SMARC

SMARC Rel. 2.0 with the Intel® Atom™ X Series,

Intel® Celeron® J / N Series and Intel® Pentium®
N Series (formerly Apollo Lake) Processors

High performance, low power and feature-rich

SM-B69

SMARC STANDARD ADVANTAGES

Extreme Low profile Dedicated battery

low power design design management
signals

DEVELOPMENT SAMPLING PRODUCTION Available in Industrial

Temperature Range

Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2
Cache, 12W TDP
Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2
Up to four Dual Ethernet SMARC Cache, 9.5W TDP
display Compact Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2
interfaces 82×50 mm
Cache, 6.5W TDP
Intel® Pentium® N4200 Quad Core @1.1GHz (burst 2.5GHz), 2MB L2
Processor
Cache, 6W TDP
Intel® Celeron® N3350 Dual Core @1.1GHz (burst 2.4GHz), 2MB L2 Cache,
6W TDP
Intel® Celeron® J3455, Quad Core @ 1.5GHz (Burst 2.3GHz), 2MB
L2Cache, 10W TDP
Intel® Celeron® J3355, Dual Core @ 2.0GHz (Burst 2.5GHz), 2MB
COMPUTER-ON-MODULE APPROACH L2Cache,10W TDP
Max Cores 4

Max Thread 4
| Design investment limited to the carrier board |
Memory Dual Channel Soldered Down LPDDR4-2400 memory, up to 8GB
| Consolidated Standard form factor |
Integrated Intel® HD Graphics 500 series controller with up to 18 Execution Units
| Scalable and future-proof | Long-term availability | Three Independent displays supported
Graphics HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1,
| ARM and x86 cross-compatibility | WMV9, JPEG/MJPEG formats
HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MPEG formats
| Multi-vendor solution | Highly configurable | eDP + MIPI-DSI interfaces or Dual Channel 18/24bit LVDS interface
Video HDMI or DP++ interface
| Innovative and upgradable | Accelerated time-to-market | Interfaces DP++ interface
2 x CSI interfaces
DP++: Up to 4096 x 2160 @60HZ
Video eDP: Up to 3840 x 2160 @60Hz
Resolution HDMI: Up to 3840 x 2160 @30Hz
MIPI-DSI, LVDS: Up to 1920 x 1200 @ 60Hz
SMARC SUPPORTED FEATURES Optional eMMC 5.0 drive soldered on-board
Mass Storage 1 x external S-ATA Gen3 Channels
SD interface
System I/O interface # of interfaces Networking
Up to 2 x Gigabit Ethernet interfaces
Intel® I210 or I211 Controller (MAC + PHY)
PCI Express lanes 4
Serial ATA channels 1 6 x USB 2.0 Host Ports
USB
2 x USB 3.0 Host Ports
USB 2.0 ports 6
USB 3.0 ports 2 PCI-e 4 x PCI-e Root Ports
LVDS channels
2 HD Audio interface
embedded DisplayPort Audio
I2S Audio interface
1 dedicated DP++
DP++ / HDMI 2 x HS-UARTs
1 shared DP++ / HDMI Serial Ports
2 x UARTs
Camera interfaces 2 MIPI CSI
Up to 12x GPIOs
High Definition Audio / I2S 1 I2S + 1 shared I2S / HD Audio
I2C Bus
Ethernet 10/100/1000 Mbps 2 SM Bus
UARTs 2 x 4-Wire + 2 x 2-Wire Other
2x SPI interfaces
Interfaces
Secure Digital I/O 4-bit 1 LPC Bus
I²C Bus 5 FAN management
SPI Bus 2 Power Management Signals
CAN Bus 2 Power
+5VDC and +3.3V_RTC
Watchdog Timer 1 Supply
Boot selection signals 3 Microsoft® Windows 10 Enterprise (64 bit)
GPIOs 12 (some with alternate functions) Operating Microsoft® Windows 10 IoT Core
System Linux
Reset out and Reset in
Yocto
Power button in
Power source status Operating 0°C ÷ +60°C (Commercial version)
System and Power Temperature* -40°C ÷ +85°C (Industrial version)
Module power state status
management signals
System management pins
Battery and battery charger management pins Dimensions 50 x 82 mm (1.97” x 3.23”)
Carrier Power On control
*Measured at any point of SECO standard heatspreader for this product, during any and all
times (including start-up). Actual temperature will widely depend on application, enclosure and/
SECO is one of the founding or environment. Upon customer to consider application-specific cooling solutions for the final
system to keep the heatspreader temperature in the range indicated.
members of SGET

