HuZijie FinalThesis
HuZijie FinalThesis
HU ZIJIE
A THESIS SUBMITTED
FOR THE DEGREE OF DOCTOR OF PHILOSOPHY
DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING
NATIONAL UNIVERSITY OF SINGAPORE
2013
Dedicated to My Beloved Parents
DECLARATION
I hereby declare that this thesis is my original work and it has been written by me in its
entirety. I have duly acknowledged all the sources of information which have been used in
the thesis.
This thesis has also not been submitted for any degree in any university previously.
_____________________________
Hu Zijie
4 November 2013
Acknowledgements
assistant professor Dr. Koenraad Mouthaan, who has led me into the interesting world of
microwave circuit design, and given me full support for my research and study. He has
continually provided me with patient guidance, invaluable advice and the opportunity to
improve my academic and engineering skills. His scientific attitude influences me a lot,
systematically and thoroughly look into problems. I believe what I have learnt from him
will always lead me ahead. I also want to thank my co-supervisor, associate Professor
Chen Xudong, for his encouragement on my research and discussion of the related topics.
I would also like to express my appreciation to other faculty staff in the NUS
Microwave & RF group: Prof Leong Mook Seng, Prof Yeo Swee Ping, Prof Yeo Tat Dr.
Hui Hon Tat, for their generous support and encouragement throughout the course of my
Ph.D. studies.
Thanks also to several students from the lab for their generous assistance with my
research-related problems and for being good partners in various physical exercises. First,
and foremost I would like to thank Tang Xinyi, Azadeh Taslimi, Chen Ying, and Lu
Xiaoming for their never-ending willingness to give time for assistance and discussions
regarding the designs and measurements over the four years we spent together in the lab.
I'd like to thank my other friends in the lab, namely Nan Lan, Dalpatadu K Radike
i
Samantha, Hu Feng, Ji Yuancheng, Ray Fang Hongzhao, Winson Lim, Zhong Zheng, for
their encouragement and assistance over these years. I will always remember my friends
for all the fun we had and will definitely miss the hot-pots and Japanese food buffet get-
I am truly grateful to Madam Lee Siew Choo, Madam Guo Lin, and Mr. Sing Cheng
Hiong, for their help in the fabrication and the measurement of microwave circuits during
Last but not least, I thank my parents, who always unconditionally support me and
love me. They are the source of my strength and I will forever be grateful.
ii
Table of Contents
Abstract vii
List of Figures ix
List of Abbreviations xv
Chapter 1 Introduction 1
1.1 Motivation 1
iii
Chapter 3 Design and Stability Analysis of a Low Voltage Subharmonic Cascode
FET Mixer 39
3.1 Introduction 39
3.4.4 Summary 70
Chapter 4 1-10 GHz RF and Wideband IF CMOS Gilbert Mixer with Cross-
Coupled Feedback 72
4.1 Introduction 72
iv
4.2.3 Wideband Active Baluns for the LO Port and IF Port 84
Chapter 5 CMOS Wideband Vector-Sum Phase Shifter with Over 400° Phase
Control Range 98
5.1 Introduction 98
5.4 A 2-16 GHz Vector-Sum Phase Shifter with Over 400 Phase Range 129
v
6.1 Summary 155
References 161
vi
Abstract
Exciting new opportunities are envisioned for wireless communication circuits that
are capable of operating at higher frequencies with wider bandwidth. However, the higher
and millimeter-wave integrated circuits (ICs) that are not present or not significant at
lower frequencies or narrower bandwidths. This thesis aims to propose and realize
reducing the local oscillator frequency, which eases the need for high frequency local
oscillator (LO). Moreover, the large-signal stability is another key issue for any RF active
mixer design as the mixer is a strongly nonlinear device, which has rarely been
investigated previously. Therefore, this thesis first explores and investigates the design
proposed to realize a low voltage subharmonic cascode FET mixer with relaxed LO
proposed subharmonic mixer, which successfully predicts and eliminates the potential
vii
To address design issues of mixers with both wide-RF and wide-IF bandwidths, a
new Gilbert-cell mixer is proposed, together with on-chip active LO and IF baluns.
conversion gain, as well as the input- and output-matching. The monolithic microwave
5.5±2.5 dB, while a conversion gain variation less than 2 dB is measured throughout the
The RF phase shifter, used for beam-steering in phased array systems, is preferable
to provide 360° phase shifting and maintain a constant amplitude within a certain
bandwidth. In previous works of the 360°vector-sum phase shifter, the fully differential
topology is typically adopted, which requires an input balun, switches and a digital-to-
analog converter (DAC). In this thesis, a novel and simple scheme is proposed based on
the phase-reversible variable gain amplifier (VGA), in order to realize the single-ended
continuously adjustable phase control range of more than 400ºwith only one DC control
voltage. The CMOS prototype exhibits a measured 3-dB bandwidth of 2-16 GHz, and the
average insertion loss amounts from -5 to -2 dB, associated with all measured states. To
the best of the authors' knowledge, it is the first full-360ºphase shifter demonstrated in
viii
LIST OF FIGURES
3.5 The conventional and proposed biasing indicated on the I/V curve.
ix
3.7 Proposed SHM circuit and auxiliary generator to detect oscillations (matching
3.8 Input admittance Y(f) at node C with PLO = -6 dBm. The oscillation frequency is
3.10 Circuit diagram for determining the large-signal gm. (a) gm1. (b) gm2.
3.19 The proposed SHM with the damping resistor Rdamp (matching and biasing
4.5 Parasitic capacitance compensated by the interstage inductor at the dominant pole.
x
4.6 Conversion gain frequency response with different inductor models.
4.8 (a) Simulated phase and gain imbalance of the adopted active balun. (b)
4.10 Microphotograph of the mixer chip (core size: 0.7 × 0.4 mm2).
dBm.
4.15 Measured IP1-dB of the proposed mixer for a fixed IF frequency of 200 MHz.
4.16 Measured IIP3 of the proposed mixer for a fixed IF frequency of 200 MHz.
5.2 Schematic diagram of the proposed VGA (DC biasing and decoupling capacitors
5.3 (a) Traditional Cherry-Hooper amplifier. (b) Proposed buffer stage based on the
xi
5.7 Measured |S11| and |S22|.
5.9 (a) Block diagram of a full 360º vector-sum phase shifter using the phase-
5.14 Simulated small-signal voltage gain versus the DC control voltage VCTL.
5.16 Schematic diagram of: (a) conventional inductive peaking circuit. (b) peaking
5.25 Block diagram of the proposed 360ºvector-sum phase shifter using the phase-
reversible VGA.
xii
5.26 Locus of the output vector with the presence of small common-mode component.
5.27 The current-reuse resistive shunt feedback stage for I/Q path.
5.36 Simulated CMRR versus frequency of the stages after the VGA.
5.38 Microphotographs of: (a) the proposed vector-sum phase shifter. (b) DC control
generator.
xiii
LIST OF TABLES
xiv
LIST OF ABBREVIATIONS
f Frequency in Hz
ω Frequency in rad/s
gm Transconductance
µn Electron Mobility
AC Alternating Current
CG Common-Gate
DC Direct Current
xv
EM Electromagnetic
GSG Ground-Signal-Ground
IF Intermediate Frequency
LO Local Oscillator
MIM Metal-Insulator-Metal
NF Noise Figure
xvi
P1-dB 1-dB Compression Point
PA Power Amplifier
Q Quality factor
RF Radio Frequency
RMS Root-Mean-Square
SoC System-on-Chip
UWB Ultra-Wideband
xvii
Chapter 1
Introduction
1.1 Motivation
The trend towards faster and more robust wireless communications as well as
extended functionality has provided a direct impetus for the development of RF front-end
circuits and systems. At the same time, the demand for increasing data rates through
signals occupying larger bandwidths at higher frequencies. Thus, the primary motivation
systems, the desire to reduce costs is universal as well. Over the past 20 years there has
been a tremendous interest in the use of CMOS technology for RF and microwave
circuits (often referred to as RF CMOS). There are significant benefits that can be
derived from the use of CMOS for RF circuits. Since the predominant technology used
for digital circuitry is CMOS there is a natural desire to use CMOS technology for RF
circuits as well. By combining the RF circuitry with the digital processing circuitry on the
1
same substrate, significant cost savings can potentially be realized. Moreover, it is also
desirable to use CMOS for RF and microwave applications because generally it is much
less expensive than other technologies, such as GaAs, GaN and InGaP processes [1]-[3].
However, there are significant challenges when using CMOS for RF circuit
implementations. Prior to the 1990s there was very little work in the area of RF CMOS
because the transistors could not meet the performance requirement at high frequencies.
Through continuous refinement and downscaling of the technology, CMOS now has the
common figures of merit for the high frequency performance of transistors are ωT and
ωmax, which are the frequencies at which the current and power gain, respectively, equal
gm
ωT = (1.1)
Cgs +Cgd
1 ωT
ωmax = (1.2)
2 R g Cgd
where gm is the transconductance of the transistor, Rg is the series gate resistance, and Cgs
and Cgd denote the parasitic gate-source and gate-drain capacitances, respectively. When
the transistor is scaled, the parasitic capacitances decrease, which leads to an increase in
ωT and ωmax, and improved high frequency performance. A cutoff frequency of over 400
It can be expected that with this extremely high cutoff frequency, the application of
2
CMOS technology in the microwave and millimeter-wave range will continue to grow for
some time into the future. For all of the MMICs demonstrated in this thesis, standard
Besides providing wide bandwidth and facilitating high frequency operation, modern
wireless networks also tend to cover vast areas to serve the demands of today’s
in urban areas, and fixed bandwidth regulations, constrain this development, new
concepts have been developed to exploit the potential as much as possible. One of these
concepts is multiple-input multiple output systems (MIMO), where multiple antennas are
employed to transmit and receive independent data streams, raising the spectral efficiency
in the presence of multipath effects [6]. Another approach uses phased arrays (also
known as adaptive antennas) to raise the signal-to-noise ratio of a given channel with
multipath or interferers by means of beam steering and spatial diversity, which also
enables the system to use more sophisticated data modulation schemes to increase the
In the last decades, phased array antennas were only feasible for defense applications
as they require a large amount of expensive RF components [9]. In recent years the
semiconductor technology, which has become the technology of choice for many RF
applications. This enables phased arrays for commercial applications including radar,
sensors and communications [10]-[12]. Fig. 1.1 shows the architecture of a phased array
3
receiver, in which phase shifters are employed as electronic beam-steering elements [13].
Different active antenna paths are combined after being adjusted in amplitude and phase.
Single-pole double-throw (SPDT) switches can be used to switch between the antenna
amplifiers are used to set the required signal amplitude [14]. For this application, the
MMICs [15].
Antenna
Vector 1
Adaptive
SPDT
Variable-Gain Phase Combiner
LNA Shifter
Calibration
Antenna Vector 2 LO
Variable-Gain Phase
SPDT
Shifter ADC
LNA
Calibration Baseband
RF control unit
Antenna Vector 3
Variable-Gain Phase
SPDT
LNA Shifter
Calibration
Moreover, advanced phased array systems with a limited number of elements and
very low side lobes require phase shifters of high resolutions [16]. The high phase
resolution is very difficult to achieve with digital phase shifters, such as all pass networks
[17], [18], true-time-delay circuits [19], LC-based circuits [20]-[23], and others [24]-[25],
due to accumulating phase errors. The vector-sum phase shifter, which applies a variable
4
and adjustable phase shift to an arbitrary RF signal over a finite bandwidth, is able to
provide a phase shift of full 360°with high resolution at microwave frequencies since
they have excellent amplitude and phase balance over a wide band [26]. The block
sin(ωt) CI•sin(ωt)
VGA
I vector
+
Vin Quadrature Vout
Splitter
cos(ωt)
VGA
Q vector CQ•cos(ωt)
The typical architecture of a vector-sum phase shifter consists of two variable gain
amplifiers (VGAs), quadrature networks and summing circuits, all of which can be
integrated compactly in almost any IC technology. Hence, the vector-sum phase shifter is
feasible under the given constraints of CMOS IC design. By properly weighting and
combining signal paths with predefined phase offsets (usually 90°), vector-sum phase
shifters can cover a phase shift of full 360°and can provide a flat gain. The output of the
5
where CI = cos(θ) is the controllable in-phase gain and CQ = sin(θ) is the quadrature gain.
Assuming the polarity of controllable gain CI and CQ can be reversed, the phase of the
output vector Vout can therefore be continuously tuned for a full 360°. In particular, VGAs
used to weight the amplitude of those paths, are desired to provide a linear gain control
curve to avoid complicated lookup tables. Additionally, the transmission phase deviation
across the assumed gain range is preferably zero, especially for VGAs used in the vector-
The performance, size and cost of vector sum phase shifters enable improved
systems solutions. However, design challenges, such as bandwidth and phase control
range are also introduced with the vector-sum phase shifters. Therefore, new circuits
targeted for wideband operation need to be investigated to address these issues, which is
The principle of this thesis is to propose and realize innovative circuit topologies and
More specifically, the circuit blocks and their corresponding design challenges covered in
A special type of mixer, the subharmonic mixer (SHM), typically requiring half of
the LO frequency of the conventional mixer, has unique advantages in terms of easing the
design difficulty of high frequency local oscillators and reducing the LO leakage to other
6
ports, and therefore can address some of the issues discussed above regarding high-
determines the spectral coverage of the RF band with a proper adjustment of the LO
frequency for the fixed IF, while the IF bandwidth is also an important parameter as it
the study of wideband techniques, which could enhance both RF and IF bandwidths, is
As discussed in Section 1.1, VGAs are critical components in the vector-sum phase
shifter, whose bandwidth constrains the bandwidth of the whole circuit. Furthermore, for
many applications, such as the automatic gain control in Wireless Local Area Network
(WLAN) receivers with single signal path, the variation of the transmission phase in
VGAs is not a critical issue. However, for VGAs used in the vector-sum phase shifter, the
phase variation over the controlled gain must be kept low in order to achieve high phase
control accuracy with the whole circuit. Therefore, new VGA circuits accounting for
overcome the design challenges of wideband vector-sum phase shifters exhibiting low
phase error. In this thesis, the design of wideband low phase error vector-sum phase
7
The main objectives of this thesis are as follows:
1. To propose a new biasing scheme to realize a subharmonic cascode FET mixer with
3. To propose a new wideband mixer based on the modified Gilbert-cell with an active
4. To investigate and propose wideband VGAs with low phase variations, for
5. To propose a wideband full-360° vector-sum phase shifter with only one control
voltage.
The proposed subharmonic mixer is demonstrated with discrete transistors and SMD
components, while the others are all demonstrated in a standard 0.13-µm CMOS
technology. The proposed circuit techniques and design solutions of the research work
presented in this thesis are all verified by experimental results. All circuit measurements
were performed at the MMIC lab of National University of Singapore (NUS). For the on-
wafer measurements, the losses and stray parasitics of the RF probes and cables were de-
FET mixer is presented. The proposed biasing requires a low supply voltage and
effectively enhances the generation of the second harmonic of the LO signal. The
8
implemented mixer exhibits competitive performance at a lower supply voltage compared
and an LO frequency of 400 MHz, with a supply of only 1 V. Note that the concept of
subharmonic mixers is more competitive and suitable for microwave and millimeter-
wave applications. However, due to funding limitations, the proposed subharmonic mixer
is not demonstrated in MMIC at millimeter-wave frequency range in our study and hence
In Chapter 4, a wideband CMOS 1-10 GHz mixer is proposed with the modified
port impedance matching are simultaneously achieved. The proposed wideband mixer
also incorporates active baluns at LO and IF ports to facilitate measurements with single-
ended equipment and to improve the port impedance matching. The proposed mixer is
employs an optimized LO power of 0 dBm and draws 7 mA from a 1.2 V supply. The RF
bandwidth from 1 to 10 GHz is observed with a conversion gain of 5.5±2.5 dB, while the
measured mixer also shows a gain variation of 2 dB in the IF bandwidth from 100 MHz
to 1 GHz. It is noteworthy that the achieved reflection coefficients for both RF and IF
ports are better than 10 dB within the frequency range of interest, and for the LO port is
9
better than 7 dB. The measured IP1-dB, IIP3 and SSB noise figure are better than -16 dB, -
In Chapter 5, wideband techniques and issues for gain control linearity as well as
transmission phase error for VGAs are investigated. Two wideband CMOS VGAs for
vector-sum phase shifter applications are presented. The first VGA exhibits a continuous,
multiplier. In the second VGA design, both a linear-in-magnitude gain control curve and
output phase reversal are achieved for applications in the full-360° vector-sum phase
shifters. Lastly, a 2-16 GHz CMOS vector-sum phase shifter is presented with over 400°
Chapter 6 summarizes the main contributions of this thesis and proposes directions
Journal Papers
Hu Zijie and Koen Mouthaan, “Design and Stability Analysis of a Low Voltage
II: Express Briefs, vol. 59, no. 3, pp. 153–157, March 2012.
