 550 MB/s
Maximum Sequential Write Up To 450 MB/s
Logical Blocks 500,118,192
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features DIPM; TRIM; DEVSLP
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
10) is reserved for system recovery software.

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NETWORKING/COMMUNICATIONS
Intel® Wi-Fi 6** AX200 + Wireless LAN Standards IEEE 802.11a
BT5 vPro IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi® certified
Frequency Band •802.11b/g/n/ax
2.402 – 2.482 GHz
•802.11a/n/ac/ax
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
Data Rates •802.11b: 1, 2, 5.5, 11 Mbps
•802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
•802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, 80MHz &
160MHz)
•802.11ax: MCS0 ~ MCS11, (1SS and 2SS) (20MHz, 40MHz, 80MHz &
160MHz)
Modulation Direct Sequence Spread Spectrum
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM , 1024QAM
Security3 •IEEE and Wi-Fi compliant 64 / 128 bit WEP encryption for a/b/g mode only
•AES-CCMP: 128 bit in hardware
•802.1x authentication
•WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
•WPA2 certification
•IEEE 802.11i
•Cisco Certified Extensions, all versions through CCX4 and CCX Lite
•WAPI

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Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power2 • 802.11b: +18.5dBm minimum
• 802.11g: +17.5dBm minimum
• 802.11a: +18.5dBm minimum
• 802.11n HT20(2.4GHz): +15.5dBm minimum
• 802.11n HT40(2.4GHz): +14.5dBm minimum
• 802.11n HT20(5GHz): +15.5dBm minimum
• 802.11n HT40(5GHz): +14.5dBm minimum
• 802.11ac VHT80(5GHz): +11.5dBm minimum
• 802.11ac VHT160(5GHz): +11.5dBm minimum
• 802.11ax HT40(2.4GHz): +10dBm minimum
• 802.11ax VHT160(5GHz): +10dBm minimum
Power Consumption •Transmit mode 2.0 W
•Receive mode 1.6 W
•Idle mode (PSP) 180 mW (WLAN Associated)
•Idle mode 50 mW (WLAN unassociated)
•Connected Standby 10 mW
•Radio disabled 8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity4 •802.11b, 1Mbps: -93.5dBm maximum
•802.11b, 11Mbps: -84dBm maximum
• 802.11a/g, 6Mbps: -86dBm maximum
• 802.11a/g, 54Mbps: -72dBm maximum
• 802.11n, MCS07: -67dBm maximum
• 802.11n, MCS15: -64dBm maximum
• 802.11ac, MCS0: -84dBm maximum
• 802.11ac, MCS9: -59dBm maximum
•802.11ax, MCS11(HT40): -59dBm maximum
•802.11ax, MCS11(VHT160): -58.5dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO communications and Bluetooth communications

Form Factor PCI-Express M.2 MiniCard

Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8g

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2. Type 126: 1.3g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1 Wireless Technology

Bluetooth Specification 4.0/4.1/4.2/5.0/5.1 Compliant

Frequency Band 2402 to 2480 MHz
Number of Available Legacy: 0~79 (1 MHz/CH)
Channels BLE: 0~39 (2 MHz/CH)
Signaling Data Rate Legacy: 3 Mbps signaling data rate1 2.17 Mbps
BLE: 1 Mbps signaling data rate1 0.2 Mbps
1. Actual throughput may vary.

Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice

channels

Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps

asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with
a maximum transmit power of + 9.5 dBm for BR and EDR.
Power Consumption Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Bluetooth Software Microsoft Windows Bluetooth Software
Supported
Power Management Microsoft Windows ACPI, and USB Bus Support
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management ETS 300 328, ETS 300 826
Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Bluetooth Profiles BT4.1-ESR 5/6/7 Compliance
Supported LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels

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Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
Security & Manageability Intel® vPro™ support with appropriate Intel® chipset components

1. Wireless access point and Internet service is required. Availability of public wireless access point is limited.
2. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
3. Check latest software/driver release for updates on supported security features.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10%
for 802.11a/g (OFDM modulation).
**Wireless access point and internet service required and sold separately. Availability of public wireless access points limited.
Wi-Fi 6 is backwards compatible with prior 802.11 specs. The specifications for Wi-Fi 6 (802.11ax) are draft and are not final.
If the final specifications differ from the draft specifications, it may affect the ability of the notebook to communicate with
other 802.11ax devices. Only available in countries where 802.11ax is supported.

