"NVIDIA’s Use of Ball Grid Array (BGA) in GPU Packaging.
NVIDIA, one of the world’s leading graphics
processing unit (GPU) manufacturers, uses Ball Grid Array (BGA) packaging for many of its high-
performance GPUs. BGA is a surface-mount packaging technology that utilizes an array of solder balls on
the underside of a chip for electrical interconnection. It is ideal for high pin-count, high-performance
components like GPUs, FPGAs, and processors."
"On the left, we see a cross-sectional diagram of a BGA package. This shows how the internal structure
of the chip looks. Let me explain the key parts:"
Die – This is the actual chip that performs the computing.
Wire Bond – Thin wires that connect the die to the package's internal wiring.
Molding Compound – This black material protects the die from damage and dust.
Solder Balls – These small balls of solder form the electrical and mechanical connection to the green PCB
underneath.
"When this chip is placed on the board and heated, the solder balls melt and connect, creating a strong,
compact connection."
"On the right is a real NVIDIA GPU using BGA packaging. You can see two sides:"
The top side, which has the label: 'NVIDIA GeForce Go 6800'.
The bottom side, which clearly shows the array of tiny solder balls – this is the 'ball grid'."
“Now that we’ve seen the inside and outside of a BGA package, let’s look at where it’s used and why.
NVIDIA uses BGA in graphics cards and data center GPUs because it’s durable, easy to mass-produce,
and handles high performance well.”
"NXP Semiconductors' FleX-NFC™ with SoP CSP NXP Semiconductors, a leading global semiconductor
manufacturer, developed the FleX-NFC™ system-on-chip (SoC), utilizing Semiconductor-on-Polymer
(SoP) Wafer-Level Chip Scale Packaging (CSP) technology. This innovation led to the creation of ultra-
thin, flexible electronic systems suitable for applications like smart labels and data loggers."
"Here is a cross-sectional diagram of the FleX-IC chip, which represents how the SoP CSP works."
Then walk your audience through each layer:
1.Top Layer – Silicon
'At the top, there is a very thin layer of silicon — typically less than 10 micrometers, even as thin as 0.2
μm in some cases. This is where the actual integrated circuit (IC) functions are fabricated.'
2.IC Interconnect Stack
'This layer contains the metal interconnects — typically 3 to 6 metal layers — that connect different
parts of the IC.'
3.Polyimide Coating (Topside, Sidewall, Backside)
'The IC is fully coated in polyimide — 3–5 μm on top, 14 μm on the back, and on the sidewalls — which
provides mechanical support, electrical insulation, and environmental protection.'
4.Bond Pad Openings
'Openings are made in the top polyimide layer to expose the bond pads, which can be used for electrical
contact — this may also include plating to raise the surface for better bonding.'
5.Overall Thickness and Width
'The total thickness of the package is about 30 μm, which is thinner than a human hair, and the die
width is typically around 2 mm, especially for SoCs like NFC chips.'
"Now that we’ve seen how the FleX-NFC™ chip is built, let’s explore where it's used and why it’s
valuable."
Applications:
Thanks to its incredibly thin and flexible structure, this technology is ideal for smart labels — like those
used in logistics, retail, or pharmaceuticals — and for data loggers, which record temperature or other
data in real time on perishable goods or sensitive shipments.
Benefits:
The SoP CSP design offers a truly ultra-thin profile, enabling seamless integration into paper-thin or
curved surfaces. Its flexibility makes it perfect for embedding in non-traditional substrates like plastic or
paper. It also supports compact integration, combining performance with minimal space usage — and
best of all, it allows for cost-effective manufacturing, which is crucial for large-scale production like in
the smart packaging industry.
"Intel’s Foveros Technology Intel's Foveros is an advanced 3D chip packaging technology that enables
the vertical stacking of multiple logic dies, facilitating heterogeneous integration within a single package.
Introduced in 2018 and entering mass production in 2019, Foveros allows for the combination of
different process nodes and functionalities, enhancing performance and power efficiency in a compact
form factor."
“This image shows Intel’s Foveros 3D Packaging Technology, which stacks multiple chip components
vertically instead of placing them side by side.
In the top diagram, you can see two chips — like CPUs or memory — stacked face-to-face using micro-
bumps, with the base logic die at the bottom connected to the circuit board.
In the bottom diagram, it adds HBM memory on the side, connected by TSVs (Through-Silicon Vias) and
EMIB (a special bridge). This setup boosts performance, saves space, and improves power efficiency.
Foveros lets Intel combine different chip parts into one compact, powerful package — ideal for AI,
mobile, and high-performance computing.”
Foveros is used in real products like the Lakefield and Meteor Lake processors.
Its main benefits are high performance, better power efficiency, and a smaller, space-saving design ideal
for AI, mobile, and high-performance computing.”
Samsung's eXtended-Cube (X-Cube) is an advanced 3D integrated circuit (IC) packaging solution that
utilizes through-silicon via (TSV) technology to vertically stack multiple dies, such as SRAM atop logic
dies. This design enables high-density integration, improved performance, and reduced power
consumption, making it ideal for next-generation applications like 5G, artificial intelligence (AI), and
high-performance computing (HPC).
“This is similar to Intel’s Foveros, where chips are stacked vertically using 3D packaging. Since we already
understand 3D stacking, I’ll now explain how Samsung’s X-Cube uses two different methods to stack
chips — one with micro-bumps, and one that’s completely bumpless.”
On the left, we see X-Cube TCB, which uses micro-bumps to connect the stacked chips.
On the right, we have X-Cube HCB, a newer method that is bumpless, meaning it doesn’t need those tiny
bumps, allowing even tighter and faster connections.
“Samsung’s X-Cube technology is especially useful in advanced applications like Artificial Intelligence and
5G networking, where speed and efficiency are critical. Because of the shorter signal paths and higher
chip density, this packaging improves power efficiency and overall performance.”