10
Hu Zijie and Koen Mouthaan, “1-10 GHz RF and Wideband IF Cross-Coupled
Hu Zijie and Koen Mouthaan, “2-16 GHz Vector-Sum Phase Shifter With 435º
Conference Papers
December 2011.
Hu Zijie and Koen Mouthaan, “A 2-6.5 GHz CMOS Variable Gain Amplifier for
Hu Zijie and Koen Mouthaan, “Wideband VGA in 0.13-µm CMOS with Phase
Reversal for 360º Vector-Sum Phase Shifters,” accepted for IEEE European
11
Chapter 2
Literature Review
superheterodyne and direct-conversion, to provide context for the work in this thesis.
For over 75 years the dominant receiver architecture has been the superheterodyne
architecture. Patented in the United States by Edwin Armstrong in 1920 [27], the
converting the received radio frequency signal to a lower intermediate frequency where
signal received by the antenna is filtered using a bandpass filter (BPF) and then amplified
by a low-noise amplifier (LNA). A local oscillator (LO) signal is generated and its
12
down-converted to a lower frequency (IF) for further processing using a mixer. After the
signal has been down-converted to IF, it is filtered and amplified. The IF filter is often
realized by an external filter (often a SAW filter), and therefore it is not possible to
design an entire system on one single chip. An I/Q demodulator is then used to convert
the signal to baseband. The demodulator uses another LO and two more mixers to
convert the signal to baseband where it goes through a low-pass filter (LPF) and is then
converted to the digital-domain via the analog-to-digital converters (ADC) where it can
be processed further. Note that subharmonic mixers could also be used in the
ADC
Fundamental or
RF BPF LNA Subharmonic Mixer IF Filter IF Amp I
LO2 To
baseband
Q
LPF
Frequency
Multiplier ADC
LO1
decade has sparked a renewed interest in the direct-conversion receiver architecture, for it
permits increased integration, lower cost, and lower power dissipation [28]. The receiver,
also referred to as zero-IF or homodyne, is shown in Fig. 2.2. This receiver architecture
13
clearly requires fewer components than the superheterodyne receiver. After the signal is
received by the antenna, it is filtered in the bandpass filter and amplified by the LNA.
The RF signal is then converted directly to baseband by mixers and an LO that has a
frequency equal to the RF carrier. Finally, the down-converted signal is low-pass filtered
and amplified before being converted to the digital domain. As a result, there is no image
frequency to reject. Most importantly, external IF filters can be eliminated, since channel
Subharmonic
Antenna LPF
Mixer
ADC
RF BPF LNA I
LO To
baseband
Q
ADC
Subharmonic LPF
Mixer
However, there are still challenges that must be overcome in order to use this
[29]. Since the RF carrier is directly converted to DC, any DC offsets that are created by
the mixer itself can interfere with the desired signal, however, many efficient modulation
14
formats have significant spectral content at or near DC (e.g. GMSK, QPSK, etc.).
Moreover, given that the LO is generally a strong signal, it can easily couple to various
circuits on the chip, which can result in a DC offset from the LO signal mixing with itself.
There are several possible paths for LO self-mixing, as shown in Fig. 2.3 [30]. Path 1
represents the LO signal that is coupled to the RF port of the mixer, which will then mix
with itself and produce a DC offset. Path 2 represents LO coupling to the input of the
LNA, which can be particularly problematic since it will then be amplified along with the
RF signal before entering the RF port. Path 3 in Fig. 2.3 represents the LO signal
coupling to the antenna where it is radiated, and reflections of this signal by nearby
objects are received by the antenna, as shown in Path 4. Path 4 can also represent a strong
nearby interfering signal that is received by the antenna and could couple to the LO port
and self-mix, also producing a DC offset. Whereas Paths 1 and 2 would generate static
DC offsets, the results of paths 3 and 4 would be dynamic due to the changing operating
to the relatively low substrate resistivity allowing energy to couple to other sub-circuits
on the chip.
such as the use of frequency doublers at the output of the LO [31] and the use of
receivers since they can reduce LO self-mixing by using an LO frequency that is much
lower than the RF. Furthermore, since the frequency of the LO is reduced there can be
15
Antenna
LNA Mixer
4
Output
1
2
3
LO
The proposed subharmonic mixer in this thesis can be implemented not only in the
mentioned above. First, any or all of the three mixers shown in Fig. 2.1 could be
subharmonic mixers. Since subharmonic mixers internally multiply the frequency of the
LO, a lower LO frequency could be used, which has several potential benefits such as
ease of design and improved oscillator phase noise. A reduction in oscillator phase noise
can ultimately result in a lower receiver noise figure and improved receiver sensitivity.
realize an LO at the frequency of interest with sufficient output power, and there may be
DC power consumption of the local oscillator might also be possible since it operates at a
much lower frequency when using a subharmonic mixer, which would ultimately result
in a longer battery life for portable electronics. Of course, the savings in LO power
16
2.2 Mixer Circuit Review
transmission and from an RF carrier back down to IF for detection. Mixers can be
categorized into two families: active and passive mixers [32]. Active mixers usually have
power gain whereas passive mixers have insertion loss. Each mixer essentially modulates
mixing action through a time-varying mechanism. The devices are usually modulated
with a large LO signal to maximize the conversion gain. It is noted that at millimeter-
wave frequencies it is difficult to generate large LO power. Even though the device
nonlinearity will produce mixing products even with a weak LO, the conversion gain is
too small when mixers are operated in such a fashion. Hence, the conversion gain and
noise figure requirements must be obtained at a reasonable LO power level (eg.∼0 dBm).
Also the design goal of low-noise, together with mm-wave modeling difficulties, limits
17
A. Diode Mixer
mixers generally focuses on very high-frequencies where the use of more complex
techniques (e.g. the Gilbert-cell, discussed in the next section) is not possible due to
in Fig. 2.4. The RF and LO inputs are combined with a directional coupler or hybrid
junction, which superimposes the two input voltages to drive the diode. With the
description is for application as a down-converter, but the same mixer can be used for up-
conversion since each port can be used as an input or output port. The input network
provides the optimum termination to the LO and RF signals and filters the IF signal
generated by the nonlinearity in the diode, in order to ensure minimum conversion losses
and maximum isolation between the input and output ports. It must also provide isolation
between the LO and the RF ports in order to avoid interference. Similarly, the output
The practical design and realisation of the filtering structures can be problematic,
especially when the frequency of an unwanted large signal (typically the LO fundamental
or low-harmonic frequency) is very close to the input or output frequency that requires a
unwanted signal, easing the design of the filtering and matching networks.
18
OUT
LO + RF IF
filter & match filter & match
B. Gilbert-Cell Mixer
Fig. 2.5 illustrates an active double-balanced circuit, known as the Gilbert cell mixer,
switches (also referred to as switching stage). The lower transistors, the so-called RF
transistors. RF and LO signals are normally applied to the circuit via the corresponding
matching networks and external baluns. Similarly, the IF output requires a matching
network as well. Since the two single-balanced mixers are connected in anti-parallel, LO
terms add up to zero at the IF output, whereas the converted RF signal is doubled in the
output. This mixer thus provides a high degree of LO-IF isolation, which alleviates
19
VDD
RD RD
iif1 iif2 vIF
+
vLO i3 i4 i5 i6
- M3 M4 M5 M6
i1 i2
M1 M2
+
vRF
-
IB
Note that the current iif1 is the sum of i3 and i5, and iif2 is the sum of i4 and i6, and the
RF current i1 is the sum of i3 and i4 and the sum of i5 and i6 is equal to i2. The bias current
IB is the sum of i1 and i2. Assuming that the LO signal is large enough to make the
while M3 and M6 will be off, and vice versa [36]. Therefore, the differential RF current is
effectively multiplied by a square wave whose frequency is that of the local oscillator:
where sgn(ωLOt) represents a squre wave with the magnitude of 1 and frequency of fLO:
20
-1 cosω LOt < 0
sgn(cosω LOt )=
1 cosωLOt > 0 (2.2)
Subsequently, sgn(ωLOt) is expanded using Fourier transform, and only contains LO odd
harmonic terms, as shown in Fig. 2.6. The Fourier spectrum of sgn(ωLOt) is obtained as
sgn(cosω LO t )= A n cos nω LO t , where A n =
sin n
2 (2.3)
n =1
n
4
where gm,RF is the transconductance of the RF input stage, i.e., gm,RF = gm,M1 = gm,M2.
Consequently, the voltage conversion gain Gc of this circuit can be found after
2 2
Gc RD g m,RF = RD K RF I B (2.5)
where RD is the load resistance, IB is the tail current, and process parameter
W
K RF =nCOX ( )n is determined by the technology and the size of the RF transistors M1,
L
M2 .
21
Unfortunately, Gilbert-cell mixers usually suffer from large power dissipation and
the need for high supply voltages because of the stacked topology (three stages: RF input,
local oscillator (LO) switching, IF load). The problem is based on the need for a large
bias current for the RF stage, which also has to pass the IF load and the switching
transistors, resulting in a voltage drop across each stage that limits the available DC
potential and output swing of the RF transconductance stage. This is obviously a major
problem in deep-submicron CMOS technologies with very low supply voltages, e.g., 1.2
deterioration of the switching action, affecting the gain, linearity, and noise performance
of the circuit [38]. In conventional Gilbert cell mixer implementations, the current
transistor pair (MN1 and MP1), DC currents for the switching transistors (M3 and M4) are
separately controlled from the currents of the transconductance stage (MN1). The current
bleeding can enable IMN1 to be higher than (IM3 + IM4). It is noteworthy that the added
selecting the current ratio of the complementary stages to be α, the enhanced conversion
2 W W
Gc’ R D nCOX ( )n I B + pCOX ( ) p I B (2.6)
L L
where (W/L)n and (W/L)p are the aspect ratio of transistors MN1-MN2 and MP1-MP2, and
IB is the bias current. Compared to (2.5), it is obvious that the conversion gain is boosted
22
without additional DC current through the switching stage and the resistive load RD. In
and broad bandwidth can be achieved simultaneously while maintaining excellent gain
flatness within the entire frequency band. Distributed amplification is considered a robust
technique for the design of broadband mixers due to its unique capability of providing a
VDD
RD RD
+ vIF -
+
vLO
- MP1 MP2
M3 M4 M5 M6
+
vRF MN1 MN2
-
IB
Fig. 2.7 Circuit diagram of Gilbert-cell mixer with current bleeding technique.
The linearity of the mixer depends on the switching stage, the transconductance stage,
and the tail current source. In [41], it was shown that imperfect switches have an effect on
the linearity of the mixer, which is roughly the sum of the intermodulation values of the
transconductors and the switches. To reduce the non-linear behavior, the switch-on
23
VDD
RD RD
iif1 iif2 vIF
+
vLO i3 i4 i5 i6
- M3 M4 M5 M6
i1 i2
vRF+ M1 M2 vRF-
voltage should be made low and a large LO power should be used. However, excessive
LO drive could cause a higher non-linearity because of the capacitive loading at the
switching pairs' common-source nodes [41]. Thus, a moderate LO drive ensures reliable
switching. If the switches are perfect, then the IIP3 of the mixer is determined by the
can be used here as well. One classic technique is source degeneration. In resistive
degeneration, two resistors are connected to the sources of the transconductors in series.
However, due to the limited voltage headroom and noise figure, inductive degeneration in
Fig. 2.8 is usually used instead. In [42], it was shown that inductive degeneration
increases linearity by providing some form of cancellation, which can not be achieved by
resistive and capacitive degeneration. One drawback is that inductors are large and take
24
up costly chip space. Other transconductor linearization methods such as the multi-tanh
principle [43] and the modified class AB transconductor [44]-[45] can also be used to
simpler and inexpensive filtering can be used [28]. However, an inevitable issue in the
development of direct conversion receivers is the local oscillator (LO) leakage causing a
time-variant DC offset at the output of the receiver. While the stages within the receiver
may be DC blocked, time-varying DC offset will be coupled through the receiver and
may degrade system performance [29]. One technique to reduce LO leakage within the
There have been many 2 SHMs proposed (e.g. [46]-[54]). In most cases (e.g. [46]-
[50]), modifications to the Gilbert-cell mixer were made in order to generate the double
frequency LO component to mix with the RF. One common modification to the Gilbert-
transistors and using quadrature LO signals rather than differential signals [49], [51]. This
25
VDD
RD RD
vIF
90°
vLO
270°
Q7 Q8 Q9 Q10
0°
vLO
180°
Q3 Q4 Q5 Q6
Q1 Q2
+
vRF
-
IBias
circuit, shown in Fig. 2.9 with bipolar transistors, has three-levels of transistors with the 0°
and 180°LO signals applied to the gates of the middle LO-transistor level, and the 90°
and 270°LO signals applied to the gates of the top LO-transistors. This configuration
generates the doubled LO frequency signal, 2fLO, that mixes with the differential RF
signal that is applied to the gates of the bottom transistors. Since this technique requires
three levels of transistors, it generally requires a higher DC supply voltage than the basic
Gilbert-cell and its use may not be possible in low-voltage applications. The topology
shown in Fig. 2.9 was introduced in [49], where it was implemented using a Si/SiGe HBT
26
technology and using passive on-chip RC phase shifters to generate quadrature LO
signals. This circuit was designed for direct-conversion applications with an RF signal
from 1 GHz to 2 GHz and an LO frequency from 500 MHz to 1 GHz. With a DC supply
voltage of 2.5 V, the measured conversion gain was 13.5 dB with an LO power of 10
dBm, a double sideband (DSB) noise figure of 10.4 dB, and an IIP3 of 3.5 dBm.
VDD
RD RD
vIF
0°
vRF
180°
Q1 Q2 Q3 Q4
IBias
demonstrated in [50] using a 0.35 μm BiCMOS technology. This circuit, which is shown
in Fig. 2.10, uses only two levels of transistors similar to the traditional Gilbert-cell,
however, it exchanges the position of the LO and RF transistor (i.e. the LO transistors are
27
on the bottom and the RF transistors are on the top). Similar to the circuit in Fig. 2.9,
quadrature LO signals are also required for this topology. In [49], the quadrature signals
were generated on-chip from a differential LO input using RC-CR networks. The circuit
in [49] was designed for an RF signal at 1.9 GHz and an LO signal at 900 MHz (a 100
MHz IF). The measured conversion gain for this circuit was 7.5 dB and the single-
sideband (SSB) noise figure was 10 dB. The input 1-dB compression point was 8 dBm
and the IIP3 was 3 dBm. The power consumption is 24 mW. Clearly, from the preceding
common (e.g. [46]-[47], [50]-[51]). Furthermore, in [52] and [53], even octet-phase
There are several circuits that have been used to realize 2× subharmonic mixers
using FETs that are not based on the Gilbert-cell. For example, in [54], the RF signal was
applied to the gate of a FET while the LO signal was applied to the bulk connection of
the FET (using CMOS 0.18-μm technology). This technique of injecting the LO signal
into the bulk of the transistor has the effect of modulating the threshold voltage and
exploiting the nonlinearity that results to realize a subharmonic mixer. The measured
conversion gain in [54] was 10.5 dB with an RF frequency of 2.1 GHz and LO frequency
of 1.025 GHz. The input 1-dB compression point was 12 dBm and the IIP3 was 3.5 dBm.
The measured noise figure (DSB) was 17.7 dB and the power consumption was 2.5 mW.
Note that the study in this thesis focuses on the active type of subharmonic mixers.
However, a review of its passive counterparts would need to be carried out, but is beyond
28
2.2.3 Image-Rejection Mixers
An important issue for the low-IF architecture is the image frequency problem, since
the image frequency is very close to the RF frequency. To overcome this problem, image
rejection architectures such as Hartley and Weaver architectures can be used [55], as
(a)
(b)
Fig. 2.11 Image rejection receivers: (a) Hartley, (b) Weaver [1].
29
In the Hartley receiver, the RF input is firstly split into I and Q paths and mixed with
quadrature LO signals. Before the two outputs are added together, a 90°phase shifter is
employed to shift the phase of one of the outputs relative to the other.
