UL PCB Recognition – what is

it & why
y do y
you need to know
about it
Presented by Emma Hudson

NCAB Customer Event – March 2015

UL and the UL logo are trademarks of UL LLC © 2015

Agenda

• What is UL and what are its aims

• Drivers for UL PCB Recognition
• p
Purpose of UL PCB Requirements
q
• Benefits of buying UL Recognized PCBs
• Types of UL PCB Recognition
• Elements controlled for a Recognized PCB
• Where to view UL PCB Recognition
• p y g a PCB that
Considerations when specifying
needs to be UL Recognized
• g Requirements
UL Marking q on the PCB
2
 Your presenter – Emma Hudson

• Lead PCB Engineer for Europe & Latin America at UL

• With UL for 9 years
• Formerly Process & Materials Laboratory Manager
for an Automotive Electronics manufacturer
• BE
BEng (H
(Hons)) iin M
Materials
t i l Technology,
T h l gained
i d att
Coventry University in 1999

Email: Emma.Hudson@UL.com
Tel: +44 1483 40 20 37

3
Agenda

• What is UL and what are its aims

• Drivers for UL PCB Recognition
• p
Purpose of UL PCB Requirements
q
• Benefits of buying UL Recognized PCBs
• Types of UL PCB Recognition
• Elements controlled for a Recognized PCB
• Where to view UL PCB Recognition
• p y g a PCB that
Considerations when specifying
needs to be UL Recognized
• g Requirements
UL Marking q on the PCB
4
What is UL?

Underwriters Laboratories (UL)

•A global independent safety science company with
more than 10,000 employees and more than 150
laboratories
Over a century of expertise in innovating safety
•Over
solutions
•A global leader in standards development,
development testing
and certification

5
The aims of UL?

Working for a Safer World Since 1894

•Promote safe living and working environments for people by
the application of safety science and hazard-based safety
engineering
•Support the production and use of products which are
physically and environmentally safe and to apply our efforts
to prevent or reduce loss of life and property
Advance safety science through research and investigation
•Advance

6
What do UL do?

Certify
Validate
WE Test
Inspect
Audit
Advise & Educate

7
Agenda

• What is UL and what are its aims

• Drivers for UL PCB Recognition
• p
Purpose of UL PCB Requirements
q
• Benefits of buying UL Recognized PCBs
• Types of UL PCB Recognition
• Elements controlled for a Recognized PCB
• Where to view UL PCB Recognition
• p y g a PCB that
Considerations when specifying
needs to be UL Recognized
• g Requirements
UL Marking q on the PCB
8
Recognition Leads to Product Safety Listing

UL Recognition of components is
driven by end product safety concerns
around:

• Fire: added fuel; ignitability

• Electric Shock: reduced spacings;

p g ;
insulation breakdown, mechanical
strength

9
Recognition Leads to Product Safety Listing
Many end-product Standards require UL Recognized
PCBs to be used

Each standard will have different requirements for the

PCB based on the application within the end-product

For example:
•IEC 60065 (Audio & Video Equipment)
− V-0
V 0 or V-1
V 1 based on power requirements*
requirements
•IEC 60950 (Information Technology Equipment)
− V-1, MOT for application, and Direct Support compliant*
•IEC 60601 (Medical Equipment)
− V-2
V 2 min
min, MOT for application
application*
•IEC 61010 (Equipment for Laboratory Use)
− V-1, 105C MOT*
•UL 508 (Industrial Control Equipment)
− V-2 min, MOT for application,
V 2 min application and Direct Support compliant may also be
needed*

* Requirements are always APPLICATION DEPENDENT and should be

verified before defining what PCB type is required

10
Demand Driver for UL PCB Certification
End Product Failure PCB
Hazard Mechanism Board Feature Test Test Method Parameter
Metal type Bond strength UL 796 MOT
conductor
adhesion Bli t i /D l
Blistering/Delam UL 796 MOT
Paste type
Conductive
conductor UL 796 MOT
Paste Adhesion
adhesion
Silver
Silver Migration UL 796 MOT
Reduce conductors
Spacings Plating
Plating adhesion UL 796 MOT
adhesion
Electric Shock
Warping /
Delamination UL 796 MOT
Cracking

