Product

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Published by
ams OSRAM Group
www.osram-os.com

Application Note No. AN036

Processing of SMD LEDs

Application Note
Valid for:
SMD LEDs from OSRAM Opto Semiconductors

Abstract
This application note provides a basic overview of the essential aspects and influencing
factors regarding the processing of SMD LEDs.

Authors: Lang Kurt-Jürgen

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Table of contents
A. Introduction ............................................................................................................ 2
B. SMD LEDs .............................................................................................................. 3
C. Processing of SMD LEDs ...................................................................................... 5
Solder pad design .............................................................................................. 6
PCB pad finishes ............................................................................................... 7
Solder paste printing / solder stencil ................................................................. 8
3D SPI (Solder Paste Inspection) ..................................................................... 10
Reflow soldering .............................................................................................. 11
Voids ................................................................................................................ 13
Solder joint / post reflow inspection ................................................................ 14
Storage ............................................................................................................ 15
Cleaning ........................................................................................................... 15
D. Summary .............................................................................................................. 16

A. Introduction
In general, LEDs do not differ in terms of processing from other electronic SMD
components. However, because of their optical properties their specific package
materials might be more sensitive, and thus the LEDs can be rapidly impaired or
may fail totally with regard to their electro-optical features if they are not correctly
handled or assembled. With progressive miniaturization and new package
concepts, requirements for LED processing are becoming more demanding, for
example in respect to the assembly and soldering processes.
With new miniature high power LEDs it is for example essential that the soldering
process is designed and adapted in the way that defects (voids) in the solder
joints are minimized. The lower the number of voids, especially at the thermal
pad of the LED, the better the thermal connection to the PCB and thus the lower
the thermal load. This in turn influences the performance and lifetime of the LED.
The possible extent of influence is diverse in such cases and is usually not
determined by only a single processing step. Factors such as component finish,
material and composition of the solder, design of the solder stencil, reflow solder
profile or process atmosphere are interlinked and contribute to the solder result.

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The professional processing of SMD LEDs from OSRAM Opto Semiconductors

is outlined below. Essential aspects and important factors of influence within the
manufacturing process are described.

B. SMD LEDs
SMD (Surface mounted device) LEDs are usually defined as devices with
packages that can be soldered directly onto the surface of a printed circuit board
via solder-capable contacts. Plastic molding compounds, ceramic or epoxy
substrates are used for the package, cast with epoxy or silicone.
According to the package type and variant, the contacts of traditional LED
devices are usually formed as Gull-Wing or J-Leads. With newer types of
package, especially for higher packing densities, the solder joints are small
metal-coated connection surfaces on the backside of the package (bottom only-
terminated (BoT)). Figure 1 shows a selection from the SMD LED portfolio of
OSRAM Opto Semiconductors.

Figure 1: Selection from the SMD LED product portfolio of OSRAM Opto
Semiconductors
OSLON®
Black Flat

OSLON®
r
we Compact PL
h po
Hig
n d:
Tre OSRAM OSTAR®
Advanced OSLON®
Power TOPLED®
Power TOPLED®

Trend: QFN / BoT

TOPLED® OSLON® SYNIOS® DURIS®

Compact
PointLED®
Tre Mini
nd:
Mi TOPLED®
nia Chip LED®
tur
iza Micro
tio SODELED®
n
SMARTLED® FIREFLY®
CSP
0402

As with all products from OSRAM Opto Semiconductors, also its SMD LEDs
fulfill the current RoHS guidelines (European Union & China), and therefore
contains no lead or other defined hazardous substances.

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Due to their geometric dimensions, beginning with a size of approx. 1 mm to

10 mm, SMD LEDs belong to the small constructions and are packaged in tapes
of plastic because they are usually required in larger quantities. The tapes with a
width of 8 mm to 24 mm are coiled on a reel, whereby the reel size and the
quantity on the roll are dependent on the form of the LED. The dimensions of the
LED-specific tape from OSRAM Opto Semiconductors are in accordance with
IEC 60286-3, EIA 481-C and can be found on the website in the Product Catalog
section, in chapter 6 “Tape and reel” of the Short-Form Catalog, or on the
respective LED data sheets.
For storage and dispatch, the reels are packed in vacuum sealed dry bags
(compliant to MIL-STD 81705C, type 1, class 1) together with desiccants and a
moisture indicator card (Figure 2). The reels and dry bags are designated with a
standard barcode product label (BPL). This label contains information on the
manufacturer (OSRAM Opto Semiconductors), an indication of origin, product
designation, batch number, date code, material number and quantity contained.

