Is31fl3198a DS
Is31fl3198a DS
5
EN_B EN_B 13
6 CPOUT
EN_G EN_G
7 1μF
EN_R EN_R
4 IS31FL3198A
EN EN
3 12
SDB SDB OUT_R
2 10
ISET OUT_G
RISET
8
4.7kΩ 9,11 OUT_B
GND
14
13 CPOUT
14 GND
16 CN
15 CP
VCC 1 12 OUT_R
ISET 2 11 GND
QFN-16
SDB 3 10 OUT_G
EN 4 9 GND
EN_B 5
EN_G 6
EN_R 7
OUT_B 8
PIN DESCRIPTION
No. Pin Description
1 VCC Power supply
2 ISET LED current setting pin
Pull below 0.4V to activate low power shutdown mode.
3 SDB
H: normal operation mode, L: shut down mode
Outputs current enable pin.
4 EN
H: outputs enable, L: outputs disable
5 EN_B OUT_B enable pin, H: OUT_B enable, L: OUT_B disable
6 EN_G OUT_G enable pin, H: OUT_G enable, L: OUT_G disable
7 EN_R OUT_R enable pin, H: OUT_R enable, L: OUT_R disable
8 OUT_B Output pin, blue channel
9, 11, 14 GND GND
10 OUT_G Output pin, green channel
12 OUT_R Output pin, red channel
Charge pump power supply output pin to drive load circuits, requires 1μF
13 CPOUT
capacitor connected between this pin and ground pin.
15 CP Charge pump flying capacitor positive terminal. (Note 1)
16 CN Charge pump flying capacitor negative terminal. (Note 1)
Thermal Pad Connect to GND.
Note 1: The flying capacitors should be placed as close as possible to the IC and the signal trace between the capacitor and CP terminals keep
as short as possible.
Copyright © 2024 Lumissil Microsystems. All rights reserved. Lumissil Microsystems reserves the right to make changes to this specification and its products
at any time without notice. Lumissil Microsystems assumes no liability arising out of the application or use of any information, products or services described
herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders
for products.
Lumissil Microsystems does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in
such applications unless Lumissil Microsystems receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Lumissil Microsystems is adequately protected under the circumstances
ELECTRICAL CHARACTERISTICS
The following specifications apply for VCC= 3.3V, TA= 25°C, unless otherwise noted.
Symbol Parameter Condition Min. Typ. Max. Unit
VCC Supply voltage 3.135 3.3 3.465 V
ICC Quiescent operating current 2x mode, all outputs disable 2.5 3.5 mA
ISD Shutdown current VSDB= 0V 0.5 1 µA
VCPOUT Voltage of CPOUT LED current= 0mA 6.27 6.6 6.93 V
RISET= 4.7kΩ±1%, VOUT_X= 3.5V (Note 4) 62 66 70 mA
IOUT Output current of R/G/B
RISET= 3.9kΩ±1%, VOUT_X= 3.5V (Note 4) 79.5 mA
RISET< 1.45kΩ,
IPT LED protect current 105 150 217.5 mA
Quit the protection when RISET> 3kΩ
IMAT Current matching RISET= 4.7kΩ±1%, VOUT_X= 3.5V -3 3 %
IACC Current accuracy RISET= 4.7kΩ±1%, VOUT_X= 3.5V -6 6 %
VHR Current sink headroom IOUT= 66mA 250 350 mV
VF LED forward voltage (Note 5) 1.1 4.8 V
EN_R, G, B= “000” 100
EN_R, G, B= “001” 87.5
EN_R, G, B= “010” 75
EN_R, G, B= “011” 62.5
ILED LED current VOUT_x= 3.5V %
EN_R, G, B= “100” 50
EN_R, G, B= “101” 37.5
EN_R, G, B= “110” 25
EN_R, G, B= “111” 12.5
TSD Thermal shutdown (Note 6) 166 °C
TSD_HY Thermal shutdown hysteresis (Note 6) 24 °C
0.7VCC
EN 0.3VCC
tSU tHD
0.7VCC 0.7VCC
EN_R/G/B
High Setting
tCL tCL
tHD
EN_R/G/B
Low Setting 0.3VCC tON
90%
Note 8: SDB and EN pin should keep low when turning on the VCC.
tSDB1
3.135V
VCC
tSTUP tSDB2
SDB
EN
8 Steps
SDB Current ISET POR OSC BG 2xCP CP
Setting
OT CN
ISET CPOUT_OVP
VCC_OVP
CLAMP CPOUT
IREF <3:1> RISET <2.1k to SD OUT
EN
OUT_B
Control Logic B
EN_B
OUT_G
Control Logic G
EN_G
OUT_R
Control Logic R
EN_R OUTPUT
GND
The current delivered through the LED load is The current setting can be set to 8 levels with
controlled by an internal configurable low dropout EN_R/G/B and EN combination.
current source. The current level is set by the levels by latch the
CHARGE PUMP pattern of EN_R, EN_G, EN_B at the time of following
EN rise to decide the current value. After the EN_R,
The converter is based on a 2-stage charge pump EN_G, EN_B signal fall once, the current interlocks
technique to efficiently generate a DC voltage to with EN_R, EN_G, EN_B’s on or off.
supply the RGB LED current.
EN=H
The integrated capacitive charge pump is designed
EN EN=L Turn on RGB
for CPOUT = VCC × 2. The charge pump converter
only needs three external components: supply EN_R Not turn on
decoupling capacitor, output bypass capacitor and
flying capacitors. EN_G
Using a larger flying capacitor (CP) reduces the The relation between the pattern and the current
output impedance and improves efficiency however, setting value of EN_R, EN_G, EN_B at the time of
above a certain point, increasing CP’s capacitance the EN rise as follows.
has a negligible effect because the output resistance
becomes dominated by the internal switch resistance EN_R EN_G EN_B Current Setting
and capacitor ESR. But when space is a constraint, it
may be necessary to sacrifice low output resistance 0 0 0 100%
for the sake of small capacitor size. 0 0 1 87.5%
Increasing the output capacitance (COUT) reduces the 0 1 0 75%
output ripple voltage. Decreasing its ESR reduces
both output resistance and ripple. Smaller 0 1 1 62.5%
capacitance values can be used with light loads. Use 1 0 0 50%
the following equation to calculate the peak-to-peak
ripple: 1 0 1 37.5%
VRIPPLE = IOUT/(fOSC×COUT) + 2×IOUT×ESRCOUT (1) 1 1 0 25%
1 1 1 12.5%
Note:
1. Land pattern complies to IPC-7351.
2. All dimensions in MM.
3. This document (including dimensions, notes & specs) is a recommendation based on typical circuit board manufacturing parameters. Since
land pattern design depends on many factors unknown (eg. User’s board manufacturing specs), user must determine suitability for use.