Environmental
E i t l UL 746E/
CTI DSR
Contamination UL746A

Dielectric UL 746E/ RTI / MOT /

Insulation Strength UL746A DSR
Board thickness
Breakdown Volume UL 746E/
DSR
Resistivity UL746A

MOT – Maximum Operating Temperature

DSR – Direct Support Requirement
RTI – Relative Thermal Index
Demand Driver for UL PCB Certification
End Product Failure PCB
Hazard Mechanism Board Feature Test Test Method Parameter
Self
Board thickness Extinguishing or UL94 RTI / Flame
Fuel for the Slow burn
fire/burn
time Self
C ti
Coatings E ti
Extinguishing
i hi or UL94 Fl
Flame
Flammability Slow burn

Hot wire Ignition UL 746E/

HWI DSR
S
O Glow
Or Gl wire
i UL746A
Ignitability
UL 746E/
High Arc Ignition HAI DSR
UL746A

UL 746E/
Flexural Strength RTI
UL746A
Ability to
Mechanical UL 746E/
support Board thickness Tensile Strength RTI
Strength UL746A
components t
Inner layer UL 746E/
RTI / MOT
Delamination UL746A

MOT – Maximum Operating Temperature

DSR – Direct Support Requirement
RTI – Relative Thermal Index
Agenda

• What is UL and what are its aims

• Drivers for UL PCB Recognition
• p
Purpose of UL PCB Requirements
q
• Benefits of buying UL Recognized PCBs
• Types of UL PCB Recognition
• Elements controlled for a Recognized PCB
• Where to view UL PCB Recognition
• p y g a PCB that
Considerations when specifying
needs to be UL Recognized
• g Requirements
UL Marking q on the PCB
13
Purpose of UL’s PCB Requirements
• Provide data characterising the behaviour of materials and PCBs
- Physical, electrical, flammability, thermal, and other properties
• To be used as guidance in the design for safety
- By the material manufacturer, the PCB fabricator, and the end product manufacturer
• For use as components
p in devices or appliances
pp

14
Agenda

• What is UL and what are its aims

• Drivers for UL PCB Recognition
• p
Purpose of ULs PCB Requirements
q
• Benefits of buying UL Recognized PCBs
• Types of UL PCB Recognition
• Elements Controlled for a Recognized PCB
• Where to view UL PCB Recognition
• p y g a board that
Considerations when specifying
needs to be UL Recognized
• g Requirements
UL Marking q on the PCB
15
Benefits of UL PCB
R
Recognition
iti

PCBs are Recognized under UL’s

Component Recognition Program

• Type Testing
− Provides user with confidence component
p initially
y
complies with requirements

− Pre-selection allows for less testing by OEMs, data

compared against requirements

− UL Recognized PCBs may be used Globally

16
Benefits of UL PCB
R
Recognition
iti
To maintain UL Recognition
g each
manufacturer is subject to an on-going
compliance program – Follow-Up Services
(
(FUS)
)

•Audit Surveillance of materials and PCBs during

production
d ti
− Each manufacturer and subcontractor is inspected
four times per year

− For Full Recognition PCBs, production boards are

subject to on-going testing, a % of board types
collected annually

•Provides confidence the component continues to

meet standard requirements moving forward

17
Agenda

• What is UL and what are its aims

• Drivers for UL PCB Recognition
• p
Purpose of UL PCB Requirements
q
• Benefits of buying UL Recognized PCBs
• Types of UL PCB Recognition
• Elements controlled for a Recognized PCB
• Where to view UL PCB Recognition
• p y g a PCB that
Considerations when specifying
needs to be UL Recognized
• g Requirements
UL Marking q on the PCB
18
Types of PCB Recognition

