MLX81205/07/10/15

Features

Microcontroller: MLX16-FX RISC CPU

o 16 bit RISC CPU with 20DMIPS and Power-Saving-Modes
o Co-processor for fast multiplication and division
o Flash and EEPROM memory with EEC
o In-circuit debug and emulation

Supported bus interfaces:

o LIN-Interface with integrated LIN transceiver supporting LIN 2.x, certified LIN protocol
software provided by Melexis
o In-Module-Programming (Flash and EE) via pin LIN using a special Melexis fast protocol
o PWM-Interface
o Full duplex SPI, Master/Slave, double-buffered, speed programmable. DMA access. Flash
and EEPROM programming also possible via SPI.

TruSense Motor Control Technology

o Patented algorithms for sensor-less 3-phase sine and trapezoidal motor control
o Phase voltage integration filter for BEMF voltage sensing at lowest speeds
o Position dependent phase inductance sensing via shunt current measurements at stand still
and low to medium speeds
o Support of Star and Delta based motor configurations without the need for center star point
o Support of 3-phase switched reluctance motor control

Voltage Regulator
o Direct powered from 12V board net with low voltage detection
o Operating voltage VS = 5V to 18V
o Internal voltage regulator with possibility to use external regulator transistor
o Very low standby current, < 30µA in sleep mode, wake-up possible via LIN or local sources

Pre-Driver
o Pre-driver (~25Ω Rdson) for all 3 N-FET half bridges with programmable Inter-Lock-Delay
and slope control for optimal EMC and thermal performance during power N-FET switching
o Monitoring of Drain-Source voltages of the N-FETs

Periphery
o 4 independent 16 bit timer modules with capture and compare, and additional software
timer
o 3 programmable 12 bit PWM units with programmable frequencies
o 10 bit ADC converter (2µs conversion time) and DMA access
o On-chip temperature sensor with ±10K accuracy
o System-clock-independent fully integrated watchdog
o 32 MHz ±5% internal RC oscillator with PLL
o Optional crystal oscillator
o Load dump and brown out interrupt function
o Integrated shunt current amplifier with programmable gain

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Applications
The MLX81205/07/10/15 controls BLDC motors via external FET transistors for:

o Oil-, water-, fuel-pumps

o Blowers, compressors
o Positioning actuators

Family Concept

MLX81205 MLX81207 MLX81210 MLX81215

Flash Memory [kByte] 32 32 32 64
RAM [kByte] 4 4 8 8
EEPROM [Byte] 384 384 384 384
Package QFN32 QFN48 QFN48 QFN48
TQFP EP 48 TQFP EP 48 TQFP EP 48
Support of active high side reverse No Yes Yes Yes
polarity protection
Current shunt measurement High side High side Low side, Low side,
possibility High side High side
UART Yes Yes Yes Yes
SPI No Yes Yes Yes
Support of sensor based BLDC No Yes Yes Yes
motor control
Support of Switched Reluctance No No No Yes
(SR) motor control
5V Regulator support for 5V No No Yes Yes
external supplies (CAN support)
Bonded pins in package 32 37 48 48
Pin compatibility MLX81210 and MLX81215 are pin compatible

Table 1 – Family Options

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Ordering Information
Order Code [1] Temp. Package Delivery Remark
Range
MLX81205 LLQ-xAA-000-TU -40 - 150 °C QFN32 5x5 Tube
MLX81205 LLQ-xAA-000-RE -40 - 150 °C QFN32 5x5 Reel
MLX81207 LLQ-xAA-000-TU -40 - 150 °C QFN48 7x7 Tube
MLX81207 LLQ-xAA-000-RE -40 - 150 °C QFN48 7x7 Reel
MLX81207 LPF-xAA-000-TR -40 - 150 °C TQFP EP 48 7x7 Tray
MLX81207 LPF-xAA-000-RE -40 - 150 °C TQFP EP 48 7x7 Reel
MLX81210 LLQ-xAA-000-TU -40 - 150 °C QFN48 7x7 Tube
MLX81210 LLQ-xAA-000-RE -40 - 150 °C QFN48 7x7 Reel
MLX81210 LPF-xAA-000-TR -40 - 150 °C TQFP EP 48 7x7 Tray
MLX81210 LPF-xAA-000-RE -40 - 150 °C TQFP EP 48 7x7 Reel
MLX81215 LLQ-xAA-000-TU -40 - 150 °C QFN48 7x7 Tube
MLX81215 LLQ-xAA-000-RE -40 - 150 °C QFN48 7x7 Reel
MLX81215 LPF-xAA-000-TR -40 - 150 °C TQFP EP 48 7x7 Tray
MLX81215 LPF-xAA-000-RE -40 - 150 °C TQFP EP 48 7x7 Reel
Table 2 – Ordering Information
[1]
.See Marking/Order Code.