Suppose the input consists of the desired RF signal cos(ωRFt) and the image signal
cos(ωIMt), and fRF − fLO = fLO − fIM = fIF . Then the signals at points A, B and C will be:
1 1
A: cos(RF t +LOt )+cos(RF t-LOt ) + cos(LOt +IM t )+cos(LOt-IM t ) (2.8)
2 2
1 1
B: sin (RF t +LOt )+sin(RF t -LOt ) + sin (LOt +IM t )+sin(LOt -IM t ) (2.9)
2 2
1 1
C: -cos(RF t +LOt )+cos(RF t-LOt ) + -cos(LOt +IM t )-cos(LOt-IM t ) (2.10)
2 2
By adding (2.8) and (2.10), the final IF output at point D can be found as:
From (2.11), it is clear that the IF components caused by the image signal at the I and Q
paths cancel out. However, in practice, there is always some image signal appearing at
the output due to both the amplitude and phase mismatches of the I and Q paths. One
design challenge for the Hartley architecture is that it is difficult to generate an accurate
90° phase shift for wideband applications. To overcome this problem, the Weaver
architecture as shown in Fig. 2.11(b) can be used. Two quadrature down-conversions are
performed on the desired RF input signal and image signal in the Weaver receiver, and it
30
can also be shown that the image signal is cancelled after the subtraction. However, the
Weaver architecture suffers from the secondary image problem. To avoid the secondary
image problem, the LO frequency selections have to be constrained by the condition ωRF
= ωLO1 ± ωLO2, resulting in a much lower design flexibility. Another drawback is the
increased circuit complexity and power consumption due to the two down-conversions.
The image rejection can be quantified as a parameter named image rejection ratio
(IRR). Assuming small amplitude and phase errors, IRR can be derived as [1]:
4
IRR (2.12)
( )2 + 2
where ε and ∆φ denote the quadrature amplitude and phase errors. It is quite difficult to
achieve much better than 0.1% of gain error and 1°of phase error, which corresponds to
an IRR of about 41 dB. Mismatch calibration can help to improve the IRR, but still does
not satisfy the requirement. Therefore, high-Q off-chip filters often have to be used to
integration. Furthermore, the IRR tends to be worse at higher frequencies due to many
other high frequency coupling effects, making it extremely difficult to achieve a high IRR
31
A. Conversion Gain
The output of a linear system only consists of those frequencies that are present at
1 1
sin 1t sin 2t = cos (1t -2t )- cos (1t +2t ) (2.13)
2 2
For the conversion gain analysis, we assume that the RF signal at the mixer input is
small, and only the LO signal overdrives the mixer. In other words, the mixer behaves
and the time-varying gain of the mixer driven by an oscillator with frequency ωo,
So = GSi
a1 g1 ag (2.16)
= a1 g0 sin i t + sin (i -0 )t - 1 1 sin (i +0 )t +...
2 2
The second term and third term are the signals of interest. We see that this nonlinear
circuit down-converts the RF signal to ωi-ωo as well as up-converts it to ωi+ωo. For both
32
down-conversion and up-conversion mixers, the conversion gain is g1/2. If an input tone
were present at 2ωo-ωi, it would result in a down-converted term at ωi-ωo. This is the
image that corrupts the down-converted signal in a heterodyne receiver. For a direct-
conversion receiver with ωi = ωo, the image is the signal itself. Therefore direct-
In the previous section, we assumed that the mixer behaves linearly with respect to
the RF port. In practice, however, the mixer will affect the RF signal in a nonlinear way,
where Gn has the same form as G in (2.15). For the single tone input (2.14),
a12 a12
S i2 = - cos 2i t
2 2
(2.18)
3a13 a13
3
Si = sini t - sin 3i t
4 4
The tone at 2ωi will be down-converted to 2ωi-2ωo by the second harmonic of the LO.
This is the second harmonic of the fundamental, which is at ωi-ωo. The same principle
33
In a direct-conversion receiver, time-varying DC offsets can be generated by a single
measures the amount of spurious signals generated by two input signals. It is defined as
For two equal-amplitude input signals at ω1 and ω2, the nth-order IM product is any tone
at pω1+ qω2 where p + q =n . Consider two tones at the input of the mixer,
The third-order terms at 2ω1-ω2 and 2ω2-ω1 are of particular concern since they are close
to the fundamentals at ω1 and ω2 for ω1 close to ω2. Then the downconverted third-order
signals when the nth-order IM product equals the fundamental. This is called the nth-
order intercept point (IPn). IPn can be input- or output-referred (IIPn or OIPn), and it is
illustrated in Fig. 2.12 for n=3. IPn is a measure of small-signal nonlinearity since it is
gain of the mixer, causing gain expansion or compression. Another source of gain
compression is limiting in the circuit. Gain compression is usually specified with the 1-
34
dB compression point (P1-dB), which occurs when the gain decreases by 1 dB from the
ideal small-signal gain. Typically, the P1-dB compression point is 10~15 dB lower than the
IIP3. The output linearity (i.e., OIP3 and OP1-dB) is equal to the input linearity (i.e., IIP3
SNRin N s +N a (2.22)
F= =
SNRout Ns
where SNRin and SNRout are the input and output signal-to-noise ratios, respectively. Ns is
the noise power due to the source impedance, and Na is the noise power added by the
circuit. The noise factor expressed in dB is called the noise figure (NF). There are two
types of noise figure defined for mixers: single-sideband (SSB) and double-sideband
(DSB).
35
SSB noise figure is used when the signal is present on only one side of the LO,
unlike noise which is present at all frequencies. The mixing process folds the noise over,
doubling the total noise power at the down-converted frequency while the signal power
remains fixed. Heterodyne receivers are characterized by this type of noise figure. DSB
noise figure is used when the signal is present on both sides of the LO. If the conversion
gain is the same for both sidebands, the down-converted signal doubles in power along
with the noise, and the DSB noise figure will be 3 dB lower than the SSB noise figure.
requirements for NF and linearity. The NF requirement for the up-conversion mixer is not
as important as for the down-conversion. As for the linearity requirement, output linearity
is critical for the up-conversion mixer, while input linearity is more important for the
techniques can be different for up-conversion and down-conversion mixers. For example,
a better power and noise matching [38]. However, the inductive degeneration is not
necessary for the up-conversion mixer. To improve the output linearity of the up-
C. Port-to-Port Isolations
Isolation is a measure of how much power is coupled from one port to the other in a
two-port or N-port device. The mixer can be treated as a three-port device, and the
36
coupling, leakage, and isolation through these ports can be analyzed using S-parameters.
Being a three port device, there are a number of combinations. However, we will focus
on a few that are most commonly used and have stringent specifications, such as the LO-
to-IF and LO-to-RF isolation, since nonideal mixers have severe LO signal leaking to
both input and output ports. For the direct-conversion receiver, the LO feedthrough to the
input port of the mixer causes self-mixing, which results in a DC offset at the output port.
Since the down-converted band extends to DC, the DC offset can corrupt the received
signal. In a low-IF up-converter, the LO feedthrough at the output port has a frequency
very close to the desired RF signal causing in-band spurs, which is almost impossible to
be filtered out on-chip. Double-balanced mixers are usually used to suppress the LO
frequencies, the LO feedthough is much higher due to many other coupling effects, such
affect the performance of the circuit. If the port-to-port isolation is not sufficient, external
components, such as high-order filters with sharp roll-offs and high attenuation at low
D. Spurious Responses
The performance of the mixer does not only degrade due to the nonlinearity,
conversion loss, and noise. There are other phenomena, which affect the overall
performance of the mixer. One such phenomenon is the occurrence of spurs. Sometimes
37
there are signals that are within the passband of the mixer, and they may be up-converted
or down-converted to the IF band where they are undesired. The undesired signals that
show up at the output of the mixer are known as spurious responses [1]. To solve these
issues, the designer has a choice of changing the input filter characteristic of the mixer, or
38
Chapter 3
3.1 Introduction
CMOS, which strongly improves the RF performance of MOS devices, has resulted in a
continuous reduction of the supply voltage for each technology generation. Thus, the goal
of this work is to realize a SHM with relaxed supply voltage and LO power requirements
that can achieve a conversion gain and is compatible with a system that uses single-ended
RF signals. This work is one of the first SHMs demonstrated with measurement results
using the proposed topology. This circuit also provides the foundation for a more
advanced higher-order and higher-frequency SHM. Note that the aim of the discrete
39
increase the frequency of operation further. Therefore, the proposed SHM operating at a
low supply voltage could be an attractive solution for frequency conversion in microwave
communication systems.
Previously reported active SHMs are mostly based on the modified Gilbert-cell in
combination with an LO frequency doubler [57], [58]. The popularity of the Gilbert-cell
stems from its good conversion gain, linearity, and high isolation. However, Gilbert-cell
based SHMs always require quadrature LO signals and a significant supply voltage,
because the stacked transistors are biased in the saturation region. In addition, some
reported Gilbert-cell based SHMs achieve low supply voltages but require much larger
LO drive powers [59], [60]. Here, we present a novel biasing scheme to realize a low-
voltage SHM based on the cascode FET cell. The proposed cascade FET SHM works in
Hence, the proposed SHM requires a low supply voltage and low LO power, which, to
the best of our knowledge, is the first time the Class-B biasing is used to realize a cascode
FET SHM.
predict any potential nonlinear oscillations. Generally, causes of the nonlinear oscillations
for mixers can be attributed to the increased gain at certain LO input powers together
with the internal feedback loop. Especially for mixers operating in Class-B mode, the
small-signal stability analysis is not valid because circuits are biased with zero DC
40
Class-B mixers can exhibit nonlinear parametric oscillations when driven with certain LO
powers [61]. A systematic stability analysis is performed on the proposed Class-B SHM,
Section 3.2 firstly reviews the conventional cascode FET mixer which realizes the
fundamental mixing, with a simple discrete circuit demonstration. In Section 3.3, the
design and measurement of a Class-B SHM using cascade FET cell in discrete circuit
proposed SHM, which predicts and eliminates the potential parametric oscillations.
Cascode FET mixers have been used successfully in many kinds of portable and
fixed radio receivers for many years. Because of this success, it was originally expected
that cascode FET mixers would become the devices of choice for most receiver
applications. Cascode FET mixers have an important advantage over single FET mixers:
the LO and RF can be applied to separate gates. Because the capacitance between the
gates is low, the mixer has good LO-to-RF isolation. Because of its high isolation, the
cascode FET mixer can be used in applications where a balanced mixer would otherwise
be needed. Cascode FET cells are also used in integrated circuits, where filters and
41
3.2.1 Principle of Mixing Process
The cascode FET mixer is well-known for realizing conversion gain and reasonable
noise figure. The circuit schematic of the conventional cascode FET mixer is shown in
Figure 3.1. The RF signal is applied and matched to the lower FET gate, whereas the LO
signal is applied and matched to the upper FET gate, periodically modulating drain
voltage (floating node) of the lower transistor. An LC tank resonating at IF frequency can
Vdd
D
G2
vLO FET2
Vgs2
D1
vRF G1 FET1
Vgs1 S1
The applied LO modulates the floating-node (D1) voltage, which is the drain of the
lower FET. Conversion gain for a cascode FET mixer is primarily due to the changing
drain-source voltage of the lower FET1, which further modulates the transconductance of
FET1. A smaller frequency conversion path in the cascode FET mixer is present due to
the modulated conductance of the FET1. The modulated drain voltage swings FET1 in and
42
out of the linear and saturated region over the LO cycle. The optimum bias point is when
voltage on FET1. This bias point can be estimated by plotting the DC transconductance of
FET1 as a function of drain-source voltage. Then the optimum bias point is where an
applied LO could modulate the transconductance the greatest. As seen in Figure 3.2, the
optimum bias for the drain voltage of FET1 would be the "knee region" on the I/V curve,
70
60
Vg1=-0.1 V
50 Vg1=-0.2 V
gm (mS)
40 Vg1=-0.3 V
30
20
10
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
VD1S1 (V)
transconductance stage. Device sizing, biasing, and inductive degeneration set the
biased in the active region. While the cascode FET mixer has the lower FET operating in
the linear region during the majority of the LO cycle, resulting in low output resistance
43
and lower transconductance. Hence, a cascode FET mixer typically has lower conversion
gain but requires a larger LO power than a Gilbert mixer. Moreover, a cascode FET
mixer exhibits a moderately better linearity performance than that of a Gilbert mixer with
actively biased transconductance stage, owing to the higher required LO power and lower
gain.
To approximately analyze the mixing principle, the simplified transistor model (i.e.
square-law current model) is employed. The square-law current model is suitable for the
W
I D1 μ n Cox VGS1 Vth1 VDS1 (3.1)
L
W
Where μ n , Cox are process parameters and is the aspect ratio of the transistor. That is,
L
drain current is a linear function of VDS1. And this linear relationship implies that the
path from the source to the drain can be represented by a linear resistor Ron1:
1
R on1 (3.2)
W
μ n Cox (VGS1 Vth1 )
L
Eqn. (3.1) indicates that the output current is simply the multiplication of vgs1 (RF
signal) and vds1 , which is modulated by the LO signal applied at G2. In order to find the
relationship between vds1 and vLO, FET1 is replaced by its equivalent resistance Ron1.
G2 D
vLO
Vds1
Ron1
Subsequently,
vds1 g m 2 Ron1
AV (3.3)
vLO 1 ( g m 2 g mb 2 ) Ron1
W W
iD1 nCox vgs1vds1 nCox vgs1vds1
L L
(3.6)
W g m 2 Ron1
nCox VRF cos wRF t VLO cos wLO t
L 1 ( g m 2 g mb 2 ) Ron1
W g m 2 Ron1
Gc nCox VLO (3.7)
L 1 ( g m 2 g mb 2 ) Ron1
As presented in [62]-[63], the optimum conversion gain occurs when the lower transistor
FET1 is biased in the “knee region”, where it can swing in and out of the linear and half-
45
saturated regime by the LO signal. This hard switching mode offers the optimum mixing
Fig. 3.4 shows the schematic of the cascode FET SHM. Differential LO signals are
applied at the gates of FET1 and FET1’, while the RF signal is applied at the gates of FET2
and FET2’. Note that the function of the damping resistor Rdamp is discussed in Section 3.4.
Vdd
IF
LO+ LO-
FET1 FET1’
ids ids’
FET2 FET2’
Vg1 Vg1
Rdamp Rdamp
RF
46
Here we propose a biasing scheme to implement a subharmonic mixing. The
proposed biasing is shown in Fig. 3.5, where FET1 and FET1’ are biased in the cutoff
region, and FET2 and FET2’ are biased at the origin of the I/V curve. Based on this
biasing, differential LO signals drive FET1 and FET1’ alternately on and off for each half
of the LO cycle, and FET2 swings between the cutoff and linear region. This Class-B
requirements. FET2 which is biased at the origin of the I/V curve, swings between the
cutoff and linear region for each half of the LO cycle. Therefore, FET2 exhibits a low
channel resistance Rlinear when it conducts. For the proposed SHM, the two branches are
pull Class-B amplifier with a source-degenerated resistor Rlinear, as shown in Fig. 3.6.
Additionally, FET2 and FET2’ are biased with zero drain-source voltage Vds, only one
saturated Vds1,sat is required from the DC source, which facilitates low voltage
applications. For comparison purposes, the “sweet spot” for the conventional cascode
FET mixer, in which the RF is mixed with the fundamental component of the LO signal,
In conclusion, the proposed biasing provides subharmonic mixing for low voltage
47
Proposed biasing
Conventional biasing
FET2
FET1
Ids
Vgs
Vds
Fig. 3.5 The conventional and proposed biasing indicated on the I/V curve.
