1

A review of different dispenser designs

Daniel Arturo Bustillos Vila
Departamento de Ingenierı́a
Universidad Católica Boliviana ”San Pablo”
La Paz, Bolivia
daniel.bustillos@ucb.edu.bo

Abstract—Based on the great advances exposed in the semi-

conductor industry, it is relevant to think about using SMT
components for functional, final prototypes and for low volume
production projects. Since this technology not only advances in
the miniaturization aspect (small, light, dense, fast and cheap), it
also focuses on aspects needed and required by users and other
industries (IoT, Medical and Health, Automotive, etc.). However,
in the Bolivian reality there is an absence of PCB assembly with
SMT components. The main problems related to this absence
are the machines cost and the lack of human resources capable
of fulfilling the process to assemble these components on a fast
and repeatable way. The assembling process can be summarized
in three steps: Deposit solder paste on the PCB pins, place the Fig. 1. Transistor focus. Retrieved from Arden W et al, More than Moore,
components in their respective location, and reflow the solder page 5.
paste through an oven. Although it is possible to do these three
processes manually, solder paste deposition is one of the most
difficult because the electronic components have too many pins
and tracks with a fine pitch. For this reason, in this paper is Roadmap for Semiconductors (NTRS) for North America and
proposed a low-cost dispenser for low production volumes. was subsequently established at the International Technology
Roadmap for Semiconductors (ITRS), where Intel was at the
Index Terms—Paste solder, jetting, dispensing, electronic pack-
aging technology. leading edge [2].
Actually, Moore’s law is still used, but it is now known
as ”More Moore”, which is adapted to focus on optimizing
I. I NTRODUCTION PPAC (Performance, Power, Area, Cost) every 2 or 3 years,
as well as focusing on digital logic and memory in the
T ODAY, technology is advancing by leaps and bounds.
It can be said that part of this progress is due to the
development and research of semiconductors, also known as
production of devices using semiconductors. On the other
hand, Dennard’s law is no longer in effect since 2014, because
transistors. These are found in almost all types of electronic even if transistors such as CMOS are scaled, they no longer
devices. The semiconductors development has a great impact improve the speed of ICs. The ITRS and other associations,
on technology thanks to the miniaturization that is sought in keeping these events in mind, proposed new ideologies and
these components [1]. projections to replace or redirect Moore’s law. Some of these
By the 1960s, a virtuous cycle for the semiconductor include: ”More than Moore”, ”Beyond Moore” and ”Time
industry began with research and development focused on Moore”.
the miniaturization of transistors. As a result, they had better ”More than Moore” is focused on giving more importance
performance, required less power consumption and increased to non-digital and non-memory features of integrated circuits
their density on a chip. The cost was also reduced, as they (IC) such as radio frequency, sensors, etc., considering the
brought improvements to devices. As a result, the market needs of society (health, transport, energy, security, etc.) and
expanded due to the qualitative changes in performance. In parts of current market (industries, communication, automo-
response to this, large companies invested in semiconductor tive, consumer, etc.) [3] [4].
research and development. Thus, the cycle was repeated. ”Beyond Moore” proposes to investigate new ways of tran-
This cycle is the result of Moore’s law, which was used sistors with different materials, it also proposes to investigate
for many decades during the planning of large semiconductor ways of packaging in order to reduce the space used. Finally,
companies, such as Intel, where Moore was a co-founder, ”Time Moore” proposes to investigate and develop ICs focused
imposing a rhythm of development and research in terms on arbitrarily regulate the frequency generated and a higher
of technology. This law is not a natural law, but rather a commutation in the frequency of microprocessors [5].
projection, that is, a goal focused on scaling transistors to Based on these ideologies, semiconductor company associ-
double the number of those in a microprocessor in a two- ations started to plan and propose various projects inspired on
year period. Thanks to Moore’s law, Intel was on the top strategies subsequent to Moore’s law. For example, European
of the companies for many years. Additionally, Moore’s law semiconductors industry plans to focus on relevant parts of
was established as a roadmap at the National Technology the most important European industries such as automotive,
 2