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QuickSpecs HP ProBook 640 G5 Notebook PC

Technical Specifications
Intel® Wi-Fi 6** AX200 + Wireless LAN Standards IEEE 802.11a
BT5 non-vPro IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi® certified
Frequency Band •802.11b/g/n/ax
2.402 – 2.482 GHz
•802.11a/n/ac/ax
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
Data Rates •802.11b: 1, 2, 5.5, 11 Mbps
•802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
•802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, 80MHz &
160MHz)
• 802.11ax: MCS0 ~ MCS11, (1SS and 2SS) (20MHz, 40MHz, 80MHz &
160MHz)
Modulation Direct Sequence Spread Spectrum
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM , 1024QAM
Security3 •IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
•AES-CCMP: 128 bit in hardware
•802.1x authentication
•WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES
•WPA2 certification
•IEEE 802.11i
•WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points

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Technical Specifications
Output Power2 • 802.11b: +18.5dBm minimum
• 802.11g: +17.5dBm minimum
• 802.11a: +18.5dBm minimum
• 802.11n HT20(2.4GHz): +15.5dBm minimum
• 802.11n HT40(2.4GHz): +14.5dBm minimum
• 802.11n HT20(5GHz): +15.5dBm minimum
• 802.11n HT40(5GHz): +14.5dBm minimum
• 802.11ac VHT80(5GHz): +11.5dBm minimum
• 802.11ac VHT160(5GHz): +11.5dBm minimum
• 802.11ax HT40(2.4GHz): +10dBm minimum
• 802.11ax VHT160(5GHz): +10dBm minimum
Power Consumption •Transmit mode 2.0 W
•Receive mode 1.6 W
•Idle mode (PSP) 180 mW (WLAN Associated)
•Idle mode 50 mW (WLAN unassociated)
•Connected Standby 10 mW
•Radio disabled 8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
4
Receiver Sensitivity •802.11b, 1Mbps: -93.5dBm maximum
•802.11b, 11Mbps: -84dBm maximum
• 802.11a/g, 6Mbps: -86dBm maximum
• 802.11a/g, 54Mbps: -72dBm maximum
• 802.11n, MCS07: -67dBm maximum
• 802.11n, MCS15: -64dBm maximum
• 802.11ac, MCS0: -84dBm maximum
• 802.11ac, MCS9: -59dBm maximum
•802.11ax, MCS11(HT40): -59dBm maximum
•802.11ax, MCS11(VHT160): -58.5dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure

Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard
Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8g
2. Type 126: 1.3g
Operating Voltage 3.3v +/- 9%

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Technical Specifications
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1 Wireless Technology

Bluetooth Specification 4.0/4.1/4.2/5.0/5.1 Compliant

Frequency Band 2402 to 2480 MHz
Number of Available Legacy: 0~79 (1 MHz/CH)
Channels BLE: 0~39 (2 MHz/CH)
Signaling Data Rate Legacy: 3 Mbps signaling data rate1 2.17 Mbps
BLE: 1 Mbps signaling data rate1 0.2 Mbps
1. Actual throughput may vary.

Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice

channels

Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps

asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with
a maximum transmit power of + 9.5 dBm for BR and EDR.
Power Consumption Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Bluetooth Software Microsoft Windows Bluetooth Software
Supported
Power Management Microsoft Windows ACPI, and USB Bus Support
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management ETS 300 328, ETS 300 826
Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Bluetooth Profiles BT4.1-ESR 5/6/7 Compliance
Supported LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance

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Technical Specifications
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
1. Wireless access point and Internet service is required. Availability of public wireless access point is limited.
2. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
3. Check latest software/driver release for updates on supported security features.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10%
for 802.11a/g (OFDM modulation).
**Wireless access point and internet service required and sold separately. Availability of public wireless access points limited.
Wi-Fi 6 is backwards compatible with prior 802.11 specs. The specifications for Wi-Fi 6 (802.11ax) are draft and are not final.
If the final specifications differ from the draft specifications, it may affect the ability of the notebook to communicate with
other 802.11ax devices. Only available in countries where 802.11ax is supported.

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Technical Specifications
Intel® 9560 Wireless LAN Standards IEEE 802.11a
802.11a/b/g/n/ac (2 x 2) IEEE 802.11b
Wi-Fi® and Bluetooth®
5.0 Combo1 vPro IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi® certified
Frequency Band •802.11b/g/n
2.402 – 2.482 GHz
•802.11a/n/ac
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
Data Rates •802.11b: 1, 2, 5.5, 11 Mbps
•802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
•802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, 80MHz &
160MHz)
Modulation Direct Sequence Spread Spectrum
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security3 •IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
•AES-CCMP: 128 bit in hardware
•802.1x authentication
•WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES
•WPA2 certification
•IEEE 802.11i
•WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
2
Output Power • 802.11b: +18.5dBm minimum
• 802.11g: +17.5dBm minimum
• 802.11a: +18.5dBm minimum

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Technical Specifications
• 802.11n HT20(2.4GHz): +15.5dBm minimum
• 802.11n HT40(2.4GHz): +14.5dBm minimum
• 802.11n HT20(5GHz): +15.5dBm minimum
• 802.11n HT40(5GHz): +14.5dBm minimum
• 802.11ac VHT80(5GHz): +11.5dBm minimum
• 802.11ac VHT160(5GHz): +11.5dBm minimum
Power Consumption •Transmit mode 2.0 W
•Receive mode 1.6 W
•Idle mode (PSP) 180 mW (WLAN Associated)
•Idle mode 50 mW (WLAN unassociated)
•Connected Standby 10 mW
•Radio disabled 8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
4
Receiver Sensitivity 802.11b, 1Mbps: -93.5dBm maximum
802.11b, 11Mbps: -84dBm maximum
802.11a/g, 6Mbps: -86dBm maximum
802.11a/g, 54Mbps: -72dBm maximum
802.11n, MCS07: -67dBm maximum
802.11n, MCS15: -64dBm maximum
802.11ac, MCS0: -84dBm maximum
802.11ac, MCS9: -59dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure

Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard with CNVi Interface
Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8g
2. Type 126: 1.3g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)

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Technical Specifications
LED Activity LED Amber – Radio OFF
LED White – Radio ON
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0 Wireless Technology

Bluetooth Specification 4.0/4.1/4.2/5.0 Compliant

Frequency Band 2402 to 2480 MHz
Number of Available Legacy: 0~79 (1 MHz/CH)
Channels BLE: 0~39 (2 MHz/CH)
Signaling Data Rate Legacy: 3 Mbps signaling data rate1 2.17 Mbps
BLE: 1 Mbps signaling data rate1 0.2 Mbps
1. Actual throughput may vary.

Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice

channels

Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps

asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with
a maximum transmit power of + 4 dBm for BR and EDR.
Power Consumption Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Bluetooth Software Microsoft Windows Bluetooth Software
Supported
Power Management Microsoft Windows ACPI, and USB Bus Support
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management ETS 300 328, ETS 300 826
Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Bluetooth Profiles BT4.1-ESR 5/6/7 Compliance
Supported LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)

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Technical Specifications
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
Security & Manageability Intel® vPro™ support with appropriate Intel® chipset components

1. Wireless access point and Internet service is required. Availability of public wireless access point is limited.
2. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
3. Check latest software/driver release for updates on supported security features.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10%
for 802.11a/g (OFDM modulation).

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Technical Specifications
Intel® 9560 Wireless LAN Standards IEEE 802.11a
802.11a/b/g/n/ac (2 x 2) IEEE 802.11b
Wi-Fi® and Bluetooth®
5.0 Combo1 non-vPro IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi® certified
Frequency Band •802.11b/g/n
2.402 – 2.482 GHz
•802.11a/n/ac
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
Data Rates •802.11b: 1, 2, 5.5, 11 Mbps
•802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
•802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, 80MHz &
160MHz)
Modulation Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security3 •IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
•AES-CCMP: 128 bit in hardware
•802.1x authentication
•WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES
•WPA2 certification
•IEEE 802.11i
•WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
2
Output Power • 802.11b: +18.5dBm minimum
• 802.11g: +17.5dBm minimum
• 802.11a: +18.5dBm minimum

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Technical Specifications
• 802.11n HT20(2.4GHz): +15.5dBm minimum
• 802.11n HT40(2.4GHz): +14.5dBm minimum
• 802.11n HT20(5GHz): +15.5dBm minimum
• 802.11n HT40(5GHz): +14.5dBm minimum
• 802.11ac VHT80(5GHz): +11.5dBm minimum
• 802.11ac VHT160(5GHz): +11.5dBm minimum
Power Consumption •Transmit mode: 2.0 W
•Receive mode: 1.6 W
•Idle mode (PSP) 180 mW (WLAN Associated)
•Idle mode: 50 mW (WLAN unassociated)
•Connected Standby/Modern Standby: 10mW
•Radio disabled: 8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
4
Receiver Sensitivity 802.11b, 1Mbps: -93.5dBm maximum
802.11b, 11Mbps: -84dBm maximum
802.11a/g, 6Mbps: -86dBm maximum
802.11a/g, 54Mbps: -72dBm maximum
802.11n, MCS07: -67dBm maximum
802.11n, MCS15: -64dBm maximum
802.11ac, MCS0: -84dBm maximum
802.11ac, MCS9: -59dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure

Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard with CNVi Interface
Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8g
2. Type 126: 1.3g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)

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Technical Specifications
LED Activity LED Amber – Radio OFF
LED White – Radio ON
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0 Wireless Technology

Bluetooth Specification 4.0/4.1/4.2/5.0 Compliant

Frequency Band 2402 to 2480 MHz
Number of Available Legacy: 0~79 (1 MHz/CH)
Channels BLE: 0~39 (2 MHz/CH)
Signaling Data Rate Legacy: 3 Mbps signaling data rate1 2.17 Mbps
BLE: 1 Mbps signaling data rate1 0.2 Mbps
1. Actual throughput may vary.

Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice

channels

Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps

asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with
a maximum transmit power of + 4 dBm for BR and EDR.
Power Consumption Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Bluetooth Software Microsoft Windows Bluetooth Software
Supported
Power Management Microsoft Windows ACPI, and USB Bus Support
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management ETS 300 328, ETS 300 826
Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Bluetooth Profiles BT4.1-ESR 5/6/7 Compliance
Supported LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)

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Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
1. Wireless access point and Internet service is required. Availability of public wireless access point is limited.
2. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
3. Check latest software/driver release for updates on supported security features.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10%
for 802.11a/g (OFDM modulation).

