QuickSpecs HP EliteBook 645 14 inch G9 Notebook PC

Overview
HP EliteBook 645 14 inch G9 Notebook PC

Left

1. Internal Microphones (2) 6. Clickpad

2. Webcam LED (Optional) 7. Smartcard Reader (Optional)
3. Camera Shutter (Only available with webcam) 8. SuperSpeed USB Type-A 5Gbps signaling rate port (USB 3.2 Gen 1)
4. HD TNR and IR Camera (Optional) 9. Ethernet Port (RJ-45)
5. IR Camera LED (Optional) 10. Nano Security Lock Slot (Lock sold separately)

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Overview

Right

1. Power Button Key 6. HDMI 2.1 Port (Cable not included)

2. Power Connector 7. Audio Combo Jack
3. SuperSpeed USB Type-C® 10Gbps signaling rate 8. External SIM Card Slot (Optional)
(USB Power Delivery, DisplayPort™ 1.4)
4. SuperSpeed USB Type-A 5Gbps signaling rate port 9. Touch Fingerprint Sensor (Select Models)
(Powered port) (USB 3.2 Gen 1)
5. SuperSpeed USB Type-A 5Gbps signaling rate port
(USB 3.2 Gen 1)

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Overview
AT A GLANCE

• Preinstalled with Windows 11 Pro, other Windows OS or FreeDOS

• Fast and upgradeable dual channel DDR4 SODIMM memory up to 64 GB
• Choice of AMD Barcelo™ 5000 series mobile processors, R7, R5 and R3
• Choice of 35.56 cm (14") diagonal HD, Ultra-Wide Viewing Angle FHD, Touch or Non-Touch screen, and Privacy Panel
option.
• Features redesigned quiet and responsive HP Keyboard with the HP Programmable key and backlit options
• Choice of solid state drives up to 1 TB
• Multi-layered security with HP SureStart Gen7, HP Privacy Camera, HP Sure View Gen4, HP Wolf Security (Includes HP
Sure Sense and HP Sure Click), HP Secure Erase, HP Client Security Manager Gen7 (Includes Sure Run Gen5, Sure Recover
Gen5), Touch Fingerprint reader, and Tamper Lock.
• Supports wireless options for connectivity on the go including gigabit-speed Wi-Fi® 6e and CAT9 4G/LTE WWAN
• Supports fast charging (50% in 30 minutes) with no impact on battery recharge cycles
• Designed to support HP docking options
• Passed MIL-STD 810H tests
• Battery life up to 20 hours and 30 minutes with the optional 51.3Whr battery
• Optimize your video calls with an HD camera and temporal noise reduction that adjusts to the lighting in your
environment.
• 180˚synchronized hinge allows the EliteBook to lay completely flat, without lifting the keyboard, and includes everyone
with visibility from multiple angles.

NOTE: See important legal disclosures for all listed specs in their respective features sections.

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Technical Specifications
PRODUCT NAME
HP EliteBook 645 14 inch G9 Notebook PC

OPERATING SYSTEM
Preinstalled Windows 11 Pro 1
Windows 11 Pro Education 1
Windows 11 Home - HP recommends Windows 11 Pro for business 1
Windows 11 Home Single Language - HP recommends Windows 11 Pro for business 1
Windows 11 Pro (Windows 11 Enterprise or Windows 10 Enterprise available with a Volume Licensing
Agreement) 1
Windows 11 Pro (preinstalled with Windows 10 Pro Downgrade) 1,2
FreeDOS

1. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately
purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is
automatically updated, which is always enabled. ISP fees may apply, and additional requirements may apply over time for
updates. See http://www.windows.com.
2. This system is preinstalled with Windows 10 Pro software and also comes with a license for Windows 11 Pro software and
provision for recovery software. You may only use one version of the Windows software at a time. Switching between
versions will require you to uninstall one version and install the other version. You must back up all data (files, photos, etc.)
before uninstalling and installing operating systems to avoid loss of your data.

PROCESSORS
AMD Ryzen™ 7 PRO 5875U with AMD Radeon™ Graphics (2.00 GHz base clock, up to 4.50 GHz max boost clock, 16 MB L3
cache, 8 cores, 16 threads) 3,4,5,6
AMD Ryzen™ 7 5825U with AMD Radeon™ Graphics (2.00 GHz base clock, 16 MB L3 cache, 8 cores, 16 threads) 3,4,5,6
AMD Ryzen™ 5 PRO 5675U with AMD Radeon™ Graphics (2.30 GHz base clock, up to 4.30 GHz max boost clock, 16 MB L3
cache, 6 cores, 12 threads) 3,4,5,6
AMD Ryzen™ 5 5625U with AMD Radeon™ Graphics (2.30 GHz base clock, 16 MB L3 cache, 6 cores, 12 threads) 3,4,5,6
AMD Ryzen™ 3 5425U with AMD Radeon™ Graphics (2.70 GHz base clock, 8 MB L3 cache, 4 cores, 8 threads) 3,4,5,6

Processor Family
AMD Ryzen™ processor 6

3. Multicore is designed to improve performance of certain software products. Not all customers or software applications will
necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application
workload and your hardware and software configurations. AMD ’s numbering is not a measurement of clock speed.
4. Processor speed denotes maximum performance mode; processors will run at lower speeds in battery optimization mode.
5. AMD Max Boost frequency performance varies depending on hardware, software and overall system configuration.
6. In accordance with Microsoft’s support policy, HP does not support the Windows 8 or Windows 7 operating system on
products configured with Intel and AMD 7th generation and forward processors or provide any Windows 8 or Windows 7
drivers on http://www.support.hp.com.

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Technical Specifications
CHIPSET
Chipset is integrated with processor.

GRAPHICS
Integrated
AMD Radeon Graphics

Supports
Support HD decode, DX12, HDMI 2.1b 7

7. HD content required to view HD images.

DISPLAY
Non-Touch
35.56 cm (14") diagonal FHD UWVA eDP anti-glare Low Blue Light narrow bezel bent, 1000 nits, 100% sRGB for HD + IR camera
and WWAN HP Sure View Gen4 integrated privacy screen (1920 x 1080) with HP Eye Ease 8,9,10, 11,12
35.56 cm (14") diagonal FHD UWVA eDP anti-glare, low power, bent, 400 nits,72% NTSC for HD + IR camera and WWAN
(1920 x 1080) 8,9,10
35.6 cm (14") diagonal, FHD UWVA eDP anti-glare narrow bezel bent, 400 nits, 100% sRGB for HD Webcam (1920 x 1080)8,9,10
35.56 cm (14") diagonal FHD UWVA eDP anti-glare narrow bezel bent, 250 nits, 45% NTSC for HD + IR camera and WWAN
(1920 x 1080) 8,9,10
35.56 cm (14") diagonal FHD UWVA eDP + W/O PSR anti-glare narrow bezel bent, 250 nits, 45% NTSC for HD + IR camera
(1920 x 1080) 8,9,10
35.56 cm (14") diagonal FHD UWVA eDP anti-glare narrow bezel bent, 250 nits,45% NTSC for HD camera and WWAN
(1920 x 1080) 8,9,10
35.56 cm (14") diagonal FHD UWVA eDP anti-glare narrow bezel bent, 250 nits,45% NTSC for HD camera (1920 x 1080) 8,9,10
35.6 cm (14") diagonal, FHD UWVA eDP1.4 w/o PSR, anti-glare, 250 nits, 45%, no mic (1920 x 1080) 8,9,10
35.6 cm (14") diagonal, FHD UWVA eDP 1.2 w/o PSR, Anti-Glare, 250 nits, 45% NTSC Narrow Bezel bent (1920 x 1080) 8,9,10
35.56 cm (14") diagonal HD SVA eDP anti-glare narrow bezel bent, 250 nits, 45% NTSC for HD Camera (1366 x 768) 8,9,10
35.6 cm (14") diagonal, HD SVA eDP 1.2 w/o PSR, Anti-Glare, 250 nits, 45% NTSC Narrow Bezel bent (1366 x 768) 8,10,12

Touch
35.56 cm (14") diagonal FHD Anti-Glare UWVA eDP narrow bezel bent touch-on-panel screen, 250 nits, 45% NTSC for HD + IR
camera and WWAN (1920 x 1080) 8,9,10,12
35.56 cm (14") diagonal FHD Anti-Glare UWVA eDP narrow bezel bent touch-on-panel screen, 250 nits, 45% NTSC for HD
camera (1920 x 1080) 8,9,10,12

Display Size
14" diagonal
35.6 cm (14") diagonal

8. HD content required to view HD images.

9. Sold separately or as an optional feature.
10. Resolutions are dependent upon monitor capability, and resolution and color depth settings.
11. HP Sure View Reflect integrated privacy screen is an optional feature that must be configured at purchase and is designed
to function in landscape orientation.

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Technical Specifications
12. Actual brightness will be lower with touchscreen or HP Sure View.

DOCKING (Sold Separately)

Docking station model #1 HP Thunderbolt Dock G2
Docking station model #2 HP USB-C Dock G5
Docking station model #3 HP USB-C/A Universal Dock G2

For additional aftermarket options and docking specs please see page 41.