when being soldered. Currently, the BGA is widely used and

not the PGA, because the PGA pins were very fragile.
The packaging industry is structured in levels 0 to 3. Level
zero is concerned with interconnection techniques inside IC
chips. The first level is related to connection techniques outside
the IC chip, which are wire bound, flip-chip and silicon
interposer [9]. The second level is referred to connecting the
packaging with the substrate or with Printed Wired Board. The
third level concerns with connecting board to board. For levels
2 and 3 are used PGA, BGA, QFP technologies among others,
Fig. 2. All strategies for driving technology innovation. Retrieved from Xiu
L, Time Moore: Exploiting Moore’s Law from the Perspective of Time, page which were discussed above [10].
53.

medical, Advanced Logic/Memories, Connectivity, etc. where

it can be seen that they integrate and use several strategies of
this law [6], [7] .
Considering the importance and direction of large semi-
conductor companies, it is relevant to think that, in a country
as Bolivia, these new technologies will be used to optimize the
market sooner or later. For this to happen, it is important to
start by promoting the use of Surface Mount Technologies
(SMT) in the country, which has advantages such as cost,
size and performance. Moreover, they are ideal for new
portability-related areas that are being developed, such as IoT,
autonomous systems, wearables, etc.
In order to use SMT components, specialized machines are Fig. 3. Generalized structure of a Heterogeneous Integration .
required to perform this type of soldering or assembly, con-
sidering that these components are too small. In the Bolivian Since the 2000s, Wafer Level Package (WLP) has been
context, there are no companies dedicated to the assembly of used. To understand this method, one must first understand
these SMT components, because there is not a large market how the chips are made. Generally, chips are made on a
for the implementation of these technologies. silicon wafer, so several of these are printed and then cut and
The types of methods and machines that exist for assem- packaged. In WLP, a whole wafer is used to make an IC, in
bling these types of technologies will be shown and compared other words, several chips are printed and the interconnections
in the following sections, focusing on low production volumes. are made on top of the wafer. Another technique is the Panel
Level Package (PLP), which consists of the same steps, but
instead of being a circle (wafer), the panel is a square or
II. E LECTRONIC PACKAGING T ECHNOLOGIES
rectangle [11].
In Electronics Industry there are Pass Through Hole (PTH) Later on, System in Package (SIP) started to be used,
components, which are components of a relatively large size where the improvement consisted in having the components
compared to their successors. The first ICs were developed in at the same packaging level all over the circuit [12]. In this
the late 1960s and were called Dual Inline Packaging (DIP) sense, passive electronic components of sufficient size to be
and Single Inline Packaging (SIP). Both were very similar to encapsulated were and are still being developed. As a result
each other, with pins all around the integrated, and also had of IC chip technology, new forms of packaging such as 2.5D
certain limitations with their size due to the number of pins and 3D packaging were thought of.
they carried [1]. As a summary, the current Electronic Packaging Technolo-
A few years later, Surface Mount Technology (SMT) com- gies are divided into 3 levels of architecture: chip, package
ponents were developed which, compared to PTH components, and PCB. Over the years, several types of architecture have
were more useful for making compact devices [8]. The first been developed, such as the traditional 2D IC, 2.5D IC (where
type of integrated are the Quad Flat Package (QFP), which, Silicon Interposer Interconnectors are used), and lately 3D IC
in general, are square in shape and have pins on the sides (where the connection is vertical). The current ICs are SIP,
of the integrated on all four sides. Then came the Pin Grid meaning that all active and passive components are on the
Array (PGA) in the late 80’s and the Ball Grid Array (BGA) package. In the future, passive components are planned to
in the early 90’s, which contain a larger number of pins or be placed on-chip, System on Chip (SIC) [13]. Looking at
connections because they are located underneath the chip. In the current technologies that are available for connections, we
this sense, the number of pins increases exponentially accord- can name the BGA, Wire Bonds, Flip Chip, Silicon Interposer
ing to the area of the integrated. The main disadvantage they and TSV (Through Silicon Vias), which are also found in the
have is the lower reliability, since they cannot be inspected interposer [14].
 3

throughout the oven, this is due to the ventilator or turbine.