Intel® XMM™ 7360 Technology/Operating FDD LTE: 2100 (Band 1), 1900 (Band 2), 1800 (Band 3),
LTE-Advanced CAT91 bands 1700/2100 (Band 4), 850 (Band 5), 2600 (Band 7), 900 (Band 8), 1400
(Band 11), 700 (Band 12 lower), 700 (Band 13 upper), 700 (Band 17 lower),
850 (Band 18 lower), 850 (Band 19 upper), 800 (Band 20), 1400 (Band 21),
850 (Band 26), 700 (Band 28), 700 (Band 29 RX only), 2300 (Band 30),
1700/2100 (Band 66).
TDD LTE: 2600 (Band 38), 1900 (Band 39), 2400 (Band 40), 2500 (Band 41).
HSPA+: 2100 (Band 1), 1900 (Band 2), 1700/2100 (Band 4),
850 (Band 5), 900 (Band 8) MHz
Wireless protocol 3GPP Release 11 LTE Specification CAT.9, DL 60MHz BW throughput up to
standards 450Mbps; UL 20MHz throughput up to 50Mbps
WCDMA R99, 3GPP Release 5, 6, 7 and 8 UMTS Specification
GPS Standalone, A-GPS (MS-A, MS-B)
GPS bands 1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz, Beidou 1561.098
MHz
Maximum data rates LTE: 450 Mbps (Download), 50 Mbps (Upload)
DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload)
HSPA+: 21Mbps (Download), 5.76 Mbps (Upload)
Maximum output power LTE: 23 dBm
HSPA+: 23.5 dBm
Maximum power LTE: 1,200 mA (peak); 900 mA (average)
consumption HSPA+: 1,100 mA (peak); 800 mA (average)
Form Factor M.2, 3042-S3 Key B
Weight 5.8 g
Dimensions 42 x 30 x 2.3 mm
1. Mobile Broadband is an optional feature and requires configuration at time of purchase. Connection requires wireless data
service contract, network support, and is not available in all areas. Contact service provider to determine the coverage area

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Technical Specifications
and availability. Connection speeds will vary due to location, environment, network conditions, and other factors. 4G LTE not
available on all products or in all countries.

Intel® XMM™ 7262 LTE- Technology/Operating FDD LTE: 2100 (Band 1), 1800 (Band 3), 850 (Band 5), 2600 (Band 7), 900
Advanced DL CAT6 bands (Band 8), 800 (Band 20), 700 (Band 28),
HSPA+: 2100 (Band 1), 850 (Band 5), 900 (Band 8)
Wireless protocol 3GPP Release 11 LTE Specification CAT.6, DL 40MHz BW throughput up to
standards 300Mbps; UL 20MHz throughput up to 50Mbps
WCDMA R99, 3GPP Release 5, 6, 7 and 8 UMTS Specification
GPS Standalone, A-GPS (MS-A, MS-B and XTRA)
GPS bands 1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz
Maximum data rates LTE: 300 Mbps (Download), 50 Mbps (Upload)
DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload)
HSPA+: 21Mbps (Download), 5.76 Mbps (Upload)
Maximum output power LTE: 23 dBm
HSPA+: 23.5 dBm
Maximum power LTE: 1,200 mA (peak); 830 mA (average)
consumption HSPA+: 1,100 mA (peak); 680 mA (average)
Form Factor M.2, 3042-S3 Key B
Weight 6g
Dimensions 42 x 30 x 2.3 mm
1. Mobile Broadband is an optional feature and requires configuration at time of purchase. Connection requires wireless data
service contract, network support, and is not available in all areas. Contact service provider to determine the coverage area
and availability. Connection speeds will vary due to location, environment, network conditions, and other factors. 4G LTE not
available on all products or in all countries.

Near Field Dimensions (L x W x H) Module 25 mm by 10 mm by 2.0 mm

Communications
Controller (optional) Chipset NPC100
System interface I2C
NFC RF standards ISO/IEC 14443 A
ISO/IEC 14443 B
ISO/IEC 15693
ISO/IEC 18092
ECMA-340 NFCIP-1 Target and Initiator
ECMA-320 NFCIP-2
NFC Forum Support Tag Type 1, Type 2, Type3 and Type 4, NFCIP-1 and NFCIP-2

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Reader (PCD-VCD) Mode1 ISO/IEC 14443 A
ISO/IEC 14443 B
ISO/IEC 15693
MIFARE 1K
MIFARE 4K
MIFARE DESFire
FeliCa
Jewel and Topaz cards
Card Emulation (PICC- ISO/IEC 14443 A
VICC) Mode1 ISO/IEC 14443 B and B’
MIFARE
FeliCa
Frequency 13.56 MHz
NFC Modes Supported Reader/Writer, Peer-to-Peer
Raw RF Data Rates 106, 212, 424, 848 kbps
Operating temperature 0°C to 70°C
Storage temperature -20°C to 125°C
Humidity 10-90% operating
5-95% non-operating
Supply Operating voltage 4.35 to 5.25 Volts
I/O Voltage 1.8V or 3.3V

Power Consumption Mode Power Consumption, Typical

(Booster enable, VBAT=
3.3V, VCC_BOOST = 5V) Polling 7.3 mA
Detected Test Tag Type 1 Total 283.8 mA
Net Module 236.8 mA
Detected Test Tag Type 2 Total 288.8 mA
Net Module 241.8 mA
Detected Test Tag Type 3 Total 287.7 mA
Net Module 240.7 mA
Detected Test Tag Type 4 Total 282.3 mA
Net Module 235.3 mA
Antenna Antenna connector, 0.5mm pitch, 7 connector FPC. Antenna matching is
external to module.