Vdd
iout
ids ids’
vLO+ vLO-
G1
Rlinear Rlinear
48
3.3.2 Analysis of Mixing Principle
model is applied for the large-signal analysis. The drain current is given by [56]
1
K (Vgs - Vth )Vds - Vds2 Linear region
I ds
2
(3.8)
1 K (V - V ) 2 Saturation region
2
gs th
where Vth is the threshold voltage and the parameter K is determined by the technology
FET1 and FET1’ provide LO pumping to FET2 and FET2’ and also operate as a
common-gate IF post-amplifier. The mixing mostly occurs in FET2 and FET2’ which
operate in the linear region [62]. The noise contributed by biasing FET2 and FET2’ in the
linear region is larger compared to biasing in the saturation region. However, the
conversion gain when biased in the linear region is much higher, which improves the
For the positive half cycle of vLO+, FET1 and FET2 are turned on. According to (3.8),
where the overdrive voltage Vgt2 = Vgs2-Vth, and vRF = VRFsin(ωRFt) is the RF input signal
applied at the gate of FET2. Following (3.9), mixing occurs due to the multiplication of
vRF and vds2, while vds2 is controlled by the LO signal vLO+. FET1 works within the
49
saturation region when it conducts. Therefore, the current flowing through FET1 can be
expressed as
1 1
ids1 K (vgs1 -vth1 vLO+ -vds2 )2 K (vLO+ -vds2 ) 2 (3.10)
2 2
where vgs1= vth1 (LO switching transistors are biased in the cutoff region), and vLO+ =
VLOsin(ωLOt). Note that, the current flowing through FET1 and FET2 is equal:
Solving Eqn. (3.9)-(3.11), the time varying drain-source current for the conducting half
cycle is obtained as
There are two solutions for ids, but only the solution with the minus sign is practical
For the negative half cycle of vLO+, the opposite branch, which is driven by vLO-, is
alternately turned on and works in the same manner. Therefore, the output current which
where vLO VLO sin(ωLO t) . Furthermore, vLO is Fourier expanded into harmonics of the
LO signal,
50
2 4 cos 2nωLO t
vLO VLO
n 1 4n 2 - 1 (3.14)
2 4
=VLO ( cos(2ωLO t) ...)
3
Note that the spectrum of vLO only contains DC and even-harmonic components,
demonstrating the LO frequency doubling. Consequently, the term K vLO vRF in (3.13)
In reality, the mixing mechanism is more complicated. The assumption that FET1
and FET2 remain in the saturation region and the linear region respectively may not be
valid when the LO power reaches a certain level. Accordingly, the conversion gain
decreases at larger LO powers, because when FET2 swings into the saturation region less
mixing effect occurs. In addition, the transistors’ higher order effects, which are not
considered in the simple square-law model, may deteriorate the mixer’s performance.
frequency of 400 MHz, with four ATF-36163 pHEMTs (fT = 28 GHz) on RT5880
substrate (εr = 2.2, h = 31 mils). The measurement results are obtained for the stabilized
SHM, while the stability analysis and stabilization of the proposed SHM will be
discussed in Section 3.4. The aim of the discrete design is to validate and demonstrate the
proposed biasing scheme. Through simulations it is found that at the RF frequency of 900
MHz, the parasitics of the discrete surface mount devices (SMDs) are the dominant
51
parasitics rather than the transistor package parasitics. However, at higher frequencies the
package parasitics will become more important. It is also noted that the low self-resonant
frequency (SRF) of the discrete components inhibits the design of a good matching
reduce these problems and increase the frequency of operation further. Therefore, this
SHM with Class-B biasing is very well suited for integrated circuit design at higher
frequencies. The bias condition is: Vdd = 1 V, Vg1 = -0.55 V (cut-off), and Vg2 = 0 V. The
large-signal stability analysis is performed with the LO drive only because the RF input
The cascode FET mixers are measured in different modes with the same RF and IF
Mode A (the proposed SHM): subharmonic mixing with the proposed Class-B biasing
Mode B: subharmonic mixing with the conventional Class-A biasing (fLO = 400 MHz).
Mode C: fundamental mixing with the proposed Class-B biasing (fLO = 800 MHz).
Mode D: fundamental mixing with the conventional Class-A biasing (fLO = 800 MHz).
All DC gate voltages are applied through resistors of 5 kΩ. The drain of FET1 and FET1’
are connected to the supply voltage through a LC resonator resonant at the IF frequency
(100 MHz). Note that the balanced cascode FET mixer biased in Class-A mode also has
52
stability issues, so all the four modes are measured with the insertion of the 10 Ω
damping resistors.
TABLE 3.1
PERFORMANCE SUMMARY
Table 3.1 summarizes the measured performance for all four modes. Comparing
mode A with mode B, it can be seen that the cascode FET mixer achieves better
subharmonic mixing with the proposed biasing. The SHM in mode A exhibits 4 dB more
conversion gain with less LO power and less DC consumption than in mode B, while the
other performance parameters are comparable. The reason for the poorer performance in
support the subharmonic mixing. Mode C and mode D are included to demonstrate that
the proposed Class-B biasing does not support fundamental mixing. It is observed that
53
Additionally, it is well known that for low frequency applications, the fundamental
mixer exhibits superior performance compared to the subharmonic mixer, which can be
seen from the comparison of mode A with D. However, when the operating frequency
increases, the design difficulty of a high-frequency local oscillator with both high output
power and good phase noise prevents the application of fundamental mixers.
are shown in [68], [69]. The mixer in [65] requires only 1.2 V but also requires an LO
drive power of 0 dBm. The mixer shown in [66] requires a relatively low LO drive and
has good conversion gain. However, a supply voltage of 3.3 V is needed. The mixers in
proposed biasing scheme (mode A) facilitates subharmonic mixing with both low voltage
and relaxed LO power requirements. Furthermore, the proposed SHM biasing will benefit
TABLE 3.2
REFERENCE TABLE
RF LO CG IIP3 NF Power Supply Circuit
Technology Year
(GHz) (dBm) (dB) (dBm) (dB) (mW) (V) Topology
0.18μm
[65] 1.9 0 2.2 -3.0 11.3 6.4 1.2 Folded mixer 2007
CMOS
2 μm HBT
[66] 5.2 -8 14.5 -5.0 21 13.2 3.3 Gilbert-cell 2007
GaInP/GaAs
[67] 1.9 0 7.5 -3.0 10 24 3.0 Gilbert-cell 0.35 μm SiGe 2001
Resistive Discrete
[68] 2.1 0 0.67 8.25 N/A N/A 3.0 2004
mixer HEMT
Cascode-FET Discrete
[69] 1.9 0 10 -1.0 8.9 180 3.0 2003
Class-A HEMT
54
3.4 Stability Analysis of the Proposed Class-B SHM
required because mixers operate in the large signal regime. Class-B mixers can exhibit
stability analysis for predicting and correcting large signal oscillations of the proposed
technique is applied for an initial prediction of any potential instability. The proposed
powers, spurious oscillations occur. Secondly, in order to study the origins of the
model parameters. Based on the in-depth understanding of the origins of the instability, a
while maintaining the desired performance. Simulation and experimental results are in a
good agreement.
The large-signal stability analysis is applied to the balanced Class-B SHM, shown in
Fig. 3.7. Note that the large-signal stability analysis is performed with the large-signal
LO drive only because the RF input signal is assumed to be small-signal [70]. The large-
signal stability analysis relies on the calculation of the linearized admittance of circuit
nodes in the large-signal regime. The algorithm analyzing the locally linearized behavior
55
of a nonlinear circuit is known as the conversion matrix method [71], which can be
Vdd
IF
Vg1 Vg1
XA
XB
LO+ LO-
FET1 FET1’
XC
Vg2 Vg2
FET2 FET2’
XD
Auxiliary Generator
Y1
XE
Y2
vAG, fAG RF
Fig. 3.7 Proposed SHM circuit and auxiliary generator to detect oscillations (matching networks
and interconnects not shown).
introduced at a circuit node of interest [72]. In the second step, the two-tone Harmonic-
Balance (HB) simulation, considering both the LO excitation and the auxiliary generator,
is carried out to obtain the linearized node’s admittance Y(f) in the large-signal regime.
56
After the two-tone HB simulation, Y(f) is given by the ratio between the observed phasor
iAG (PLO , f AG )
Y f = (3.15)
vAG (PLO , f AG )
Re Y f o 0andIm Y f o 0 (3.16)
As an example, the admittance Y(f) at node C is plotted in Fig. 3.8 for PLO = -6 dBm.
order to detect the range of LO powers where the oscillation can occur, both PLO and fAG
are swept. The detected oscillation frequency versus the LO power is shown in Fig. 3.9,
which indicates that the oscillation condition is satisfied when the LO power is in the
range of -7 dBm to -3.5 dBm, and the observed oscillation frequency varies from 4.04 to
4.18 GHz. The circuit is stable when driven with an LO power outside the above power
range.
Note that the node at which the oscillation condition is fulfilled determines the
oscillation mode [73]. At the internal nodes B, C and D, both even- and odd-mode
oscillations can be excited and at the power combining nodes A and E, only the even-
mode oscillation can be excited. In our design it is found that the oscillation condition is
satisfied only at nodes B, C, and D, and oscillations are detected at LO powers from -7
57
Real (Y(f))
8 Imaginary (Y(f))
4
Y(f) (mS)
-4
-8
Fig. 3.8 Input admittance Y(f) at node C with PLO = -6 dBm. The oscillation frequency is around
4.12 GHz.
4.20
Osillation Frequency (GHz)
4.16
4.12
4.08
4.04
58
3.4.2 Odd-Mode Equivalent Circuit Analysis
circuit analysis is necessary. First, the large-signal transconductances gm1 and gm2 versus
the input LO power are determined for FET1 and FET2. Subsequently, a simplified circuit
[72] is applied again. The schematic for calculating gm1 and gm2 under large-signal
conditions is shown in Fig. 3.10. Ideal circulators and ideal filters are employed to
separate incident waves a1 and a2 and reflected waves b1 and b2. The auxiliary source is
set at fag =1 Hz. After the two-tone HB simulation, in which fLO is the nonlinear tone and
fag is the small-signal tone, the S parameters at fag linearised in the large-signal regime are
computed from
b1 b b b
S11 ,S12 1 , S21 2 ,S22 2 (3.17)
a1 a2 a1 a2
gm Re(Y21 ) (3.18)
59
Port 1 Port 2 Port 2 Pag
Pag Pag
a2
a1 a2 b2
b1 b2
50 Ω 50 Ω 50 Ω
fag
FET1
FET1
fag fag
PLO
PLO
a1
FET2 FET2
b1
fag
50 Ω Port 1 Pag 50 Ω
(a) (b)
Fig. 3.10 Circuit diagram for determining the large-signal gm. (a) gm1. (b) gm2.
Fig. 3.11 shows the large-signal gm1 and gm2 versus LO power from -20 to 20 dBm. It is
observed that LO transistor FET1 enters into Class-A region, i.e., gm1 is larger than 0, for
LO powers from -20 dBm to around 10 dBm. Using the large-signal gm1 and gm2, a circuit
60
30
nonlinear gm1
25 nonlinear gm2
20
(mS)
15
m
g
10
0
-20 -10 0 10 20
LO power (dBm)
For the odd-mode oscillation in the Class-B SHM, the signals in both branches are
180°out of phase. Thus, a virtual ground can be assumed at power combining points A
and D. One branch of the balanced circuit is chosen with virtual grounds added at nodes
A and D, as shown in Fig. 3.12. According to (3.21), the necessary oscillation condition
is:
where Yleft and Yright are the input admittance looking towards left and right at node C.
61
LO+
Yleft Yright
TLd
TLg
C
Zparallel Ztotal
g2 i1 d2 Yleft
+
+ Cgd2 i2 i3 i4
TLg vgs2 vin
Cgs2 gm2vgs2 Cds2 rds2
-
-
s2
In order to gain insight in the high-frequency behavior of Yleft, the intrinsic model of
the ATF-36163 HEMT is applied, as shown in Fig. 3.13. The large-signal gm1 and gm2
obtained at PLO = -6 dBm are used in the following circuit analysis. The parasitic
capacitances are extracted from the small-signal analysis and assumed to be constant for
i2 i4 1
Re Yleft cg m2 (3.20)
Vin rds2
62
where XTLg is the input reactance of the gate transmission line TLg, using the lossless
microstrip line model. Fig. 3.14 shows the calculated c and Re(Yleft) versus frequency. As
can be seen, Re(Yleft) is highly negative around 6.2 GHz, which is mainly due to the
resonance of the resonator formed by Cgd2, Cgs2, and TLg. Three frequency regions in Fig.
Region I: At low frequencies, the complex resonator Ztotal is capacitive with a high
reactance, while the parallel resonator Zparallel is inductive with a low reactance.
Consequently, c is negative, but the magnitude is too small to make Re(Yleft) negative.
However, c decreases with frequency, and when the frequency approaches 6.2 GHz, the
first resonant frequency of Ztotal, c becomes highly negative, and Re(Yleft) becomes highly
negative as well.
Region II: Right after the first resonance, Ztotal becomes inductive, and Zparallel remains
Region III: When the frequency increases further, the parallel resonator Zparallel resonates,
which gives an infinite reactance. Then c approaches 1, and Re(Yleft) is still positive.
After the second resonance, Cgs2 dominates Zparallel, which is in series with Cgd2 to give a
63
18
12
c 6
-6
I II III
-12
-18
4 5 6 7 8
Freq (GHz)
(a)
1.5
1.0
0.5
) (S)
left
0.0
Re(Y
-0.5
-1.0
-1.5
-2.0
4 5 6 7 8
Freq (GHz)
(b)
64
Next, we obtain the input admittance of the right side Yright. The simplified
equivalent circuit is shown in Fig. 3.15. Within the frequency range of interest, the
impedance of FET1’s gate matching network is negligible, therefore the gate terminal g1
is shorted to ground for simplicity. Applying the circuit nodal equations, the input
where Xres is the reactance due to Cgd1 in parallel with the drain transmission line TLd,
and yds1 is the conductance of rds1. Re(Yright) is also plotted in Fig. 3.16(a). Then, an
1
Re(Yright ) g m1 + (3.23)
rds1
Cgd1 TLd
g1 d1
+
vgs1
Cgs1 gm1vgs1 Cds1 rds1
- i1 i2 i3 i4
s1
Yright
+
vin
-
65
To find the potential instability, the sum of Re(Yleft) and Re(Yright) is plotted in Fig.
3.16(b). It can be seen that the negative input admittance occurs at 6.2 GHz, which is
100
gm1+yds1
80
) (mS )
60
right
40
Re(Y
20
-20
0 1 2 3 4 5 6 7 8 9 10
Freq (GHz)
(a)
1.5
Re(Yleft)+Re(Yright)
1.0
) (S)
right
0.5
)+Re(Y
0.0
left
-0.5
Re(Y
-1.0
-1.5
0 1 2 3 4 5 6 7 8 9 10
Freq (GHz)
(b)
66
3.4.3 Experiments and Stabilization Technique
The board photo of the designed balanced SHM is shown in Fig. 3.17. A parametric
example, Fig. 3.18 shows the output spectrum at PLO = -3 dBm. An oscillation around 4.2
GHz is observed, which is close to the frequency predicted by the large-signal stability
analysis of Section 3.4.1. Note that the distributed parasitic capacitance coming from the
package is comparable to the intrinsic parasitic capacitance. The discrepancy between the
measured oscillation frequency and the predicted oscillation frequency found in Section
3.4.2 is attributed to the negligence of the transistors’ package parasitics and the
IF
LO+ LO-
RF
SHM Core
67
From the equivalent circuit analysis of Section 3.4.2, it is found that the resonance of
the complex resonator Ztotal causes the negative admittance Yleft. An effective way to
eliminate the oscillation is to insert a damping resistor Rdamp into Ztotal to suppress the
negative admittance Yleft, as shown in Fig. 3.19. The large-signal stability analysis
discussed in Section 3.4.1, is performed again for different values of the damping resistor.
The simulated Re(Y(f)) at node C is shown in Fig. 3.20. As can be seen, a 10 Ω damping
that the proposed methodology has determined the suitable location and correct value of
68
Vdd
IF
LO+ LO-
FET1 FET1’
FET2 FET2’
Rdamp Rdamp
RF
Fig. 3.19 The proposed SHM with the damping resistor Rdamp (matching and biasing networks
not shown).
60 Rdamp=0 Ohm
Rdamp=10 Ohm
40 Rdamp=20 Ohm
Re(Y(f)) (mS)
20
-20
-40
0 1 2 3 4 5 6 7 8 9 10
Freq (GHz)
69
3.4.4 Summary
A systematic stability analysis for the proposed Class-B SHM is performed in order
to detect nonlinear oscillations and to determine the root causes. To the best of our
knowledge, this is the first time the origin of the large-signal oscillation in the Class-B
SHM is analyzed incorporating the critical nonlinear circuit parameters using the
eliminates the large-signal parametric oscillation. Simulation and experimental results are
in a good agreement.
