BZX284
BZX284
DATA SHEET
book, halfpage
M3D154
BZX284 series
Voltage regulator diodes
Product specification 1999 Apr 19
Supersedes data of 1996 Apr 17
Philips Semiconductors Product specification
FEATURES DESCRIPTION
• Total power dissipation: Low-power voltage regulator diodes in a small ceramic SMD SOD110 package.
max. 400 mW The diodes are available in the normalized E24 ±2% (BZX284-B) and ±5%
• Two tolerance series: (BZX284-C) tolerance range. The series consists of 37 types with nominal
±2% and ±5% working voltages from 2.4 to 75 V.
• Working voltage range:
nom. 2.4 to 75 V (E24 range).
cathode mark
handbook, 4 columns
a k k a
APPLICATIONS
• General regulation functions.
MARKING
1999 Apr 19 2
Philips Semiconductors Product specification
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
IF continuous forward current − 250 mA
IZSM non-repetitive peak reverse current tp = 100 µs; square wave; see Tables 1 and 2
Tamb = 25 °C prior to surge
Ptot total power dissipation Tamb = 25 °C; note 1 − 400 mW
Tstg storage temperature −65 +150 °C
Tj junction temperature − 150 °C
Note
1. Device mounted on a printed-circuit board: 11 × 25 × 1.6 mm.
ELECTRICAL CHARACTERISTICS
Total BZX284-B and C series
Tj = 25 °C unless otherwise specified.
1999 Apr 19 3
1999 Apr 19
Philips Semiconductors
Table 1 Per type BZX284-B/C2V4 to B/C24
WORKING VOLTAGE DIFFERENTIAL RESISTANCE TEMP. COEFF. DIODE CAP. NON-REPETITIVE PEAK
VZ (V) rdif (Ω) SZ (mV/K) Cd (pF) REVERSE CURRENT
BZX284-
at IZtest = 5 mA at IZtest = 5 mA at f = 1 MHz; IZSM (A) at tp = 100 µs;
B or C
(see Figs 5 and 6) VR = 0 V Tamb = 25 °C
XXX Tol. ±2% (B) Tol. ±5% (C) at IZtest = 1 mA at IZtest = 5 mA
MIN. MAX. MIN. MAX. TYP. MAX. TYP. MAX. TYP. MAX. MAX.
2V4 2.35 2.45 2.2 2.6 275 400 70 100 −1.6 450 12.0
2V7 2.65 2.75 2.5 2.9 300 450 75 100 −2.0 440 12.0
3V0 2.94 3.06 2.8 3.2 325 500 80 95 −2.1 425 12.0
3V3 3.23 3.37 3.1 3.5 350 500 85 95 −2.4 410 12.0
3V6 3.53 3.67 3.4 3.8 375 500 85 90 −2.4 390 12.0
3V9 3.82 3.98 3.7 4.1 400 500 85 90 −2.5 370 12.0
4V3 4.21 4.39 4.0 4.6 410 600 80 90 −2.5 350 12.0
4V7 4.61 4.79 4.4 5.0 425 500 50 80 −1.4 325 12.0
5V1 5.00 5.20 4.8 5.4 400 480 40 60 −0.8 300 12.0
5V6 5.49 5.71 5.2 6.0 80 400 15 40 1.2 275 12.0
4
BZX284 series
16 15.70 16.30 15.3 17.1 25 200 4 20 12.4 97 1.5
Product specification
18 17.60 18.40 16.8 19.1 25 225 4 20 14.4 93 1.5
20 19.60 20.40 18.8 21.2 30 225 4 20 16.4 88 1.5
22 21.60 22.40 20.8 23.3 30 250 5 25 18.4 84 1.25
24 23.50 24.50 22.8 25.6 30 250 6 30 20.4 80 1.25
1999 Apr 19
Philips Semiconductors
Table 2 Per type BZX284-B/C27 to B/C75
WORKING VOLTAGE DIFFERENTIAL RESISTANCE TEMP. COEFF. DIODE CAP. NON-REPETITIVE PEAK
VZ (V) rdif (Ω) SZ (mV/K) Cd (pF) REVERSE CURRENT
BZX284-
at IZtest = 2 mA at IZtest = 2 mA at f = 1 MHz; IZSM (A) at tp = 100 µs;
B or C
VR = 0 V Tamb = 25 °C
XXX Tol. ±2% (B) Tol. ±5% (C) at IZtest = 0.5 mA at IZtest = 2 mA
MIN. MAX. MIN. MAX. TYP. MAX. TYP. MAX. TYP. MAX. MAX.