Figure 2: Dry packing of SMD LEDs with Humidity Indicator (HIC) and Barcode Product
Label (BPL)

The BPL also references the ESD-, and moisture sensitivity class, development
designation, brightness class and grouping of the LEDs as supplementary
information if required. It is generally recommended to check the bag after
receipt for damage and completeness. No holes, dents or fissures of any type
should exist that could impair the content. For the storage of its SMD LEDs in
unopened dry packaging, OSRAM Opto Semiconductors specifies a maximum
storage time of 24 months (shelf life) with ambient conditions not exceeding
40 °C and a humidity content of max. 90 % RH (relative humidity). Further
information can be found in the ZVEI guide for the long-term storage of
components, assemblies and devices (“Leitfaden – Langzeitlagerfähigkeit von
Bauelementen, Baugruppen und Geräten”).
It is necessary to check the moisture indicator card contained inside directly after
opening and before processing of the components. The indicator changes color
from blue to pink when the corresponding moisture grade is exceeded. If the
color changes, the specified handling information (see HIC and moisture
sensitive label – ML) must be observed and the components should be dry
backed if necessary (also see JEDEC J-STD-033). After opening the dry bag,
LEDs have a specific floor life depending on their moisture level classification
(according to JEDEC-STD-020). The floor life specifies the time period after
removal from a dry bag, dry storage or dry bake and before reflow soldering.

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Table 1: Moisture sensitive level vs. floor life

Moisture sensitive level Floor life

1 No limit
2 1 year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6 6 hours

The information regarding the assigned moisture sensitive level (MSL) can be
found in the corresponding data sheet of the LED or on the Barcode Product
Label.
Note: The MSL makes no fundamental “statement” about the solder capability
(solderability) of the components.
It is generally recommended to leave not required reels in their packaging, and
to store components during processing in ambient conditions of ≤ 10 % RH.
Drying cabinets with dry nitrogen (N2) or dry air are suitable for this type of
storage. With regard to dry packs, further information can be found on the
Internet and in the Short Form Catalog in the “Tape and Reel” chapter, under the
topic “Dry Pack”. Normative references such as JEDEC can also be found here.

C. Processing of SMD LEDs

Generally, SMD LEDs from OSRAM Opto semiconductors are compatible with
existing industrial SMT processing methods, so that current populating
techniques can be used for the mounting process. Figure 3 shows the process
flow for processing SMD LEDs with the individual process steps. For ideal
mounting of the various SMD LED types to the circuit board, certain aspects
should be taken into consideration. For the manufacturing process the impact is
diverse, and is usually not determined by only a single processing step.

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Figure 3: Process flow for SMD LEDs

Solder paste printing

Solder paste inspection
(SPI)
Pick & place
Reflow soldering
Optical inspection

SMD LEDs

SMT process flow

Factors such as component finish, material and composition of the solder,

design of the solder stencil, reflow solder profile or process atmosphere are
interlinked and contribute to the solder result. The influence of the PCB itself
must also be considered as well as factors such as PCB material, solder pad
design, surface quality and finish of the solder pad. Information on the most
important points is thus specified below.

Solder pad design

Since the solder pad effectively creates the direct contact between the LED and
the circuit board, the design of the solder pad decisively contributes to the
performance of the solder connection. The design has an influence on the solder
joint reliability, the self-centering effect (self alignment) and heat dissipation, for
example. In most cases, it is therefore advantageous to use the recommended
solder pad, since it is individually adapted to the properties and conditions of the
LED. The corresponding solder pad can be found in the data sheet of each LED.
For the smallest possible positioning tolerance, the given designs show a
compromise between the preferable non solder mask defined pads (NSMD) and
the needs of good processing capability, a reliable solder connection and of
course the requirements for good thermal management. The copper area in the
layout should be kept as large as possible, which dissipates and spreads the
generated heat over the PCB and is typically covered with a layer of solder resist.
A typical compromise is a so-called half solder mask defined pad, as shown in
Figure 4.

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Figure 4: Solder mask defined (SMD) / half SMD pad design

Cu area covered with solder

resist or solder mask

Cu solder pad

Solder stencil aperture

However, it should be noted that the self-centering effect is limited in its extent.
Slightly misaligned components (less than 0.150 mm) are automatically aligned
during reflow due to the self-centering effect of the symmetrical pad design
(Figure 5). If the placement position is offset more than 150 μm from the center,
the components should not be reflowed, as electrical shorts resulting from solder
bridges may occur. Since the placement and rotational alignment of the
component depends also on the process and equipment, optimization must take
both factors into consideration.