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Contents

1. FUNCTIONAL DIAGRAM ........................................................................................................................ 5

2. PIN DESCRIPTION .................................................................................................................................. 6
3. ELECTRICAL CHARACTERISTICS........................................................................................................ 7
3.1 OPERATING CONDITIONS .................................................................................................................... 7
3.2 ABSOLUTE MAXIMUM RATINGS ............................................................................................................ 7
4. APPLICATION EXAMPLES..................................................................................................................... 8
4.1 SENSOR-LESS BLDC MOTOR CONTROL ON THE LIN-BUS OR VIA PWM-INTERFACE WITH REVERSE
POLARITY PROTECTION AND CURRENT SENSING ................................................................................................. 8
4.2 SENSOR-LESS BLDC MOTOR CONTROL ON THE LIN-BUS OR VIA PWM-INTERFACE WITH REVERSE
POLARITY PROTECTION IN THE HIGH SIDE PATH ................................................................................................ 10
4.3 SENSOR BASED BLDC MOTOR CONTROL .......................................................................................... 11
4.4 SENSOR-LESS BLDC MOTOR CONTROL WITH ABSOLUTE POSITION SENSING ....................................... 12
4.5 SENSOR-LESS BLDC MOTOR CONTROL VIA A CAN-BUS-INTERFACE .................................................. 13
5. MECHANICAL SPECIFICATION ........................................................................................................... 14
5.1 QFN ................................................................................................................................................ 14
5.1.1. QFN32 5x5 (32 leads)............................................................................................................................... 14
5.1.2. QFN48 7x7 (48 leads)............................................................................................................................... 14
5.2 TQFP EP 48 7X7 (48 LEADS) ........................................................................................................... 15
6. MARKING/ORDER CODE ..................................................................................................................... 16
6.1 MARKING MLX81205/07/10/15 ........................................................................................................ 16
6.2 ORDER CODE MLX81205/07/10/15 ................................................................................................. 16
7. ASSEMBLY INFORMATION.................................................................................................................. 17
8. DISCLAIMER.......................................................................................................................................... 18

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1. Functional Diagram
RTG VDDA CLKO OSC1 OSC2 VREF

VBAT_S1
VS
VDDD
fmain VBAT_S2

V5IN VS
VREF
V5R ISENSH
ISENSL
TEMP
GND_S1
VBAT_S1
VBAT_S2
GND_S1
GND_S2
U
V
W
IOHV T GND_S2
PHASEINT
IOHV
IO1
...
IO9
......
fmain
......
IO1
CP0
HS0
IO2
LS0
IO3 U
SHU
IO4

IO5 CP1
HS1
IO6
ADC SPI
LS1
IO7
V

IO8 SHV

IO9 CP2
HS2
LS2
LIN
W
GNDA SHW
GNDD T
GNDCAP
GNDDRV

TI0 TI1 TO

Figure 1 - Block Diagram

Black: common for all versions,
Blue: additional pins / functionality for MLX81207,
Blue + red: additional pins / functionality for MLX81210 / MLX81215