A new biasing for the cascode FET mixer is proposed in order to realize a
subharmonic mixer. The proposed SHM requires a low supply voltage and reduced LO
drive power, which makes it a suitable solution for low-voltage applications. Furthermore,
the odd-mode parametric oscillation. Simulation and measurement results provided are in
good agreement.
balun for the LO port could be used, in order to save chip area.
70
As an advantageous candidate for frequency conversion in direct-conversion receiver,
studied.
71
Chapter 4
4.1 Introduction
Since the Federal Communications Commission (FCC) has allocated 7.5 GHz (3.1-
10.6 GHz) of unlicensed bandwidth for low-power high-data-rate wireless networks and
defined radio (SDR) and ultra-wideband (UWB) standards, call for the operational
frequency range covered from 1 GHz up to about 6 GHz (SDR) or 10 GHz (UWB) [74].
And for monolithic microwave integrated circuits (MMICs), a wideband mixer catering
for multiple applications is also attractive and advantageous, in light of high data rate,
CMOS technologies have become the most appealing and promising candidate for radio-
frequency (RF) applications. The Gilbert-cell based mixer is a typical type of active
72
mixers, which has been widely used as the down-converter to provide the required
frequency translation in CMOS designs. This active topology is favored over its passive
counterparts due to the offered conversion gain, which relaxes gain and noise
improve the bandwidth of CMOS Gilbert-cell mixers, novel circuit techniques have been
the input (RF and LO) ports, and the distributed architecture with input artificial
transmission lines [37]. These techniques are considered robust for the design of
broadband mixers, at the cost of larger chip area due to the additional passive networks.
wideband behavior by shifting the LO frequency across the intended RF frequency range,
while exhibiting a relatively small IF bandwidth. Therefore, these mixers are wideband
RF, but narrowband IF. Indeed, the RF bandwidth is an important parameter for a mixer
as it determines the spectral coverage of the RF band with a proper adjustment of the LO
determines the channel bandwidth or the number of channels in UWB systems. However,
to date, only a few published mixers have demonstrated both wideband RF and wideband
transconductance stage translating the input RF voltage into a current. The differential
pairs M3-M4 and M5-M6 referred to as the LO commutating stage and are used as
73
VDD
RD RD
iif1 iif2 vIF
+
vLO i3 i4 i5 i6
- M3 M4 M5 M6
i1 i2
M1 M2
+
vRF
-
IB
realize both wideband RF and wideband IF performance. To the best of our knowledge,
the proposed mixer is the first Gilbert-cell mixer using a common gate transistor with
cross-coupled feedback in the RF stage, exhibiting a flat conversion gain as well as good
designed and implemented in a standard 0.13 µm CMOS process. Layout and measured
results of the proposed CMOS wideband mixer are then presented. Compared with the
74
mixer has the advantages of low-complexity of geometry, good in-band input/output
VLO+ VLO-
VLO Active
Balun
Two key requirements for MMIC wideband mixers are good input- and output-
matching and adequate conversion gain flatness. To meet these demands, various design
aspects are discussed in the following sections, including the device size selection,
bandwidth limitation, conversion gain boosting, conversion gain flattening and circuit
realization. Fig. 4.2 illustrates the block diagram of the proposed mixer, which is divided
into three functional blocks: a mixer core based on the Gilbert-cell multiplier, an active
systems, which facilitates second order distortion suppression, as well as noise reduction
75
from power supply and substrate [80]. Active baluns are designed for the LO and IF ports,
mostly for convenience of measurements, which slightly increases the overall power
consumption. All building blocks are designed and simulated using GlobalFoundries
VDD
RD RD
vIF+ vIF-
vLO+ M3 M4 M5 M6
vLO-
LO Stage
Interstage RF Stage
The proposed mixer core is based on a Gilbert-cell multiplier, as shown in Fig. 4.3.
transconductace stage. As commonly used in wideband LNA designs, the common gate
(CG) topology features desirable properties for wideband operation, and exhibits superior
stability due to the absence of the Miller effect of Cgd. Ignoring the loading effect of the
following stages and the back-gate transconductance gmb, the input impedance of the
1
Zin (4.1)
g m,M1 sCgs,M1 1 / R S
where gm,M1 and Cgs,M1 are the transconductance and gate to source capacitance of the
common gate NMOS transistor M1. By selecting RS = 200 Ω and optimizing the size of
M1 for impedance matching, an input return loss larger than 10 dB can easily be achieved
up to 10 GHz.
The conversion gain of a Gilbert-cell mixer strongly depends on the load impedance
RD and the effective Gm of the RF transconductance stage. And for a given bias current,
the mixer linearity tends to degrade with increased RD, due to the excess voltage drop
across the load. Therefore, the conversion gain of the proposed mixer is determined by
the transconductance of the CG transistor gm,M1, which is restricted by the input matching,
active feedback is proposed for the RF stage. The RF stage of a Gilbert-cell mixer has
differential inputs and differential outputs, which allow the two branches to be cross-
coupled for transconductance enhancement [81]. As shown in Fig. 4.3, the proposed RF
77
stage contains two CG transistors M1 and M2 and two complementary pairs (MN1/MP1
and MN2/MP2), where the drain of each complementary pair is cross-coupled to the gate
of the other. To illustrate how the effective transconductance of the proposed RF stage
Gm,eff, is boosted, the signal polarity and current direction are labeled in Fig. 4.3. When
the differential RF signal vRF+ is in the positive half-cycle, a positive small-signal current
id1 results; whereas a negative small-signal current id2 results from the negative vRF-.
Meanwhile, the drain voltage vd1 of M1 increases and the vd2 of M2 decreases. With the
cross-coupled connection, these changes in the drain voltage of CG transistors also cause
drain current variations in the complementary pairs. For instance, the decrease of vd2,
which is also the gate-source voltage of MN2/MP2, would cause a positive iC2. Since the
small-signal output current of the RF stage iRF+ consists of two current components id1
and iC2 with the same polarity, iRF+ is enhanced, which results in an increase of Gm,eff. It is
worth noting that a positive voltage feedback is formed between node C1 and C2 due to
the cross-coupled complementary pairs MP1/MN1 and MP2/MN2, which further improves
Gm,eff.
To explain the proposed gm boosting technique further, we consider the left branch of
the RF stage where the drain voltage and current of M1 are given by
where ZC denotes the node impedance at C1, and vC1 is the small-signal voltage at node
C1. Subsequently, the current flowing into the complementary stage MP2/MN2 is derived,
78
iC2 = -iC1
(4.3)
=(g m,MP1 +g m,MN1 )vC1
Consequently, the output current of the left branch can be expressed as:
g m,M1
G m,eff = (4.5)
1-(g m,MP1 +g m,MN1 )ZC
1
F (4.6)
1-(g m,MP1 +g m,MN1 )ZC
1 1
ZC R ds,M1 R ds,CP2 (4.7)
2g m,LO jωCC
where Rds,M1 and Rds,CP2 denote the drain source resistance of M1 and the complementary
pair MN2/MP2, CC is the parasitic capacitance at node C1, and the input resistance looking
into the source of the LO stage is approximated by 1/(2gm,LO). Note that the term
79
(gm,MP1+gm,MN1)ZC from (4.5) is required to remain less than 1 for any frequencies, to
It can be seen from (4.6) and (4.7), Gm,eff can be enhanced by properly designing the
boost Gm,eff, preferably wide transistors are used for the complementary pair. However,
when the transistor width increases, the gate parasitic capacitance increases too, which
reduces the node impedance ZC at higher frequencies. Thus, a tradeoff should be made
between Gm,eff and RF bandwidth. Alternatively, reducing the width of LO transistors M3-
require a larger overdrive voltage which results in a reduction of voltage headroom in the
RF stage, and therefore degrades linearity and noise performance of the mixer [3].
Cadence simulations show a very good agreement with the presented analysis, and
increase of noise figure caused by the channel noise of the cross-coupled transistors is
also observed.
bleeding in the Gilbert-cell mixer to keep the gain high. The proposed mixer also
employs the current-reuse technique realized by the bias current difference in the
complementary transistors (MN1 and MP1). Taking the complementary pair MP1 and
MN1 as an example, increasing the aspect ratio (W/L)MP1 of the PMOS transistor or
decreasing the aspect ratio (W/L)MN1 of the NMOS transistor would allow more bias
80
current injecting into the drain of M2. The relationship between the bias currents of RF
where (IM5+IM6) refers to the bias current of the LO stage. By optimizing the size of the
complementary transistors, the bias current through the LO transistors can be reduced,
which improves the switching function, and offers better gain, linearity and noise
performance as well [82]. Reduction of the DC current through the resistive load RD also
voltage due to technology scaling, and therefore improves the mixer linearity and
conversion gain.
frequencies, which is mainly due to Cgs of the LO transistors and the complementary pair.
frequencies for a fixed IF frequency of 200 MHz. Note that the LO and IF baluns are also
included in HB simulations, which will be discussed in Section II-C. The conversion gain
frequency response of the mixer using the proposed RF stage is shown in Fig. 4.4,
81
15
14 Original mixer + interstage inductor
Original mixer
12
11
Post-Layout Spectre Simulation
To reduce the effect of parasitic capacitance present at the interstage node C1 and C2,
and to realize a flat conversion gain over a wider frequency range, an inductor Linter is
added between the LO and RF stage, as shown in Fig. 4.5. The parallel connection of
Cp,LO and Cp,RF is broken up and a complex resonator is formed by the total parasitic
capacitor at the source of LO transistors Cp,LO, the interstage inductor Linter, and the total
parasitic capacitor at the output node of the RF stage Cp,RF. The resulting equivalent
1
YC jωCp,RF
1
jωLint er
jω Cp,LO (4.9)
jω(Cp,RF Cp,LO ω L int er Cp,RF Cp,LO )
2
1 ω2 Lint er Cp,LO
82
Let YC equal to zero, i.e., the parasitic capacitance is compensated, then the resonating
1
ωO (4.10)
C C
Lint er ( p,LO p,RF )
Cp,LO Cp,RF
That is, the interstage inductance Linter resonating with Cp,LO and Cp,RF gives the best
inductance Linter = 3.5 nH at 10 GHz is adopted. As shown in Fig. 4.4, the gain-peaking
occurs around 8.5 GHz, which effectively improves the conversion gain flatness up to 10
GHz. Cadence simulations also show that the noise performance is improved around the
gain peaking frequency. The main reason for the noise figure improvement is the part of
noise added by the circuit itself remains unchanged due to the gain peaking, while the
vIF+ vIF-
vLO+
LO Stage
vLO+
Cp,LO Cp,LO
Fig. 4.5 Parasitic capacitance compensated by the interstage inductor at the dominant pole.
83
Sensitivity analysis is also investigated by Cadence corner simulations. As shown in
Fig. 4.6, the conversion gain variation is less than 1 dB, indicating the conversion gain
Fig. 4.6 Conversion gain frequency response with different inductor models.
The LO signal fed into a mixer is either from an internal VCO or an external signal
source. However, a VCO with differential outputs would require higher power
consumption and complicated control voltages. Additionally, the LO signal fed into the
84
gate of the switching transistors is large-signal, and reflections due to impedance
The cascode common gate common-source balun is adopted and designed at the LO
port [83]. As shown in Fig. 4.7, the cascode common gate topology is employed to add
phase delay to compensate the phase deviation between the two stages over a wide
bandwidth. Note that the resistor Rin =200 Ω is utilized for the RF block and input
matching, instead of using an inductor in order to save the die area. Cadence HB
simulations are performed on the designed LO balun, loaded with the gate-source
capacitance Cgs of LO transistors M3-M6. The process parameters are given by the
GlobalFoundries 0.13-µm CMOS process models (LO transistor W/L = 50/0.13, Cgs =
38.65 fF). Fig. 4.8(a) depicts the simulated phase imbalance and gain imbalance of the
adopted active balun, which shows a phase imbalance better than 6°and an amplitude
imbalance within 2.6 dB, in the frequency range from 1 to 10 GHz. Simulations also
indicate a 6-dB gain variation throughout the 1-10 GHz LO band, which slightly
increases the required LO power for the optimum conversion gain, as shown in Fig. 4.8
(b).
85
RFout1 RFout2
CS Stage
CGCG Stage
RFin
Rin
3
6 Phase Imbalance
Gain Imbalance
4
Gain Imbalance (dB)
2
Phase Imbalance ( )
o
0 1
-2
0
-4
1 2 3 4 5 6 7 8 9 10
Frequency (GHz)
(a)
86
6
CGCG
4
CS
-2
-4
-6
1 2 3 4 5 6 7 8 9 10
Frequency (GHz)
(b)
Fig. 4.8 (a) Simulated phase and gain imbalance of the adopted active balun. (b) Simulated
An on-chip active IF balun is also designed for matching and testing purposes. The
common source amplifier with diode-connected load and a source follower [84]. Because
the output impedance of the source follower stage is inherently low, output matching and
conversion gain flatness can be achieved throughout the entire IF-band, simply by
optimizing the transistor size. Note that the source follower stage can also be utilized as a
simple output buffer for achieving wideband matching, if the output signal is required to
remain differentially.
87
After thorough and detailed design considerations, the size of the transistor M1 is set
identical to that of the M2 for output balancing without gain and phase mismatches, and
both transistors are in saturation. Since the same current flows from the transistor M1 to
M2, the transconductance of the transistor M1 is identical to that of the M2. For the source
follower stage, shown in Fig. 4.9(b), the voltage gain can be approximated by 1, thus the
For the CS amplifier with diode-connected load, shown in Fig. 4.8(c), the output voltage
1
vo2 -g m2 vin2 -vin2 (4.12)
g m1
Source Diode-connected
Load
M1 follower M1
M1
v+ vin1
vo2
Differential
vout
vo1
CS amplifier
M2 M2
M2
v- vin2
88
Circuit simulations are performed on the designed IF balun combined with the mixer
core. The optimized aspect ratio of the two equally sized transistor M1 and M2 is 35
µm/0.13 µm, for considerations of flat conversion gain and good output return loss
technology. The die photograph is shown in Fig. 4.10 with a chip size of 1.4 × 1.1 mm2,
in which the active area only occupies 0.28 mm2 excluding pads and DC decoupling
capacitors. The mixer characteristics are measured using on-wafer probing on RF, LO,
and IF pads, while DC pads are wire-bonded to the printed circuit board (PCB). Signal
generators are used to generate the RF and LO signals. A spectrum analyzer is used to
measure the converted signal at the IF port. An external balun is used at the RF port to
provide the differential RF signals. All losses from the balun, probes and cables are
carefully extracted for precise power calibrations. Operated with a 1.2-V supply voltage,
the measured power dissipation of the entire chip is 8.4 mW. The simulated power
consumptions of the mixer core, LO balun and IF balun are 2.55 mW, 1.6 mW and 3.05
mW, respectively.
performed using a vector network analyzer. The measured and simulated port reflection
coefficients are shown in Fig. 4.11. Due to the use of common gate transistors in the RF
stage, the measured RF input return loss is better than 10 dB from 0.6 to 12 GHz. The LO
89
port exhibits an input return loss larger than 7 dB from 1 GHz to 10 GHz, whereas the
Active Area
0.4 mm
0.7 mm
Fig. 4.10 Microphotograph of the mixer chip (core size: 0.7 × 0.4 mm2).
0
Measured
-2
Simulated
Reflection Coefficient (dB)
-4
IF
-6
LO
-8
-10
-12
RF
-14
-16
-18
0 1 2 3 4 5 6 7 8 9 10
Frequency (GHz)
Fig. 4.11 Measured and simulated reflection coefficient at RF, LO and IF port.
