Max 1473
Max 1473
Pin Configurations
TOP VIEW
LNASRC
+
PWRDN
PDOUT
XTAL1
XTAL2
LNAIN
AVDD
XTAL1 1 28 XTAL2
N.C.
AVDD 2 27 PWRDN
+
25
32
31
30
29
28
27
26
LNAIN 3 26 PDOUT
LNASRC 4 25 DATAOUT N.C. 1 24 DATAOUT
AGND 5 24 VDD5 AGND 2 23 VDD5
MAX1473
LNAOUT 6 23 DSP LNAOUT 3 22 DSP
AVDD 7 22 DFFB AVDD 4 MAX1473 21 N.C.
MIXIN1 8 21 OPP MIXIN1 5 20 DFFB
MIXIN2 9 20 DSN MIXIN2 6 19 OPP
AGND 10 19 DFO AGND 7 18 DSN
IRSEL 11 18 IFIN2 IRSEL 8 17 DFO
MIXOUT 12 17 IFIN1
DGND 13 16 XTALSEL
10
11
12
13
14
15
16
9
DVDD 14 15 AGCDIS
MIXOUT
DGND
DVDD
AGCDIS
N.C.
XTALSEL
IFIN1
IFIN2
TSSOP
THIN QFN
AC Electrical Characteristics
(Typical Application Circuit, AVDD = DVDD = VDD5 = 3.0V to 3.6V, all RF inputs are referenced to 50Ω, fRF = 315MHz, TA = -40°C to
+85°C, unless otherwise noted. Typical values are at VDD = 3.3V and TA = +25°C.) (Note 1).
Note 1: Note 1: 100% tested at TA = +25°C. Guaranteed by design and characterization over temperature.
Note 2: IRSEL is internally set to 375MHz IR mode. It can be left open when the 375MHz image rejection setting is desired. A 1nF
capacitor is recommended in noisy environments.
Note 3: BER = 2 x 10-3, Manchester encoded, data rate = 4kbps, IF bandwidth = 280kHz.
Note 4: Input impedance is measured at the LNAIN pin. Note that the impedance includes the 15nH inductive degeneration con-
nected from the LNA source to ground. The equivalent input circuit is 50Ω in series with 2.2pF.
Note 5: Crystal oscillator frequency for other RF carrier frequency within the 300MHz to 450MHz range is (fRF - 10.7MHz)/64 for
XTALSEL = 0V, and (fRF - 10.7MHz)/32 for XTALSEL = AVDD.
MAX1473 toc02
MAX1473 toc03
5.5 +105°C fRF = 433MHz
6.5
10
SUPPLY CURRENT (mA)
5.4 +105°C
MAX1473 toc05
-106
DELTA (dB)
fRF = 433MHz 1.8 1.8 0.5
RSSI (V)
RSSI (V)
-108
-110 1.6 VAGCDIS = 0V 1.6 -0.5
DELTA
-112
1.4 1.4 -1.5
-114 fRF = 315MHz
RSSI
1.2 1.2 -2.5
-116
-118 1.0 1.0 -3.5
-40 -20 0 20 40 60 80 100 120 -140 -120 -100 -80 -60 -40 -20 0 -90 -70 -50 -30 -10 10
TEMPERATURE (°C) RF INPUT POWER (dBm) IF INPUT POWER (dBm)
IMAGE REJECTION IMAGE REJECTION
SYSTEM GAIN vs. FREQUENCY vs. RF FREQUENCY vs. TEMPERATURE
30 55 45
MAX1473 toc07
MAX1473 toc08
MAX1473 toc09
10 44
50dB IMAGE 45
REJECTION LOWER 43
0 SIDEBAND fRF = 375MHz
43
40
-10 42 fRF = 433MHz
fRF = 375MHz
FROM RFIN TO 42
35 fRF = 315MHz
-20 MIXOUT
fRF = 315MHz fRF = 433MHz 41
-30 30 41
0 5 10 15 20 25 30 280 330 380 430 480 -40 -15 10 35 60 85
IF FREQUENCY (MHz) RF FREQUENCY (MHz) TEMPERATURE (°C)
NORMALIZED IF GAIN
vs. IF FREQUENCY S11 MAGNITUDE-LOG PLOT OF RFIN S11 SMITH PLOT OF RFIN
5 30 MAX1473 toc12
MAX1473 toc10
MAX1473 toc11
20
600MHz
0 10
NORMALIZED IF GAIN (dB)
0
MAGNITUDE (dB)
-5 -10
-20
-10 -30 100MHz
-40 315MHz
-34dB
-15 -50
-60
-20 -70
1 10 100 10 109 208 307 406 505 604 703 802 901 1000
IF FREQUENCY (MHz) RF FREQUENCY (MHz)
MAX1473 toc14
MAX1473 toc15
fRF = 315MHz fRF = 433MHz
3.0 -20 -20
REGULATOR VOLTAGE (V)
-40°C
+25°C -40 -40
PHASE NOISE (dBc/Hz)
2.9 +85°C
+105°C
-60 -60
2.8
-80 -80
2.7
-100 -100
2.6
-120 -120
VDD = 5.0V
2.5 -140 -140
5 15 25 35 45 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
REGULATOR CURRENT (mA) OFFSET FREQUENCY (MHz) OFFSET FREQUENCY (MHz)
Pin Description
PIN
NAME FUNCTION
TSSOP TQFN
1 29 XTAL1 1st Crystal Input. (See the Phase-Locked Loop section.)