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2. Pin Description
Name Type Function MLX81205 MLX81207 MLX81210 MLX81215
VS P Battery Supply X X X X
RTG O 3.3V External MOS Gate Control X X X X
VDDA P 3.3V Supply X X X X
V5R P 5V Regulator Output for external NFET X X
V5IN I 5V Regulator Input X X
VDDD P 1.8V Regulator output X X X X
GNDD GND Digital ground X X X X
GNDCAP GND Digital ground X X X
GNDDRV GND Driver ground X X X X
GNDA GND Analog ground X X X X
LIN HVIO Connection to LIN bus or PWM interface X X X X
IOHV HVIO General purpose IO pin X X X X
TI0 I Test input, debug interface X X X X
TI1 I Test input, debug interface X X X X
TO O Test output, debug interface X X X X
OSC1 I Quarz interface input X X X X
OSC2 O Quarz interface ouput X X X X
IO1 LVIO General purpose IO pin (Low voltage 3.3V) X X X X
IO2 LVIO General purpose IO pin (Low voltage 3.3V) X X X X
IO3 LVIO General purpose IO pin (Low voltage 3.3V) X X X
IO4 LVIO General purpose IO pin (Low voltage 3.3V) X X X
IO5 LVIO General purpose IO pin (Low voltage 3.3V) X X X
IO6 LVIO General purpose IO pin (Low voltage 3.3V) X X
IO7 LVIO General purpose IO pin (Low voltage 3.3V) X X
IO8 LVIO General purpose IO pin (Low voltage 3.3V) X X
IO9 LVIO General purpose IO pin (Low voltage 3.3V) X X
CLKO HVO Switchable 250kHz clock output to VREF level X X X
SHU HVI Phase U input to BEMF sensing blocks X X
SHV HVI Phase V input to BEMF sensing blocks X X
SHW HVI Phase W input to BEMF sensing blocks X X
T HVI Reference input to BEMF sensing blocks X X X X
VREF P Clamped 8V or 12V ref. voltage for bootstrap X X X X
CP2 HVIO High side bootstrap capacitor driver 2 X X X X
HS2 HVIO N-FET high side gate driver 2 X X X X
W HVI Phase W input to HS2 buffer and BEMF sensing blocks X X X X
LS2 HVO N-FET low side gate driver 2 X X X X
CP1 HVIO High side bootstrap capacitor driver 1 X X X X
HS1 HVIO N-FET high side gate driver 1 X X X X
V HVI Phase V input to HS1 buffer and BEMF sensing blocks X X X X
LS1 HVO N-FET low side gate driver 1 X X X X
CP0 HVIO High side bootstrap capacitor driver 0 X X X X
HS0 HVIO N-FET high side gate driver 0 X X X X
U HVI Phase U input to HS0 buffer and BEMF sensing blocks X X X X
LS0 HVO N-FET low side gate driver 0 X X X X
VBAT_S1 HVI VS high side input for current sensing X X X X
VBAT_S2 HVI VS low side input for current sensing X X X X

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GND_S1 LVI GND high side input for current sensing X X

GND_S2 LVI GND low side input for current sensing X X
Pin count 32 37 48 48

Table 3 - Pin Description MLX81205 / MLX81207 / MLX81210 / MLX81215

3. Electrical Characteristics
All voltages are referenced to ground (GND). Positive currents flow into the IC. The absolute maximum
ratings given in the table below are limiting values that do not lead to a permanent damage of the device but
exceeding any of these limits may do so. Long term exposure to limiting values may affect the reliability of
the device. Reliable operation of the MLX81205/07/10/15 is only specified within the limits shown in
Operating conditions.

3.1 Operating Conditions

Parameter Symbol Min Max Unit

IC supply voltage VS 5 18 V
Operating ambient temperature Tamb -40 +150 [1] °C

Table 4 - Operating Conditions

[1]
Target temperature specification after qualification. With temperature applications at TA>125°C a reduction of chip internal power
dissipation with external supply transistor is mandatory. The extended temperature range is only allowed for a limited period of time,
customer’s mission profile has to be agreed by Melexis as a mandatory part of the Part Submission Warrant.