• Two levels of PCB Recognition that manufacturers can

apply for

- Full Recognition
- Flammability-Only Recognition

• PCB Recognition type required will depend on the application of

the PCB in the end product

19
Types of PCB Recognition

Full Flame-Only
Recognition Recognition

Flame Rating  
Solder Limits  
Maximum Operating Temperature  
(MOT)
Direct Support (DSR)  
Comparative Tracking Index (CTI)  

20
Categorisation of PCB Constructions

• Along with the level of Recognition, PCBs are also

categorised by construction type –
PCB Category Features
Singlelayer
g y External Cu layers only, on one or both sides (single-sided or double-sided)

Multilayer One or more internal Cu layers present

Mass Laminated PCB manufacturer creates a multilayer PCB using a pre-laminated material.

Singlelayer PCB employs a metal base or core that is not electrically connected to the
Metal Base circuit board, typically used for thermal applications. No internal circuitry
layers.
Multilayer
M ltil PCB employs
l a metal
t lb
base or core ththatt iis nott electrically
l t i ll connected
t d to
t the
th
Metal Base circuit board, typically used for thermal applications

High Density The PCB employs a resin coated copper (RCC) or build-up material (BUM)
Interconnect (HDI) layer on top of the rigid dielectric material
material.
Does not include HDI constructions made using traditional rigid laminate and
prepreg only.
Flexible This category is broken down into multiple sub-categories

21
Categorisation of Flexible PCB Constructions
Flexible PCBs are categorised not only by construction but
by
y application
pp too
• Application options are
- Flexible – assessed for dynamic
y and repeated
p bending
g applications
pp
- Flex-to-Install – assessed for flexing during instillation and servicing
- Rigid – not assessed for any flexing or bending properties

• Construction types are

- Singlelayer,
g y , single
g or double-sided
- Multilayer
- Multilayer mass-laminated

• Also have Multilayer Rigid-Flex Composite constructions that are

made up of multiple elements and different sections of the board can
be assessed for different applications
22
Categorisation of PCB Constructions
Technological advances may see some additional terms
being
g used when categorising
g g the PCBs,, for example
p

•Multilayer with embedded chip components

- UL are seeing more and more requests for Recognition of PCBs with
embedded components in them

•Multilayer rigid-flex composite constructions also employing HDI

materials

When a PCB includes a unique feature, such as embedded

components it will be referenced as part of the PCB Recognition
components,

23
Agenda

• What is UL and what are its aims

• Drivers for UL PCB Recognition
• p
Purpose of ULs PCB Requirements
q
• Benefits of buying UL Recognized PCBs
• Types of UL PCB Recognition
• Elements Controlled for a Recognized PCB
• Where to view UL PCB Recognition
• p y g a board that
Considerations when specifying
needs to be UL Recognized
• g Requirements
UL Marking q on the PCB
24
Elements Controlled for a Recognized PCB

Manufacturing
M f t i
Material Construction Parameters
Process

Recognized PCB

25
Materials
Control the following materials for a UL Recognized PCB –
• Dielectric material
• Solder resist
• Hole-plugging ink
• Marking ink used for decorative purposes
• Conductive pastes
• Adhesives
• Coating materials
• Stiffener materials &
• Embedded Components

Dielectric & Coating materials are typically Recognized for the material
manufacturer to minimise the testing the PCB manufacturer needs to
conduct
26
& - Only controlled for Flexible boards Recognized under ZPMV, not controlled for ZPXK category
Construction
Control the following construction features for a UL
Recognized PCB –
Construction Flame-Only
Full Recognition
Type Recognition
• Min laminate
Mi l i t thickness
thi k
• Min starting Cu foil thickness (and max if • Min laminate thickness
Singlelayer >102microns) • Single or double-sided
• Single or double-sided