www.seco.com 17
 SMARC SMARC

SMARC Rel. 2.0 with NXP i.MX 8M SMARC Rel. 2.0 with the Xilinx® Zynq®
Applications Processors Ultrascale+™ MPSoC

Standard solution for next generation Flexibile ARM + FPGA Heterogeneous

multimedia applications Processing in a Standard Form Factor
SM-C12 SM-B71

DEVELOPMENT SAMPLING PRODUCTION Available in Industrial DEVELOPMENT SAMPLING PRODUCTION Available in Industrial
Temperature Range Temperature Range

NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Xilinx® Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs:
Cortex®-M4 processor: Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +
Processor • i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz Dual-core ARM® Cortex®-R5 Real-Time Processing Unit
• i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
Processor
• i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU Xilinx® Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or ZU5EV
Soldered Down LPDDR4-3200 memory, 32-bit interface, MPSoCs:
Memory Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +
up to 4GB
Dual-core ARM® Cortex®-R5 Real-Time Processing Unit
Integrated Graphics Processing Unit, supports 2 independent displays
Embedded VPU, supports HW decoding of HEVC (H.265), H.264, Soldered Down DDR4-2400 memory
Memory
Graphics H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG Up to 8GB for Processing System Unit + up to 2GB for Programmable Logic
Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Only on EG and EV MPSOcs:
Open VG 1.1 Integrated ARM Mali-400 MP2 Graphics Processing Unit
HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4 Graphics Multicore 2D/3D acceleration at 667MHz
Video OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface (factory
Interfaces On EV MPSoCs only, H.264/H.265 integrated video codec
alternatives)
Video HDMI: Up to 4096 x 2160 @ 60 (4K) 18- / 24-bit Dual Channel LVDS interface
Video
Resolution MIPI-DSI, LVDS: Up to 1920 x 1080 @ 60Hz DP interface
Interfaces
2 x CSI interfaces
Optional SD 4-bit interface
Mass Storage QSPI Flash soldered-onboard DP: Up to 4096 x 2160
Video
eMMC 5.0 drive soldered on-board LVDS: Dependent on the IP implemented in the programmable
Resolution
logic
1 x Gigabit Ethernet interface
Networking 1 x external S-ATA Gen3 Channel
Optional WiFi + BT LE module onboard
SD interface
2 USB 3.0 Host ports Mass Storage
QSPI Flash soldered-onboard
USB 2 USB 2.0 Host ports Optional eMMC 4.51 drive soldered on-board
1 USB 2.0 OTG port
Networking Up to 2 x Gigabit Ethernet interfaces
PCI-e 2x PCI-e x1 ports
1x USB 2.0 OTG
Audio I2S Audio Interface USB 2x USB 2.0 Host
2x USB 3.0 Host
Up to 2x UART Tx/Rx/RTS/CTS
Serial Ports 2x UART Tx/Rx PCI-e PCI-e x4 interface
1x CAN Bus (TTL level)
Audio Dependent on the IP implemented in the programmable logic
1x 4-lanes + 1x 2-lanes CSI camera interfaces
I2C Bus 2 x UART Tx/Rx/RTS/CTS
SM Bus Serial Ports 2 x UART Tx/Rx
Other 2x SPI interfaces 2 x CAN Bus
Interfaces QuadSPI interface
12 x GPI/Os 2x I2C Bus
Boot select signals 2 x SPI interfaces
Other
Power Management Signals 12 x GPI/Os
Interfaces
Boot select signals
Power +5VDC Power Management Signals
Supply +3.3V_RTC
Power +3÷+5.25VDC
Linux Supply +3.3V_RTC
Operating
Yocto
System Operating Linux
Android
System Android
Operating 0°C ÷ +60°C (Commercial version)
Temperature* -40°C ÷ +85°C (Industrial version) Operating 0°C ÷ +60°C (Commercial version)
Temperature* -40°C ÷ +85°C (Industrial version)
Dimensions 50 x 82 mm (1.97” x 3.23”)
Dimensions 50 x 82 mm (1.97” x 3.23”)
*Measured at any point of SECO standard heatspreader for this product, during any and all
times (including start-up). Actual temperature will widely depend on application, enclosure and/ *Measured at any point of SECO standard heatspreader for this product, during any and all
or environment. Upon customer to consider application-specific cooling solutions for the final times (including start-up). Actual temperature will widely depend on application, enclosure and/
system to keep the heatspreader temperature in the range indicated. or environment. Upon customer to consider application-specific cooling solutions for the final
system to keep the heatspreader temperature in the range indicated.