Finally, Vapor Phase Reflow Soldering, which uses condensed
steam to heat the fluid surrounding the assembly [18].
It is important to highlight BGA technology. This type of
interconnects theoretically do not need solder paste, it all
depends on the experience and the manufacturer’s recommen-
dation. However, for a proper soldering it is necessary, even
if Solder Balls are used. This is due to the fact that the balls,
being firm, cannot adhere in the best way to the surface, for
this reason the solder paste facilitates the soldering.

A. Solder Paste
Solder paste is composed of Powder Particles, usually more
than 80% by weight, and flux, which must be more than 50%
by volume of the paste. Solder particles are usually composed
of materials such as silver, tin and copper in different amounts
depending on the type of solder paste. The flux is a compound
made of solvents, activators and gels, which must have a
certain viscosity or correct thickness for the Stencil Printing
technique or for the solder paste dispenser [19].
Fig. 4. Semiconductor Packaging History [15]. Since the early 2000s, Lead is no longer used in solder,
because it causes health problems, following the restrictions
of RoHS (Restriction Of The Use Of Certain Hazardous
III. S URFACE M OUNT A SSEMBLY Substances) [20]. This regulation gave way to a great challenge
as Lead Free Solder, something too new compared to SnPb
There are 3 known methods for soldering SMT electronic solders [21]. As a result of this restriction, the main problem
components. The first one is Handle Soldering, which basically was that the new solder assemblies were weaker and presented
consists of using hand tools and soldering techniques. The problems in the Reflow stage, in addition to generating voids
second method is Wave Soldering, which although it is used into the BGA solder assemblies [22]. Similarly, Lead Free Sol-
for soldering it is not widely used for SMT soldering, it is der proved to be unreliable due to its low melting temperature,
more used for PTH, because it can damage the IC packages which causes Solder Joints to fail under thermal conditions
that are sensitive to heat. The third one is Reflow Soldering, and vibrations [23]. During those years, Japanese and North
which is widely used in electronics industries and the most American Associations recommended the use of SAC (Sn-Ag-
recommended to offer a soldering standard for Surface Mount Cu) system solder pastes, in addition to some solder pastes that
Devices (SMD) [16]. had the ability to self-align, which was due to a higher silver
Focusing more on the Reflow Soldering process, it has content than other pastes [24]. It is important to know that the
3 simple steps. The first one concerns leaving the solder size of the Powder Particles and the type of Flux are important
paste on top of the PCB tracks. For this step there are two for the rheological properties of the solder paste. The solder
known techniques which are: Stencil Printing, which is faster paste has to be thixotropic, having the property of decreasing
and more popular in the industry, and Dispensing, that is viscosity when being pushed and increasing viscosity when
cleaner and cheaper than the other technique. There is another being at rest [25]. Another important aspect of the flux is
technique that is not so well known, but it compares in speed that, depending on the type, it can better wet the solder paste,
with the Stencil Printing technique, which is Pin Transfer [17]. which prevents bad soldering that forms Solder Joints with
The second step consists of placing the electronic com- grainy and dull appearance [26].
ponents. Automated machines are usually used for this task. Although there are different types of rheological studies that
There are two types of Placement Machines: Pick And Place, describe the behavior of the paste, we cannot choose the paste
which consists of picking up a component and placing it in based on this. So it is important to carry out studies on the
its respective location, and Collect And Place, which involves behavior during the dispensing process in order to make a
picking up a certain number of components and placing them. better choice [28].
The last step is Reflow, which consists of passing the Solder paste is also very important in the paste deposition
entire assembly through a machine that heats and reflows the process. Whether for printing, dispensing or jetting, specific
solder paste. There are 3 types of methods commonly used pastes are needed for each deposition method. It is good to
to perform this step: Infrared Reflow Soldering, which uses remember that viscosity is a property of fluids that opposes
an emitter of electromagnetic waves called infrared and an resistance to deformation, and it decreases when the Shear
oven that has a specific shape to optimally use the absorbed, Rate increases [29]. For Printing, there is no need to worry
reflected and transmitted radiation. Convection Reflows Ovens, about a paste with high viscosity, since the Shear Stress used
characterized by the fact that the temperature is the same by this method is low compared to others. For Dispensing the
 4