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QuickSpecs HP ProBook 640 G5 Notebook PC

Technical Specifications
Intel® i219LM Connector RJ-45
10/100/1000
Integrated NIC System Interface PCI (Intel proprietary) + SMBus
Data rates supported 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-
30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40)
Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100
Mbit/s
IEEE Compliance IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.1q VLAN support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
IEEE 802.3az EEE (Energy Efficient Ethernet)
Performance TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling (Hash Mode Only)
Jumbo Frame 9K
Power consumption Cable Disconnection: 25mW
100Mbps Full Run: 450mW
1000bp Full Run: 1000mW
WoL Enable(S3/S4/S5): 50mW
WoL Disable(S3/S4/S5): 25mW
Power Management ACPI compliant – multiple power modes
Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power
consumption
Management Interface Auto MDI/MDIX Crossover cable detection
IT Manageability Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft
Wake-Up Frame); Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x,
clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
Security & Manageability Intel® vPro™ support with appropriate Intel® chipset components

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QuickSpecs HP ProBook 640 G5 Notebook PC

Technical Specifications
Intel® i219v Connector RJ-45
10/100/1000 Integrated
NIC System Interface PCI (Intel proprietary) + SMBus
Data rates supported 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-
30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40)
Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100
Mbit/s
IEEE Compliance IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.1q VLAN support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
IEEE 802.3az EEE (Energy Efficient Ethernet)
Performance TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling (Hash Mode Only)
Jumbo Frame 9K
Power consumption Cable Disconnection: 25mW
100Mbps Full Run: 450mW
1000bp Full Run: 1000Mw
WoL Enable(S3/S4/S5): 50mW
WoL Disable(S3/S4/S5): 25mW
Power Management ACPI compliant – multiple power modes
Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power
consumption
Management Interface Auto MDI/MDIX Crossover cable detection
IT Manageability Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft
Wake-Up Frame); Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x,
clause 30)
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
Security & Manageability Intel® vPro™ support with appropriate Intel® chipset components

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QuickSpecs HP ProBook 640 G5 Notebook PC

Technical Specifications
Intel® I219-LM 1 Gigabit Connector RJ-45
Network Connection LOM System Interface
PCI (Intel proprietary) + SMBus
(vPro)
Data rates supported 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-
30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40)
Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100
Mbit/s
IEEE Compliance IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.1q VLAN support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
IEEE 802.3az EEE (Energy Efficient Ethernet)
Performance TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling (Hash Mode Only)
Jumbo Frame 9K
Power consumption Cable Disconnetion: 25mW
100Mbps Full Run: 450mW
1000bp Full Run: 1000mW
WoL Enable(S3/S4/S5): 50mW
WoL Disable(S3/S4/S5): 25mW
Power ACPI compliant – multiple power modes
Management Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power
consumption
Management Interface Auto MDI/MDIX Crossover cable detection
IT Manageability Wake-on-LAN from modern standby or sleep state (Magic Packet and
Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x,
clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
Security & Manageability Intel® vPro™ support with appropriate Intel® chipset components

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QuickSpecs HP ProBook 640 G5 Notebook PC

Technical Specifications
Intel® I219-LM 1 Gigabit Connector RJ-45
Network Connection LOM System Interface
PCI (Intel proprietary) + SMBus
(non-vPro)
Data rates supported 1. 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
2. 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-
30)
3. 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 802.3 clauses
40)
4. Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10, 100 &
1000 Mbit/s
IEEE Compliance IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.1q VLAN support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
IEEE 802.3az EEE (Energy Efficient Ethernet)
IEEE 802.3i 10BASE-T
IEEE 802.3u 100BASE-TX
IEEE 802.3ab 1000BAE-T
IEEE 802.3bz 2.5GBASE-T
Performance TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling (Hash Mode Only)
Jumbo Frame 9K
Power consumption Cable Disconnetion: 25mW
100Mbps Full Run: 450mW
1000bps Full Run: 1000mW
WoL Enable(S3/S4/S5): 50mW
WoL Disable(S3/S4/S5): 25mW
Power ACPI compliant – multiple power modes
Management Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power
consumption
Management Interface Auto MDI/MDIX Crossover cable detection
IT Manageability Wake-on-LAN from modern standby or sleep state (Magic Packet and
Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x,
clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
Security & Manageability Intel® non-vPro™ support with appropriate Intel® chipset components

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QuickSpecs HP ProBook 640 G5 Notebook PC