STORAGE AND DRIVES

Primary M.2 Storage
128 GB PCIe® NVMe™ M.2 Value Solid State Drive 13
256 GB PCIe® NVMe™ M.2 Value Solid State Drive 13
256 GB PCIe® Gen4x4 NVMe™ M.2 TLC Self Encrypted OPAL2 Solid State Drive 13,14
256 GB PCIe® Gen4x4 NVMe™ M.2 TLC single-sided Solid State Drive 13,14
256 GB PCIe® NVMe™ M.2 SSD 13
512 GB PCIe® Gen4x4 NVMe™ M.2 TLC Self Encrypted OPAL2 Solid State Drive 13,14
512 GB PCIe® Gen4x4 NVMe™ M.2 TLC Solid State Drive 13,14
512 GB PCIe® NVMe™ M.2 SSD 13
1 TB PCIe® Gen4x4 NVMe™ M.2 TLC Solid State Drive13,14

Secondary M.2 Storage (Optional)

128 GB PCIe® NVMe™ M.2 Value Solid State Drive 13,15
256 GB PCIe® NVMe™ M.2 Value Solid State Drive 13,15

13. For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
10 and 11) is reserved for system recovery software.
14. Only functions at the Gen3x4 capacity with AMD Ryzen Barcelo processor.
15. Second storage is only available with non-WWAN base Unit AND Primary M.2 storage.

MEMORY
Maximum Memory
64 GB DDR4-3200 SDRAM 16

Memory
64 GB DDR4-3200 SDRAM (2 x 32 GB) 16
32 GB DDR4-3200 SDRAM (1 x 32 GB) 16
32 GB DDR4-3200 SDRAM (2 x 16 GB) 16
16 GB DDR4-3200 SDRAM (1 x 16 GB) 16
16 GB DDR4-3200 SDRAM (2 x 8 GB) 16
8 GB DDR4-3200 SDRAM (1 x 8 GB) 16
8 GB DDR4-3200 SDRAM (2 x 4 GB) 16

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Technical Specifications
Memory Slots
2 SODIMM
Both slots are customer accessible / upgradeable
DDR4 PC4 SODIMMS (Barcelo runs at 3200)
Supports Dual Channel Memory

16. Due to the non-industry standard nature of some third-party memory modules, we recommend HP branded memory to
ensure compatibility. If you mix memory speeds, the system will perform at the lower memory speed.

NETWORKING/COMMUNICATIONS
WLAN
Realtek RTL8852BE 802.11ax 2x2 Wi-Fi® + Bluetooth ® 5.3 Wireless Card 17
Qualcomm® Fast Connect 6900 Wi-Fi 6E + Bluetooth ® 5.2 (802.11ax 2x2) Wireless Card 18

WWAN
Intel® XMM™ 7560 R+ LTE-Advanced Pro Cat 16 19

NFC
NXP NPC300 Near Field Communication Module (NFC Mirage WNC XRAV-1)

Miracast
Native Miracast Support

Ethernet
Realtek RTL8111HSH 10/100/1000 Integrated NIC 20
Realtek RTL8111FPH 10/100/1000 Integrated NIC 20

Wake on WLAN
Support on S3 AC mode only

17. Wireless access point and internet service required and sold separately. Availability of public wireless access points
limited. Wi-Fi 6 is backwards compatible with prior 802.11 specs.
18. Wi-Fi 6E requires a Wi-Fi 6E router, sold separately, to function in the 6GHz band. Availability of public wireless access
points limited. Wi-Fi 6E is backwards compatible with prior 802.11 specs. And available in countries where Wi-Fi 6E is
supported.
19. WWAN module is an optional feature, requires factory configuration and requires separately purchased service contract.
Check with service provider for coverage and availability in your area. Connection speeds will vary due to location,
environment, network conditions, and other factors. 4G LTE not available on all products, in all regions.
20. The term "10/100/1000" or "Gigabit" Ethernet indicates compatibility with IEEE standard 802.3ab for Gigabit Ethernet,
and does not connote actual operating speed of 1 Gb/s. For high-speed transmission, connection to a Gigabit Ethernet server
and network infrastructure is required.

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Technical Specifications
AUDIO/MULTIMEDIA
Audio
2 Integrated stereo speakers
Integrated microphone (Dual Array)

Speaker Power
2W/4ohm Per speaker

Camera
720p HD camera with Temporal Noise Reduction 8,9
720p HD camera+IR Camera with Temporal Noise Reduction 8,9
8. HD content required to view HD images.
9. Sold separately or as an optional feature.

KEYBOARDS/POINTING DEVICES/BUTTONS & FUNCTION KEYS

Keyboard
HP Premium Keyboard, spill resistant with optional backlit function 21

Pointing Device
Clickpad with multi-touch gesture support

Function Keys
F1 - Display Switching
F2 - Blank or SureView On/Off
F3 - Brightness Down
F4 - Brightness Up
F5 - Audio Mute
F6 - Volume Down
F7 - Volume Up
F8 - Mic Mute
F9 - Blank or Backlit Toggle
F10 - Insert
F11 - Wireless
F12 - Programmable key

Hidden Function Keys

Fn+R - Break
Fn+S - Sys Rq
Fn+C - Scroll Lock

21. Backlit keyboard is an optional feature.

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Technical Specifications
SOFTWARE AND SECURITY
Software
HP Quick Touch
HP Quick Drop 22
HP PC Hardware Diagnostics Windows
Touchpoint Customizer for Commercial
myHP
HP Smart Support 23
HP Connection Optimizer
HP Hotkey Support
HP Support Assistant 24
HP Notifications
HP Privacy Settings
Buy Microsoft Office (Sold separately)

Manageability Features
HP Connect for Microsoft Endpoint Manager25
HP Image Assistant Gen5 (download)
HP Manageability Integration Kit (download)26
HP Client Management Script Library (download)
HP Patch Assistant (download)27
HP Driver Packs (download)
HP Client Catalog (download)

NOTE: To enhance brightness, level go to the Intel® Graphics Command Center app, click on System and turn off the Display
Power Savings function.

Security Management
HP Wolf Security of Business28 includes:
HP Sure Click 29
HP Sure Sense 30
HP Sure Run Gen5 31
HP Sure Recover Gen5 32
HP Sure Start Gen7 33
HP Tamper Lock
HP Sure Admin 34
HP Client Security Manager Gen7 35

BIOS
HP BIOSphere Gen6 36
HP Secure Erase 37
Absolute Persistence Module 38
HP DriveLock & Automatic DriveLock
BIOS Update via Network
HP Wake on WLAN
HP Fingerprint Sensor 39
Secured-Core PC Enable 40
TPM 2.0 Embedded Security Chip (Common Criteria EAL4+ Certified) (FIPS 140-2 Level 2 Certified)

Security

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Technical Specifications
TPM
Model: Infineon SLB9672VU2.0
Version:15.21
Revision: TPM 2.0
FIPS 140-2 Compliant: Yes

Smartcard Reader
Model number: Alcor AU9560
FIPS 201 Compliant: Yes

IPv6 Support
Yes

FirstNet Certified
No

Is the BIOS on this notebook ISO/IEC 19678:2015 (formerly NIST 800-147) compliant?: Yes
UEFI version: 2.7
Class: Class 3

22. HP Quick Drop requires Internet access and Windows 10 PC preinstalled with HP QuickDrop app and either an Android
device (phone or tablet) running Android 7 or higher with the Android HP QuickDrop app, and /or an iOS device (phone or
tablet) running iOS 12 or higher with the iOS HP QuickDrop app.
23. HP Smart Support automatically collects the telemetry necessary upon initial boot of the product to deliver device-level
configuration data and health insights and is available preinstalled on select products, thru HP Factory Configuration
Services; or it can be downloaded. For more information about how to enable HP Smart Support or for download, please visit
http://www.hp.com/smart-support.
24. HP Support Assistant requires Windows and Internet Access
25. HP Connect for Microsoft Endpoint Manager is available from the Azure Market Place for HP Pro, Elite, Z and Point-of-Sale
PCs managed with Microsoft Endpoint Manager. Subscription to Microsoft Endpoint Manager required and sold separately.
Network connection required.
26. HP Manageability Integration Kit can be downloaded from http://www.hp.com/go/clientmanagement.
27. HP Patch Assistant available on select HP PCs with the HP Manageability Kit that are managed through Microsoft System
Center Configuration Manager. HP Manageability Integration Kit can be downloaded from
http://www8.hp.com/us/en/ads/clientmanagement/overview.html.
28. HP Wolf Security for Business requires Windows 10 or higher, includes various HP security features and is available on HP
Pro, Elite, RPOS and Workstation products. See product details for included security features and OS requirement.
29. HP Sure Click requires Windows 10 Pro or higher or Enterprise. See https://bit.ly/2PrLT6A_SureClick for complete details.
30. HP Sure Sense is available on select HP PCs with Windows 10 Pro, Windows 10 Enterprise, Windows 11 Pro, or Windows
11 Enterprise OS.
31. HP Sure Run Gen5 is available on select HP PCs and requires Windows 10 and higher.
32. HP Sure Recover Gen5 is available on select HP PCs and requires Windows 10 and higher and an open network
connection. You must back up important files, data, photos, videos, etc. before using HP Sure Recover to avoid loss of data.
Network based recovery using Wi-Fi is only available on PCs with Intel Wi-Fi Module.
33. HP Sure Start Gen7 is available on select HP PCs and requires Windows 10 and higher
34. HP Sure Admin requires Windows 10 and higher, HP BIOS, HP Manageability Integration Kit from
http://www.hp.com/go/clientmanagement and HP Sure Admin Local Access Authenticator smartphone app from the Android
or Apple store.
35. HP Client Security Manager Gen7 requires Windows and is available on the select HP Elite and Pro PCs.