Fig. 7. Types of contact Dipensing [34].

(MCA), Moving Magnetic Actuator (MMA); and Piezo-Stack

Actuators and Magnetostrictive Actuators, which are the types
of actuators with higher thrust force but shorter stroke length
Fig. 5. Solder paste [27]. [35]. The Jetting technique is based on the Nozzle-Needle-
System principle, where its operation is that the actuator drives
the Jet Valve which is normally closed (this valve has a needle
Shear Stress is higher because the paste is pushed through a inside). The open state of this valve consists of letting a small
syringe or nozzle. Jetting is the same but uses more pressure amount of paste through because the nozzle retains the fluid.
to generate a spot of paste. On the other hand, as a general rule When the needle closes, it cuts off the paste inlet and ejects
for any method, the smallest diameter through which the paste the paste by forcing the nozzle open. This type of dispenser
flow passes has to be 6 times larger than the largest Powder is called Non-Contact and only needs to move in two axes to
Particles [30]. deposit the paste. In addition, the Droplets it makes have the
same size, so it has a high repeatability.
There are several factors to take into account in the design of
the Nozzle-Needle-System that affect the droplet diameter. The
most important are: the size between the needle and the nozzle
(the smaller the nozzle, the smaller the droplet diameter),
needle stroke, needle shape and nozzle diameter [36]. Jetting
dispensers have become a trend in the industry, so they are
being designed according to significant parameters such as the
Fig. 6. Solder gaps on BGA. Retrieved from Lau, John H.,State of the Art diameter of the dots, working frequency, open time, etc.
of Lead-Free Solder Joint Reliability, page 4.

IV. D ISPENSING AND J ETTING

Making comparisons between the three techniques of paste
deposition, it is known that Printing is the most used in the
industry, because of the great speed it has in terms of mass
production. But for low volume production, we have the other
two techniques, which are more versatile because they do not
need a stencil, also they do not require a lot of cleaning and
they consume the necessary amount of material. On the other
Fig. 8. Jet dispenser models. Retrieved from Tran m et al, Design and
hand, Jetting has a better performance than Dispensing in simulation of electromagnetic linear actuators for jet dispensers, page 2.
terms of the number of dots it can make per hour, due to
the fact that it does not need to move on the three axes. Electromagnetic linear actuators (SA, MCA, MMA) are
About the design of the Dispensing technique, we can infer commonly used. Focusing on the thrust force of these, SA has
that it is a simple mechanism where the objective is to push the a large thrust force which decreases drastically as the stroke
solder paste through the syringe, it has a reduction mechanism length increases. On MCA and MMA, the thrust force is lower,
in order to control in a better way the range of action of the but it decreases slowly as the stroke length increases [37]. On
plunger [31], [32]. While the dispenser mechanism is simple, the other hand, MCA and MMA actuators are bi-directional
this type of dispenser is called a contact dispenser, which and may or may not use spring return, however SA requires
means that the dispenser has to move closer to dispense the spring return.
paste, so it moves on all three axes and this takes much longer Currently Piezo-Stack Actuators are very important for
[33]. the Jetting technique because it can have higher operating
The Jetting technique has three types of actuators: electro- frequency than other actuators [38]. The operating frequency
pneumatic linear actuators; electromagnetic linear actuators, mainly depends on the parameters Needle Stroke and Open
such as Solenoid Actuator (SA), Moving Coil Actuator Time [39].
 5