Positive Analog Supply Voltage. For +5V operation, pin 2 (TSSOP package) is the output of an on-
chip +3.2V low-dropout regulator and should be bypassed to AGND with a 0.1µF capacitor as close
2, 7 4, 30 AVDD as possible to the pin. Pin 7 must be externally connected to the supply from pin 2 and bypassed to
AGND with a 0.01µF capacitor as close as possible to the pin (see the Voltage Regulator section and
the Typical Application Circuit).
3 31 LNAIN Low-Noise Amplifier Input. (See the Low-Noise Amplifier section.)
Low-Noise Amplifier Source for External Inductive Degeneration. Connect inductor to ground to set
4 32 LNASRC
LNA input impedance. (See the Low-Noise Amplifier section.)
5 2 AGND Analog Ground
Low-Noise Amplifier Output. Connect to mixer through an LC tank filter. (See the Low-Noise Amplifier
6 3 LNAOUT
section.)
8 5 MIXIN1 1st Differential Mixer Input. Connect through a 100pF capacitor to LC tank filter from LNAOUT.
9 6 MIXIN2 2nd Differential Mixer Input. Connect through a 100pF capacitor to AVDD side of the LC tank.
10 7 AGND Analog Ground
Image Rejection Select Pin. Set VIRSEL = 0V to center image rejection at 315MHz. Leave IRSEL
11 8 IRSEL unconnected to center image rejection at 375MHz. Set VIRSEL = AVDD to center image rejection at 433MHz.
Input logic level based on AVDD, ~3.2V supply.
12 9 MIXOUT 330Ω Mixer Output. Connect to the input of the 10.7MHz bandpass filter.
13 10 DGND Digital Ground
Positive Digital Supply Voltage. Connect to both of the AVDD pins. Bypass to DGND with a 0.01µF
14 11 DVDD
capacitor as close as possible to the pin (see the Typical Application Circuit).
15 12 AGCDIS AGC Control Pin. Pull high to disable AGC. Input logic level based on VDD5 voltage.
Crystal Divider Ratio Select Pin. Drive XTALSEL low to select divider ratio of 64, or drive XTALSEL
16 14 XTALSEL
high to select divider ratio of 32. Input logic level based on AVDD, ~3.2V supply.
1st Differential Intermediate Frequency Limiter Amplifier Input. Decouple to AGND with a 1500pF
17 15 IFIN1
capacitor.
2nd Differential Intermediate Frequency Limiter Amplifier Input. Connect to the output of a 10.7MHz
18 16 IFIN2
bandpass filter.
19 17 DFO Data Filter Output
20 18 DSN Negative Data Slicer Input
21 19 OPP Noninverting Op-Amp Input for the Sallen-Key Data Filter
22 20 DFFB Data Filter Feedback Node. Input for the feedback of the Sallen-Key data filter.
23 22 DSP Positive Data Slicer Input
+5V Supply Voltage. Bypass to AGND with a 0.01µF capacitor as close as possible to the pin. For
24 23 VDD5 +5V operation, VDD5 is the input to an on-chip voltage regulator whose +3.2V output appears at the
pin 2 AVDD pin. (See the Voltage Regulator section and the Typical Application Circuit.)
25 24 DATAOUT Digital Baseband Data Output. Output logic level based on VDD5 voltage.
26 26 PDOUT Peak Detector Output
Power-Down Select Input. Drive this pin with a logic high to power on the IC.
27 27 PWRDN
Input logic level based on VDD5 voltage.
28 28 XTAL2 2nd Crystal Input
1, 13,
— N.C. No Connection
21, 25
— — EP Exposed Pad (TQFN Only). Connect EP to GND.