Surface Finish

Cu

Core Laminate
Cu
Solder Resist
PTH

27
Construction

Construction Flame-Only
Full Recognition
Type
yp Recognition
g
• Min dielectric build-up thickness
• Min dielectric build-up
• Min laminate and prepreg sheet thickness
thickness
Multilayer • Min starting external Cu foil thickness
• Min laminate and p prepreg
p g
(and max if >102microns)
sheet thickness
• Max internal Cu thickness
• Min dielectric build-up thickness
• Min dielectric build-up
• Min starting Cu foil thickness (and max if
Mass >102microns)
thickness
[Min laminate and prepreg sheet
Laminate [Min laminate and prepreg sheet thicknesses and maximum thicknesses controlled for the material
internal Cu thickness is controlled for the material manufacturer]
manufacturer]

Cu Plating
Ex. Cu Foil
Cu
Core Laminate
Cu Prepreg

Solder Resist
PTH Surface Finish
28
Construction

Construction Flame-Only
Full Recognition
Type Recognition
• Min and max dielectric thickness
• Min and max dielectric
• Min metal thickness
Metal Base, thickness
• Min starting Cu foil thickness (and max if
Singlelayer • Min metal thickness
>102microns)
• Single or double sided
• Single or double sided

Single Sided (SS) Example

Surface Finish
Solder Resist
Cu
Insulation
Metal - May be glass fibre reinforced
- May be unreinforced like HDI

29
Construction

Construction Flame-Only
Full Recognition
Type Recognition
• Min and max dielectric build-up thickness
• Min and max dielectric
• Min individual sheet thickness
build-up thickness
• Min starting external Cu foil thickness (and
Metal Base
Base, • Min laminate and
max if >102microns)
Multilayer prepreg sheet thickness
• Max internal Cu thickness
• Min metal thickness
• Min metal thickness
• Single or double-sided
• Single or double-sided

Single Sided (SS) Example

Holes filled with resin during lamination Surface Finish Solder Resist
PTH on core Ext. Cu + Plating
2nd Insulation
- May be glass fibre reinforced
Laminate - May be unreinforced like HDI
Internal Cu
1st Insulation
Metal - May be glass fibre reinforced
- May be unreinforced like HDI
30
Construction

Construction Flame-Only
Full Recognition
T
Type R
Recognition
iti
Core:
•Min dielectric build-up thickness Core:
•Min laminate and prepreg sheet thickness •Min dielectric build-up
•Min external Cu foil thickness when no HDI thickness
material applied (and max if >102microns) •Min laminate and prepreg
•Max internal Cu thickness sheet thickness
HDI HDI: HDI:
•Min and max HDI layer thickness •Min and max HDI layer
•Min and max number of HDI layers that can be thickness
applied •Min
Min and max number of
•Max internal Cu thickness HDI layers that can be
•Min external Cu foil thickness (and max if applied
>102microns)

•Need to understand whether blind or buried vias are included within any build-up

31
 Construction

HDI Rigid PCB Example:

Buried Via for L3–L6

Filled with plugging material PTH
Blind Via (L1
(L1–L2)
L2) Through
oug Holeoe
Filled with plugging material Blind Via (L1–L3) Surface Finish

L1 Solder Resist
HDI
L2
HDI
L3
Prepreg
Buried L4
Via Core Laminate
L5
Prepreg
p g
L6
HDI
L7
L8 HDI

32
Construction
Flexible Constructions
• Need to know minimum and maximum thickness of each layer within
the construction and all possible build-up options
• For Full Recognition need to know minimum and maximum Cu
thickness of each layer
• Need to understand which sections are to be Flexible, Flex-to-Install,
and Rigid
• Stack-up diagrams of all possible combinations are key
Cu Cu

Cu Cu

Cu Cu
Coverlay Film
Cu
Base Film
Cu
C
Coverlay
l Film
Fil
Bondply
Coverlay Film
Cu
Base Film
Cu
Coverlay Film
Cu Cu

Cu Cu
33
Cu Cu
Parameters
Control the following materials for a UL Recognized PCB –

• Flame Rating
• Maximum Operating Temperature (MOT)
• Pattern Limits
- Minimum width conductor

- Minimum edge width conductor

• edge conductors = any that fall within 0.4mm of the edge of the PCB

- Maximum area diameter

• represents the largest unpierced copper area that could be used in a board

• Solder Limits
- This parameter is meant to simulate the soldering operation(s) the board will be exposed to during the
population process