Figure 5: Self alignment during reflow soldering (e.g @OSLON, OSRAM OSTAR SMT
and OSRAM OSTAR Compact)
Before reflow During reflow After reflow

Dielectric Dielectric Dielectric

Solder paste Cu solder pad Solder paste Cu solder pad Solder paste Cu solder pad

PCB pad finishes

In general, typical finishes (Table 2) are highly proven for SMT assembly, but with
smaller solder pads the quality of the plating/finish is more important. Hot Air
Solder Leveling (HAL/HASL) finishes are less preferred for assembly because of
the uneven surface compared to completely “flat” platings such as Cu-OSP
(OSP: Organic Solderability Preservative) or immersion Sn or NiAu (ENIG). From
a package point of view, it is difficult to recommend a certain PCB pad finish that
will always meet all requirements. The choice of finish also depends strongly on
board design, pad geometry, needs of other components on the board and
process conditions, and must be specified according to the needs of the specific
application. Internal tests at OSRAM Opto Semiconductors have shown that
Cu-OSP or NiAu offers suitable and reliable plating in most cases.

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Table 2: Comparison of PCB finishes

Finish / solder Typ. layer Advantages /

Concerns
pad plating thickness properties

OSP (Organic 0.3 – 0.5 μm lowest cost, fully solderability degradation

Solderability planar surface, sim- (storage conditions, multi-
Preservative) ple easy to operate ble thermal cycles→ N2
process reflow) exposure copper
HAL / HASL 0.5 – 10 μm Low cost, widely Uneven surface, forma-
(Hot Air Solder usage, excellent tion of humps, flatness of
Leveling) wetting single pads, during pro-
cess high thermal stress
on PCB, residues (flux)
Immersion Sn 0.3 – 1.3 μm Simple process, Limited shelf life and stor-
(electroless) planar surface, only age, copper diffusion into
copper and solder Sn, balking or 2x reflow of
in solder joint PCB may be critical
Immersion Ag 0.3 – 0.5 μm planar surface, wire Limited shelf life and stor-
(electroless) bondable age, copper diffusion into
Sn, baking or 2x reflow of
PCB may be critical
Electroless Ni / 3 – 7 μm fully planar surface, High cost, process con-
Immersion Au 0.06 – 0.1 μm very good shelflife trol, compatible to solder
(ENIG) mask, concerns of Ni cor-
rosion (Black pad)
Electroless Ni / 3 – 7 μm fully planar surface, High cost, process con-
Electroless Pd/ 0.05 – 0.15 μm “universal Finish” trol, compatible to solder
Immersion Au 0.01 – 0.1 μm soldrable and wire mask
(ENEPIG) boundable, reduce
Au thickness, Pd
reduces

Solder paste printing / solder stencil

As recommended by OSRAM Opto Semiconductor, the solder paste is normally
applied via stencil printing. An appropriate solder stencil design is specified in
the data sheet of the LED (Figure 6). The amount to be applied as well as the
quality of the paste deposits and the entire printing are primarily determined by
the design of the printing stencil aperture and thickness, and are also influenced
by the respective process.

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Figure 6: Example of a stencil aperture for LEDs of the OSLON product family
2,6 [0,102´´]
0,3 [0,012´´]
2,6 [0,102´´]
0,9 [0,035´´]

0,45 [0,018´´]
0,4 [0,016´´]
solder stencil

The stencil apertures are typically smaller than the recommended solder pad.
Stencil thickness used in the SMT industry varies from 100 μm to 150 μm
(0.004 in to 0.006 in). OSRAM Opto Semiconductors typically recommends
120 μm for SMD LEDs, resulting in a solder-joint thickness (standoff height)
which is typically between 40 μm to 75 μm.
However, the stencil thickness used may also depend on other SMD
components on the PCB. For an ultra-compact high power SMD LED package
such as OSLON® Compact, OSRAM Opto Semiconductors has found in internal
tests that an optimized stencil aperture and thickness may minimize tilting and
result in very good self-alignment. The two stencil aperture designs are shown in
Figure 7. In addition to the design itself, the thickness of the solder paste was
adapted from 120 μm to 100 μm.