Another important parameter is the size of the Powder VI. D EFECTS ON ELECTRONIC ASSEMBLY
Particles, because they are very influential with respect to A. Soldering defects
continuous dispensing [40]. Generally, electromagnetic and
It is very important that a solder joint is perfect, because
electro-pneumatic actuators do not exceed 100 Hz. On the
nowadays there are many dangerous devices that if they have
other hand, the Weber number must also be taken into account,
failures in the circuits at the wrong time, they could cause
this indicates the surface force exerted by a gas on the
serious accidents. As seen above, the main defects in lead free
surface of a fluid, since the surface tension on the droplet
solder are under critical temperature and vibration conditions.
is what maintains the droplet shape [41]. If the Weber number
The possible soldering defects that can occur at temperature
is too large, the droplet disintegrates into several droplets
are as follows [50].
as sputtering [42]. Another parameters also have a role in
• Dewetting can be identified when the joint solder is dull
this phenomenon such as Reynolds number, paste viscosity,
geometrical shape of the Nozzle [43]. in color and sometimes grainy.
• Demarcation occurs when the solder forms on the PCB
Other important aspects for the performance of the dis-
tracks and very little solder coats the component pins.
pensers are related to temperature and pressure. It is important
• Solder Bridging is identified when two IC pins are joined
that the solder paste be stored at a temperature below 20
together.
°C and there is no strong temperature change at the time of
• Excess Solder - It is mostly an imperfection.
dispensing, that is, that the temperature of the paste and the
• Overheat joint: Identified by white solder joints, due to
environment should be similar. It is also important to use low
burnt flux.
pressures below 40 PSI, because they affect the consistency
• Solder Starved: Refers to the absence of solder, although
and repeatability of the dispenser [44].
it makes good electrical contact.
• Flux residue: It is due to several factors, but can be
corrosive to the circuit.
V. C OMPUTER N UMERICAL C ONTROL • Peel off. Part of the solder covers the component.
• Solder balls appear due to moisture in the paste.
The control system required by the Dispensing technique is • Soler bump. They are generated by excess of paste.
the same as a 3D printer. This is because the nozzle moves • Offset in soldering. It is due to misalignment before or
along the three axes and a stepper motor is needed to drive after reflow.
the mechanism of the syringe that contains the paste. For this • Colder joint: It is identified by having a porous joint,
reason it is possible to use open source firmwares such as which is not very resistant.
Marlin, which is very used to control 3D printers. For this
type of CNC, an ATMEL 2560 microprocessor (which is the
VII. C ONCLUSION
Arduino Mega chip) is used due to the number of ports that it
has, since it is needed to control at least 4 actuators and their To design a low cost dispenser for low volume production
limit stops [45]. there are several design parameters as well as advantages
On the other hand, the control of the Jetting technique is and disadvantages. The design of these machines has to
different, as it aims to switch between an open and closed focus on useful aspects such as repeatability, dispensing speed
state of the jet valve. For this type of machines [46], the most and fine pitch in the solder paste deposition. Depending
common way is to use GRLB firmware which is free of charge. on the dispensing technique (Dispensing or Jetting) different
In addition, there are several cheap solutions such as CNC design parameters are involved. For Dispensing, the dispensing
shields from 3D printers or even Arduino as a controller of mechanism is a worm drive that pushes the paste through
the dispenser actuators. You can also use a GRLB shield for the syringe, where the solder paste can be denser, but the
Arduino, which has integrated drivers for stepper motors [47] repeatability and speed are low because it needs three axes
[48]. A heater may also be required at the nozzle tip, to provide to move. Jetting, on the other hand, uses a nozzle-needle
consistency and repeatability, as explained above in Jetting mechanism which dispenses in the form of droplets. In this
dispensing [49]. technique, the solder paste has to be thickness, in addition
it can be driven by different types of actuators and only
needs two axes to dispense. Comparing the two dispensing
techniques for low production volumes, it is concluded that,
although Dispensing is a simple and versatile solution for
this process, which is less expensive in certain aspects, the
dispensing speed and repeatability are low. Jetting, on the other
hand, is faster and has high repeatability, these factors are very
relevant in terms of quality and time saving for the assembly
process. However, the cost increases due to the fact that it
is a larger and more complex system. Finally, although the
Fig. 9. System Control CNC. Retrieved from Waleed M, Design and dispensing technique affects the repeatability of the dispenser
Development of Abrasive Water Jet Cutting Machine, page 3. to some measure, this characteristic is still affected by the
temperature and pressure exerted on the paste.
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[14] P. A. Thadesar, X. Gu, R. Alapati, and M. S. Bakir, “Through-silicon