34
Manufacturing Process
Control the most severe manufacturing process that could
be used –
• Any step conducted over 100⁰C
- Specify maximum temperature and maximum time

- Specify maximum pressure for any lamination step

• Any plating step

• Any final finish step

• Any step where a coating is applied

• Any step conducted at a subcontract facility

- All steps that are deemed to be critical and are conducted at a subcontract facility have to
be identified and that subcontract facility inspected by UL

35
Agenda

• What is UL and what are its aims

• Drivers for UL PCB Recognition
• p
Purpose of UL PCB Requirements
q
• Benefits of buying UL Recognized PCBs
• Types of UL PCB Recognition
• Elements controlled for a Recognized PCB
• Where to view UL PCB Recognition
• p y g a PCB that
Considerations when specifying
needs to be UL Recognized
• g Requirements
UL Marking q on the PCB
36
Where to View UL PCB Recognitions
All UL Recognized components have a Listing Card documenting
the parameters the board is Recognized with

Two tools available to view this information

•Online Certifications Directory

y
•UL iQ Database

37
Online Certifications Directory
Accessed by going to www.UL.com

38
Online Certifications Directory

39
Online Certifications Directory

Search Results for:

UL Category Code
= ZPMV2

ZPMV2 is the main

UL category code
for Recognized
g
PCBs

40
Online Certifications Directory

41
UL iQ Database
Accessed by going to iq.ul.com

42
UL iQ Database

43
UL iQ Database

44
UL iQ Database

45
UL iQ Database
Accessed for iq.ul.com

46
UL iQ Database

47
UL iQ Database

48
Agenda

• What is UL and what are its aims

• Drivers for UL PCB Recognition
• p
Purpose of UL PCB Requirements
q
• Benefits of buying UL Recognized PCBs
• Types of UL PCB Recognition
• Elements controlled for a Recognized PCB
• Where to view UL PCB Recognition
• p y g a PCB that
Considerations when specifying
needs to be UL Recognized
• g Requirements
UL Marking q on the PCB
49
So what board do you need?

• Just saying a board needs to meet UL might not get you want
you need or want

• Could end up with something very different to what you need

unless you provide the right details

50
Understand What Parameters Your PCB Needs

• It is important to specify the right PCB when asking for UL

Recognition

• The parameters required for your PCB will be based on the

application of the board in your end product

• May
y need only
y a flame rating
g or could need a flame rating,
g, MOT,,
DSR compliance and a minimum CTI value

• If y
you are not sure what p
parameters you
y will need the PCB to
have please engage with UL and an end product engineer will be
able to help you determine this
- Do
D thi
this as earlier
li ini the
th design
d i phase
h as you can

51
Parameters to Consider – Do You Need a
S
Specific
ifi Flame
Fl Rating?
R ti ?
Minimum acceptable flame class is specified by end-product
requirements

Classification represents small scale sample evaluation and burn time

• Flame Classes
- V-0,
V0 V V-1,
1 VV-2
2
- VTM-0, VTM-1, VTM-2
- HB

Determined by performing UL94 burning tests on the PCB

•With and without coatings based on finished PCB
•After thermal shock (thermal stress) exposure

Slide 52
The Flame Tests
HB – Horizontal Burning
•Most flammable
•Known
Known as “slow-burning”
slow burning materials
•Generally materials with little or no flame-retardant added
•Test measures burning rate

V – Vertical
V ti l B Burning
i (20
(20mm))
•Less flammable
•Known as “self-extinguishing” materials
•Generallyy have flame-retardant added
•A measure of the material’s ability to extinguish itself once removed from the source of ignition

VTM – Vertical Thin Material

•For materials that due to their thinness, either distort, shrink and/or are consumed up to the holding clamp when
tested under Vertical Flame Test
•PCB manufacturer can chose to conduct VTM test if the samples are less that 0.25mm in thickness and can be
formed around the mandrel used for testing