Technical Specifications
POWER
AC Adapter 45 Watt nPFC Dimensions 62.0 x 62.0 x 28.5 mm
Wall Mount USB type C™ Weight unit: 220 g +/- 10 g
Straight 1.8m C6NS
Input Input Efficiency Average Efficiency of 25%, 50%, 75%, 100%
load condition with 115Vac/230Vac Spec:
5V: 81.5%
9V: 86.7%
10V: 87.5%
12V: 87.8%
15V: 87.8%
20V: 87.8%
Input frequency range 47 ~ 63 Hz
Input AC current 1.4 A at 90 VAC
Output Output power Average Efficiency of 25%, 50%, 75%, 100%
load condition with 115Vac/230Vac Spec
DC output 5V: 81.5%
Hold-up time 9V: 86.7%
Output current limit 10V: 87.5%
Connector Non-Standard C6
Environmental Design Operating temperature 32°Fto 95°F (0°to 35°C)
Non-operating (storage) -4°F to 185°F (-20°to 85°C)
temperature
Altitude 0 to 16,400 ft (0 to 5000m)
Humidity 20% to 95%
Storage Humidity 10% to 95%
EMI and Safety CE Mark - full compliance with LVD and EMC directives
Certifications Worldwide safety standards - IEC60950, EN60950, UL60950, Class1,
SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B,
FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE.
MTBF - over 200,000 hours at 25°C ambient condition.

AC Adapter 45 Watt Dimensions 95.0 x 40.0 x 26.5 mm

Smart nPFC Standard Weight unit: 200 g +/- 10 g
Barrel 4.5mm Right Angle
Input Input Efficiency 87.74 % at 115 Vac and 88.4 % at 230Vac
1.8m
Input frequency range 47 ~ 63 Hz
Input AC current Max. 1.4 A at 90 Vac
Output Output power 45W
DC output 19.5V
Hold-up time 5ms at 115 Vac input
Output current limit <8.0A

Connector C6
Environmental Design Operating temperature 32°F to 95°F (0°to 35°C)

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QuickSpecs HP ProBook 640 G5 Notebook PC

Technical Specifications
Non-operating (storage) -4°F to 185°F (-20°to 85°C)
temperature
Altitude 0 to 16,400 ft (0 to 5000m)
Humidity 20% to 95%
Storage Humidity 10% to 95%
Safety Certifications CE Mark - full compliance with LVD and EMC directives
Worldwide safety standards - IEC60950, EN60950, UL60950, Class1,
SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B,
FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE.
MTBF - over 200,000 hours at 25°C ambient condition.

AC Adapter 45 Watt Dimensions 95.0 x 40.0 x 26.5 mm

Smart nPFC Standard Weight unit: 200 g +/- 10 g
Barrel 4.5mm Right Angle
1.8m Argentina Input Input Efficiency 87.74 % at 115 Vac and 88.4 % at 230Vac
Input frequency range 47 ~ 63 Hz
Input AC current Max. 1.4 A at 90 Vac
Output Output power 45W
DC output 19.5V
Hold-up time 5ms at 115 Vac input
Output current limit <8.0A

Connector C6
Environmental Design Operating temperature 32°F to 95°F (0°to 35°C)
Non-operating (storage) -4°F to 185°F (-20°to 85°C)
temperature
Altitude 0 to 16,400 ft (0 to 5000m)
Humidity 20% to 95%
Storage Humidity 10% to 95%
Safety Certifications CE Mark - full compliance with LVD and EMC directives
Worldwide safety standards - IEC60950, EN60950, UL60950, Class1,
SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B,
FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE.
MTBF - over 200,000 hours at 25°C ambient condition.

AC Adapter 45 Watt Dimensions 95.0 x 40.0 x 26.5 mm

Smart nPFC Standard Weight unit: 200 g +/- 10 g
Barrel 4.5mm Right Angle
1.8m 2prong Input Input Efficiency 87.74% at 115Vac and 88.4% at 230Vac
Input frequency range 47 to 63 Hz
Input AC current Max. 1.4 A at 90 Vac
Output Output power 45W
DC output 19.5V

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QuickSpecs HP ProBook 640 G5 Notebook PC

Technical Specifications
Hold-up time 5ms at 115 VAC input
Output current limit <8.0A
Connector C6
Environmental Design Operating temperature 32°F to 95°F (0°to 35°C)
Non-operating (storage) -4°F to 185°F (-20°to 85°C)
temperature
Altitude 0 to 16,400 ft (0 to 5000m)
Humidity 20% to 95%
Storage Humidity 10% to 95%
Safety Certifications CE Mark - full compliance with LVD and EMC directives
Worldwide safety standards - IEC60950, EN60950, UL60950, Class1,
SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B,
FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE.
MTBF - over 200,000 hours at 25°C ambient condition.