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Technical Specifications
36. HP BIOSphere Gen6 features may vary depending on the platform and configuration.
37. For the methods outlined in the National Institute of Standards and Technology Special Publication 800-88 "Clear"
sanitation method. HP Secure Erase does not support platforms with Intel® Optane™.
38. Absolute firmware module is shipped turned off and can only be activated with the purchase a license subscription and
full activation of the software agent. License subscriptions can be purchased for terms ranging multiple years. Service is
limited, check with Absolute for availability outside the U.S. Certain conditions apply. For full details visit:
https://www.absolute.com/about/legal/agreements/absolute/.
39. Fingerprint Reader is an optional feature that must be configured at purchase.
40. Requires an Intel® vPro®, AMD Ryzen™ Pro processor or Qualcomm® processor with SD850 or higher and requires 8 GB or
more system memory. Secured-core PC is enabled from the factory.

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Technical Specifications
POWER
Power Supply
AC Adapter 45 Watt nPFC Standard USB type C Straight 1.8m 41
AC Adapter 45 Watt Smart nPFC Standard Barrel 4.5mm Right Angle 1.8m 41
AC Adapter 45 Watt Smart nPFC Standard C8 for 2 prong Barrel 4.5mm Right Angle 41
AC Adapter 65 Watt nPFC Slim USB type C Straight 1.8m 41
AC Adapter 65 Watt nPFC Standard USB type C Straight 1.8m 41
AC Adapter 65 Watt Smart nPFC EM Barrel 4.5mm 41
AC Adapter 65 Watt Smart nPFC Standard Barrel 4.5mm Right Angle 1.8m 41

Battery
HP Long Life 3-cell, 42.75 Wh Polymer 42,43
HP Long Life 3-cell, 51.3 Wh Polymer 42,43
Compliant with UL 1642 Standard

Power Cord
3-wire plug - 1m
2-wire plug - 1m

Battery Life
Up to 20 hours and 30 minutes with 51whr battery (HP Long Life 3-Cell, 51 Whr Polymer, UMA graphic, AMD R7, display set to
200 nits, 8G memory, 256 GB SSD)44
Up to 17 hours and 30 minutes with 42whr battery (HP Long Life 3-Cell, 42 Whr Polymer, UMA graphic, AMD R7, display set to
200 nits, 8G memory, 256 GB SSD)44

Battery Weight
HP Long Life 3-cell - 42.75 Wh Polymer - .40 lb
HP Long Life 3-cell - 51.3 Wh Polymer - .45 lb
HP Long Life 3-cell - 42.75 Wh Polymer - 181.83 g
HP Long Life 3-cell - 51.3 Wh Polymer - 203.56 g

41. Availability may vary by country.

42. Battery is internal and not replaceable by customer. Serviceable by warranty.
43. Actual battery Watt-hours (Wh) will vary from design capacity. Battery capacity will naturally decrease with shelf life,
time, usage, environment, temperature, system configuration, loaded apps, features, power management settings and other
factors.
44. MM18 battery life will vary depending on various factors including product model, configuration, loaded applications,
features, use, wireless functionality, and power management settings. The maximum capacity of the battery will naturally
decrease with time and usage. See http://www.bapco.com for additional details.

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Technical Specifications
WEIGHTS & DIMENSIONS
Product Weight
Starting at 3.03 lb 45
Starting at 1.37 kg 45

Product Dimensions (W x D x H)
12.67 x 8.42 x 0.78 in
32.19 x 21.39 x 1.99 cm

45. Weight will vary by configuration. Does not include power adapter.

PORTS/SLOTS
Ports
1 SuperSpeed USB Type-C® 10Gbps signaling rate (USB Power Delivery, DisplayPort™ 1.4)
3 SuperSpeed USB Type-A 5Gbps signaling rate Port includes 1 Powered port (USB 3.2 Gen 1)
1 AC power
1 HDMI 2.1 46
1 Headphone/microphone combo jack
1 Nano SIM slot for WWAN (optional)
1 RJ-45

Expansion Slots
Smart Card Reader (optional)

46. HDMI cable sold separately.

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Technical Specifications
SERVICE AND SUPPORT
1-year and 3-year limited warranties and 90 day software limited warranty options depending on country.
Batteries have a default one year limited warranty except for Long Life batteries which will have same 1-year or 3-year
limited warranty as the platform. Refer to http://www.hp.com/support/batterywarranty/ for additional battery information.
On-site service and extended coverage is also available. HP Care Pack Services are optional extended service contracts that
go beyond the standard limited warranties. To choose the right level of service for your HP product, use the HP Care Pack
Services Lookup Tool at: http://www.hp.com/go/cpc. 47

47. HP Care Packs are sold separately. Service levels and response times for HP Care Packs may vary depending on your
geographic location. Service starts on date of hardware purchase. Restrictions and limitations apply. For details, visit
http://www.hp.com/go/cpc. HP services are governed by the applicable HP terms and conditions of service provided or
indicated to Customer at the time of purchase. Customer may have additional statutory rights according to applicable local
laws, and such rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty
provided with your HP Product.

CERTIFICATION AND COMPLIANCE

Energy Efficiency Compliance: ENERGY STAR® certified
Energy Efficiency Compliance: EPEAT® 2019 Gold 48
Environmental Specifications: Low halogen 49
Environmental Specifications: TCO 9.0 Certification

48. Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. EPEAT® status varies by country. Visit
http://www.epeat.net for more information
49. External power supplies, power cords, cables and peripherals are not Low Halogen. Service parts obtained after
purchase may not be Low Halogen.

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Technical Specifications
SYSTEM UNIT
Nominal Operating Voltage 19V
Average Operating Power 7.52W (Idle)
Integrated graphics Yes (AMD Radeon™ Graphics)
Discrete Graphics N/A
Max Operating Power Discrete < 65W
UMA < 45W
Temperature
Operating 32° to 95° F (0° to 35° C)
Non-operating -4° to 140° F (-20° to 60° C)
Relative Humidity
Operating 10% to 90%, non-condensing
Non-operating 5% to 95%, 101.6° F (38.7° C) maximum wet bulb temperature
Shock
Operating 40 G, 2 ms, half-sine
Non-operating 200 G, 2 ms, half-sine
Random Vibration
Operating 1.043 grams
Non-operating 3.5 grams
Altitude (unpressurized)
Operating -50 to 10,000 ft (-15.24 to 3,048 m)
Non-operating -50 to 40,000 ft (-15.24 to 12,192 m)
Planned Industry Standard
Certifications
Regulatory Model Number HSN-Q35C-4
UL Yes
CSA Yes
FCC Compliance Yes
ENERGY STAR® Yes 50
EPEAT® EPEAT® 2019 Gold in United States 51
ICES Yes
Australia / Yes
NZ A-Tick Compliance Yes
CCC Yes
Japan VCCI Compliance Yes
KC Yes
BSMI Yes
CE Marking Compliance Yes
BNCI or BELUS Yes
CIT Yes
GOST Yes
Saudi Arabian Compliance (ICCP) Yes
SABS Yes
UKRSERTCOMPUTER Yes

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Technical Specifications
50. Configurations of the HP EliteBook 645 G9 that are ENERGY STAR® certified are identified as HP EliteBook 645 G9 ENERGY
STAR on HP websites and on http://www.energystar.gov.
51. Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. EPEAT® status varies by country. Visit
http://www.epeat.net for more information.

DISPLAYS
NOTE: All specifications represent the typical specifications provided by HP's component manufacturers; actual performance may
vary either higher or lower.
1. Actual brightness will be lower with touchscreen or HP Sure View.

14.0 in FHD (1920 x 1080) Outline Dimensions (W x H) 314.612x 185.330 (max)

Anti-Glare UWVA Low Blue
Active Area 309.312 x 173.990 mm (typ)
Light sRGB NB2Y 1000 eDP
1.3+PSR 100 PrivacyG4 Plus Weight 230 g
bent LCD Panel Diagonal Size 14 inch
Thickness 2.2/3.9 (max)
Interface eDP 1.3
Surface Treatment Anti-Glare
Touch Enabled No
Contrast Ratio 1500:1
Refresh Rate 60 Hz
Brightness 1000 nits
Pixel Resolution 1920 x1080 (FHD)
Format WLED
Backlight RGB
Color Gamut Coverage sRGB 100%
Color Depth 8
Viewing Angle UWVA 85/85/85/85
Low Blue Light Yes
Power Consumption (W, EBL@
NA
150nits max/ 200nits max)

Panel LCD 14 inch FHD Outline Dimensions (W x H) 316.170 x 186.400 (max)

(1920 x 1080) Anti-Glare 309.370 x 174.020 mm (typ)
WLED UWVA 45percent cg Active Area
250nits eDP 1.2 w/o PSR bent Weight 305 g (max)
Touch on Panel NWBZ Diagonal Size 14.0 inch
Thickness 3.0 / 5.0 (max)
Interface eDP 1.2
Surface Treatment Anti-Glare On-cell
Touch Enabled Yes1
Contrast Ratio 600:1 (typ)
Refresh Rate 60 Hz
Brightness 250 nits1
Pixel Resolution 1920 x 1080 (FHD)
Format WLED
Backlight RGB