3.2 Absolute Maximum Ratings

Parameter Symbol Condition Min Max Unit

T = 2 min -0.3 28
IC supply voltage VS V
T < 500 ms 45
Maximum reverse current into any pin -10 +10 mA
Maximum sum of reverse currents into all pins +10 mA
DC voltage on LVIO pins, OSC<2:1>, GND_S<2:1> -0.3 VDDA+0.3 V
DC voltage on HV I/O pin, V5R pin -0.3 VS+0.3 V
DC voltage on drivers supply pin VREF -0.3 18 V
DC voltage on drivers control pins (CLKO, LS<2:0>) -0.3 VREF+0.3 V
DC voltage on drivers CP<2:0>, HS<2:0> pins -0.3 VS + VREF V
DC voltage on phases related pins (U, V, W, SHU,
SHV, SHW, T, VBAT_S<2:1>) -0.3 VS+1.5 V
Human body model, equivalent to
ESD capability of pin LIN ESDBUSHB discharge 100pF with 1.5kΩ,
-6 +6 kV
Human body model, equivalent to
ESD capability of any other pins ESDHB discharge 100pF with 1.5kΩ,
-2 +2 kV
Maximum latch–up free current at any Pin ILATCH -250 +250 mA
Junction temperature [1]
Tvj +155 °C
Storage temperature Tstg -55 +150 °C
Rthjc QFN32 10 K/W
Rthjc QFN48 Rthjc 5 K/W
Rthjc TQFP48 5.5 K/W

Table 5 - Absolute Maximum Ratings

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[1]
Target temperature specification after qualification. With temperature applications at TA>125°C a reduction of chip internal power
dissipation with external supply transistor is mandatory. The extended temperature range is only allowed for a limited period of time,
customer’s mission profile has to be agreed by Melexis as a mandatory part of the Part Submission Warrant.

4. Application Examples
The following sections show typical application examples[1].

4.1 Sensor-less BLDC Motor Control on the LIN-Bus or via PWM-Interface with
reverse polarity protection and current sensing

In the sample application of Figure 2, the MLX81205 can realize the sensor-less driving of a BLDC motor via
three external power N-FET half bridges with only a few external components. The high side N-FET driving is
done with a bootstrap output stage. Reverse polarity protection of the bridge is realized with an external
power FET in the ground path. An external temperature sensor is connected to the 10 bit ADC via pin IO1.
The integrated watchdog with a dedicated separate RC-oscillator is monitoring application integrity. The
communication interface could be LIN or a PWM interface. The pin LIN can also be used as wake-up source
and to program the Flash memory.
The motor currents are measured by a shunt resistor in the high side path. In case the current exceeds the
programmed threshold, the bridge can be switched off automatically and / or a software interrupt can be
generated. The motor current can also be measured by the 10-bit ADC converter.
The patented Melexis TruSense technology combines two methods to determine the rotor position:
- The measurement of the induced BEMF voltage at medium and high speeds.
- The measurement of position dependent coil inductance variations at stand-still and low speeds.
As a result TruSense allows operation of the motor in the widest dynamic speed range. The motor can be
driven with block, trapezoidal or sine-wave currents. The motor start-up can be made independent of the
load conditions according to the application requirements.
In this example application the motor star point is not available. It is modeled with external resistors from the
motor phases and connected to T input. Alternatively an artificial IC internal reference point can be chosen
as shown in the block diagram of the MLX81205/07/10/15.
[1]
The application examples are principal application schematics only. The details need to be worked out for each application schematic
separately, depending on the application requirements.

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Figure 2 - Typical Sensor-less BLDC Motor Control Application Example with MLX81205

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4.2 Sensor-less BLDC Motor Control on the LIN-Bus or via PWM-Interface with
reverse polarity protection in the high side path
In the sample application of Figure 3, the MLX81207 has been selected in order to benefit from the external
high side reverse polarity protection possibility compared to the application shown in section 4.1.
All other remarks from the previous application example remain valid.