vias: Drivers, performance, and innovations,” IEEE Transactions on
Components, Packaging and Manufacturing Technology, vol. 6, pp.
1007–1017, 7 2016.
[15] C. H. Liu, J. L. Tsai, H. H. Chang, C. L. Lu, and S. C. Chen, “In-
tegrated process characterization and fabrication challenges for 2.5d ic
packaging utilizing silicon interposer with backside via reveal process,”
Proceedings - Electronic Components and Technology Conference, pp.
1628–1634, 9 2014.
[16] B. Willis, “Reflow soldering processes and troubleshooting smt,
bga, csp and flip chip technologies,” Soldering Surface
Mount Technology, vol. 15, 1 2003. [Online]. Available:
https://doi.org/10.1108/ssmt.2003.21915aae.003
[17] L. H. Tung, M. A. M. Mukhtar, A. Abas, A. Azman, F. C. Ng, M. N.
Nashrudin, and Z. Samsudin, “Dynamic fsi simulation of pin transfer
process for solder paste transport,” AIP Conference Proceedings, vol.
2129, 7 2019.
[18] B. Illes, O. Krammer, and A. Geczy, “Reflow soldering : apparatus and
heat transfer processes,” 2020.
[19] N. Ismail, A. Jalar, M. A. Bakar, R. Ismail, and N. S. Ibrahim, “Effect
of flux functional group for solder paste formulation towards soldering
quality of sac305/cnt/cu,” Soldering and Surface Mount Technology,
vol. 32, pp. 157–164, 4 2020.
[20] J. H. Lau, “State of the art of lead-free solder joint reliability,” Journal
of Electronic Packaging, Transactions of the ASME, vol. 143, 6 2021.
[21] D. Suraski and K. Seelig, “The current status of lead-free solder alloys,”
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFAC-
TURING, vol. 24, 2001.
[22] W. Lin, “The void-free reflow soldering of bga with vacuum,” 2007.
[23] N. Jiang, L. Zhang, Z. Q. Liu, L. Sun, W. M. Long, P. He, M. Y. Xiong,
and M. Zhao, “Reliability issues of lead-free solder joints in electronic
devices,” Science and Technology of Advanced Materials, vol. 20, pp.
876–901, 12 2019.
[24] A. M. Najib, M. Z. Abdullah, A. A. Saad, Z. Samsudin, and F. C. Ani,
Fig. 10. Soldering Defects. Retrieved from Kuttiyil O. et al, Electronics
“Experimental study of self-alignment during reflow soldering process,”
Production Defects and Analysis, pages 13-37.
Journal of Advanced Manufacturing Technology, 2017.
[25] N. Phan-Thien and N. Mai-Duy, “Understanding viscoelasticity: An
introduction to rheology,” 1 2017.
R EFERENCES [26] A. Hanss, M. Hutter, J. Trodler, and G. Elger, “Solder process for
fluxless solder paste applications,” Proceedings - Electronic Components
[1] A. Lopez, “Packaging part 1 - traditional packaging,” YouTube, Jul and Technology Conference, vol. 2016-August, pp. 447–454, 8 2016.
2020. [Online]. Available: https://youtu.be/jE8pu3F-mm8 [27] “Aim ws488 – sac305,” BLT Circuit Services. [Online]. Available:
[2] C. LÉCUYER, “Driving semiconductor innovation: Moore’s law at https://bltcircuitservices.co.uk/product/aim-ws488
fairchild and intel,” Enterprise Society, vol. 23, pp. 133–163, 2022. [28] S. Mallik, M. Schmidt, R. Bauer, and N. N. Ekere, “Influence of solder
[Online]. Available: https://www.cambridge.org/core/article/driving- paste components on rheological behaviour,” 2008 2nd Electronics
semiconductor-innovation-moores-law-at-fairchild-and- System-Integration Technology Conference, pp. 1135–1140, 2008.
intel/58A6DBCC19D454A2BB20E1333A9D12C6 [29] A. Pietrikova and M. Kravcik, “Investigation of rheology behavior of
[3] W. Arden, M. Brillouët, P. Cogez, M. Graef, B. Huizing, and solder paste,” 2012 35th International Spring Seminar on Electronics