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QuickSpecs HP EliteBook 645 14 inch G9 Notebook PC

Technical Specifications
Color Gamut Coverage NTSC 45%
Color Depth 6 (Hi FRC w/ condition to enable)
Viewing Angle UWVA 85/85/85/85
Low Blue Light No
Power Consumption (W, EBL@ 2.30 (max)/ 2.80 (max)
150nits max/ 200nits max)

Panel LCD 14 inch FHD Outline Dimensions (W x H) 315.070 x 186.600 (max)

(1920 x 1080) Anti-Glare 309.370 X 174.020 mm (typ)
WLED UWVA sRGB 100percent Active Area
cg 400nits eDP 1.4+PSR2 bent Weight 200 g (max)
LP NB2X Diagonal Size 14.0 inch
Thickness 2.0 /4.0 (max)
Interface eDP 1.4
Surface Treatment Anti-Glare
Touch Enabled No
Contrast Ratio 1200:1 (typ)
Refresh Rate 60 Hz
Brightness 400 nits
Pixel Resolution 1920 x 1080 (FHD)
Format WLED
Backlight RGB
Color Gamut Coverage sRGB 100%
Color Depth 6
Viewing Angle UWVA 85/85/85/85
Low Blue Light No
Power Consumption (W, EBL@ 2.07 (max)/ 2.50 (max)
150nits max/ 200nits max)

Panel LCD 14-in FHD Outline Dimensions (W x H x D) 316.170 x 186.400 (max)

(1920 x 1080) Anti-Glare 309.370 x 174.020 mm (typ)
WLED UWVA 45percent cg Active Area
250nits eDP 1.2 w/o PSR Weight 300 g (max)
NWBZ bent Diagonal Size 14.0 inch
Thickness 3.0 / 5.0 (max)
Interface eDP 1.2
Surface Treatment Anti-Glare
Touch Enabled No
Contrast Ratio 600:1 (typ)
Refresh Rate 60 Hz
Brightness 250 nits
Pixel Resolution 1920 x 1080 (FHD)
Format WLED
Backlight RGB
Color Gamut Coverage NTSC 45%
Color Depth 6 (Hi FRC w/ condition to enable)

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QuickSpecs HP EliteBook 645 14 inch G9 Notebook PC

Technical Specifications
Viewing Angle UWVA 85/85/85/85
Low Blue Light No
Power Consumption (W, EBL@ 150nits 2.205 (max)/ 2.716 (max)
max/ 200nits max)

Panel LCD 14-in HD Outline Dimensions (W x H x D) 316.110 x 186.370 (max)

(1366 x 768) Anti-Glare WLED 309.400 x 173.950 mm (typ)
SVA 45percent cg 250nits eDP Active Area
1.2 w/o PSR NWBZ bent Weight 300 g (max)
Diagonal Size 14.0 inch
Thickness 3.0 / 5.0 (max)
Interface eDP 1.2
Surface Treatment Anti-Glare
Touch Enabled No
Contrast Ratio 300:1 (typ)
Refresh Rate 60 Hz
Brightness 250 nits
Pixel Resolution 1366 x 768 (HD)
Format WLED
Backlight RGB
Color Gamut Coverage NTSC 45%
Color Depth 6
Viewing Angle SVA 45/45/15/35
Low Blue Light No
Power Consumption (W, EBL@ 150nits 2.52 (max) / 2.86 (max)
max/ 200nits max)

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QuickSpecs HP EliteBook 645 14 inch G9 Notebook PC

Technical Specifications
STORAGE AND DRIVES
For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows 10 and 11)
is reserved for system recovery software.
SSD 128GB 2230 PCIe Drive Weight M.2 2230
NVMe Value Rotation speed 128GB
NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Weight 0.01 lb (5 g)
Interface PCIe NVMe Gen3
Maximum Sequential Read Up to 2100 MB/s
Maximum Sequential Write Up to 1200 MB/s
Logical Blocks 250069680
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features Pyrite; TRIM; L1.2

SSD 256GB 2230 PCIe Form Factor M.2 2230

NVMe Value Capacity 256 GB
NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface PCIe NVMe Gen3
Maximum Sequential Read up to 2500 MB/s
Maximum Sequential Write up to 1300 MB/s
Logical Blocks 500118192
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features Pyrite; TRIM; L1.2

SSD 256GB 2280 PCIe Form Factor M.2 2280

NVMe Value Capacity 256GB
NAND Type Value
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface PCIe NVMe Gen3
Maximum Sequential Read Up to 2900 MB/s
Maximum Sequential Write Up to 1400 MB/s
Logical Blocks 500118192
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features ATA Security; TRIM; L1.2

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Technical Specifications
SSD 256GB 2280 PCIe-4x4 Form Factor M.2 2280
NVMe Three Layer Cell Capacity 256 GB
NAND Type 3D TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Weight 9.0g
Interface PCIe NVMe Gen4
Maximum Sequential Read Up to 6,400 MB/s
Maximum Sequential Write Up to 2,700 MB/s
Logical Blocks 500118192
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features Pyrite 2.0; TRIM; L1.2

256GB PCIe-4x4 2280 NVME Form Factor M.2 2280

Self Encrypted OPAL2 Three Capacity 256GB
Layer Cell Solid State Drive NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface PCIe NVMe Gen4
Maximum Sequential Read 6400
Maximum Sequential Write 2700
Logical Blocks 500118192
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features ATA Security (Option); TCG Opal 2.0; TRIM; L1.2

SSD 512GB 2280 PCIe NVMe Form Factor M.2 2280

Value Capacity 512GB
NAND Type Value
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface PCIe NVMe Gen3
Maximum Sequential Read Up to 3500 MB/s
Maximum Sequential Write up to 3000 MB/s
Logical Blocks 1000215216
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features TRIM; L1.2

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Technical Specifications
SSD 512GB 2280 PCIe-4x4 Form Factor M.2 2280
NVMe Three Layer Cell Capacity 512GB
NAND Type 3D TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Weight 9.0g
Interface PCIe NVMe Gen4
Maximum Sequential Read Up to 6,600 MB/s
Maximum Sequential Write Up to 5,100 MB/s
Logical Blocks 1000215216
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features Pyrite 2.0; TRIM; L1.2

512GB PCIe-4x4 2280 NVME Form Factor M.2 2280

Self Encrypted OPAL2 Three Capacity 512GB
Layer Cell Solid State Drive NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface PCIe NVMe Gen4
Maximum Sequential Read Up to 6,600 MB/s
Maximum Sequential Write Up to 5,100 MB/s
Logical Blocks 1000215216
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features ATA Security (Option); TCG Opal 2.0; TRIM; L1.2

SSD 1TB 2280 PCIe-4x4 Form Factor M.2 2280

NVMe Three Layer Cell Capacity 1TB
NAND Type 3D TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Interface PCIe NVMe Gen4
Maximum Sequential Read Up to 7,100 MB/s
Maximum Sequential Write Up to 5,200 MB/s
Logical Blocks 2000409264
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features Pyrite 2.0; TRIM; L1.2

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QuickSpecs HP EliteBook 645 14 inch G9 Notebook PC

Technical Specifications
NETWORKING/COMMUNICATIONS
Qualcomm® Fast Connect Wireless LAN Standards IEEE 802.11a
6900 Wi-Fi 6E + BT5.2 IEEE 802.11b
(802.11ax 2x2, AMD AIM- IEEE 802.11g
IEEE 802.11n
T AME, supporting gigabit
IEEE 802.11ac
file transfer speeds) IEEE 802.11ax
Wireless Card 1 IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11u
IEEE 802.11v
IEEE 802.11w
Interoperability Wi-Fi certified
Frequency Band •802.11b/g/n/ax
2.402 – 2.482 GHz
•802.11a/n/ac/ax
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
5.925 – 7.125 GHz
Data Rates •802.11b: 1, 2, 5.5, 11 Mbps
•802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
•802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, ,80MHz &
160MHz)
• 802.11ax: MCS0 ~ MCS11, (1SS and 2SS) (20MHz, 40MHz, ,80MHz &
160MHz)
Modulation Direct Sequence Spread Spectrum
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM, 4096QAM
Security3 •AES-CCMP: 128 bit in hardware
•802.1x authentication
•WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
•WPA2 certification
•IEEE 802.11i
Network Architecture Wi-Fi Direct in Win10 for peer-to-peer connection.
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power2 2.4GHz (MIMO, typical):
• 802.11b: +18dBm
• 802.11g: +16.5dBm
• 802.11n/ac/ax (HT20/VHT20/HE20): +16dBm
• 802.11n/ac/ax (HT40/VHT40/HE40): +12.5dBm
5GHz (MIMO, typical):
• 802.11a: +13dBm
• 802.11n/ac/ax (HT20/VHT20/HE20): +13.5dBm
• 802.11n/ac/ax (HT40/VHT40/HE40): +12.5dBm