Figure 3 – Typical Sensor-less BLDC Motor Control Application Example with MLX81207

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4.3 Sensor based BLDC Motor Control

In the sample application of, Figure 4, the MLX81207 can realize the driving of a BLDC motor with three Hall
sensors. An external P-FET is used to derive the 3.3V supply with a higher current capability in order to bring
power consumption outside the MLX81207.
VBAT

CLKO
VS
VHIGH

RTG VBAT_S1
VCC3 SHUNT
VDDA VBAT_S2
VREF
VPROT

CP2
VDDD CP1
CP0

VCC3
HS0
IO1 U
U
LIN / PWM
LIN LS0

IO2 MLX81207 VPROT

HS1
IO3 V
V
IOHV

LS1
OSC1

VPROT
OSC2

HS2
W
IO4
IO5 W

LS2

TI0 VCC3
T
TI1
VCCHALL
TO
HALL1
GNDA HALL2
GNDD HALL3
GNDCAP GND
GNDDRV

GND

Figure 4 – Typical Sensor based BLDC Motor Control Application Example with MLX81207

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4.4 Sensor-less BLDC Motor Control with absolute position sensing

In the sample application of Figure 5, the MLX81210 is working with an absolute position sensor in order to
measure the position of the gear shaft in throttle valve application systems or any other similar applications,
where absolute precise position sensing is requested.

Figure 5 – Typical Sensor-less BLDC Motor Control Application Example with MLX81210 and Triaxis®
absolute position sensing

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4.5 Sensor-less BLDC Motor Control via a CAN-Bus-Interface

In this sample application the MLX81215 can realize the sensor-less driving of a BLDC motor via a CAN-Bus
Interface. System wake-up on CAN-bus traffic is possible. The 5V and a 3.3V voltage supply needed for the
CAN-Bus, is generated via external N-FET control in order to limit the power dissipation in the package.
The motor current can be monitored via shunt resistors in the ground and battery path in case the application
requests a double side monitoring for security reasons.
Application programming on module level via the CAN-Bus is supported by the SPI-Interface.

Figure 6 – Typical BLDC Motor Control Application Example on the CAN-Bus with MLX81215

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5. Mechanical Specification
5.1 QFN

Figure 7 – QFN Drawing

5.1.1. QFN32 5x5 (32 leads)

Symbol [1][2] A A1 A3 b D D2 E E2 e L N [3] ND [4] NE [4]

Min 0.80 0.00 0.18 3.50 3.50 0.35

QFN32 Nom 0.85 0.02 0.20 0.25 5.00 3.60 5.00 3.60 0.50 0.40 32 8 8
Max
0,90 0.05 0.30 3.70 3.70 0.45

Table 6 – QFN32 5x5 Package Dimensions

5.1.2. QFN48 7x7 (48 leads)

Symbol [1][2] A A1 A3 b D D2 E E2 e L N [3] ND [4] NE [4]

Min 0.80 0 0.18 5.00 5.00 0.45

QFN48 Nom 0.85 0.02 0.20 0.25 7.00 5.10 7.00 5.10 0.50 0.50 48 12 12
Max
0.90 0.05 0.30 5.20 5.20 0.55

Table 7 - QFN48 7x7 Package Dimensions

[1] Dimensions and tolerances conform to ASME Y14.5M-1994

[2] All dimensions are in Millimeters. All angels are in degrees
[3] N is the total number of terminals
[4] ND and NE refer to the number of terminals on each D and E side respectively

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5.2 TQFP EP 48 7x7 (48 leads)

Exposed pad need best

possible contact to ground for
exlectrical and thermal reasons

Figure 8 – TQFP EP 7x7 Drawing

A A1 A2 b b1 D D1 D2 E E1 E2 e L N Ccc ddd
Min - 0.05 0.95 0.17 0.17 0.45 - -
Nom - - 1.00 0.22 0.20 9.00 7.00 4.00 9.00 7.00 4.00 0.50 0.60 48 - -
Max 1.20 0.15 1.05 0.27 0.23 0.75 0.08 0.08
Table 8 – TQFP EP 7x7 Package Dimensions

