Tda 7053 A
Tda 7053 A
DATA SHEET
TDA7053A
Stereo BTL audio output amplifier
with DC volume control
Objective specification 1995 Nov 09
Supersedes data of May 1995
File under Integrated Circuits, IC01
Philips Semiconductors Objective specification
ORDERING INFORMATION
TYPE PACKAGE
NUMBER NAME DESCRIPTION VERSION
TDA7053A DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
TDA7053AT SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
1995 Nov 09 2
Philips Semiconductors Objective specification
BLOCK DIAGRAM
VP
5
TDA7053A
TDA7053AT
4 I i 16 positive
input 1 output 1
DC volume 2
control 1 Ι
I i 13 negative
output 1
TEMPERATURE
STABILIZER PROTECTION
Vref
6 I i 12 negative
input 2
output 2
DC volume 8
control 2 ΙΙ
I i 9 positive
output 2
1,3,11,15 7 14 10 MSA717 - 2
not
signal power power
connected ground ground 1 ground 2
1995 Nov 09 3
Philips Semiconductors Objective specification
PINNING
1995 Nov 09 4
Philips Semiconductors Objective specification
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VP supply voltage − 18 V
IORM repetitive peak output current − 1.25 A
IOSM non-repetitive peak output current − 1.5 A
Ptot total power dissipation Tamb ≤ 25 °C
TDA7053A − 2.5 W
TDA7053AT − 1.32 W
tsc short-circuit time − 1 hr
Vn input voltage pins 2, 4, 6 and 8 − 5 V
Tamb operating ambient temperature −40 +85 °C
Tstg storage temperature −55 +150 °C
Tvj virtual junction temperature − +150 °C
THERMAL CHARACTERISTICS
Power dissipation
TDA7053A:
Assume VP = 6 V and RL = 8 Ω.
The maximum sine wave dissipation is 2 × 0.9 W = 1.8 W.
The Rth j-a of the package is 50 K/W therefore Tamb(max) = 150 − (50 × 1.8) = 60 °C.
TDA7053AT:
Assume VP = 6 V and RL = 16 Ω.
The maximum sine wave dissipation is 2 × 0.46 W = 0.92 W.
The Rth j-a of the package is 95 K/W therefore Tamb(max) = 150 − (95 × 0.92) = 62.6 °C.
1995 Nov 09 5
Philips Semiconductors Objective specification
CHARACTERISTICS
VP = 6 V; Tamb = 25 °C; fi = 1 kHz; TDA7053A: RL = 8 Ω; TDA7053AT: RL = 16 Ω; unless otherwise specified
(see Fig.13).
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VP supply voltage 4.5 − 18 V
Iq(tot) total quiescent current VP = 6 V; RL = ∞; note 1 − 22 25 mA
Maximum gain; V2,8 ≥ 1.4 V
Pout output power THD = 10%
TDA7053A 1.0 1.1 − W
TDA7053AT 0.5 0.6 − W
THD total harmonic distortion
TDA7053A Pout = 0.5 W − 0.3 1 %
TDA7053AT Pout = 0.25 W − 0.3 1 %
Gv voltage gain 39.5 40.5 41.5 dB
VI(rms) input signal handling (RMS value) Gv = 0 dB; THD < 1% 1 − − V
Vno noise output voltage fi = 500 kHz; note 2 − 210 − µV
B bandwidth at −1 dB − note 3 − Hz
SVRR supply voltage ripple rejection note 4 34 38 − dB
VO(os) DC output offset voltage V16 − V13 and V12 − V9 − 0 200 mV
Zi input impedance (pins 4 and 6) 15 20 25 kΩ
αcs channel separation RS = 5 kΩ 40 − − dB
Gv channel unbalance note 5 − − 1 dB
G1 = 0 dB; note 6 − − 1 dB
Mute position; V2,8 = 0.4 V ±30 mV
VO output voltage in mute position Vi = 1.0 V; note 7 − − 30 µV
DC volume control
GC gain control 68.5 73.5 − dB
IDC volume control current V2 = V8 = 0 V −20 −25 −30 µA
Notes
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by RL.