Slide 53
The 20mm Vertical Flame Test

• Vertically oriented sample

• Cotton indicator @ 300 mm

• 2 - ten second flame applications

• Observe
- flame/glow time
- cotton indicator
- extent of burn

• Sample dimensions are 125mm x 13mm x thickness based on product being

tested
d
Slide 54
The Vertical Thin Material (VTM) Flame Test

Front view Side view Back view

• Sample dimensions are 200mm x 50mm x thickness based on product being
tested
d
Slide 55
The Flame Ratings

Slide 56
Parameters to Consider – Do You Need a
M i
Maximum Operating
O ti Temperature
T t (MOT)?
Represents PCB maximum continuous use temperature
• End-product exposure under normal operating conditions
• Minimum acceptable MOT specified by end-product requirements
• Cannot exceed base material mechanical or electrical RTI

Simulated on PCBs with short-term thermal conditioning (10 or 56

days)
• Exposure temperature based on PCB manufacturer request
• MOT determined by analysis of PCB physical properties
- Conductor adhesion and PCB delamination

Not a property Recognized for Flammability

Flammability-Only
Only PCB types
Slide 57
 Bond Strength & Delamination Test Samples

10 mm 13 mm Max diameter

50 mm Needs to be within 0.40

A mm from edge of board
0.40 mm
B
A < 0.40 mm
A
B
B
C
100 mm
A：Minimum width conductor
B：1.60 mm wide conductor
C：Edge conductor

Slide 58
RTI vs. MOT

RTI (Relative
( Thermal Index)) - The temperature below which a
critical property will not be unacceptably compromised through
chemical thermal degradation,
g over the reasonable life of an electrical
product

MOT (Maximum Operating Temperature) – The maximum

continuous use temperature that the PCB may be thermally exposed to
under normal operating conditions

Slide 59
Parameters to Consider – Do You Need Direct
S
Support
t (DSR) C
Compliance?
li ?

• Direct S
Di Support RRequirements
i (DSR) represent performance
f
characteristics for Recognized laminates in direct contact with
current carrying parts at 120V or less

• PCB DSR compliance is determined by the materials available to

manufacture itit, no tests are done directly on the PCB

• Not a p
property
p y Recognized
g for Flammability-Only
y y PCB types
yp

• A PCB type may be able to be manufactured using materials that

are DSR complaint
l i t and
d others
th that
th t are not.
t In
I this
thi case th
the PCB will
ill
have the DSR triangle “” documented on the Listing Card.
- When a PCB is Recognized with a  and a DSR compliant material was used for
manufacture then this triangle should also be marked on the board
Slide 60
DSR Performance Tests

Comparative Tracking Index (CTI)

• Determine spacing requirements with addition of wet contaminant
• ASTM D3638 test method used for UL Recognition

Di l t i St
Dielectric Strength
th (DS)
• Establish insulation resistance baseline at 5000V or 6.89 kV/mm

High Current Arc Ignition (HAI)

• Simulate loose connections and broken leads

Hot Wire Ignition (HWI)

• Determine ignition properties when adjacent to or supporting an
insulated or uninsulated wire

Slide 61
DSR Performance Tests (cont’d)

Volume Resistivity (VR)

• Determine if material is an insulator or a semi
semi-conductive
conductive material

Heat deflection
• Identify
Id tif andd restrict
t i t the
th use off low
l temperature
t t polymeric
l i materials
t i l
• Not required for thermoset or film materials

Slide 62
Direct Support ()

Slide 63
Parameters to Consider – Do You Need A
Mi i
Minimum CTI (PLC) Rating?
R ti ?