Figure 7: Stencil aperture and proper solder paste print for OSLON® Compact CM
Aperture design 1:1 Aperture design 2 pads
120 μm 100 μm

The adapted design and thickness of the solder stencil result in significant
improvements of the alignment and minimized tilting after reflow soldering
(Figure 8).

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Figure 8: Comparison of solder result for the different stencil designs and thicknesses
(e.g OSLON® Compact CM)
Higher risk of tilting Less tilting
(aperture design 1:1, 120 μm) (Aperture design 2 pads, 100 μm)

3D SPI (Solder Paste Inspection)

The solder paste print process is potentially very unstable in the SMT industry,
so that solder paste inspection (SPI) becomes necessary as a process evaluation
and process control tool, especially with small component landing pads. Also for
failure prevention it is recommended to check the solder paste volume regularly
via solder paste inspection.

Figure 9: Example of a solder paste thickness profile via 3D SPI

Generally, SMD LEDs from OSRAM Opto Semiconductors are compatible with
existing industrial SMT processing methods, where automated pick & place
equipment provides the best handling and placement accuracy. In the
application note “Recommended pick and place tools for LEDs from OSRAM
Opto Semiconductors” a catalog with a linkage of the tools successfully tested
is shown for the SMD LED product families. When processing by means of
automated placement equipment and based on in-house pick and place
experiments, OSRAM Opto Semiconductors advises customers to take the
following general pick and place guidelines into account:
1. Care should generally be taken that an appropriate pick and place tool is
used and that process parameters conform to package characteristics. As
a starting point, a placement force of 2.0 N is recommended and should be
minimized where possible.
2. The nozzle tip should be clean and free of any particles since this may
interact in particular with the critical and optical relevant area (area over

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die/s and wire bond/s) of the LED package during pick & place
3. To ensure zero defect, and in particular with LEDs, damage-free processing
by the pick & place nozzle, it is a good practice to inspect the top surface
of the LED under a microscope during setup and initial production runs.

Reflow soldering
The individual soldering conditions for each LED type according to JEDEC J-
STD-020E can be found in the respective data sheets. In this regard it must also
be stated that JEDEC J-STD-020E does not represent production profiles for the
user but for the component manufacturer for qualification and classification of its
moisture-sensitive semiconductor components.
A standard reflow soldering process with forced convection under standard N2
atmosphere is recommended for mounting the component, in which a typical
lead-free SnAgCu metal alloy is used as solder. Figure 10 shows the temperature
profile for lead-free soldering with the recommended peak temperature of
245 °C. In this context, it is recommended to check the profile on all new PCB
materials and designs. As a good starting point, the recommended temperature
profile provided by the solder paste manufacturer can be used. The maximum
temperature for the profile as specified in the data sheet should not be exceeded
though.

Figure 10: Temperature profile for lead-free reflow soldering according to

JEDEC J-STD-020E
T [°C]
300

250 245 °C Recommended Solder Profile

240 °C
(max 260 °C)
217 °C
200 Ramp down
max 30 s 6 K/s (max)

150

max 120 s max 100 s

100

50 Ramp Up
3 K/s (max)
25
0
0 50 100 150 200 250 300
t [s]

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Table 3: Profile parameters for recommended reflow process

Profile feature Recommendation Max. ratings

Ramp-up rate to preheat1 2 °C/sec 3 °C/sec

25 °C to 150 °C
Time tS from TS min to TS max 100 s min. 60 sec; max. 120 sec
(150 °C- 200 °C)

Ramp-up rate to peak1 2 °C/sec 3 °C/sec

TS max to TP

Liquidus temperature TL 217 °C

Time tL above TL 80 sec max. 100 sec

Peak temperature TP 245 °C max. 260 °C

Time tP within 5 °C of the speci- 20 sec min. 10 sec; max. 30 sec

fied peak temperature TP - 5 K

Ramp-down rate1 3 °C/sec 6 °C/sec maximum

TP to 100 °C

Time 25 °C to peak temperature max. 8 min

Notes: All temperatures refer to the center of the package, measured on the top of the
component
1slope calculation ΔT/Δt: Δt max. 5 sec; fulfillment for the whole T-range