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Technical Specifications
• 802.11ac/ax (VHT80/HE80): +11.5dBm
• 802.11ax HE160: +11.5dBm
6GHz LPI mode (MIMO, typical):
• 802.11a: 0dBm
• 802.11ax HE20: +1dBm
• 802.11ax HE40: +4dBm
• 802.11ax HE80: +7dBm
• 802.11ax HE160: +7.5dBm
Power Consumption •Transmit mode: 3.0 W
•Receive mode: 2.0 W
•Idle mode (WLAN associated): 300mW
•Idle mode (WLAN unassociated): 100mW
•Modern Connected Standby: 10mW
•Radio disabled: 8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
4
Receiver Sensitivity 2.4GHz (SISO):
• 802.11b, 11Mbps: -82dBm maximum
• 802.11g, 54Mbps: -71dBm maximum
• 802.11n, MCS7: -64dBm maximum
• 802.11ac, MCS9: -52dBm maximum
• 802.11ax, MCS11(HT40): -49dBm maximum
5GHz (SISO):
• 802.11a, 54Mbps: -71dBm maximum
• 802.11n, MCS07: -64dBm maximum
• 802.11ac, MCS9: -52dBm maximum
• 802.11ax, MCS11(HE80/HE160): -46dBm maximum
6GHz (SISO):
• 802.11a, 54Mbps: -71dBm maximum
• 802.11n, MCS7: -64dBm maximum
• 802.11ac, MCS9: -52dBm maximum
• 802.11ax, MCS11(HE160): -46dBm maximum"
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure.
Two embedded dual band 2.4/5/6 GHz antennas are provided to the card
to support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard
Dimensions Type 2230: 2.3 x 22.0 x 30.0 mm
Weight Type 2230: 3g
Operating Voltage 3.3 +/ 0.165v
Temperature Operating –10° to 60° C
Non-operating –40° to 85° C
Humidity Operating 10% to 60% (non-condensing)
Non-operating 5% to 95% (non-condensing)"
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity N/A
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2 Wireless Card
Bluetooth Specification 4.0/4.1/4.2/5.0/5.1/5.2 Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Legacy : 0~79 (1 MHz/CH)
Channels BLE : 0~39 (2 MHz/CH)

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Technical Specifications
Data Rates and Legacy : 3 Mbps data rate; throughput up to 2.17 Mbps
Throughput BLE : 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice
channels
Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps
asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class 1.5 Bluetooth device
with a maximum transmit power of + 14 dBm and 10 dBm for BR and EDR,
respectively.

1. Wi-Fi 6E requires a Wi-Fi 6E router, sold separately, to function in the 6GHz band. Availability of public wireless access points
limited. Wi-Fi 6E is backwards compatible with prior 802.11 specs. And available in countries where Wi-Fi 6E is supported. Wi-Fi 6E
is designed to support gigabit data rate when transferring files between two devices connected to the same router. Requires a
wireless router, sold separately, that supports 80MHz and higher channels.
2. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
3. Check latest software/driver release for updates on supported security features.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for
802.11a/g (OFDM modulation).

Realtek RTL8852BE Wireless LAN Standards IEEE 802.11a

802.11ax 2x2 Wi-Fi® + IEEE 802.11b
BT5.3 (802.11ax 2x2, IEEE 802.11g
IEEE 802.11n
supporting gigabit data
IEEE 802.11ac
rate) Wireless Card 1 IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi certified modules
Frequency Band •802.11b/g/n/ax
2.402 – 2.482 GHz
•802.11a/n/ac/ax
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
Data Rates •802.11b: 1, 2, 5.5, 11 Mbps
•802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11n: max 300Mbps
•802.11ac: max 866.7Mbps
• 802.11ax: max 1201Mbps
Modulation Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
Security3 •IEEE and WiFi certified 64 / 128 bit WEP encryption for a/b/g mode only
•AES-CCMP: 128 bit in hardware

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Technical Specifications
•802.1x authentication
•WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
•WPA2 certification
•WPA3 certification
•IEEE 802.11i
•WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power2 • 802.11b: +18.5dBm minimum
• 802.11g: +17.5dBm minimum
• 802.11a: +18.5dBm minimum
• 802.11n HT20(2.4GHz): +15.5dBm minimum
• 802.11n HT40(2.4GHz): +14.5dBm minimum
• 802.11n HT20(5GHz): +15.5dBm minimum
• 802.11n HT40(5GHz): +14.5dBm minimum
• 802.11ac VHT80(5GHz): +11.5dBm minimum
• 802.11ax HE40(2.4GHz): +10dBm minimum
• 802.11ax HE80(5GHz): +10dBm minimum
Power Consumption •Transmit mode:2.5 W
•Receive mode:2 W
•Idle mode (PSP)180 mW(WLAN Associated)
•Idle mode:50 mW(WLAN unassociated)
•Connected Standby/Modern Standby: 10mW
•Radio disabled: 8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity4 •802.11b, 1Mbps : -93.5dBm maximum
•802.11b, 11Mbps : -84dBm maximum
•802.11a/g, 6Mbps : -86dBm maximum
•802.11a/g, 54Mbps : -72dBm maximum
•802.11n, MCS07 : -67dBm maximum
•802.11n, MCS15 : -64dBm maximum
•802.11ac, MCS0 : -84dBm maximum
•802.11ac, MCS9 : -59dBm maximum
•802.11ax, MCS11(HE40): -57dBm maximum
•802.11ax, MCS11(HE80): -54dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard
Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8g
2. Type 126: 1.3g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)

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Technical Specifications
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF
LED Off – Radio ON
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2/5.3 Wireless Card
Bluetooth Specification 4.0/4.1/4.2/5.0/5.1/5.2/5.3 Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Legacy: 0~79 (1 MHz/CH)
Channels BLE: 0~39 (2 MHz/CH)
Data Rates and Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
Throughput BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice
channels
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps
asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with
a maximum transmit power of + 4 dBm for BR and EDR.

1. Wireless access point and Internet service required and sold separately. Availability of public wireless access points limited. Wi-
Fi 6 (802.11ax) is backwards compatible with prior 802.11 specs. Wi-Fi 6™ is designed to support gigabit data rate when
transferring files between two devices connected to the same router. Requires a wireless router, sold separately, that supports
80MHz and higher channels.
2. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
3. Check latest software/driver release for updates on supported security features.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for
802.11a/g (OFDM modulation).

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Technical Specifications
Intel® XMM™ 7560 R+ Technology/Operating FDD LTE:
LTE-Advanced Pro1 bands 2100 (Band 1), 1900 (Band 2), 1800 (Band 3),
1700/2100 (Band 4), 850 (Band 5), 2600 (Band 7), 900 (Band 8), 700 (Band
12 lower), 700 (Band 13 upper), 700 (Band 14 upper), 700 (Band 17
lower), 850 (Band 18 lower), 850 (Band 19 upper), 800 (Band 20), 1900
(Band 25), 850 (Band 26), 700 (Band 28), 700 (Band 29 RX only), 2300
(Band 30), 1700/2100 (Band 66), 600 (band 71).
TDD LTE:
2100 (Band 34), 2600 (Band 38), 1900 (Band 39), 2400 (Band 40), 2500
(Band 41), 3500 (Band 42), 3700 (Band 43), 3700 (band 48), 5200 (Band
46 RX only) MHz; HSPA+:
2100 (Band 1), 1900 (Band 2), 1700/2100 (Band 4),
850 (Band 5), 900 (Band 8) MHz
Wireless protocol 3GPP Release 12 LTE Specification DL-CAT.16, DL 100MHz BW throughput
standards up to 978Mbps; UL-CAT.13 40MHz throughput up to 150Mbps
WCDMA R99, 3GPP Release 5, 6, 7 and 8 UMTS Specification
GPS Standalone GPS/Beidou/Glonass, A-GPS (MS-A, MS-B)
GPS bands 1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz, Beidou
1561.098 MHz
Maximum data rates LTE: 978 Mbps (Download), 150 Mbps (Upload)
DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload)
HSPA+: 21Mbps (Download), 5.76 Mbps (Upload)
Maximum output power LTE: 23 dBm in all band except B41
LTE B41 HPUE = 26dBm
HSPA+: 23.5 dBm
Maximum power LTE: 1,200 mA (peak); 900 mA (average)
consumption HSPA+: 1,100 mA (peak); 800 mA (average)
Form Factor M.2, 3042-S3 Key B
Weight 6g
Dimensions 42 x 30 x 2.3 mm
(Length x Width x
Thickness)
eSIM Support

1. Mobile Broadband is an optional feature. Connection requires wireless data service contract, network support, and is not
available in all areas. Contact service provider to determine the coverage area and availability. Connection speeds will vary due to
location, environment, network conditions, and other factors. 4G LTE not available on all products or in all countries.

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Technical Specifications
NXP NPC300 Near Field Dimensions (L x W x H) Module 17 mm by 10 mm by 2.0 mm
Communication Chipset NPC300
Module System interface I2C
NFC RF standards ISO/IEC 14443 A
ISO/IEC 14443 B
ISO/IEC 15693
ISO/IEC 18092
ECMA-340 NFCIP-1 Target and Initiator
ECMA-320 NFCIP-2
NFC Forum Support Tag Type 1, Type 2, Type3 and Type 4, NFCIP-1 and NFCIP-2
Reader (PCD-VCD) ISO/IEC 14443 A
Mode(1) ISO/IEC 14443 B
ISO/IEC 15693
MIFARE 1K
MIFARE 4K
MIFARE DESFire
FeliCa
Jewel and Topaz cards
Card Emulation (PICC- ISO/IEC 14443 A
VICC) Mode(1) ISO/IEC 14443 B and B’
MIFARE
FeliCa
Frequency 13.56 MHz
NFC Modes Supported Reader/Writer, Peer-to-Peer
Raw RF Data Rates 106, 212, 424, 848 kbps
Operating temperature 0°C to 70°C
Storage temperature -20°C to 125°C
Humidity 10-90% operating
5-95% non-operating
Supply Operating 2.97 to 5.5 Volts
voltage
I/O Voltage 1.8V or 3.3V
Power Consumption
(Booster enable, VBAT= 3.3V, VCC_BOOST = 5V)
Mode Power Consumption, Typical
Polling 7.3 mA
Detected Test Tag 32.9 mA
Type 1
Detected Test Tag 70.7 mA
Type 2
Detected Test Tag 79.2 mA
Type 3
Detected Test Tag 64.9 mA
Type 4
Antenna Antenna connector, 0.5mm pitch, 7 connector FPC. Antenna matching is
external to module.