Notes:
1. All Dimensioning and Tolerances conform to ASME Y14.5M-1994,
∆2. Datum Plane [-|-|-] located at Mould Parting Line and coincident with Lead, where Lead exists, plastic body at bottom of parting line.
∆3. Datum [A-B] and [-D-] to be determined at centerline between leads where leads exist, plastic body at datum plane [-|-|-]
∆4. To be determined at seating plane [-C-]
∆5. Dimensions D1 and E1 do not include Mould protrusion. Dimensions D1 and E1 do not include mould protrusion. Allowable mould
protrusion is 0.254 mm on D1 and E1 dimensions.
6. 'N' is the total number of terminals
∆7. These dimensions to be determined at datum plane [-|-|-]
8. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package.
∆9. Dimension b does not include dam bar protrusion, allowable dam bar protrusion shall be 0.08mm total in excess of the "b"
dimension at maximum material condition, dam bar can not be located on the lower radius of the foot.
10. Controlling dimension millimeter.
11. Maximum allowable die thickness to be assembled in this package family is 0.38mm
12. This outline conforms to JEDEC publication 95 Registration MS-026, Variation ABA, ABC & ABD.
∆13. A1 is defined as the distance from the seating plane to the lowest point of the package body.
∆14. Dimension D2 and E2 represent the size of the exposed pad. The actual dimensions are specified ion the bonding diagram, and
are independent from die size.
15. Exposed pad shall be coplanar with bottom of package within 0.05.

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6. Marking/Order Code
6.1 Marking MLX81205/07/10/15

IC Version: 07/10 or 15
Silicon Revision: Character [A...Z]

Lot Number

Assembly Date Code: Week number

Firmware Revision: Characters [AA...ZZ]
Assembly Date Code: Year
1

Silicon Revision: Character [A...Z]

Lot Number

Assembly Date Code: Week number

Firmware Revision: Characters [AA...ZZ]
Assembly Date Code: Year
1

6.2 Order Code MLX81205/07/10/15

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7. Assembly Information

This Melexis device is classified and qualified regarding soldering technology, solder ability and moisture
sensitivity level, as defined in this specification, according to following test methods:

• IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification For No hermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
• EIA/JEDEC JESD22-A113
Preconditioning of No hermetic Surface Mount Devices Prior to Reliability Testing (Reflow profiles
according to table 2)
• CECC00802
Standard Method For The specification of Surface Mounting Components (SMD’s) of Assessed
Quality
• EIA/JEDEC JESD22-B106
Resistance to soldering temperature for through-hole mounted devices
• EN60749-15
Resistance to soldering temperature for through-hole mounted devices
• MIL 883 Method 2003 / EIA/JEDEC JESD22-B102
Solder ability

For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after
consulting Melexis regarding assurance of adhesive strength between device and board.

Based on Melexis commitment to environmental responsibility, European legislation (Directive on the

restriction of the use of certain hazardous substances, RoHS) and customer requests, Melexis has installed
a roadmap to qualify their package families for lead free processes also. Various lead free generic
qualifications are running, current results on request.

For more information on Melexis lead free statement see quality page at our website:
http://www.melexis.com/html/pdf/MLXleadfree-statement.pdf

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8. Disclaimer
The product abstract just provides an overview of the described devices. Please consult the complete
product specification/datasheet in its latest revision for any detailed information.

Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the
information set forth herein or regarding the freedom of the described devices from patent infringement.
Melexis reserves the right to change specifications and prices at any time and without notice. Therefore,
prior to designing this product into a system, it is necessary to check with Melexis for current information.
This product is intended for use in normal commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or high reliability applications, such as military,
medical life-support or life-sustaining equipment are specifically not recommended without additional
processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be
liable to recipient or any third party for any damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential
damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical
data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering
of technical or other services.
© Melexis NV. All rights reserved

For the latest version of this document, go to our website at

www.melexis.com

Or for additional information contact Melexis Direct:

Europe, Africa, Asia: America:

Phone: +32 1367 0495 Phone: +1 248 306 5400
E-mail: sales_europe@melexis.com E-mail: sales_usa@melexis.com

ISO/TS16949 and ISO14001 Certified

Product Abstract Page 18 of 18 Rev 3.9

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