• Comparative
C i T Tracking
ki IIndex
d (CTI) evaluated
l d on llaminate
i materials
i l
• CTI values are reported on the Listing Card as a Performance Level
Category
g y ((PLC))

• ASTM D3638 test method used for UL Recognition

• Property is not deemed to be thickness dependent

Slide 64
CTI (PLC) Rating

• PCB CTI (PLC) values

l d
determined
i db by the
h materials
i l available
il bl to
manufacture the board, no tests are done directly on the PCB

• Not a property Recognized for Flammability-Only PCB types

• A PCB type may be able to be manufactured using materials with

different CTI (PLC) values. When this is the case a “ * ” will be
documented on the Listingg Card.
- When a PCB is Recognized with a “ * ” for the CTI value the CTI value of the material
used should be marked on the PCB

Slide 65
Parameters to Consider – What soldering
processes will
ill th
the PCB be
b exposed
d to
t during
d i
population?
• Solder limits represent assembly process
- Maximum surface temperature
- Cumulative exposure time

• Simulated on PCB samples with thermal shock (thermal

stress) test
- Designed to evaluate the physical fatigue of the anticipated assembly soldering
t
temperatures
t (solder
( ld lilimits)
it )

• Test with maximum temperature and maximum time, or

multiple solder limit specified by PCB manufacturer

Slide 66
Parameters to Consider – Multiple Soldering
Processes

• Assembly processes now often use Surface Mount Technology

(SMT)
- T
Traditional
diti l solder
ld flfloatt ttestt ((single
i l titime and
d ttemp)) d
does nott representt iindustry
d t
practices
- PCBs exposed to at least three cycles of reflow process
• One cycle for single-sided; two for double-sided; three for PTH soldering or
rework
- Multiple solder limits are used to represent the temperature profile during the
soldering
ld i operation ti

• If yyour PCB will be exposed

p to multiple
p reflow cycles
y yyou should be
specifying a board with multiple solder limits that represent these
processes

Slide 67
Properties to Consider – Does the PCB need to
h
have Canadian
C di Recognition?
R iti ?
• Depending
p g on where the end pproduct will be sold there may
y be a
requirement for the PCB to be both US and Canadian Recognized

• No additional
N dditi l testing
t ti is i required
i d to
t extend
t d Recognition
R iti from
f US to
t
US and Canadian for the PCB

• A PCB that has both US and Canadian Recognition will be detailed

as having both ZPMV2 and ZPMV8 Recognition in the Online
Certifications Directory or will have the following mark on the Listing
Card from the UL iQ directory

Slide 68
Properties to Consider – Does the PCB need to
b made
be d usingi a specific
ifi UL/ANSI Material?
M t i l?
• The UL/ANSI ggrade of the base materials used to manufacture a
PCB are not included on the Listing Card and are confidential to the
PCB manufacturer

• All materials that the PCB manufacturer can use are documented in
their UL file

• NCAB have worked with the PCB manufacturers to gather this

information and capture it in an NCAB database, so they can source
the appropriate boards

Slide 69
FR-4 UL/ANSI Material – A change to be aware
off
• FR-4 UL/ANSI category of material has been split into two different
UL/ANSI grades
grades, FR
FR-4.0
4 0 and FR
FR-4.1
41
• Changes to the FR-4 materials had meant that not all FR-4’s were
behaving
be a g the
t e same
sa e aandd as suc
such wee cou
could
d no
o longer
o ge co
consider
s de test
testing
g
of one representative for another.
• To allow continuation of the reduced test programs FR-4 had to be
split into FR-4.0 and FR-4.1

UL/ANSI type Resin Reinforcement Material

FR-4.0 a Brominated Epoxy Continuous filament woven glass fabric

FR-4.1 ab Non-Halogenated Epoxy Continuous filament woven glass fabric

a – Total inorganic filler content equal to 45 percent maximum by weight
b – Total halogen content equal to 900ppm maximum Bromine or Chlorine and 1500ppm combined Bromine and Chlorine
tested in accordance with UL 746E paragraph 8.12 (which references IPC-TM-650 Method 2.3.41)

Slide 70
Do you want the board manufactured in a
specific
ifi country
t or factory?
f t ?
• Each UL PCB file may have one or more manufacturing location
detailed in it
- Every manufacturer of UL Recognized PCBs has been evaluated by UL and is subject to on-
going surveillance
- Each manufacturing location has to apply a factory mark that identifies which location it was
made at, if there is the option of using more than one facility in their UL file