For lead-free reflow soldering it is strongly recommended to solder in a nitrogen

atmosphere. The accelerated oxide growth occurring due to the increase in
temperature during lead-free soldering is reduced significantly in the nitrogen
atmosphere. This expands significant the process window again. In particular,
with the increasing use of new, lead-free component finishes such as Ag, NiPd,
NiAu, NiPdAu or NiPdAu-Ag, with a nitrogen atmosphere and a residual oxygen
content of < 500 ppm a significant improvement in wettability on the PCB
surface and component metalization is achieved. Connected to this is also a
distinct reduction of voids in the solder joint (see also the application notes
“Further details on lead-free reflow soldering of LEDs” and “Measuring of the
temperature profile during the reflow solder process”). After soldering it is
generally recommended that all twisting, warping, bending and other forms of
stress to the circuit board, especially with ceramic SMD LEDs, should be
avoided in order to prevent breakage of the LED package or the solder joints.
Therefore, separation of the circuit boards should not be carried out manually,
but should be carried out only with a specially designed tool.

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Voids
For a good thermal connection and a high board level reliability it is
recommended that voids and bubbles should be eliminated in all solder joints. A
total elimination of voids, particularly for larger thermal pads (such as the
OSLON® family or OSRAM OSTAR® Compact) is difficult however. In industry
standards such as IPC-A-610 D or J-STD-001D (which refer only to surface
mount area array components such as BGA, CSP, etc.) the amount of voids
(verified by the x-ray pattern) should be less than 25 %.
Internal studies and simulations at OSRAM Opto Semiconductors have
determined however that for areas of up to 50 % of the thermal pad area the
voids only have a minor effect on the thermal resistance. The limit of acceptable
voiding can vary for each application and depends on the power dissipation and
the total thermal performance of the system, affected by the PCB materials used.

Figure 11: X-ray image of a solder joint (e.g OSLON®)

The comprehension of the mechanisms for the creation of voids during reflow
soldering and the complex issues existing with factors of influence and their
interactions are being analyzed in the industry as part of projects such as “AK
Poren (Void)”. These show that the individual factors mutually influence each
other partly through contrary interactions. Thus, for specific solder processes a
complete approach must be utilized (Figure 12).
Based on internal analyses by OSRAM Opto Semiconductors, the following
general information for the minimization of voids can be deduced:
• The paste type (flux) has a major influence on wetting and porosity → Use
of good wetting pastes, “low voiding pastes”
• Surface metalization of PCB: different PCB finish in combination with
different solder paste may improve wetting
• Reflow profile; Parameters → Time above liquidus (TAL) > 80 s
• Solder atmosphere has significant influence, N2 distinctly improves wetting
dynamics → O2 < 500 ppm

• Design of the stencil aperture. The recommended design with smaller

multiple openings in the stencil enables an out-gassing of the solder paste
during the reflow soldering process and also serves to regulate the final
solder thickness. → Typical solder paste coverage of 50 % – 70 % is
recommended.

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Figure 12: Typical factors for affecting solder voiding (relevant factors in red)
Materials Soldering process

Solder alloy
Solder flux Reflow profile
(TAL) Reflow process
chemistry PCB material Peak temp Confection / vampor phase
outgasing Vacuum
PCB surface
finish Reflow atmosphere
Air / N2

Solder voiding

Footprint Placement
geometry force
Stencil aperture Proper printing
Solder pad Solver pad
design (PCB) coverage
Stencil Time between
thickness print - assembly

Package / design Assembly process

Solder joint / post reflow inspection

After the reflow process, an automated optical inspection (AOI) is the state-of-
the-art to check for final product quality. For the most common SMD LEDs this
is the simple and cost-efficient way to detect potential defects such as:
• Displacement
• Tombstone
• Solder joint defects
• Defective dry joints & bridges
• Bent and lifted leads
SMD LEDs within the category of “bottom-only terminated” SMD components in
IPC-A-610-D solder joint inspections are typically accomplished with
transmission type x-ray equipment (similar to QFN packages).
X-ray inspection system (AXI) can detect bridges, shorts, opens, and solder
voids. In industry, x-ray inspection is typically used to define process settings
and parameters and is then used to monitor the production process and
equipment for process control, but is not performed as a 100-percent inspection.
To support the visual inspection of the solder wetting after reflow soldering, a so
called “solder wetting indicator” can be additionally designed into the solder pad
(Figure 13).

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Figure 13: Solder pad with solder wetting indicator (e.g OSRAM OSTAR® Compact)
Solder wetting indicator

Storage
PCBs or assemblies containing LEDs should not be stacked so that force is
applied to the LEDs, or should not be handled directly at the LED. Generally, all
LED assemblies should be allowed to return to room temperature after soldering,
before subsequent handling, or the next process step.