2. The noise output voltage (RMS value) at fi = 500 kHz is measured with RS = 0 Ω and bandwidth = 5 kHz.
3. 20 Hz to 300 kHz (typical).
4. The ripple rejection is measured with RS = 0 Ω and fi = 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value)
is applied to the positive supply rail.
5. The channel unbalance is measured with VDC1 = VDC2.
6. The channel unbalance at G1 = 0 dB is measured with VDC1 = VDC2.
7. The noise output voltage (RMS value) is measured with RS = 5 kΩ unweighted.
1995 Nov 09 6
Philips Semiconductors Objective specification
MBG672 MBG671
40 12
handbook, halfpage handbook, halfpage
Iq
THD
(mA)
(%)
30
8
10
0 0
0 4 8 12 16 20 10−2 10−1 1 Pout (W) 10
VP (V)
(1) VP = 4.5 V.
(2) VP = 6 V; RL = 8 Ω.
(3) VP = 12 V; RL = 25 Ω.
Fig.3 Quiescent current as a function of supply
voltage. Fig.4 THD as a function of output power.
MBG669 MBG670
10 2.5
handbook, halfpage handbook, halfpage
THD Pout
(%) (W)
8 2.0
4 1.0
(2)
2 (1) 0.5
0 0
10−2 10−1 1 10 102 0 4 8 12
VP (V)
16
f (kHz)
(1) RL = 8 Ω.
(2) RL = 16 Ω.
(1) Gv = 30 dB; Po = 0.1 W. (3) RL = 25 Ω.
(2) Gv = 40 dB; Po = 0.1 W.
1995 Nov 09 7
Philips Semiconductors Objective specification
MBG668 MBG667
4 80
handbook, halfpage handbook, halfpage
Pdiss Gv
(W) (dB)
40
3
(1) (2) (3)
−40
1
−80
0 −120
0 4 8 12 16 0 0.4 0.8 1.2 1.6 2.0
VP (V) VVC (V)
(1) RL = 8 Ω.
(2) RL = 16 Ω.
(3) RL = 25 Ω.
Fig.7 Total worst case power dissipation as a Fig.8 Voltage gain as a function of volume control
function of supply voltage. voltage.
MBG664 MBG663
1 0
handbook, halfpage handbook, halfpage
SVRR
(dB)
Vno
(mV) −20
(1)
10−1 −40
−60
(2)
10−2 −80
0 0.4 0.8 1.2 1.6 2.0 10−2 10−1 1 10 102
VVC (V) f (kHz)
1995 Nov 09 8
Philips Semiconductors Objective specification
MBG665 MBG666
2.0 30
handbook, halfpage handbook, halfpage
IVC
Vin
(µA)
(V) 20
1.6
10
1.2
0.8
−10
0.4
−20
0 −30
0 4 8 12 16 20 0 0.4 0.8 1.2 1.6 2.0
VP (V) VVC (V)
THD = 1 %.
Fig.12 Volume control current as a function of
Fig.11 Input signal handling. volume control voltage.
1995 Nov 09 9
Philips Semiconductors Objective specification
5
TDA7053A
16
470 nF I+1
4
input 1
(2)
2
Rs = 5 kΩ I−1
13
TEMPERATURE
STABILIZER MCL
PROTECTION
12
470 nF I−1
6
input 2
8 (2)
I+1
DC- 9
volume
Rs = 5 kΩ
7 10 14
signal power
ground ground
VCC = 6 V
volume volume 56 kΩ
control 2, 8 maximum voltage control 2, 8 maximum voltage
gain 34 dB gain 40 dB
1 µF 1 MΩ 1 µF 22 kΩ
MBG673
(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 5.
(2) RL = 8 Ω.