18 www.seco.com
 Development Kit

SMARC 2.0 Development Kit

Cross Platform Philosophy Development Kit for

SMARC Rel. 2.0 compliant module
SMARC DEV KIT

Cross-compatible
platform with x86
and ARM solutions

SCHEMATICS
PUBLICLY AVAILABLE

DEVELOPMENT SAMPLING PRODUCTION

FEATURES OF CSM-B79
LVDS connector, interface shared with 2 x eDP/DSI connectors
Backlight control + LCD selectable voltages dedicated connector
Video DP++ dedicated connector
Interfaces HDMI connector (interface shared with USB 3.1 Type-C alternate mode
port)
2x CSI Camera input interfaces
SATA M 7p connector with dedicated power connector, interface shared
Mass Storage with M.2 Socket 2 2242 / 2260 Key B SSD slot
microSD Card Slot
2 x RJ-45 Gigabit Ethernet connectors
M.2 Socket1 2230 Key E Slot for WiFi Modules (interface shared with
Networking PCI-e x 4 slot)
M.2 Socket2 2260 Key E Slot for WWAN Modem Modules (interface
shared with PCI-e x 4 slot), connected to on-board microSIM slot
1 x USB 3.0 type A Socket
1 x USB 2.0 type A Socket
USB Ports 1 x USB OTG micro-AB Socket
1 x USB 3.1 Type-C Socket, with Alternate Mode and Power Delivery
functionality
PCI-e PCI-e x4 slot, interface shared with 2 x PCI-e x1 Slot and M.2 Slots
Mic In Jack, Line Out Jack
Audio Onboard I2S Audio Codec (TI TLV320AIC3204) + HD Audio Codec (Cirrus
Logic CS4207)
2 x CAN ports
2 x RS-232/RS-422/RS-485 configurable serial ports on internal pin
Serial Ports
header
2 x Serial ports (Tx/Rx signals only, TTL level) on feature pin header
eSPI pin header + Flash Socket
SPI pin header + Flash Socket
I2C EEPROM Socket
4 x 7-segment LCD displays for POST codes
Feature pin header with 8x GPIOs, I2C, SM Bus, Watchdog and Power
Other Management Signals
Interfaces 4x GPIOs dedicated connector
FAN connector
RTC Coin cell battery holder
Optional Debug USB port on mini-B Socket
Boot selection switches
JTAG connector
9-21V through dedicated Mini-Fit Jr 2x2 power connector or USB Type-C
Power
connector
Supply
6-17V through 2/3/4 Cell Smart Battery Connector
Operating
-40°C ÷ +85°C
Temperature*
Dimensions 345 x 170mm (13.58” x 6.69”)

*All carrier board components must remain within the operating temperature at any and all
times, including start-up; carrier operating temperature is independent of the module installed.
Please refer to the specific module for more details. Actual temperature will widely depend
on application, enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.

www.seco.com 19