90
The conversion gain is firstly measured for a -40 dBm RF input at 3 GHz, where the
2.8 GHz LO power is swept from -10 to 5 dBm. As shown in Fig. 4.12, the measured
conversion gain is saturated when the LO power is 0 dBm, hence a 0 dBm LO power is
used to drive this mixer over the entire RF band for the sake of simplicity. The
conversion gain frequency response is subsequently measured with both RF and LO ports
swept in the frequency range from 1 GHz to 10 GHz. Fig 4.13 depicts the measured
The simulated conversion gain in Fig. 4.4 is also plotted together for comparison
purposes. The measured conversion gain is 5.5±2.5 dB throughout the whole RF band of
1 to 10 GHz, and the IF bandwidth from 100 MHz to 1 GHz is observed with a
conversion gain variation less than 2 dB. Compared with the simulated conversion gain,
the relatively large discrepancies at high frequencies are attributed to process variations
As for the port-to-port isolation, the measured results with an LO power of 0 dBm
are presented in Fig. 4.14. The LO-to-RF isolation is generally higher than 45 dB, while
the LO leakage to the IF port is lower than -40 dB within the entire RF band. Note that all
metal connections in the Gilbert-cell core are placed as symmetrical as possible; however,
there are some inevitable crossovers between these metal connections, which deteriorate
the RF trace intersection issues are presented in [85]-[87], which are not considered in
91
8
3
Measured at RF=3 GHz, IF=200 MHz
2
1
-10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5
LO Power (dBm)
8
Conversion Gain (dB)
6 5 dB
IF@100 MHz
5 IF@200 MHz
IF@300 MHz
IF@500 MHz
4
IF@800 MHz
IF@1000 MHz
Simulated@200 MHz IF
3
2
1 2 3 4 5 6 7 8 9 10
RF frequency (GHz)
92
LO-to-RF
60 LO-to-IF
Isolation (dB)
40
20
0
0 1 2 3 4 5 6 7 8 9 10
RF frequency (GHz)
Fig. 4.14 Measured port-to-port isolation (LO-to-RF and LO-to-IF) with an LO power of 0 dBm.
distortion test is performed. The test procedure is performed over the entire RF band. In
each case, RF signals spaced 1 MHz apart are down-converted to two-tone IF of 199 and
200 MHz. Subsequently, the measured input referred 1-dB compression point (IP1-dB) and
third-order input intercept point (IIP3) as a function of RF frequency are plotted in Fig.
4.15 and Fig. 4.16, respectively. The IP1-dB is from -16 to -13 dBm and the measured IIP3
is better than -7 dBm over the entire RF band. In addition to the linearity, the noise figure
frequencies, the measured single-sideband (SSB) noise figure ranges from 11.3 to 15 dB
93
-12
-13
-15
-16
-18
1 2 3 4 5 6 7 8 9 10
RF frequency (GHz)
Fig 4.15 Measured IP1-dB of the proposed mixer for a fixed IF frequency of 200 MHz.
-2
-4
IIP3 (dBm)
-5
-6
-7
-8
1 2 3 4 5 6 7 8 9 10
RF frequency (GHz)
Fig 4.16 Measured IIP3 of the proposed mixer for a fixed IF frequency of 200 MHz.
94
20
IF
100 MHz
18
300 MHz
Noise Figure (dB) 500 MHz
700 MHz
16
900 MHz
14
12
10
1 2 3 4 5 6 7 8 9 10
RF frequency (GHz)
CMOS mixers is shown in Table 4.1. The reported wideband mixers are implemented
with either 0.13-µm or 0.18-µm CMOS technology and demonstrated in the similar
frequency range. Mixers in [83], and [88]-[90] are measured at a fixed IF frequency, and
therefore they are only wideband RF mixers. Compared with recently published
wideband mixers in [78], [83], [88]-[90], the mixer presented here has advantages in
power requirement, low power consumption, along with acceptable conversion gain, gain
flatness, linearity. As is well known, the wider IF bandwidth deteriorates the noise
performance, however, the noise figure of our proposed mixer still competes well with
the narrow-band IF mixers. Especially compared with works based on the Gilbert-cell
95
topology in [83], [89]-[90], our proposed mixer exhibits significantly better performance,
TABLE 4.1
PERFORMANCE SUMMARY AND REFERENCE TABLE
PLO (dBm) -5 -3 9 -5 5 0
96
in the RF input stage, a conversion gain of 5.5±2.5 dB and RF return loss better than 10
dB are measured over the RF band from 1 to 10 GHz. The proposed mixer also exhibits a
measured IF bandwidth from 100 MHz to 1 GHz, with a conversion gain variation less
than 2 dB, as well as an output return loss better than 10 dB. The chip draws only 7 mA
at a supply voltage of 1.2 V. The measured IP1-dB, IIP3, and SSB noise figure are better
than -16 dBm, -7 dBm, 15 dB throughout the entire RF band, respectively. To the best of
our knowledge, the proposed mixer is the first demonstration of a CMOS Gilbert mixer
exhibiting a flat conversion gain and good input/output matching over large RF and IF
bandwidths.
There are several potential directions for future work on the proposed wideband
mixer.
For the current CMOS prototype, two interstage inductors are used to flatten the
conversion gain within the RF band. In order to save chip area and improve the self-
resonant frequency (SRF) of inductors, the feasibility of coupling the two differential
The measured conversion gain variation in RF band of 1-10 GHz is 5 dB, which
Noise figure analysis on the proposed Gilbert-cell mixer with the common gate input
97
Chapter 5
5.1 Introduction
Since being proposed in the 1930s [91], the electrically scanned phased array
system has been widely used in defense and science applications. The advantages of
this all-RF architecture are its simplicity, improved system-level linearity, (no mixer,
and improvement on the signal-to-noise ratio (SNR) [92]. For MMIC (monolithic
become a good candidate since its continuous down-scaling has facilitated RF and
ability to integrate active RF circuits, digital circuits, transmission lines, and passive
In the architectural view of phased arrays, phase shifting in the RF domain for
each array element has been dominant ever since they were developed [91]. The phase
98
and maintain a constant amplitude and group delay in a certain bandwidth to
minimize the distortion of the signal processing [93]. In addition, advanced phased
array systems with a limited number of antenna paths and very low side lobes
especially depend on phase shifters with high phase resolution. To address the above-
phase shifts at microwave frequencies and is well suited for monolithic integration.
VI VOI = CI•VI
CI
I vector
+
Vin Quadrature Vout
Splitter
VQ
CQ
VGA
Q vector VOQ = CQ•VQ
The block diagram of a vector-sum phase shifter is shown in Fig. 5.1, and the
variable gain amplifier (VGA) of each signal path, the two signals are combined to
99
the quadrature splitter and analog adder are ideal and lossless, the output Vout with the
where M denotes the maximum achievable gain of the VGA, and the gains of the I-
variable gains CI and CQ should be kept as cos(θ) and sin(θ) to realize the adjustable
phase together with the constant amplitude. Note that it is highly desirable for the
variable gain to be a linear function of the control voltage. Otherwise a calibration and
phase of the VGA should be kept as small as possible in order to reduce phase and
In previous works of the 360° vector sum phase shifter, the fully differential
topology is typically adopted [93]-[97]. A balun is placed at the input port to provide
the differential input signal and therefore all the following building blocks are
designed differentially, including the quadrature coupler, VGAs and adder. The
VGAs, where the differential phases are obtained by the roles of transistors rather
than the passive networks, and this results in a simpler system architecture and layout
over the fully differential one for large arrays with hundreds of elements.
Along with the increasing numbers of features and communication standards that
phased arrays is needed. The bandwidth of a vector-sum phase shifter mostly depends
100
on its quadrature splitter and VGA circuits. Note that the bandwidth of on-chip
quadrature splitter is smaller than its off-chip counterpart, especially when using lossy
octave bandwidth can be easily realized. Therefore, it is very important to design the
in-magnitude controlled gain with only one control voltage. Lastly, a wideband
vector-sum phase shifter with over 400° phase range is demonstrated in 0.13-µm
Section 5.4.
Targeted for wideband vector-sum phase shifter applications, the VGA poses
within the control voltage range, etc. Here, we propose a wideband linear-in-
standard 0.13-µm CMOS process, the proposed VGA achieves a 3-dB bandwidth
from 2 to 6.5 GHz and good in-band input/output matching, which is the widest
101
5.2.1 Design Considerations of the Proposed VGA
VGAs are the critical component in vector-sum phase shifters, which play a
significant role for the overall performance of the phase shifter, in terms of phase
control range, phase resolution, insertion loss, phase error, group delay. General
High gain control range, in order to reach the phase range borders.
The relationship between gain and control signal should be as linear as possible.
Good in-band input and output impedance matching to 50 Ω, within the full gain
control range.
Hooper amplifier. The simplified schematic diagram of the proposed VGA is shown
in Fig. 5.2, where the required gain is set by the control voltage VCTL. Note that on-
chip MIM capacitors and poly-resistors are used for AC coupling and DC bias, and
The common gate (CG) amplifier, common drain feedback amplifier, and
resistive shunt feedback amplifier are widely used topologies that can achieve
102
wideband input matching as well as flat and moderate gain over a wide operating
frequency. Here, we utilize the common gate topology as the input stage for wideband
input matching. Ignoring the loading effect of the second stage, the input impedance
1
Zin (5.2)
g m,NM1 sCgs,NM1 1 / R S
where gm,NM1 and Cgs,NM1 are the transconductance and the gate to source capacitance
of the common gate transistor NM1. By selecting RS = 150 Ω and optimizing the size
of NM1 for input matching, an input return loss larger than 10 dB can be easily
Transconductance
CG Input Multiplier Modified Cherry-Hooper Buffer
Fig. 5.2 Schematic diagram of the proposed VGA (DC biasing and decoupling capacitors are
not shown).
B. Transconductance Multiplier
transconductance multiplier. PM1 operates in the linear region and acts as a resistor
Rlinear, while PM2 operates in the saturation region with the gate biased by the control
voltage VCTL. To find the drain source voltage of PM1, PM2 can be considered as a
103
source follower loaded by the equivalent resistor Rlinear of PM1. Applying the basic
transistor model for simplicity, the drain-source voltage of PM1 is derived as:
g m,PM2 R linear
Vds,PM1 VCTL (5.3)
1 g m,PM2 R linear
where gm,PM2 is the transconductance of the PM2 transistor. By properly adjusting the
size of PM2 and the control voltage, the condition gm,PM2×Rlinear »1 can be satisfied.
1 2
I ds,PM1 K Vgs,PM1 Vth Vds,PM1 Vds,PM1 (5.5)
2
where the parameter K is determined by the technology and the size of the transistor,
and Vth denotes the threshold voltage. Vgs,PM1 is the gate-source voltage of PM1,
containing the RF signal. Following (5.4) and (5.5), it can be seen that the linear
and VCTL.
topology inherently reduces the transmission phase error. When the control voltage
increases, the transmission phase of the PM1 stage, which operates in the linear
region, increases; and the transmission phase of the PM2 stage, which operates in the
saturation region, decreases. These two effects are in opposite direction, and the net
104
C. Output Buffer
Cherry-Hooper amplifier with a resistive load is shown in Fig. 5.3(a). The local
feedback resistor RF raises the pole frequencies and enables high-speed operation. The
low-frequency small-signal voltage gain and the output resistance are given by:
Vout g
g m1R F - m1
Vin g m2 (5.6)
R out g -1
m2
where gm1 and gm2 are the transconductances of NMOS transistors M1 and M2. To
further improve the small-signal voltage gain and reduce the output resistance, the
circuit can be modified as shown in Fig. 5.3(b). Replacing NMOS transistors M1 and
M2 by the inverter (M1P, M1N) and (M2P, M2N), the effective gm1 and gm2 can be
increased,
where gm1N , gm1P, gm2N , gm2P are the transconductance of the imverter transistors M1P,
M1N, M2P, M2N, respectively. Thus, the small-signal gain and output matching can be
improved simultaneously. Note that the inductive peaking technique is also employed
in the local feedback loop of the last stage (see LF in Fig. 5.2), which is an effective
approach to improve the bandwidth and gain flatness. A reasonable set of values for
the transistor’ aspect ratios, RF, LF, and the number of stages is determined through
circuit simulation and optimization. The optimized design values of the proposed
105
VDD VDD
IB
M2P
RF Vout
M1P R Vout
F
Vin
M2
M2N
Vin
M1 M1N
(a) (b)
Fig. 5.3 (a) Traditional Cherry-Hooper amplifier. (b) Proposed buffer stage based on the
modified Cherry-Hooper amplifier.
TABLE 5.1
DESIGN VALUES OF WIDEBAND VGA
The proposed VGA was designed and fabricated in a standard 0.13-µm CMOS
process. Fig. 5.4 shows the chip microphotograph. The overall chip area is 0.7 × 0.85
mm2 including the test pads. The VGA was on-wafer measured with ground-signal-
ground probes, and the DC bias pads were all connected to the PCB by bond wires.
106
Operated with a DC supply of 1.2 V, the whole VGA draws 5 mA with a VCTL from
0.3 V to 0.7 V.
from 2 GHz to 6.5 GHz, as shown in Fig. 5.5. Note that the maximum gain always
occurs around 6.1 GHz, due to the inductive peaking technique. The magnitude and
phase of the power gain versus the control voltage VCTL are shown in Fig. 5.6, which
demonstrates a linear-in-magnitude controlled gain and phase error less than 4ºfrom
0.3 V to 0.7 V. The measured S11 remains below -10 dB up to more than 8 GHz, and
the measured S22 is lower than -6 dB across the entire band, as shown in Fig. 5.7.
The measured input referred 1-dB compression point (IP1-dB) is between -25 and -15
RFout
RFin
Core Circuit
107
5
-5
|S21| (dB)
-10
VCTL= 0.3 V
-15
VCTL= 0.4 V
VCTL= 0.5 V
-20
VCTL= 0.6 V
-25 VCTL= 0.7 V
0 1 2 3 4 5 6 7 8
Frequency (GHz)
2.0 160
phase(S21) @ 2GHz
1.8
1.6
80
1.4
phase(S21) @ 3GHz
phase(S21)
|S21|
1.2
0
phase(S21) @ 4GHz
1.0
2 GHz
phase(S21) @ 5GHz
0.8 3 GHz
4 GHz -80
0.6
5 GHz
0.4 6 GHz phase(S21) @ 6GHz
0.2 -160
0.3 0.4 0.5 0.6 0.7
VCTL (V)
Fig. 5.6 Magnitude and phase of S21 versus control voltage VCTL.
108
0
-4
|S22|
|S11|, |S22| (dB)
-8
-12
|S11|
-16
-20
-24
0 1 2 3 4 5 6 7 8
Frequency (GHz)
5.2.3 Conclusions
sum phase shifter applications. The proposed VGA exhibits a 3-dB bandwidth and
good input/output matching simultaneously from 2 GHz to 6.5 GHz and consumes
only 6 mW. Within the gain control range of 14 dB, the absolute phase variation is
less than 4º, which makes it suitable for wideband vector-sum phase shifter
applications.
109
5.3 Wideband Phase-reversible VGA with Linearly Controlled
Gain
5.3.1 Motivation
between 0° and 90° can be achieved by properly weighing the path gains.
single-ended to differential converter (balun) is placed at the input before all critical
blocks of the vector-sum phase shifter, which are designed differentially, including
the quadrature coupler, VGAs and analog adder. Nevertheless, there are several
caused by the inevitable input balun and switch, especially when using lossy CMOS
Switch Iout+
Iin+ +
VGA
Iout-
Quadrature
-
Iin-
Splitter
+
Balun
Balun
RFin RFout
Qin-
Switch Qout-
Qin+ +
VGA
- Qout+
110
To alleviate the above-mentioned design issues, we propose a phase-reversible
VGA, where differential phases are realized by the role of transistors. Fig. 5.9(a)
shows the topology of the full 360°phase shifter using the proposed phase-reversible
VGA. It is noteworthy that the new topology is single-ended and eliminates the input
balun and switch. By properly setting the variable gains CI and CQ of the two VGAs,
the output phase can be continuously tuned, and the output amplitude remains
+
Vin Vout
Quadrature CI,CQ -max,+max
Splitter
(a)
111
VOQ,90º
VOQ,270º
(b)
Fig. 5.9 (a) Block diagram of a full 360ºvector-sum phase shifter using the phase-reversible
VGA. (b) Vector diagram of the full-360ºphase control.
The block diagram of the proposed VGA is shown in Fig. 5.10. The VGA is
multiplier cell [18] with input matching stage, a differential amplifier for common-
mode signal suppression, and output buffer. Note that the required phase-reversible
gain is set by only one control voltage VCTL. In the following parts of this section, the
functional principle and design considerations of each circuit block will be discussed
respectively. The circuits are designed and simulated using the GlobalFoundries 0.13-
µm CMOS design kit. All component values are optimized through Cadence
SPECTRE simulations.
112
RFin VMO+
Common-Gate VMI Gilbert-cell Common-mode
Input Stage Multiplier VMO- suppression circuit
VCTL RFout
VGA for the vector-sum phase shifter application, RF multipliers are suitable
candidates due to the linear relationship between the product signal and the two input
signals. The source-coupled pair is a stage which is widely used in op-amps and other
shown in Fig. 5.11. Note that a common gate (CG) input stage is also designed before
the multiplier cell for wideband impedance matching, as discussed in Section 5.2. The
gate of tail transistor M1 is driven by the output signal of the preceding CG stage vMI.