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Technical Specifications
1. WWAN module is an optional feature, requires factory configuration and requires separately purchased service contract.
Check with service provider for coverage and availability in your area. Connection speeds will vary due to location, environment,
network conditions, and other factors. LTE not available on all products, in all regions

Realtek RTL8111HSH Ethernet Features 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
10/100/1000 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-
Integrated NIC 30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40)
Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100
Mbit/s
Power Management ACPI compliant – multiple power modes
Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power
consumption
Performance Features TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling
Jumbo Frame 9K
Manageability Wake-on-LAN from modern standby or sleep state (Magic Packet and
Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x,
clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status

Interface PCIe + SMBus

NIC Device Driver Realtek PCIe GBE Ethernet Family Controller
Name

Realtek RTL8111FPH Ethernet Features 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
10/100/1000 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-
Integrated NIC 30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40)
Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100
Mbit/s
Power Management ACPI compliant – multiple power modes
Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power
consumption
Performance Features TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling
Jumbo Frame 9K

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Technical Specifications
Manageability Wake-on-LAN from modern standby or sleep state (Magic Packet and
Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x,
clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
Security & Support DASH 1.2 compliant
Manageability:
Interface PCIe + SMBus
NIC Device Driver Realtek PCIe GBE Ethernet Family Controller
Name

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Technical Specifications
POWER
1. Actual battery Watt-hours (Wh) will vary from design capacity. Battery capacity will naturally decrease with shelf life, time,
usage, environment, temperature, system configuration, loaded apps, features, power management settings and other factors.
AC Adapter 45 Watt Dimensions (H x W x D) 94.0mm x 40.0mm x 26.5mm
nPFC Standard USB type Weight 192.5g +/-10%
C Straight 1.8m Input Input Efficiency Average Efficiency of 25%, 50%, 75%,
100% load condition with 115Vac/230Vac
Spec:
5V: 81.5%
9V: 86.7%
12V: 87.41%
15V: 87.8%"
Input frequency range 47 ~ 63Hz
Input AC current Max. 1.4 A at 90 Vac
Output Output power 5V/15W
9V/27W
12V/36W
15V/45W
DC output 5V/9V/12V/15V
Hold-up time 5ms at 115 Vac input
Output current limit <5.0A
Connector USB Type-C
Environmental Design Operating temperature 32°F to 95°F (0° to 35°C)
Non-operating (storage) -4°F to 185°F (-20° to 85°C)
temperature
Altitude 0 to 16,400 ft (0 to 5,000m)
Humidity 20% to 95%
Storage Humidity 10% to 95%
EMI and Safety Eg:
Certifications *CE Mark - full compliance with LVD and EMC directives
* Worldwide safety standards - IEC60950-1 and/or IEC62368-1,
EN60950-1 and/or EN62368-1, UL60950-1 and/or UL62368-1, Class1,
SELV;
Agency approvals - C-UL-US, NORDICS, DENAN, EN55032 Class B, FCC
Class B, CISPR32 Class B, CCC, NOM-001 NYCE.
* MTBF - over 200,000 hours at 25°C ambient condition.

AC Adapter 45 Watt Dimensions 95x45x26.5mm

Smart nPFC Standard Weight unit: 200g +/- 10g
Barrel 4.5mm Right
Angle 1.8m Input Input Efficiency 87.74 % at 115 Vac and 88.4 % at 230Vac
Input frequency range 47 ~ 63 Hz
Input AC current Max. 1.4 A at 90 Vac
Output Output power 45W
DC output 19.5V
Hold-up time 5ms at 115 Vac input
Output current limit <8.0A

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Technical Specifications
Connector 4.5mm Barrel Type
Environmental Design Operating temperature 32oF to 95oF (0oto 35oC)
Non-operating (storage) -4oF to 185oF (-20oto 85oC)
temperature
Altitude 0 to 16,400 ft (0 to 5,000m)
Humidity 20% to 95%
Storage Humidity 10% to 95%
EMI and Safety Eg:
Certifications *CE Mark - full compliance with LVD and EMC directives
* Worldwide safety standards - IEC60950-1 and/or IEC62368-1,
EN60950-1 and/or EN62368-1, UL60950-1 and/or UL62368-1 , Class1,
SELV;
Agency approvals - C-UL-US, NORDICS, DENAN, EN55032 Class B, FCC
Class B, CISPR32 Class B, CCC, NOM-001 NYCE.
* MTBF - over 200,000 hours at 25°C ambient condition.

AC Adapter 65 Watt Dimensions 90.0 x 51 x 28.5mm

nPFC Standard USB Weight unit: 250g +/- 10g
type C Straight 1.8m
Input Input Efficiency Average Efficiency of 25%, 50%, 75%, 100%
load condition with 115Vac/230Vac Spec:
5V : 81.5%
9V : 86.7%
12V : 88%
15V : 88%
20V : 89%
Input frequency 47 ~ 63 Hz
range
Input AC current 1.6 A at 90 VAC and maximum load
5V/15W
9V/27W
12V/60W
15V/60W
Output Output power 20V/65W
DC output 5V/9V/12V/15V/20V
Hold-up time 5ms at 115 Vac input
Output current limit <8.0A
Connector USB Type C
Environmental Design Operating 32oFto 95oF (0oto 35oC)
temperature
Non-operating -4oFto 185oF (-20oto 85oC)
(storage)
temperature
Altitude 0 to 16,400 ft (0 to 5,000m)
Humidity 20% to 95
Storage Humidity 10% to 95%

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Technical Specifications
EMI and Safety Eg:
Certifications *CE Mark - full compliance with LVD and EMC directives
* Worldwide safety standards - IEC60950-1 and/or IEC62368-1,
EN60950-1 and/or EN62368-1, UL60950-1 and/or UL62368-1 , Class1,
SELV;
Agency approvals - C-UL-US, NORDICS, DENAN, EN55032 Class B, FCC
Class B, CISPR32 Class B, CCC, NOM-001 NYCE.
* MTBF - over 200,000 hours at 25°C ambient condition.

AC Adapter 65 Watt Dimensions 102 x 55 x 30mm

Smart nPFC EM Barrel Weight unit: 250g +/- 10g
4.5mm
Input Input Efficiency 88.0 % at 115 Vac and 89.0 % at 230Vac
Input frequency 47 ~ 63 Hz
range
Input AC current Max. 1.7 A at 90 Vac
Output Output power 65W
DC output 19.5V
Hold-up time 5ms at 115 Vac input
Output current limit <11.0A
Connector 4.5mm Barrel Type
Environmental Design Operating 32°F to 95°F (0°to 35°C)
temperature
Non-operating -4°F to 185°F (-20°to 85°C)
(storage)
temperature
Altitude 0 to 16,400 ft (0 to 5,000m)
Humidity 20% to 95%
Storage Humidity 10% to 95%
EMI and Safety Eg:
Certifications *CE Mark - full compliance with LVD and EMC directives
* Worldwide safety standards - IEC60950-1 and/or IEC62368-1,
EN60950-1 and/or EN62368-1, UL60950-1 and/or UL62368-1 , Class1,
SELV;
Agency approvals - C-UL-US, NORDICS, DENAN, EN55032 Class B, FCC
Class B, CISPR32 Class B, CCC, NOM-001 NYCE.
* MTBF - over 200,000 hours at 25°C ambient condition.

AC Adapter 65 Watt Dimensions 90 x 51 x 28.5mm

Smart nPFC Standard Weight 230g +/-10%
Barrel 4.5mm Right
Angle 1.8m Input Input Efficiency 88.0 % at 115 Vac and 89.0 % at 230 Vac
Input frequency 47 ~ 63 Hz
range
Input AC current Max. 1.7 A at 90 Vac
Outpu Output power 65W
DC output 19.5V
Hold-up time 5 ms at 115 Vac input
Output current limit <11.0A
Connector 4.5mm Barrel Type

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Technical Specifications
Environmental Design Operating 320F to 950F (0oto 35oC)
temperature
Non-operating -4oF to 185oF (-20oto 85oC)
(storage)
temperature
Altitude 0 to 16,400 ft (0 to 5000m)
Humidity 20% to 95%
Storage Humidity 10% to 95%
EMI and Safety Eg:
Certifications *CE Mark - full compliance with LVD and EMC directives
* Worldwide safety standards - IEC60950-1 and/or IEC62368-1,
EN60950-1 and/or EN62368-1, UL60950-1 and/or UL62368-1 , Class1,
SELV;
Agency approvals - C-UL-US, NORDICS, DENAN, EN55032 Class B, FCC
Class B, CISPR32 Class B, CCC, NOM-001 NYCE.
* MTBF - over 200,000 hours at 25°C ambient condition.