R. Mahnkopf, “More-than-moore white paper,” 2010. Technology, pp. 138–143, 2012.
[4] P. Nayak, “Asic technology roadmap: A literature review,” 2019. [30] K. F. Becker, M. Koch, S. Voges, T. Thomas, M. Fliess, J. Bauer,
[5] L. Xiu, “Time moore: Exploiting moore’s law from the perspective of T. Brairn, R. Aschenbrenner, M. Schneider-Ramelow, and K. D. Lang,
time,” IEEE Solid-State Circuits Magazine, vol. 11, pp. 39–55, 12 2019. “Precision jetting of solder paste - a versatile tool for small volume
[6] J. Ahopelto, G. Ardila, L. Baldi, F. Balestra, D. Belot, G. Fagas, S. D. production,” Proceedings - 2014 47th International Symposium on
Gendt, D. Demarchi, M. Fernandez-Bolaños, D. Holden, A. M. Ionescu, Microelectronics, IMAPS 2014, pp. 438–443, 2014.
G. Meneghesso, A. Mocuta, M. Pfeffer, R. M. Popp, E. Sangiorgi, [31] L. R. Ramı́rez, “Máquina cnc para la elaboración de placas electrónicas;
and C. M. S. Torres, “Nanoelectronics roadmap for europe: From proceso de soldadura y colocación de componentes electrónicos,” 2019.
nanodevices and innovative materials to system integration,” Solid-State [32] J. Li and G. Deng, “Technology development and basic theory study of
Electronics, vol. 155, pp. 7–19, 5 2019. fluid dispensing-a review,” 2004.
[7] P. Wesling, “Heterogeneous integration roadmap, version 1.0,” 2019. [33] A. Lewis, “Formulation considerations for automated dispensing of lead
[Online]. Available: www.asme.org free solder paste,” 2004.
[8] G. R. Blackwell, “The electronic packaging handbook,” 2000. [34] J. Kai, “Modeling of positive-displacement dispensing process,” 2008.
[9] D. Lu and C. P. Wong, “Materials for advanced packaging, second [35] C. Zhou, J. H. Li, J. A. Duan, and G. L. Deng, “The principle and
edition,” Materials for Advanced Packaging, Second Edition, pp. 1–969, physical models of novel jetting dispenser with giant magnetostrictive
1 2016. and a magnifier,” Scientific Reports, vol. 5, 12 2015.
[10] P. Zhu, D. L. Daniel, Z. Zhang, and C. Wong, “Electronic packaging [36] S. Gu, X. Jiao, J. Liu, Z. Yang, H. Jiang, and Q. Lv, “Design and
technology,” 2019. experiment of a solder paste jetting system driven by a piezoelectric
[11] T. Braun, K. F. Becker, O. Hoelck, S. Voges, R. Kahle, M. Dreissigacker, stack,” Micromachines, vol. 7, 6 2016.
and M. Schneider-Ramelow, “Fan-outwafer and panel level packaging [37] M. S. Tran and S. J. Hwang, “Design and simulation of electromagnetic
as packaging platform for heterogeneous integration,” Micromachines, linear actuators for jet dispensers,” Applied Sciences (Switzerland),
vol. 10, 5 2019. vol. 10, 3 2020.
[12] W. W. M. Dai, “Historical perspective of system in package (sip),” IEEE [38] S. Lu, Y. Liu, Y. Yao, L. Sun, and M. Zhong, “Bond-graph model of a
Circuits and Systems Magazine, vol. 16, pp. 50–61, 4 2016. piezostack driven jetting dispenser,” Simulation Modelling Practice and
[13] H. Lee, V. Smet, and R. Tummala, “A review of sic power module Theory, vol. 49, pp. 193–202, 2014.
packaging technologies: Challenges, advances, and emerging issues,” [39] J. W. Sohn and S. B. Choi, “Identification of operating parameters most
IEEE Journal of Emerging and Selected Topics in Power Electronics, strongly influencing the jetting performance in a piezoelectric actuator-
vol. 8, pp. 239–255, 3 2020. driven dispenser,” Applied Sciences (Switzerland), vol. 8, 2 2018.
 7