27 26.50 27.50 25.1 28.9 35 250 8 40 23.4 73 1.0
30 29.40 30.60 28.0 32.0 35 250 10 40 26.6 66 1.0
33 32.30 33.70 31.0 35.0 40 275 11 40 29.7 60 0.9
36 35.30 36.70 34.0 38.0 40 300 15 60 33.0 59 0.8
39 38.20 39.80 37.0 41.0 40 300 25 75 36.4 58 0.7
43 42.10 43.90 40.0 46.0 45 325 30 80 41.2 56 0.6
47 46.10 47.90 44.0 50.0 45 325 30 90 46.1 55 0.5
51 50.00 52.00 48.0 54.0 45 350 35 110 51.0 52 0.4
56 54.90 57.10 52.0 60.0 50 375 40 120 57.0 49 0.3
62 60.80 63.20 58.0 66.0 60 400 50 140 64.4 44 0.3
5
BZX284 series
Product specification
Philips Semiconductors Product specification
THERMAL CHARACTERISTICS
Note
1. Device mounted on a printed-circuit board: 11 × 25 × 1.6 mm.
MOUNTING
Wave soldering
Reflow soldering
Before wave soldering, attach SOD110 packages to the
Follow standard reflow soldering techniques to ensure printed-circuit boards using a small dot of thermo-setting
correct application of solder paste and placement of the epoxy or UV-curing adhesive centred between the
SOD110 package (see Fig.2). soldering lands (see Fig.3).
,,,,, ,, ,,,
3.00 handbook, halfpage 3.40
handbook, halfpage
,,,,,
1.00 1.00
1.25
MGC119
,, ,,, 1.10 1.10
1.25
MGC126
Fig.2 SOD110 reflow soldering pattern. Fig.3 SOD110 wave soldering pattern.
1999 Apr 19 6
Philips Semiconductors Product specification
GRAPHICAL DATA
MBG781 MBG783
300 0
handbook, halfpage handbook, halfpage
IF SZ
(mA) (mV/K) 4V3
200 −1
3V9
3V6
100 −2 3V3
3V0
2V4
2V7
0 −3
0.6 0.8 VF (V) 1.0 0 20 40 IZ (mA) 60
BZX284-B/C2V4 to B/C4V3.
Tj = 25 to 150 °C.
Tj = 25 °C.
MBG782
10
handbook, halfpage
12
SZ
11
(mV/K)
10
9V1
5
8V2
7V5
6V8
6V2
5V6
5V1
0
4V7
−5
0 4 8 12 16 20
IZ (mA)
BZX284-B/C4V7 to B/C12.
Tj = 25 to 150 °C.
1999 Apr 19 7
Philips Semiconductors Product specification
PACKAGE OUTLINE
D E
cathode
identifier DIMENSIONS (mm are the original dimensions)
A
UNIT D E y
1 2 max.
2.10 1.40
0 0.5 1 mm mm 1.6 0.1
1.90 1.10
scale
SOD110 97-04-14
DEFINITIONS
1999 Apr 19 8
Philips Semiconductors Product specification
NOTES
1999 Apr 19 9
Philips Semiconductors Product specification
NOTES
1999 Apr 19 10
Philips Semiconductors Product specification
NOTES
1999 Apr 19 11
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Printed in The Netherlands 115002/3180/03/pp12 Date of release: 1999 Apr 19 Document order number: 9397 750 05488