AC Adapter 65 Watt Dimensions 88x53.5x21mm

nPFC Slim USB type C Weight unit: 220g +/- 10g
Straight 1.8m
Input Input Efficiency 81.5% min at 115 Vac/ 230Vac @ 5V/3A
86.7% min at 115 Vac/ 230Vac @ 9V/3A
88% min at 115 Vac/ 230Vac @ 12V/5A
89% min at 115 Vac/ 230Vac @ 15V/4.33A
89% min at 115 Vac/ 230Vac @ 20V/3.25A
Input frequency 47 ~ 63 Hz
range
Input AC current 1.7 A at 90 VAC and maximum load
Output Output power 65W
DC output 5V/9V/12V/15V/20V
Hold-up time 5ms at 115 Vac input
Output current limit <8.0A
Connector USB Type C
Environmental Design Operating 32oF to 95oF (0oto 35oC)
temperature
Non-operating -4oF to 185oF (-20oto 85oC)
(storage)
temperature
Altitude 0 to 16,400 ft (0 to 5,000m)
Humidity 5% to 95%
Storage Humidity 5% to 95%
EMI and Safety Eg:
Certifications *CE Mark - full compliance with LVD and EMC directives
* Worldwide safety standards - IEC60950-1 and/or IEC62368-1,
EN60950-1 and/or EN62368-1, UL60950-1 and/or UL62368-1 , Class1,
SELV;
Agency approvals - C-UL-US, NORDICS, DENAN, EN55032 Class B, FCC
Class B, CISPR32 Class B, CCC, NOM-001 NYCE.
* MTBF - over 200,000 hours at 25°C ambient condition.

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Technical Specifications
RH 42Whr Long Life Dimensions (H x W x L) 6.2 x 76.25 x 249.50 mm (0.244 x 3.002 x 9.823 inch)
Polymer Fast Charge 3 Weight 0.18 kg (0.397 lb)
cell Battery Cells/Type 3cell Lithium-Ion Polymer cell / 545974
Energy
Voltage 11.4V
Amp-hour capacity 3.752Ah
1
Watt-hour capacity 42.75Wh
Temperature
Operating (Charging) 32˚ to 113˚ F (0˚ to 45˚ C)
Operating 14˚ to 122˚ F (-10˚ to 60˚ C)
(Discharging)
Fuel Gauge LED N/A
Warranty
Optional Travel No
Battery Available

RH 51Whr Long Life Dimensions (H x W x L) 6.50 x 67.80 x 254.00 mm (0.256 x 2.669 x 10 inch)
Polymer Fast Charge 3 Weight 0.2025 kg (0.446 lb)
cell Battery Cells/Type 3cell Lithium-Ion Polymer cell / 566075
Energy
Voltage 11.58V
Amp-hour capacity 4.431Ah
Watt-hour capacity1 51.3Wh
Temperature
Operating (Charging) 32˚ to 113˚ F (0˚ to 45˚ C)
Operating 14˚ to 122˚ F (-10˚ to 60˚ C)
(Discharging)
Fuel Gauge LED N/A
Warranty
Optional Travel No
Battery Available

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Technical Specifications
AUDIO
HD Stereo Codec ALC3247-CG
Audio I/O Ports Headset: CTIA only and Headphone-out
Internal Speaker Amplifier ALC 3247 has Embedded Class-D 2W Stereo Amplifier
Multi-streaming Capable Playback multi-streaming can be enabled in the audio control panel to allow independent audio.
Following MSFT Behavior
Sampling DAC: 48kHz
ADC: 44.1k/48kHz
Wavetable Syntheses N/A
Analog Audio Support 3.5mm Headset: CTIA only and Headphone-out
# of Channels on Line-Out N/A
Internal Speaker Yes

FINGERPRINT READER
Sensor vendor Model: Elan efsa80ST (module P1515E)
Sensor type Capacitive
DPI resolution 508 dpi
Scan area 80*80 pixels
False Rejection Rate FRR: ≤ 3%
False Acceptance Rate FAR: 1:100K
Mobile Voltage Operation 2.7V to 3.6V
Operating Temperature -4°F – 175°F (-20° ~ +80°C)
Current Consumption 50mA peak
Image
Low Latency Wait For 900uA
Finger
Capture Rate 30 frame/sec
ESD Resistance +15KV
Detection Matrix 80*80 pixels/ 508 dpi / 4*4mm sensor area

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Technical Specifications
ENVIRONMENTAL DATA
Eco-Label Certifications & This product has received or is in the process of being certified to the following approvals and may
declarations be labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• US Federal Energy Management Program (FEMP)
• EPEAT Gold registered in the United States. See http://www.epeat.net for registration
status in your country.
• TCO Certified
• China Energy Conservation Program (CECP)
• China State Environmental Protection Administration (SEPA)
• Taiwan Green Mark
• Korea Eco-label
• Japan PC Green label*
Sustainable Impact • Ocean-bound plastic in Speaker
Specifications • 15% post-consumer recycled plastic
• Low halogen
• Outside Box and corrugated cushions are 100% sustainably sourced and recyclable
• Recycled Plastic cushions
• Bulk packaging available
System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions data for the
Notebook model is based on a “Typically Configured Notebook”.

Energy Consumption
(in accordance with US
ENERGY STAR® test method) 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
Normal Operation (Sort idle) 5.57 W 5.47 W 5.01 W
Normal Operation (Long 0.95 W 1.31 W 1.23 W
idle)
Sleep 0.95 W 1.31 W 1.23 W
Off 0.30 W 0.30 W 0.28 W

NOTE:
Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model
family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S.
Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model
family does not offer ENERGY STAR® compliant configurations, then energy efficiency data listed
is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a
Microsoft Windows® operating system.

Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz

Normal Operation (Short
idle) 19 BTU/hr 18.7 BTU/hr 17.1 BTU/hr
Normal Operation (Long
idle) 3.2 BTU/hr 4.5 BTU/hr 4.2 BTU/hr
Sleep 3.2 BTU/hr 4.5 BTU/hr 4.2 BTU/hr
Off 1 BTU/hr 1 BTU/hr 1 BTU/hr
*NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is
attained for one hour.

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Technical Specifications
Declared Noise Emissions Sound Power Sound Pressure
(in accordance with (LWAd, bels) (LpAm, decibels)
ISO 7779 and ISO 9296)
Typically Configured – Idle 2.2 13.3
Fixed Disk – Random writes 2.7 18.3
Optical Drive – Sequential 2.9 22.4
reads
Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years. Upgradeable
features and/or components contained in the
Spare parts are available throughout the warranty period and or for up to “5” years after the end
of production.
Additional Information • This product is in compliance with the Restrictions of Hazardous Substances (RoHS)
directive - 2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic
Equipment (WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe
Drinking Water and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680 (EPEAT) standard at the Gold level, see
www.epeat.net
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and
ISO1043.
• This product is 93.2% recycle-able when properly disposed of at end of life.

Packaging Materials External: PAPER/Corrugated 220 g

Internal: PLASTIC/EPE (Expanded Polyethylene) 170 g
PLASTIC/Polyethylene low density - LDPE 55 g
PLASTIC/Polypropylene - PP 3g
The plastic packaging material contains at least 0.0% recycled content.
The corrugated paper packaging materials contains at least 54.5% recycled content.
RoHS Compliance HP Inc. complies fully with materials regulations. We were among the first companies to extend
the restrictions in the European Union (EU) Restriction of Hazardous Substances (RoHS) Directive
to our products worldwide through the HP GSE. HP has contributed to the development of
related legislation in Europe, as well as China, India, and Vietnam.
We believe the RoHS directive and similar laws play an important role in promoting industry-
wide elimination of substances of concern. We have supported the inclusion of additional
substances—including PVC, BFRs, and certain phthalates—in future RoHS legislation that
pertains to electrical and electronics products.
We met our voluntary objective to achieve worldwide compliance with the new EU RoHS
requirements for virtually all relevant products by July 2013, and we will continue to extend the
scope of the commitment to include further restricted substances as regulations continue to
evolve.
To obtain a copy of the HP RoHS Compliance Statement, see HP RoHS position statement.

Material Usage This product does not contain any of the following substances in excess of regulatory limits
(refer to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html
):
• Asbestos
• Certain Azo Colorants

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Technical Specifications
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Bis(2-Ethylhexyl) phthalate (DEHP)
• Benzyl butyl phthalate (BBP)
• Dibutyl phthalate (DBP)
• Diisobutyl phthalate (DIBP)
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently
handled or carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has
been voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging Usage HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in
packaging materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120
standards.

End-of-life Management HP offers end-of-life HP product return and recycling programs in many geographic areas. To
and Recycling recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest
HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible
manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information

for each product type for use by treatment facilities. This information (product disassembly
instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers.
These instructions may be used by recyclers and other WEEE treatment facilities as well as HP
OEM customers who integrate and re-sell HP equipment.

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HP, Inc. Corporate For more information about HP’s commitment to the environment:
Environmental Information
Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

footnotes • Percentage of ocean-bound plastic contained in each component varies by product

• Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-
2018 standard.
• External power supplies, WWAN modules, power cords, cables and peripherals
excluded.
• 100% outer box packaging and corrugated cushions made from sustainably sourced
certified and recycled fibers.
• Plastic cushions are made from >90% recycled plastic.