5.3.2.B. For convenience of circuit analysis, the simplified MOS square-law model is
applied in the saturation region, thus the drain source current ID=K(VGS - VT)2, where
determined by the technology and the size of the transistor. The drain current of each
113
2
K i V2 V
i2 2 1 DC DC (5.8)
2 K1 2 2
2
K i V2 V
i3 2 1 DC DC (5.9)
2 K1 2 2
2i1
iout i2 i3 K 2 VDC VDC
2
(5.10)
K1
2i1
Vout iout RD K2 VDC VDC
2
RD (5.11)
K1
where K1 and K2 are determined by the technology and size of transistor M1 and M2,
respectively. And VDC = VDC+ - VDC-, i.e., the difference between the two DC control
voltages VDC+ and VDC-. Whereas, the tail current i1 can be expressed as
i1 K1 (VMI VT )2 (5.12)
where VMI is the superposition of the small-signal RF voltage vMI and the DC bias
voltage VMI, at the gate of M1. Substituting (5.12) into (5.11), the output voltage of
The output voltage, therefore, has a product term of the DC control voltage VDC and
the RF input vMI, which indicates a linear control of the RF signal’s magnitude. As
114
expected, the output voltage VMO is an odd function of VDC, falling to zero when VDC+
= VDC-, thus the phase-reversible gain can be obtained by properly setting VDC+ and
VDC-. It is observed from Cadence simulations that the proposed topology has low
transmission phase variation within the DC control range. The reason is that the quasi-
gain and all transistors operate within the saturation region, which altogether ensures
Single-Balanced Multiplier
VDD
CG Input Stage RD RD
VDD vMO+ vMO-
RCG i2 i3
M2 M3
VDC+ VDC-
MCG
RFin i1
RS M1
vMI
VMI
B. DC Control Circuit
seen in Fig. 5.11) makes it necessary to design a DC control circuit to minimize the
control complexity. The design of the DC control circuit is critical because it affects
the linearity of the gain control curve and gain tuning range. Here, the source-coupled
115
and VDC-, which requires only one external control terminal VCTL. As shown in Fig.
5.12, one of the differential inputs is biased at a fixed voltage V G2 = 0.9 V and the
VDD
RT
RB RB
VDC+ VDC-
IDC+ IDC-
VCTL MD2 MD3 VG2
ISS
VG1
MD1
1.12
1.10
VDC+
VDC+ & VDC- (V)
1.08
VDC-
1.06
1.04
1.02
0.7 0.8 0.9 1.0 1.1
VCTL (V)
116
The functional principle is explained as follows: tail transistor MD1 works as a
current source, for a fixed tail current ISS. Varying the voltage of VCTL, ISS is switched
alternatively between each branch. When VCTL = VG2, IDC+ = IDC- = 1/2·ISS, while for
other cases, the DC current changes in the opposite direction of each branch, and
the tuning range of VDC+ and VDC-. The simulated DC voltage transfer curve is shown
in Fig. 5.13, which implies a linear transfer relationship when VCTL ranges from 0.8 to
1 V.
The common gate input stage, single-balanced multiplier core, and DC control
circuit are designed and simulated using the GlobalFoundries 0.13-µm CMOS design
kit. The component values are obtained through Cadence SPECTRE simulations for
characteristic and large gain tuning range. The optimized component values are given
in Table 5.2. The typical simulation conditions are: VDD = 1.2 V, and gates of
transistor MCG, M1and MD1 are all biased at 0.6 V. Sweeping the DC control voltage
VCTL from 0.7 V to 1.1 V, the small-signal voltage gain in linear scale are plotted in
Fig. 5.14, as well as the calculated differential gain. It is observed that the variable
differential gain exhibits a linear-in-magnitude gain control curve, for VCTL within the
range of 0.8 to 1 V. Fig. 5.15 shows the phase of the simulated differential gain. It is
seen that the phase shifts 180ºin the vicinity of VCTL = 0.9 V, which indicates the
117
TABLE 5.2
DESIGN VALUES OF PHASE-REVERSIBLE VGA
MCG (µm) 35
M1 (µm) 30
M2, M3 (µm) 15
MD1 (µm) 9
RS (Ω) 150
RD (Ω) 600
RT (Ω) 2000
RB (Ω) 4000
13
Voltage Gain at Output VMO+
12
Voltage Gain at Output VMO-
11
Voltage Gain at Differential Output (VMO+-VMO-)
10
9
8
Voltage Gain
7
6
5
4
3
2
1
0
0.7 0.8 0.9 1.0 1.1
VCTL (V)
Fig. 5.14 Simulated small-signal voltage gain versus the DC control voltage VCTL.
118
0
Phase(Voltage Gain) ( )
o
-50
-100
-150
-200
0.7 0.8 0.9 1.0 1.1
VCTL (V)
Fig. 5.15 Simulated phase of the differential voltage gain versus VCTL.
variable gain with reversible phase is realized. However, there is a large common-
mode (CM) component in the multiplier's output vMO+ and vMO-, as indicated in Fig
inductor LCT is proposed to provide high common-mode rejection, and to improve the
improve the gain flatness, inductor peaking is applied. Instead of applying two
symmetric inductor LCT is adopted, as shown in Fig. 5.16(b). This reduces the layout
size, improves the quality factor, and suppresses the common-mode signals
effectively.
119
VDD VDD
LC LC LCT
RC RC
RC RC
vCO+ vCO-
vCO+ vCO-
vMO+ MC2 MC3 vMO-
vMO+ MC2 MC3 vMO-
VG1
VG1 MC1
MC1
(a) (b)
Fig. 5.16 Schematic diagram of: (a) conventional inductive peaking circuit. (b) peaking
circuit with common-mode suppression.
To illustrate how the common-mode component of the input signals vMO+ and
vMO- is removed effectively from the differential output vCO+ and vCO-, the working
inductors increases the total inductance, because the current has the same direction.
However, with common-mode excitation, these currents are in the opposite direction
which reduces the overall inductance [1]. Consequently, for the common-mode
excitation, the effective load impedance at any frequency is lower than the impedance
of the differential-mode excitation. That is, the common-mode gain is lower than the
120
Common-mode Current
Differential-mode Current
Simulations are performed to find the component values for this stage which
shows reasonable tradeoff between higher common-mode rejection ratio and small-
signal voltage gain, as well as in-band gain flatness. Increasing the value of RC could
increase the overall voltage gain, whereas, it affects the gain peaking at higher
frequency which reduces the bandwidth, and limits the common-mode suppression.
Increasing LCT could improve the common-mode suppression and gain flatness to
some extent. However, due to the increasing parasitics with larger value inductors, the
bandwidth drops rapidly. The final optimized RC and LCT values are 40 Ω and 12 nH
at 6 GHz.
D. Output Buffer
(D-to-S) converter and the modified three-stage Cherry Hooper amplifier for the
121
bandwidth enhancement and output matching purpose. The working principles of
these two circuits are discussed in Section 4.2.3.B and Section 5.2.1.C of this thesis.
The simplified schematic diagram is sketched in Fig. 5.18. On-chip MIM capacitors
and poly-resistors used for AC coupling and DC bias, are not shown in the figure. A
reasonable set of transistors’ aspect ratios, RF, LF, and number of stages are
Table 5.3.
TABLE 5.3
DESIGN VALUES OF OUTPUT BUFFER
122
5.3.3 Measurement Results and Discussion
CMOS process. Fig. 5.19 shows the chip microphotograph, which occupies a die area
of about 1.3 × 0.64 mm2 including bonding pads and on-chip decoupling capacitor
arrays, while the core VGA circuit area is only 0.29 mm2.
Active Area
RFin RFout
A direct on-wafer measurement of the CMOS prototype was carried out using
coplanar ground-signal-ground (GSG) RF probes, and all the DC pads are biased
through the bond wires to the PCB. The VGA consumes approximately 12 mW of
power from a 1.2 V supply throughout the full DC control range from 0.8 to 1 V. Fig.
5.20 shows the simulated and measured |S21| of the VGA for different control voltages
from 0.8 to 1 V in steps of 0.05 V. At 6 GHz the gain varies from -6 to 12 dB. The
gain deviation is less than 5 dB over the 0.6 to 6.8 GHz bandwidth, while the
maximum gain always occurs around 6 GHz due to the inductive peaking at that
123
frequency. Fig. 5.21 shows the simulated and measured input and output reflection
coefficients |S11| and |S22| of the VGA, indicating an input return loss of more than 10
dB over the full 0.6–6.8 GHz bandwidth. However, the 10-dB bandwidth of |S22| is
from 0.6 to 4.6 GHz only, and the worst case always occurs around 6 GHz, which
implies that a tradeoff could be made between the gain peaking and output return loss.
Simulations indicate that the output mismatch and over-peaking of |S21| at 6 GHz can
be improved by further optimizing the peaking inductor LF. Note that the input and
output return loss remain the same at all gain levels, since the input and output stage
are designed independently and therefore are not affected by the control voltage. The
measured phase of |S21| versus the control voltage VCTL is plotted in Fig. 5.22. It can
be observed that a phase shift of 180ºis achieved in the vicinity of 0.9 V, where the
VGA drops to its minimum gain level. To estimate the transmission phase error of the
proposed phase-reversible VGA, the absolute phases of the last two states (VCTL=0.95
and 1 V) are shifted down by 180º, and the equivalent transmission phase against the
control voltage VCTL is plotted in Fig. 5.23. The largest phase variation along the
control voltage is measured to be 8º, at the frequency of 0.5 GHz. Note that the phase
fluctuation around VCTL = 0.9 V is not important since the output voltage of that state
is a nearly zero vector for which the phase can be arbitrary. Lastly, the magnitude of
S21 on a linear-scale is plotted against VCTL at various frequencies in Fig. 5.24, which
results are summarized in Table 5.4. The 1-dB input compression point and the noise
figure are measured at 6 GHz, which are better than -25 dBm and 25 dB respectively,
124
Measured performance of the two designed CMOS VGAs are given in Table 5.5,
and compared with recently published VGAs intended for phase control systems. It is
shown that the proposed VGAs exhibit competitive gain control and phase error
performance, while having the largest bandwidths. Note that the gain control ranges
20
10
-10
|S21| (dB)
-20
-30
Measure @800 mV Sim@800 mV
-40 Measure @850 mV Sim@850 mV
Measure @900 mV Sim@900 mV
Measure @950 mV Sim@950 mV
-50
Measure @1 V Sim@1 V
0 2 4 6 8 10
Frequency (GHz)
-10
-20
|S11|, |S22| (dB)
-60
0 2 4 6 8 10
Frequency (GHz)
125
0.5 GHz
0
-200
Phase(S21) (o)
-400
-600 7 GHz
-800
0.80 0.85 0.90 0.95 1.00
VCTL (V)
-100
0.5 GHz
Equivalent Transmission Phase ( )
o
-200
-300
-400
-500
-600
-700
7 GHz
-800
0.80 0.85 0.90 0.95 1.00
VCTL (V)
126
4.0
1 GHz
3.5 2 GHz
3 GHz
3.0 4 GHz
5 GHz
2.5 6 GHz
Mag(S21)
2.0
1.5
1.0
0.5
0.0
0.80 0.85 0.90 0.95 1.00
VCTL (V)
TABLE 5.4
PERFORMANCE SUMMARY OF THE PROPOSED PHASE-REVERSIBLE VGA
127
TABLE 5.5
COMPARISON TABLE
Frequency
5.2~5.9 1.9 5.2~5.7 2~6.5 0.6~6.8
(GHz)
Gain control
20 22 23 14 18
(dB)
5.3.4 Conclusions
linear-in-magnitude controlled gain, with only one control voltage. To the best of our
knowledge, it is the first time that the phase-reversible concept in VGAs is proposed,
which facilitates a novel and simpler architecture of the full 360°vector-sum phase
ranging from 0.6 to 6.8 GHz, while the gain variation is less than 5 dB. Throughout
gain control range of 18 dB and maximum transmission phase variation of 8º. The
phase reversion characteristic is observed in the vicinity of 0.9 V. The measured input
128
return loss is better than 10 dB at frequencies of interest and the chip draws only 10
Range
5.4.1 Introduction
CMOS technologies [91], [102]. However, the substrate losses and the low Q-factors
of the passive components still impede the realization of CMOS phase shifters in
passive networks. Therefore, CMOS phase shifters based on active networks have
become mainstream and occupy a very small chip area. The vector-sum approach is a
good topology of choice, due to its capability of continuous and adjustable phase
control, and elimination of varactor diodes. Additionally, the output phase error
resulting from the I/Q amplitude mismatch in the vector-sum phase shifter can be
compensated by adjusting the I- and Q-path gains accordingly. This results in a design
In previous works of the 360° vector sum phase shifter, the fully differential
topology is typically adopted, as illustrated in Fig. 5.8 [91], [93], [94]. The quadrature
splitter, two variable gain amplifiers (VGAs) and the analog summing circuit are the
core part of the phase shifter and are designed differentially. Baluns (single-to-
differential, and differential-to-single) are placed at the input and output ports to
129
provide a single-ended 50 Ω interface to the measurement system. A digital-to-analog
converter (DAC) synthesizes the necessary control logic signals for switches and
VGAs to provide the desired gains and polarities of each I/Q path. After adding up the
weighted I- and Q-vectors, an interpolated output signal with a synthetic phase θ and
magnitude M is obtained,
Qout
tan 1 and M Iout +Qout
2 2
(5.15)
Iout
Nevertheless, there are three major drawbacks of this traditional topology. The first
drawback is the limitation in small-signal gain and bandwidth due to the inevitable
passive components, such as the input balun and switch, especially when using lossy
circuit is usually required to control switches and VGAs, which increases the control
complexity, design cost, power consumption and chip size. Note that it is desirable to
have the variable phase shift with only one DC control signal, in order to minimize
control complexity. Lastly, the fully differential configuration requires larger power
reversible VGA. To the best of the authors' knowledge, it is the first full-360ºvector-
sum phase shifter using the single-ended configuration and only one control voltage.
demonstrated in a standard 0.13-µm CMOS process. Section 5.4.2 describes the phase
building blocks are discussed in Section 5.4.3, while measurement results are
130
presented and compared with recently published wideband vector-sum phase shifters
in Section 5.4.4.
Fig. 5.25 illustrates the block diagram of the proposed 360ºvector-sum phase
shifter, in which most building blocks are single-ended, requiring no input balun and
switches.
+
vin Quadrature Output vout
Splitter CI,CQ -max,+max Buffer
Fig. 5.25 Block diagram of the proposed 360ºvector-sum phase shifter using the phase-
reversible VGA.
The proposed vector-sum phase shifter consists of six functional blocks: the
external quadrature splitter, input stage for wideband impedance matching, phase-
reversible VGA core, DC-control circuit, analog adder, and output buffer. Assuming
that the magnitude of the input I- and Q-signals is unity and all circuit blocks have a
fixed gain of unity except the VGA, the output vout with the desired phase shift θ can
expressed as
131
vout CI vI CQ vQ
CI sin ωt CQ cos ωt (5.16)
M sin ωt θ
where M denotes the maximum differential gain of the VGA, and gains of the I- and
adjustable phase shift, a compact DC control circuit is also proposed to replace the
generator exhibits sine- and cosine-like voltage transfer curves simultaneously with
only one external control voltage. Therefore, the proposed 360ºvector-sum phase
shifter can be implemented with a single-ended input signal and controlled by only
one DC voltage, which is advantageous regarding the control complexity, chip size,
the role of transistors rather than passive balun and switches. Unfortunately, the
output signal (vOI or vOQ) of the phase-reversible VGA inherently contains a large
common-mode component. Thus, in order to realize the desired phase shift and
maintain a constant magnitude, the analog adder and output buffer should provide
phase and magnitude performance for certain phase states is performed. Taking into
account the unwanted common-mode component in the phase shifter output, (5.16) is
rewritten as,
132
vout CI vI CQ vQ
Mcosθ+M CM sin ωt Msinθ+M CM cos ωt (5.17)
M' sin ωt +φ
where MCM = M/CMRR denotes the common-mode gain of the whole phase shifter,
and the common-mode rejection ratio (CMRR) is defined as the overall differential
gain over the common-mode gain. By varying the angle parameter θ, the locus of the
Provided that MCM is much smaller than M, a phase control range of full-360ºis
(5.18)
M 2 2MM CM sin θ+45 2 M
2 2
CM
Msinθ+MCM
M
θ
M’
(MCM, MCM)
φ
Mcosθ+MCM 0 I
Fig. 5.26 Locus of the output vector with the presence of a small common-mode component.