Data Slicer
b
C7 = The purpose of the data slicer is to take the analog
a (100k ) (π) (f c )
output of the data filter and convert it to a digital signal.
a This is achieved by using a comparator and comparing
C6 =
4(100k ) (π) (f c ) the analog input to a threshold voltage. The output logic
level is based on VDD5 voltage supply. One input is
where fC is the desired 3dB corner frequency. supplied by the data filter output. Both comparator inputs
are accessible off chip to allow for different methods of
For example, choose a Butterworth filter response with a generating the slicing threshold, which is applied to the
corner frequency of 5kHz: second comparator input.
1.000 The suggested data slicer configuration uses a resistor
C7 ≈ 450pF
(1.414) (100kΩ) (3.14) (5kHz) (R1) connected between DSN and DSP with a capacitor
(C8) from DSN to DGND (Figure 2). This configuration
Choosing standard capacitor values changes C7 to 470pF averages the analog output of the filter and sets the
and C6 to 220pF, as shown in the Typical Application threshold to approximately 50% of that amplitude. With
Circuit. this configuration, the threshold automatically adjusts as
the analog signal varies, minimizing the possibility for
errors in the digital data. The sizes of R1 and C8 affect
how fast the threshold tracks to the analog amplitude. Be
MAX1473 sure to keep the corner frequency of the RC circuit much
lower than the lowest expected data rate.
RSSI
Note that a long string of zeros or 1s can cause the
threshold to drift. This configuration works best if a coding
RDF2 RDF1 scheme, such as Manchester coding, which has an equal
100kΩ 100kΩ number of zeros and 1s, is used.
To prevent continuous toggling of DATAOUT in the
19 21 22 absence of an RF signal due to noise, hysteresis can be
DFO OPP DFFB added to the data slicer as shown in Figure 3.
C6 C7 For further information on Data Slicer options, please refer
to Maxim Application Note 3671, Data Slicing Techniques
DATA
MAX1473 SLICER
DATA 25 23 20 19
SLICER DATAOUT DSP DSN DFO
R1
R2
R3
25 20 23 19
DATAOUT DSN DSP DFO
R* *OPTIONAL C8
C8 R1
Figure 2. Generating Data Slicer Threshold Figure 3. Generating Data Slicer Hysteresis
AVDD VDD
IF VDD IS THEN AVDD IS
(SEE TABLE)
3.0V TO 3.6V CONNECTED TO VDD
4.5V TO 5.5V CREATED BY LDO, X1
AVAILABLE AT AVDD
(PIN 2)
L3 7 22
AVDD DFFB
C3
C2 8 21
MIXIN1 OPP
C7
9 20
MIXIN2 DSN
C4 10 19
C9 AGND DFO
11 18
IRSEL IFIN2
**
12 17 R1
MIXOUT IFIN1
13 16
DGND XTALSEL
14 15
DVDD AGCDIS
FROM µP
Y1 * C5 C6 C8
IF FILTER
C10 IN OUT
GND
COMPONENT VALUES
IN TABLE 2
Chip Information
PROCESS: CMOS
Functional Diagram
0˚ IF LIMITING
AUTOMATIC
3 Q AMPS
LNAIN LNA GAIN IMAGE
CONTROL ∑
REJECTION
2 90˚
AVDD MAX1473
24 3.2V REG I RSSI
VDD5
7
AVDD
14 DIVIDE DATA
DVDD VCO FILTER
BY 64
RDF2 RDF1
100kΩ 100kΩ
13 PHASE LOOP
DGND DETECTOR FILTER
DATA
5,10 1 CRYSTAL POWER SLICER
AGND
2 DRIVER DOWN
16 1 28 27 25 20 23 19 26 21 22
XTALSEL XTAL1 XTAL2 PWRDN DATAOUT DSN DSP DFO PDOUT OPP DFFB
Package Information
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Revision History
REVISION REVISION PAGES
DESCRIPTION
NUMBER DATE CHANGED
Added lead-free parts and exposed pad in Ordering Information and Pin Description
4 5/10 1, 8
tables
Updated Absolute Maximum Ratings, AC Electrical Characteristics, Pin Description,
2, 3, 4, 8, 9, 12,
5 1/11 Layout Considerations, Typical Application Circuit, Functional Diagram, and Package
13, 14
Information; added Voltage Regulator section to the Detailed Description section
Updated DC Electrical and AC Electrical Characteristics tables, replaced TOC 4,
6 1/12 updated Tables 1 and 2 and Figure 1; updated Phase-Locked Loop, Data Filter, Data 3, 5, 6, 10–13
Slicer, and Layout Considerations sections
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Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
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