AC Adapter 65 Watt nPFC Dimensions 74 x 74x28.5mm

USB type C Straight 1.8m Weight unit: 245 g +/- 10 g
C6NS
Input Input Efficiency 81.5% min at 115 Vac/ 230Vac @ 5V/3A
86.7% min at 115 Vac/ 230Vac @ 9V/3A
88% min at 115 Vac/ 230Vac @ 10V/5A
88% min at 115 Vac/ 230Vac @ 12V/5A
89% min at 115 Vac/ 230Vac @ 15V/4.33A
89% min at 115 Vac/ 230Vac @ 20V/3.25A
Input frequency range 47 ~ 63 Hz
Input AC current 1.7 A at 90 VAC and maximum load
Output Output power 65W
DC output 5V/9V/10V/12V/15V/20V
Hold-up time 5ms at 115 Vac input
Output current limit <8.0A
Connector Non-Standard C6
Environmental Design Operating temperature 32° to 95° F (0° to 35° C)
Non-operating (storage) -4° to 185° F (-20° to 85° C)
temperature
Altitude 0 to 16,400 ft (0 to 5000m)
Humidity 5% to 95%
Storage Humidity 5% to 95%
Safety Certifications CE Mark - full compliance with LVD and EMC directives
Worldwide safety standards - IEC60950, EN60950, UL60950, Class1,
SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B,
FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE.
MTBF - over 100,000 hours at 25°C ambient condition.

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QuickSpecs HP ProBook 640 G5 Notebook PC

Technical Specifications
AC Adapter 65 Watt Dimensions 102 x 55 x 30 mm
Smart nPFC EM Barrel Weight unit: 250 g +/- 10 g
4.5 mm New EM
Input Input Efficiency 88.0 % at 115 Vac and 89.0 % at 230Vac
Input frequency range 47 ~ 63 Hz
Input AC current Max. 1.7 A at 90 Vac
Output Output power 65W
DC output 19.5V
Hold-up time 5ms at 115 Vac input
Output current limit <11.0A
Connector C6
Environmental Design Operating temperature 32° to 95° F (0° to 35° C)
Non-operating (storage) -4° to 185° F (-20° to 85° C)
temperature
Altitude 0 to 16,400 ft (0 to 5000m)
Humidity 20% to 95%
Storage Humidity 10% to 95%
Safety Certifications CE Mark - full compliance with LVD and EMC directives
Worldwide safety standards - IEC60950, EN60950, UL60950, Class1,
SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B,
FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE.
MTBF - over 200,000 hours at 25°C ambient condition.

AC Adapter 65 Watt Dimensions 90.0 x 51 x 28.5 mm

Smart nPFC Standard Weight unit: 230 g +/- 10 g
Barrel 4.5 mm Right
Input Input Efficiency 88.0 % at 115 Vac and 89.0 % at 230Vac
Angle 1.8 m
Input frequency range 47 ~ 63 Hz
Input AC current Max. 1.7 A at 90 Vac
Output Output power 65W
DC output 19.5V
Hold-up time 5ms at 115 Vac input
Output current limit <11.0A
Connector 4.5mm Barrel Type C6
Environmental Design Operating temperature 32° to 95° F (0° to 35° C)
Non-operating (storage) -4° to 185° F (-20° to 85° C)
temperature
Altitude 0 to 16,400 ft (0 to 5000m)
Humidity 20% to 95%
Storage Humidity 10% to 95%
Safety Certifications CE Mark - full compliance with LVD and EMC directives
Worldwide safety standards - IEC60950, EN60950, UL60950, Class1,
SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B,
FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE.
MTBF - over 200,000 hours at 25°C ambient condition.

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QuickSpecs HP ProBook 640 G5 Notebook PC

Technical Specifications

HP 3-cell Long Life Li-Ion Dimensions (H x W x L) 8.05 x 185.15 x 95 mm

(48 WHr)
Weight 0.26 kg
Cells/Type 3cell Lithium-Ion Polymer cell / 606072
Energy Voltage 11.4V
Amp-hour capacity 4.212Ah /4.0Ah
Watt-hour capacity 48Wh
Temperature Operating (Charging) 32˚ to 113˚ F (0˚ to 45˚ C)
Operating (Discharging) 14˚ to 122˚ F (-10˚ to 60˚ C)
Optional Travel Battery
No
Available

COUNTRY OF ORIGIN
China

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QuickSpecs HP ProBook 640 G5 Notebook PC

Options and Accessories (sold separately and availability may vary by country)
Type Description Part #
Cases HP Essential Top Load Case H2W17AA#xxx
HP Essential Backpack (up to 15.6") H1D24AA
HP Essential Messenger Case (up to 17.3") H1D25AA

Docking HP UltraSlim Docking Station D9Y32AA#xxx

HP UltraSlim Docking Station TAA US E5C22AV#ABA
HP Thunderbolt Dock 120W G2 2UK37AA
HP Thunderbolt Dock 120W G2 TAA 2UK37AA
HP TB Dock G2 w/ Combo Cable 3TR87AA
HP TB Dock 120W G2 w/ Audio 3YE87AA#xxx
HP USB-C Universal Dock 1MK33AA#xxx
HP USB-C/A Universal Dock G2 5TW13AA#XXX
HP USB-C Universal Dock w/4.5mm Adapter 2UF95AA
HP USB-C Universal Dock NF 3DV65AA
HP USB-C Dock G4 3FF69AA#xxx
HP USB-C Dock G5 5TW10AA#XXX
HP USB-C Mini Dock 1PM64AA#xxx
HP USB-C Travel Dock T0K29AA#xxx
HP USB Travel Dock T0K30AA#xxx
HP TB Dock Audio Module 3AQ21AA
HP TB Dock 120W G2 cable 3XB94AA
HP TB Dock G2 combo cable 3XB96AA
HP Adjustable Dual Display Stand AW664AA#xxx
HP Display and Notebook Stand II E8G00AA#xxx
HP USB-C Mini Dock 1PM64AA#xxx