1995 Nov 09 10
Philips Semiconductors Objective specification
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
D ME
seating plane
A2 A
A1
L
c
Z e w M
b1
(e 1)
b
16 9 MH
pin 1 index
E
1 8
0 5 10 mm
scale
UNIT
A A1 A2
b b1 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.40 0.53 0.32 21.8 6.48 3.9 8.25 9.5
mm 4.7 0.51 3.7 2.54 7.62 0.254 2.2
1.14 0.38 0.23 21.4 6.20 3.4 7.80 8.3
0.055 0.021 0.013 0.86 0.26 0.15 0.32 0.37
inches 0.19 0.020 0.15 0.10 0.30 0.01 0.087
0.045 0.015 0.009 0.84 0.24 0.13 0.31 0.33
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
92-10-02
SOT38-1 050G09 MO-001AE
95-01-19
1995 Nov 09 11
Philips Semiconductors Objective specification
SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
D E A
X
y HE v M A
16 9
Q
A2 A
A1 (A 3)
pin 1 index
θ
Lp
L
1 8 detail X
e w M
bp
0 5 10 mm
scale
0.30 2.45 0.49 0.32 10.5 7.6 10.65 1.1 1.1 0.9
mm 2.65 0.25 1.27 1.4 0.25 0.25 0.1 o
0.10 2.25 0.36 0.23 10.1 7.4 10.00 0.4 1.0 0.4 8
0.012 0.096 0.019 0.013 0.41 0.30 0.42 0.043 0.043 0.035 0o
inches 0.10 0.01 0.050 0.055 0.01 0.01 0.004
0.004 0.089 0.014 0.009 0.40 0.29 0.39 0.016 0.039 0.016
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
92-11-17
SOT162-1 075E03 MS-013AA
95-01-24
1995 Nov 09 12
Philips Semiconductors Objective specification
Apply a low voltage soldering iron (less than 24 V) to the A mildly-activated flux will eliminate the need for removal
lead(s) of the package, below the seating plane or not of corrosive residues in most applications.
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in REPAIRING SOLDERED JOINTS
contact for up to 10 seconds. If the bit temperature is Fix the component by first soldering two diagonally-
between 300 and 400 °C, contact may be up to 5 seconds. opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
SO time must be limited to 10 seconds at up to 300 °C. When
REFLOW SOLDERING using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
Reflow soldering techniques are suitable for all SO 270 and 320 °C.
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1995 Nov 09 13
Philips Semiconductors Objective specification
DEFINITIONS
1995 Nov 09 14
Philips Semiconductors Objective specification
NOTES
1995 Nov 09 15
Philips Semiconductors – a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc.,
BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Metro MANILA, Tel. (63) 2 816 6380, Fax. (63) 2 817 3474
Tel. (02)805 4455, Fax. (02)805 4466 Portugal: PHILIPS PORTUGUESA, S.A.,
Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,
Tel. (01)60 101-1236, Fax. (01)60 101-1211 Apartado 300, 2795 LINDA-A-VELHA,
Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (01)4163160/4163333, Fax. (01)4163174/4163366
Tel. (31)40-2783749, Fax. (31)40-2788399 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Brazil: Rua do Rocio 220 - 5th floor, Suite 51, Tel. (65)350 2000, Fax. (65)251 6500
CEP: 04552-903-SÃO PAULO-SP, Brazil. South Africa: S.A. PHILIPS Pty Ltd.,
P.O. Box 7383 (01064-970), 195-215 Main Road Martindale, 2092 JOHANNESBURG,
Tel. (011)821-2333, Fax. (011)829-1849 P.O. Box 7430, Johannesburg 2000,
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS: Tel. (011)470-5911, Fax. (011)470-5494
Tel. (800) 234-7381, Fax. (708) 296-8556 Spain: Balmes 22, 08007 BARCELONA,
Chile: Av. Santa Maria 0760, SANTIAGO, Tel. (03)301 6312, Fax. (03)301 42 43
Tel. (02)773 816, Fax. (02)777 6730 Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,
China/Hong Kong: 501 Hong Kong Industrial Technology Centre, Tel. (0)8-632 2000, Fax. (0)8-632 2745