[40] S. Li, Y. Wang, J. Zhou, and F. Xue, “Investigation of jet printing per-
formance of lead-free solder paste,” 2016 17th International Conference
on Electronic Packaging Technology (ICEPT), pp. 709–712, 2016.
[41] F. M. F. M. White, “Fluid mechanics,” 2011, includes bibliographical
references and index.
[42] S. Lu, J. Zhang, Y. Liu, H. Zheng, C. Ren, and W. Liu, “Droplet
formation study of a liquid micro-dispenser driven by a piezoelectric
actuator,” Smart Materials and Structures, vol. 28, 3 2019.
[43] J. Vinnars and J. Vinnars, “Correlations between rheological properties
and jetting results in solder paste jetting,” 2017. [Online]. Available:
http://www.teknat.uu.se/student
[44] J. S. Hwang, “Solder paste in electronics packaging,” Solder Paste in
Electronics Packaging, 1989.
[45] R. Kayfi, D. Ragab, and T. A. Tutunji, “Mechatronic system design
project: A 3d printer case study,” 2015 IEEE Jordan Conference on
Applied Electrical Engineering and Computing Technologies (AEECT),
pp. 1–6, 2015.
[46] M. Waleed, “Design and development of abrasive water jet cutting
machine,” 7 2021.
[47] S. K. Dhinesh, K. L. S. Kumar, K. S. Prasad, M. Raghunath, S. Mad-
heshwaran, A. P. Gokulraj, and D. A. İn, “Design and fabrication of
arduino con-trolled cnc foam cutting machine,” International Journal of
Aquatic Science, vol. 12, 2021.
[48] S. S. Sarguroh and N. Mumbai, “Using grbl-arduino-based controller
to run a two-axis computerized numerical control machine arun bhiva
rane,” 2018 International Conference on Smart City and Emerging
Technology (ICSCET), 2018.
[49] G. Deng and Z. Feng, “Fuzzy pid based temperature controller for jetting
dispenser,” IOP Conference Series: Materials Science and Engineering,
vol. 677, 12 2019.
[50] O. T. Kuttiyil, T. Padma, and P. Gopalan, “Electronics
production defects and analysis,” 2021. [Online]. Available:
https://link.springer.com/bookseries/16799