Input/Output HP Slim USB Keyboard and Mouse T6T83AA#xxx

HP Slim Wireless Keyboard and Mouse T6L04AA#xxx
HP USB Essential Keyboard and Mouse H6L29AA
HP Ultra Mobile Wireless Mouse H6F25AA#xxx
HP Comfort Grip Wireless Mouse H2L63AA
HP 3-Button USB Laser Mouse H4B81AA
HP USB Travel Mouse G1K28AA
HP Slim Bluetooth Mouse F3J92AA#xxx
HP Essential USB Mouse 2TX37AA#xxx
HP Elite Presenter Mouse 2CE30AA#xxx
HP HDMI to DVI Adapter F5A28AA
HP USB-C to DP N9K78AA
HP USB-C to HDMI 2.0 1WC36AA#xxx

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QuickSpecs HP ProBook 640 G5 Notebook PC

Options and Accessories (sold separately and availability may vary by country)
HP USB-C to USB-A Hub Z6A00AA
HP UC Wireless Mono Headset W3K08AA
HP UC Wireless Duo Headset W3K09AA
HP Stereo 3.5mm Headset T1A66AA
HP Stereo USB Headset T1A67AA
HP TB Dock Audio Module 3AQ21AA
HP Thunderbolt 120W 1m cable 3AQ23AA
HP Thunderbolt 1m combo cable 3AQ25AA

Power HP 45W Smart AC Adapter 4.5mm H6Y88AA#xxx

HP 65W Smart AC Adapter H6Y89AA#xxx
HP 65W Slim AC Adapter H6Y82AA#xxx
HP 45W USB-C Power Adapter 1HE07AA#xxx
HP 65W USB-C Power Adapter 1HE08AA#xxx
3-cell Prismatic Battery TBD
HP Notebook Power Bank N9F71AA#xxx
HP USB-C Notebook Power Bank 2NA10AA
HP 65W USB-C Slim Power Adapter 3PN48AA#xxx

Storage HP External USB Optical Drive F2B56AA

HP 256GB TLC PCIe 3x4 NVMe M.2 SSD 1FU87AA
HP 512GB TLC PCIe 3x4 NVMe M.2 SSD 1FU88AA
HP 500GB 7200rpm HDD F3B97AA

Security HP Essential Combination Loc T0Y16AA

HP Combination Lock T0Y15AA
HP Keyed Cable lock T0Y14AA
HP 14.0" Notebook Privacy Filter J6E65AA
HP Docking Station Cable Lock AU656AA#XXX
HP Keyed Cable Lock 10mm T1A62AA

UCC HP Conferencing Keyboard K8P74AA#xxx

HP Speaker Phone K7V16AA
HP Wired Headset K7V17AA

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QuickSpecs HP ProBook 640 G5 Notebook PC

Options and Accessories (sold separately and availability may vary by country)
Memory HP 4GB DDR4 Memory Z4Y84AA
HP 8GB DDR4 Memory Z4Y85AA
HP 16GB DDR4 Memory Z4Y86AA
HP 4GB DDR4 3200 Memory 286H5AA
HP 8GB DDR4 3200 Memory 286H8AA
HP 16GB DDR4 3200 Memory 286J1AA

Displays HP ProDisplay P223 21.5-inch Monitor X7R61AA

HP ProDisplay P240va 23.8-inch Monitor N3H14AA
HP EliteDisplay E243 23.8-inch Monitor 1FH47AA

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QuickSpecs HP ProBook 640 G5 Notebook PC

Summary of Changes

Date of change: Version History: Update Description of change:

June 10, 2019 V1 to V2 Added HP Cloud Recovery
June 21, 2019 V2 to V3 Added Environmental Tab
June 24, 2019 V3 to V4 Updated Display Section
June 27, 2019 V4 to V5 Updated Display Section
September 9, 2019 V5 to V6 Updated Intel® Optane™ and disclaimer for 1000 nit Sure View panel
September 11, 2019 V6 to V7 Updated Ports and Slots section
March 30, 2020 V7 to V8 Updated Images section, USB-C port
April 19, 2021 V8 to V9 Added Intel I219-LM(v-Pro)/I219-V (non-vPro)/Memory Modules
V9 to V10

Copyright © 2021 HP Development Company, L.P. The information contained herein is subject to change without notice. The only
warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein
should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions
contained herein.

Intel®, Optane™, vPro and Thunderbolt are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the
United States and other countries. AMD is a trademark of Advanced Micro Devices, Inc. USB Type-C™ and USB-C™ are trademarks
of USB Implementers Forum. MicroSD is a registered trademark of SD-3C in the United States, other countries or both. Qualcomm
is a trademark of Qualcomm Incorporated, registered in the United States and other countries, used with permission. ENERGY
STAR is a registered trademark of the U.S. Environmental Protection Agency. All other trademarks are the property of their
respective owners.

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