72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. (852)2319 7888, Fax. (852)2319 7700 Tel. (01)488 2211, Fax. (01)481 77 30
Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17, Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West
77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,
Fax. (571)217 4549 TAIPEI 100, Tel. (886) 2 382 4443, Fax. (886) 2 382 4444
Denmark: Prags Boulevard 80, PB 1919, DK-2300 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
COPENHAGEN S, Tel. (032)88 2636, Fax. (031)57 1949 209/2 Sanpavuth-Bangna Road Prakanong,
Finland: Sinikalliontie 3, FIN-02630 ESPOO, Bangkok 10260, THAILAND,
Tel. (358)0-615 800, Fax. (358)0-61580 920 Tel. (66) 2 745-4090, Fax. (66) 2 398-0793
France: 4 Rue du Port-aux-Vins, BP317, Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
92156 SURESNES Cedex, Tel. (0 212)279 27 70, Fax. (0212)282 67 07
Tel. (01)4099 6161, Fax. (01)4099 6427 Ukraine: Philips UKRAINE, 2A Akademika Koroleva str., Office 165,
Germany: P.O. Box 10 63 23, 20043 HAMBURG, 252148 KIEV, Tel. 380-44-4760297, Fax. 380-44-4766991
Tel. (040)3296-0, Fax. (040)3296 213. United Kingdom: Philips Semiconductors LTD.,
Greece: No. 15, 25th March Street, GR 17778 TAVROS, 276 Bath Road, Hayes, MIDDLESEX UB3 5BX,
Tel. (01)4894 339/4894 911, Fax. (01)4814 240 Tel. (0181)730-5000, Fax. (0181)754-8421
India: Philips INDIA Ltd, Shivsagar Estate, A Block, United States: 811 East Arques Avenue, SUNNYVALE,
Dr. Annie Besant Rd. Worli, Bombay 400 018 CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556
Tel. (022)4938 541, Fax. (022)4938 722 Uruguay: Coronel Mora 433, MONTEVIDEO,
Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4, Tel. (02)70-4044, Fax. (02)92 0601
P.O. Box 4252, JAKARTA 12950,
Tel. (021)5201 122, Fax. (021)5205 189
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. (01)7640 000, Fax. (01)7640 200
Italy: PHILIPS SEMICONDUCTORS S.r.l., Internet: http://www.semiconductors.philips.com/ps/
Piazza IV Novembre 3, 20124 MILANO,
Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557 For all other countries apply to: Philips Semiconductors,
Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, TOKYO 108, International Marketing and Sales, Building BE-p,
Tel. (03)3740 5130, Fax. (03)3740 5077 P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. +31-40-2724825
Korea: Philips House, 260-199 Itaewon-dong,
Yongsan-ku, SEOUL, Tel. (02)709-1412, Fax. (02)709-1415 SCD45 © Philips Electronics N.V. 1995
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,
All rights are reserved. Reproduction in whole or in part is prohibited without the
SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880 prior written consent of the copyright owner.
Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,
Tel. 9-5(800)234-7381, Fax. (708)296-8556 The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, notice. No liability will be accepted by the publisher for any consequence of its
Tel. (040)2783749, Fax. (040)2788399 use. Publication thereof does not convey nor imply any license under patent- or
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, other industrial or intellectual property rights.
Tel. (09)849-4160, Fax. (09)849-7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. (022)74 8000, Fax. (022)74 8341 Printed in The Netherlands
Pakistan: Philips Electrical Industries of Pakistan Ltd.,
Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, 513061/1100/03/pp16 Date of release: 1995 Nov 09
KARACHI 75600, Tel. (021)587 4641-49, Document order number: 9397 750 00426
Fax. (021)577035/5874546