COUNTRY OF ORIGIN
China

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Options and Accessories (sold separately and availability may vary by country)
DOCKING (Sold Separately)
Docking station model #1 HP Thunderbolt Dock G2
Total number of supported displays 4
(incl.the notebook display)
Max.resolutions supported Dual 4K @30Hz or dual 4K UHD @ 60Hz is supported
Dual 8K@ 60Hz for TB hosts or USB-C hosts DP 1.4 with DSC in high res mode
Dock Connectors 2xDP, 1xVGA, 1xTB, 1xUSB-C alt-mode
Technical limitations Thunderbolt Hosts:
Maximum of (4) displays with maximum resolution of 5K@ 30Hz running
Thunderbolt host.
Maximum resolution possible is dual 8K displays @ 60Hz running Thunderbolt
host or running a non-Thunderbolt host in high resolution mode @30Hz
Non-Thunderbolt hosts:
The highest resolution for dual displays running a non-Thunderbolt host in
multi-function mode is
(1) 5K dual cable (using both DP ports) +(1) 4K on USB-C DP port
Non-Thunderbolt hosts support (3) displays with a maximum resolution of (2)
5K single cable + (1) 4K UHD @ 60 Hz in high resolution mode. In multi-function
mode the maximum resolution for (3) displays is (2) 5K single cable @ 30Hz +
(1) 4K UHD @ 30Hz.

Docking station model #2 HP USB-C Dock G5

Total number of supported displays 3
(incl.the notebook display)
Max.resolutions supported Dual 5K@ 30Hz + 1 4K UHD (multi-function mode)
Dock Connectors 1xHDMI, 2xDP
Technical limitations Highest resolution with dual displays is two 8K@ 60Hz host in High Resolution
mode.
Three maximum displays supported are two 5K@ 30 Hz on DP ports plus one
4K UHD@ 30 Hz on HDMI in Multi-function mode
The highest resolution for a non-Thunderbolt host in multi-function mode is a
single 5K dual cable (using both DP ports) + (1) 4K on HDMI port.

Docking station model #3 HP USB-C/A Universal Dock G2

Total number of supported displays 3
(incl.the notebook display)
Max.resolutions supported Triple 4K UHD@ 60Hz 3840 x 2160
Dock Connectors 1xHDMI, 2xDP
Technical limitations The best resolution for dual or triple displays is 4K UHD@ 60Hz.
For use with the USB-A adapter that comes in the box the maximum number of
displays supported is (2) 4k x 60 Hz on the Type-A Gen 1 connection from the
host.

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Options and Accessories (sold separately and availability may vary by country)
Category Description Part Number
Audio/Video HP Wired USB-A Stereo Headset 428K6AA
HP Wired 3.5mm Stereo Headset 428K7AA

Cases HP Business 14.1 Sleeve 2UW01AA

HP Business Slim 17.3 Top Load 2UW02AA
HP Executive 14.1 Tote 6KD10AA
HP Executive 15.6 Backpack 6KD07AA
HP Executive 15.6 Top Load 6KD06AA
HP Executive 17.3 Backpack 6KD05AA
HP Executive 17.3 Top Load 6KD08AA
HP Executive Leather 15.6 Top Load 6KD09AA
HP Executive Slim 14.1 Top Load 6KD04AA
HP Prelude G2 15.6 Backpack 1E7D6AA
HP Prelude G2 15.6 Top Load 1E7D7AA
HP Prelude Pro Recycled 15.6 Backpack 1X644AA
HP Prelude Pro Recycled 15.6 Top Load 1X645AA
HP Renew 14 Laptop Sleeve 2E6U9AA,2E6V0AA
HP Renew Business 14.1 Laptop Sleeve 3E2U7AA
HP Renew Business 17.3 Laptop Backpack 3E2U5AA
HP Renew Business 17.3 Laptop Bag 3E2U6AA
HP Renew Business 14.1 Laptop Bag 3E5F9AA
HP Renew Business 15.6 Laptop Bag 3E5F8AA

Docking HP Thunderbolt 120W G2 Dock 2UK37AA

HP Thunderbolt 120W G2 Dock w/Audio 3YE87AA
HP Thunderbolt 120W G4 Dock 4J0A2AA
HP Thunderbolt 230W G2 Dock w/Combo Cable 3TR87AA
HP Thunderbolt 280W G4 Dock w/Combo Cable 4J0G4AA
HP USB-C/A 120W G2 Universal Dock 5TW13AA
HP USB-C 120W G5 Dock 26D32AA

Hub HP Universal USB-C Multiport Hub 50H55AA

HP USB-C Travel Dock G2 7PJ38AA
HP USB-C to USB-A Hub Z6A00AA

Adapter HP HDMI to DVI Adapter F5A28AA

HP HDMI to VGA Adapter H4F02AA
HP USB-C to DisplayPort Adapter N9K78AA
HP USB-C to HDMI 2.0 Adapter 1WC36AA
HP USB-C to USB 3.0 Adapter N2Z63AA
HP USB-C to VGA Adapter N9K76AA

Keyborad/Combo HP 975 USB+BT Dual-Mode Wireless Keyboard 3Z726AA

HP 455 Programmable Wireless Keyboard 4R177AA

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QuickSpecs HP EliteBook 645 14 inch G9 Notebook PC

Options and Accessories (sold separately and availability may vary by country)
HP 125 WD USB Keyboard 266C9AA
HP 320K WD USB Keyboard 9SR37AA
HP 655 Wireless Keyboard and Mouse Combo 4R009AA
HP 225 Wired Mouse and Keyboard Combo 286J4AA
HP 235 Wireless Mouse and Keyboard Combo 1Y4D0AA
HP Slim Wireless Keyboard and Mouse T6L04AA
HP Wired Desktop 320MK Mouse and Keyboard 9SR36AA
HP Wireless Rechargeable 950MK Mouse and Keyboard 3M165AA

Mouse HP USB Premium Wireless Mouse 1JR31AA

HP 435 Multi-Device Wireless Mouse 3B4Q5AA
HP 125 USB-A Wired Mouse 265A9AA
HP 128 USB Laser Wired Mouse 265D9AA
HP 320M USB-A Wired Mouse 9VA80AA
HP Creator USB-A+Bluetooth 935 Wireless Mouse Black 1D0K8AA
HP USB-A+Bluetooth Multi-Device 635 Wireless Mouse Black 1D0K2AA
HP USB-A+Bluetooth Travel Bluetooth Mouse 6SP30AA

Power HP 65W USB-C Auto Chevy AC Power Adapter 5TQ76AA

HP 45W 4.5 mm Smart AC Power Adapter H6Y88AA
HP 45W USB-C G2 Zeus AC Power Adapter 1HE07AA
HP 45W USB-C LC Dali AC Power Adapter 1MZ01AA
HP 65W 4.5 mm LC Smart non-EM India Ony AC Power Adapter 3FF84AA#ACJ
HP 65W 4.5 mm Smart AC Power Adapter H6Y89AA
HP 65W 4.5 mm wDongle 7.4 mm Slim AC Power Adapter H6Y82AA
HP 65W USB-C Hades AC Power Adapter 1HE08AA
HP 65W USB-C LC AC Power Adapter 1P3K6AA

Commodity HP USB DVD-Writer EXT ODD F2B56AA

HP Nano Keyed Cable Lock 1AJ39AA
HP Nano Master Keyed Cable Lock 1AJ40AA
HP SureKey Standard/Nano/Wedge Cable Lock 6UW42AA

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QuickSpecs HP EliteBook 645 14 inch G9 Notebook PC

Summary of Changes
Date of change Version History Description of change

January 25, 2022 V1 to V2 Added TPM, Smart reader, IPv6 Compliance and FirstNet Certified in Security section
and Battery Life
February 11, 2022 V2 to V3 Updated USB Type-C® and HDMI from Ports/Slots section
February 22, 2022 V3 to V4 Updated Battery life and WWAN module
March 1, 2022 V4 to V5 Added Wake on WLAN in Networking section
March 14, 2022 V5 to V6 Added Battery Compliance in Power section
April 11, 2022 V6 to V7 Added Reference for USB ports
May 24, 2022 V7 to V8 Added DASH support in Networking section
June 15, 2022 V8 to V9 Added Added note in Manageability Feature
October 19, 2022 V9 to V10 Updated Bluetooth version
November 4, 2022 V10 to V11 Updated Ports section
December 7, 2022 V11 to V12 Updated Windows OS
December 19, 2022 V12 to V13 Updated Battery life section
January 20, 2023 V13 to V14 Updated Operating System
January 25, 2023 V14 to V15 Added Miracast in Networking section
March 2, 2023 V15 to V16 Updated Networking and communications section
V16 to V17

© Copyright 2023 HP Development Company, L.P. The information contained herein is subject to change without notice. The only
warranties for HP products and services are set forth in the express warranty statements accompanying such products and
services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial
errors or omissions contained herein.

Intel, Core and Intel vPro are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and
other countries. DisplayPort™ and the DisplayPort™ logo are trademarks owned by the Video Electronics Standards Association
(VESA®) in the United States and other countries. USB Type-C® and USB-C® are trademarks of USB Implementers Forum. ENERGY
STAR is a registered trademark of the U.S. Environmental Protection Agency. Microsoft and Windows are either registered
trademarks or trademarks of Microsoft Corporation in the United States and/or other countries.

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