• Manufacturing locations are confidential to the PCB manufacturers

UL file and are not shared on the Listing Card

• The company address provided on the UL Listing Card does not

have to be a manufacturing location

• NCAB understand what documentation needs to be checked to

verify
if the
th PCB manufacturing
f t i facility
f ilit is
i UL Recognized
R i d to
t make
k that
th t
PCB type

Slide 71
Agenda

• What is UL and what are its aims

• Drivers for UL PCB Recognition
• p
Purpose of UL PCB Requirements
q
• Benefits of buying UL Recognized PCBs
• Types of UL PCB Recognition
• Elements controlled for a Recognized PCB
• Where to view UL PCB Recognition
• p y g a PCB that
Considerations when specifying
needs to be UL Recognized
• g Requirements
UL Marking q on the PCB
72
UL Marking Requirements – Mandatory Marks
Optional /
Marking Comments
Mandatory
This could be the company name, company initials, a trademark, or UL
file number.
Anything other than the company name or file number needs to be
Company Identification Mandatory
requested as an alternative company marking option by the PCB
manufacturer.
All marking options are detailed on the Listing Card.
If there is more than one manufacturer detailed in the UL file that could
have made the board then a factory identification mark should be
Factory Identification Mandatory present.
All manufacturer location marks will be detailed in the UL file in the
Authorization page.
The board type designation must be applied, so the parameters of the
Board Type
yp Designation
g Mandatoryy board can be identified. The PCB manufacturer defines the name of the
PCB.

Canadian Recognition Mark

* Is not applicable to all UL files. Boards must be detailed as having

If boards have US and Canadian Recognition it Mandatory *
Canadian Recognition for this mark to be applicable for use.
is acceptable to apply the joint Recognition
mark –

• All mandatory marks MUST be applied to the PCB where there is “sufficient
sufficient space
space”. UL 796 defines “sufficient
sufficient space
space” as “…a
a
space at least 2.5 mm (0.1 inch) high and of sufficient length to accommodate the marking.” See section 33 of UL 796 for further
information.
Slide 73
UL Marking Requirements – Optional Marks
Optional /
Marking Comments
Mandatory

US Recognition Mark
This mark does not have to be applied to UL Recognized PCBs PCBs.
Optional It is an optional mark. If you wish it to be applied to the PCBs you
purchase this will need to be requested.

If all base materials detailed for a PCB are considered to be DSR

compliant then no DSR marking needs to be applied (indicated as "All"
on the Listing Card).
If a board contains base materials that are both DSR compliant and not
DSR compliant then the DSR triangle “▲” may be detailed on the board
Direct Support (DSR) Compliance
Optional
p g y the material used in fabrication was DSR compliant.
to signify p This mark
S b l (▲)
Symbol
must not be applied if the base material used for fabrication was not
DSR compliant.
If DSR compliance is a requirement for the PCB you are purchasing
and the board is Recognized with the ▲ make sure to request that your
q
board does meet DSR requirements and is marked accordingly.
gy

The flame rating of the board designation may be marked on the board.
Flame Rating Optional Each board type may only have a single flame rating assigned to it and
as such it is not a mandatory mark.
The CTI (PLC) rating may be marked on the board
board. The CTI (PLC)
value to be marked is that detailed for the base material used to
construct it.
CTI (PLC) Value Optional If a minimum CTI value is requirement for the PCB you are purchasing
and it is Recognized with a CTI value detailed as “ * “ make sure to
equest tthat
request at you
your board
boa d is
s marked
a ed with
t ttheeC
CTI value
a ue for
o tthe
e material
ate a
used.

Slide 74
Summary

• UL Recognition of components is driven by end

product
d t safety
f t concerns
• PCB requirements will be application dependant
• Understand the requirements your PCB needs to
meet before sourcing the board, minimise the
chance of problems as early in the design process
as possible
• Ask for the appropriate parameters and marks to be
applied to your UL Recognized PCB
• UL is here to help you!

75
THANK YOU
YOU.