Figure 14: Correct storage of LED assemblies

Cleaning
Isopropyl alcohol can be used for cleaning since this has been approved by
OSRAM Opto Semiconductors as suitable for most types of SMD LEDs.
However, please be aware that for some of the LEDs a wet cleaning process is
not applicable e.g. due to not hermetically sealed packages. Please refer to the
respective data sheets for further information. In general, if cleaning materials are
used, their suitability must be tested beforehand, particularly as to whether or not
damage is associated with the LED and in respect to long term reliability.
Ultrasonic cleaning of LEDs is not recommended. For dry cleaning, in addition to
purified compressed air (e.g. a central supply or spray can), a clean, soft, lint-free
cloth can be used, especially for LEDs with an epoxy encapsulant. Dry cleaning
of LED devices encapsulated with silicone is not recommended. A combination
of dry and wet cleaning may be required, depending on the type and extent of
the contamination. Special LED type-specific notes for cleaning can be found in
the corresponding data sheets and in the application note “Cleaning of LEDs”.

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D. Summary
Generally, all SMD LEDs from OSRAM Opto semiconductors are compatible
with existing industrial SMT processing methods, so that current populating
techniques can be used for the mounting process. Basic recommendations
regarding solder pad/stencil design and reflow solder profile can be found in the
corresponding data sheet of the LEDs. Please visit the website of OSRAM Opto
Semiconductor for additional application notes regarding processing, specific
LED-types, thermal management etc.
When developing circuitry, special attention should be given to the position and
orientation of the LED on the circuit board. Depending on the position and
orientation of the LED, the mechanical stress on the LED may vary.
OSRAM Opto Semiconductors supports its customers during their development
and design processes in order to help them to find the best possible solution for
a specific application.

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be whenever you are looking for information or
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www.ledlightforyou.com

ABOUT OSRAM OPTO SEMICONDUCTORS

OSRAM, Munich, Germany is one of the two leading light manufacturers in the world. Its subsidiary, OSRAM
Opto Semiconductors GmbH in Regensburg (Germany), offers its customers solutions based on semiconduc-
tor technology for lighting, sensor and visualization applications. OSRAM Opto Semiconductors has produc-
tion sites in Regensburg (Germany), Penang (Malaysia) and Wuxi (China). Its headquarters for North America
is in Sunnyvale (USA), and for Asia in Hong Kong. OSRAM Opto Semiconductors also has sales offices th-
roughout the world. For more information go to www.osram-os.com.

DISCLAIMER
PLEASE CAREFULLY READ THE BELOW TERMS AND CONDITIONS BEFORE USING THE INFORMA-
TION SHOWN HEREIN. IF YOU DO NOT AGREE WITH ANY OF THESE TERMS AND CONDITIONS, DO
NOT USE THE INFORMATION.
The information provided in this general information document was formulated using the utmost care; howe-
ver, it is provided by OSRAM Opto Semiconductors GmbH on an “as is” basis. Thus, OSRAM Opto Semicon-
ductors GmbH does not expressly or implicitly assume any warranty or liability whatsoever in relation to this
information, including – but not limited to – warranties for correctness, completeness, marketability, fitness
for any specific purpose, title, or non-infringement of rights. In no event shall OSRAM Opto Semiconductors
GmbH be liable – regardless of the legal theory – for any direct, indirect, special, incidental, exemplary, con-
sequential, or punitive damages arising from the use of this information. This limitation shall apply even if
OSRAM Opto Semiconductors GmbH has been advised of possible damages. As some jurisdictions do not
allow the exclusion of certain warranties or limitations of liabilities, the above limitations and exclusions might
not apply. In such cases, the liability of OSRAM Opto Semiconductors GmbH is limited to the greatest extent
permitted in law.
OSRAM Opto Semiconductors GmbH may change the provided information at any time without giving notice
to users and is not obliged to provide any maintenance or support related to the provided information. The
provided information is based on special conditions, which means that the possibility of changes cannot be
precluded.
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It is prohibited to reproduce, transfer, distribute, or store all or part of the content of this document in any form
without the prior written permission of OSRAM Opto Semiconductors GmbH unless required to do so in ac-
cordance with applicable law.

OSRAM Opto Semiconductors GmbH

Head office:

Leibnizstr. 4
93055 Regensburg
Germany
www.osram-os.com

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