133
From (5.18) it can be seen that the output magnitude is a function of θ. The maximum
within 2 2M CM , which can be reduced by increasing the CMRR of the whole phase
shifter.
In this section, the functional principle and design considerations of key building
blocks are discussed. Circuits are designed using the standard 0.13-µm CMOS
process models and all component values are optimized through Cadence SPECTRE
facilitates the overall performance, since the external quadrature coupler module can
easily achieve multi-octave bandwidth and exhibit less I/Q mismatch, compared to its
Thus, the design of the wideband quadrature splitter is not given, as it is beyond the
Common gate (CG) stage and resistive shunt feedback amplifier are two
Section 5.2.1, the common gate (CG) input stage can feature desirable properties for
134
transconductance gm,CG of a CG stage is restricted by the input matching condition,
and cannot be freely traded off with other performance parameters, such as the 3-dB
employed here as the input stage for both I- and Q-path. After a 50 Ω-matched
quadurature splitter, the input RF signal is divided into I- and Q-path with 90ºoffset.
For each path, a current-reuse shunt feedback amplifier is employed as the input stage.
As shown in Fig. 5.27, the complementary pair MNF-MPF are stacked to efficiently
the input and output nodes, offers the feasibility of self-biasing of the gate voltage.
resistor RF and the effective transconductance. The impedance seen at the input of the
R F rds
Zin (5.19)
1 g m,in rds
the transconductance gm,in, while unlike the common gate input stage, the matching
condition of the feedback topology can still be maintained by properly selecting the
135
VDD
MPF
RFI(Q) RF vI(Q)
MNF
Fig. 5.27 The current-reuse resistive shunt feedback stage for I/Q path.
Both common gate input stage and resistive shunt feedback input stage are unloaded
in simulations. Note that when connected to the latter stages, the gate parasitic
which is similar to an open circuit at low frequencies. The element values for both
topologies are optimized for input impedance matching and similar small-signal
voltage gain at low frequencies for fair comparison. Fig. 5.28 plots the simulated
input reflection coefficient S11 and small-signal voltage gain on a linear scale, for both
topologies. From the figure it is observed that, with a similar low-frequency voltage
gain of 4, the CG input stage exhibits a worse gain roll-off against frequency,
compared to the current-reuse input stage with resistive shunt feedback. Whereas both
topologies could achieve a simulated input return loss better than 10 dB up to 15 GHz.
In summary, the resistive shunt feedback stage is a favorable topology for UWB
applications regarding gain flatness and wideband input matching, and is therefore
136
0
-2
4
-6
-8
|S11| (dB)
-12
-14
2
-16
-18
0 3 6 9 12 15
Frequency (GHz)
B. DC Control Generator
The middle state of the voltage transition in the conventional folding ADC circuit
(as shown in Fig. 5.29, two-staged folding circuit), is employed here for generating a
generator is shown in Fig. 5.30, which consists of six source coupled pairs, with
various reference voltages at a step voltage ΔVref of 0.2 V. The maximum reference
voltage becomes large and tends to drive the upper transistor into the linear region and
therefore distorts the voltage transfer curve when using thin-gate transistors in a 0.13-
µm CMOS. Although the step of reference voltage ΔVref can be further lowered by
increasing the aspect ratio of the input transistors, the circuit will suffer from more
power consumption and lower precision due to the process variations and device
137
transistors which allow a supply voltage of 3 V, are used here to design the proposed
DC control circuit. Note that the reference voltages are generated by a resistor ladder
composed by 15 identical resistors, hence the reference voltages can follow on the
VDD
VDC+ VDC-
VRef1 VRef2
VCTL
VEE
RT
RB RB
VS+ VS-
VG0 MD1
VG0 MD1 VG0 MD1
VCTL VEE
RT
RB RB
VC+ VC-
138
Optimized device values are obtained through co-simulations with other
VS- and VC+-VC- are properly designed, to ensure that the I-path and Q-path VGAs
(Fig. 5.32) operate within the linear-in-magnitude gain range. Therefore, the sine and
VGAs. The simulated quasi-differential control signals are shown in Fig. 5.31, which
indicates that within a control voltage ranging from 1 to 2 V, sine and cosine-like
transfer curves can be obtained simultaneously for more than a full period.
1.30
VS+
1.25 VS-
VC+
Output Control Signal (V)
1.20 VC-
1.15
1.10
1.05
1.00
0.95
1.0 1.2 1.4 1.6 1.8 2.0
VCTL (V)
The VGA plays a significant role for the overall performance of vector-sum
phase shifters, with respect to insertion loss, phase error and phase control range.
(discussed in Section 5.3.2) is employed for weighing the amplitude of the I- and Q-
139
signal, which realizes the linear-in-magnitude controlled gain and reversible output
phase. The simplified circuit schematic is shown in Fig. 5.32. The inter-stage node D1
parasitic capacitance and relatively low node resistance presenting at the source of the
reduce the effect of the parasitic capacitance at node D1 and therefore achieves a
provided by the proposed DC control generator, ensure that the two VGAs operate
within the linear-in-magnitude gain range, the sine and cosine-shaped voltage transfer
curves of the DC control generator can be translated to the output of VGAs. To verify
the analysis and insights, Cadence AC simulations at 3 GHz are performed on the
proposed I- and Q-path VGAs together with the DC control circuit. The small-signal
voltage gain of two VGAs is plotted in linear scale against VCTL, as shown in Fig.
5.33. It indicates that the sine-shaped (vOI+, vOI-) and cosine-shaped (vOQ+, vOQ-) gain
control curves can be obtained for more than one cycle, with only one DC control
voltage VCTL ranging from 1 to 2 V. Therefore, the output phase, which relies on the
sine- and cosine-like gain of the I- and Q-path, can be continuously adjusted, while
140
VDD VDD
RM RM RM RM
CP CP
LM LM
vI MM1 vQ MM1
(a) (b)
Fig. 5.32 Schematic diagram of (a) I-path VGA. (b) Q-path VGA.
10
vOI+
vOI-
8 vOQ+
Small-Signal Voltage Gain
vOQ-
0
1.0 1.2 1.4 1.6 1.8 2.0
VCTL (V)
141
D. Gilbert-Cell Adder With Common-Mode Suppression
differential I- and Q-signals in the current domain [11]. The simplified schematic is
shown in Fig. 5.34, where the four output signals (vOI+-vOI- and vOQ+-vOQ-) from the I-
and Q-path VGAs are fed to the gate of upper transistors. The four branches are cross-
connected to have one differential output. Note that the inductive peaking technique is
also applied here for the bandwidth enhancement. The peaking inductance LS and
other component values are optimized for the targeted bandwidth. Fig. 5.35 shows the
differential voltage gain versus VCTL, for both phase and magnitude performance. It
indicates that the continuous phase shift of over 400º is accomplished in the
VDD
LS LS
RS RS
vsum+ vsum-
142
0 1.5
Phase of the differential gain@3 GHz
Magnitude of the differential gain@3 GHz
-100 1.4
Simulated Magnitude
Simulated Phase (o)
-200 1.3
-300 1.2
-400 1.1
-500 1.0
1.0 1.2 1.4 1.6 1.8 2.0
VCTL (V)
small-signal voltage gain of VGAs. The Gilbert-cell adder based on two source-
Ignoring any effects caused by device or process mismatch, the CMRR of this stage,
which is defined as the ratio between differential-mode gain Adm and the common-
A dm
CMRR 20lg( )
A cm
gmZL
20lg( ) (5.20)
1
Z L /( +2Zds,S1 )
gm
20lg(1+2g m Zds,S1 )
impedance composed of RS in series with LS, and Zds,S1 is the equivalent impedance
seen at the drain node of lower transistor MS1, which consists of the drain-source
143
resistance of MS1 in parallel with the parasitic capacitance present at this node. Owing
be satisfied, i.e., the common-mode gain is lower than the differential-mode gain,
Fig. 5.36, which drops when frequency increases, caused by the decreased Zds,S1.
30
Gilbert-cell Adder
D-to-S Converter
25
Simulated CMRR (dB)
20
15
10
5
0 5 10 15 20
Frequency (GHz)
Fig. 5.36 Simulated CMRR versus frequency of the stages after the VGAs.
network is designed. The simplified schematic is shown in Fig. 5.37. The bias
circuitry and decoupling capacitors are not shown. Note that, the D-to-S converter
exhibits common-mode rejection [84]. As shown in Fig. 5.36, the simulated CMRR of
the D-to-S converter is larger than 10 dB throughout the target band, which further
144
D-to-S Converter Modified 2-Stage Cherry-Hooper Buffer
inductor LF in the last stage for inductive peaking purposes at the higher passband,
which successfully alleviates the severe gain roll-off against frequency. All
bandwidth, small-signal gain and input/output matching criteria. The design values for
the entire vector-sum phase shifter are summarized in Table 5.6. Note that gate length
of the thick-gate transistors MD1-MD3 is 0.28 µm, and for the other transistors is 0.13
µm.
145
TABLE 5.6
DESIGN VALUES OF THE PROPOSED VECTOR-SUM PHASE SHIFTER
flexible and robust measurement. Die microphotographs of the phase shifter and DC
control generator are shown in Fig. 5.38 (a) and (b). The die size is 1.20×1.10 mm2
and 0.64×0.47 mm2 respectively, mainly determined by the pad frame. The core area,
the total area. The chips are mounted on Rogers RO4003 substrate with DC pads
wire-bonded for bias and tuning purposes, while RF signals are measured through
coplanar ground-signal-ground (GSG) on-wafer probes. The phase shifting and large-
signal performance are measured using Rohde and Schwarz ZVA50 vector network
146
(a)
(b)
Fig. 5.38 Microphotographs of: (a) vector-sum phase shifter. (b) DC control generator.
90ºhybrid coupler (Krytar, amplitude imbalance ≤ ±0.5 dB, phase imbalance ≤ ±10º
@ 1-18 GHz) for generating the single-ended I- and Q-signal. The following
measurements have been carried out under supply voltages of 1.5 V and 3V, for the
phase shifter and DC control generator, respectively. The current consumption of the
147
phase shifter is 14 mA, and 1.5 mA is consumed by the DC control generator, which
A total of thirty states of the two-port S parameters are measured by tuning the
control voltage VCTL from 1 to 2 V. Since the external 90ºhybrid coupler isolates the
input terminal from the rest of the chip, the phase tuning by the control voltage VCTL
does not disturb the |S11| performance. Similarly, |S22| also changes very little among
different phase states, since a constant output impedance is set by the output buffer
stage. Fig. 5.39 displays the typical simulation and measurement results of |S11| and
|S22|, which indicates that the measured input and output return loss are better than 10
dB and 5 dB from 2 to 16 GHz. Note that the measured output return loss of this
phase shifter is still acceptable, if the subsequent circuit block after the phase shifter
should possess a good input matching. Fig. 5.40 shows the measured insertion loss,
together with the simulated curves. It can be observed that the maximum measured
|S21| always occurs around 14 GHz, which ranges from -3.5 and -1 dB for all the 30
states, and the 3-dB gain bandwidth is measured slightly larger than 2-16 GHz. Here,
we can find a general agreement between simulated and measured S-parameters. The
relatively large discrepancies at high frequencies are due to the lack of EM models of
interconnects.
148
0
-10
-20
-30
Simulated S11
Simulated S22
-40 Measured S11
Measured S22
-50
0 4 8 12 16 20
Frequency (GHz)
0
Simulated
-5
Measured
-10
S21 (dB)
-15
-20
-25
0 2 4 6 8 10 12 14 16 18 20
Frequency (GHz)
Subsequently, using the measured |S21| in Fig. 5.40, the root-mean-square (RMS)
amplitude error is calculated at each measured frequency [93] and shown in Fig. 5.41,
which has a maximum value of 1.05 dB throughout the 2-16 GHz band.
149
1.1
1.0 Measurement
Simulation
RMS Amplitude Error (dB) 0.9
0.8
0.7
0.6
0.5
0.4
0.3
2 4 6 8 10 12 14 16
Frequency (GHz)
Fig. 5.41 Measured and simulated RMS amplitude error versus frequency.
The phase performance of this CMOS prototype is also characterized. Note that
the phase shift of this CMOS prototype is continuously adjustable. In total, thirty
states of insertion phases are measured by tuning the control voltage VCTL from 1 to 2
V, which are equally distributed in steps of 15°at the center frequency of 9 GHz. The
reference state is set at VCTL = 1 V, and therefore subtracted from all the measured
phase responses. Fig. 5.42 shows the relative phase shift versus frequency for all
phase states, indicating an adjustable phase shift over 400°within the 2-16 GHz band.
The RMS phase error, which is commonly used to characterize the phase performance
of digital phase shifters [93], is also applied here. As shown in Fig. 5.43, the measured
RMS phase error is less than 6.3ºover the 2-16 GHz band.
150
450
400
300
250
200
150
100
50
0
2 4 6 8 10 12 14 16
Frequency (GHz)
6 Measurement
Simulation
o
RMS Phase Error ( )
2 4 6 8 10 12 14 16
Frequency (GHz)
Fig. 5.43 Measured and simulated RMS phase error versus frequency.
16 GHz in steps of 1 GHz, when the control voltage VCTL = 1.5 V. The measured
input referred 1-dB compression point (IP1-dB) versus frequency is plotted in Fig. 5.44,
which reveals a minimum value of -20 dBm at the frequency of 2 GHz, and a
151
maximum value of -15 dBm at 16 GHz.
-10
-15
-20
-25
2 4 6 8 10 12 14 16
Frequency (GHz)
A performance summary and comparison between this work and other recently-
published vector-sum phase shifters is shown in Table 5.7. Note that our work and [94]
report a phase range of more than 360°, which is beneficial for narrow-band true time
delay (TTD) applications by realizing a larger time delay range. The proposed vector
phase shifter exhibits the largest bandwidth, while still possessing some advantages in
terms of low control complexity, good in-band input matching, low RMS amplitude
and phase error. With all the competitive performance figures, the proposed CMOS
applications.
152
TABLE 5.7
PERFORMANCE SUMMARY AND COMPARISON TABLE
This
[94] [93] [95] [91] [96] [97]
Work
Bandwidth
2-16 2-3 2.3-4.8 4.3-6.1 5-18 6-18 18-32
(GHz)
Gain (dB) -5~-2 0~5.5 -8~-3 2~4 -2~-0.2 11~19.5 -2~0
Input return loss > 10, only @
> 10 >10 >2 > 10 >3 N.A.
(dB) 11.2~15.2 GHz
Phase range (°) 435 360 360 360 360 360 810
RMS amplitude
≤ 1.05 ≤ 1.2 ≤ 1.1 ≤ 0.5 ≤ 1.7 ≤ 1.05 N.A.
error (dB)
RMS phase
≤ 6.3 ≤5 ≤ 1.4 ≤ ±9 ≤ 10 ≤ 5.6 N.A.
error (º)
Power (mW) 25.5 24 19 29.2 8.7 61.7 800
1 3 5 3 10 8 1
Control voltages
analog analog analog analog analog digital analog
IP1-dB (dBm) -20~-15 -13.5 0.6~3 3 -6.7~-4 -39~-36 N.A.
5.4.5 Conclusions
realizes a continuously adjustable phase control range of more than 400ºwith only
one DC control voltage. The CMOS prototype exhibits a measured 3-dB bandwidth of
2-16 GHz, and the average insertion loss ranges from 5 to 2 dB, associated with all
measured states. The RMS gain and phase error are less than 1.05 dB and 6.3°over
the measured frequency span. The total power consumption is 25.5 mW, where 21
control circuit. Wideband matching networks are also adopted to ensure good
impedance-matching. The measured input and output reflection coefficient are better
than -10 and -5 dB, respectively, throughout the entire band. To the best of the
153
authors' knowledge, it is the first full-360ºphase shifter demonstrated in CMOS
technology using the single-ended configuration and one control voltage, without
input balun and switches. Measured results show that this proposed work competes
quite well with other full-360ºvector-sum phase shifters, especially for wideband
applications.
154
Chapter 6
6.1 Summary
The demand for higher frequency and larger bandwidth operation of RF front-end
In this thesis, a subharmonic mixer with a novel biasing scheme is proposed using
the conventional cascode FET cell. The proposed SHM, operating at a low supply voltage
Next, to address the design issues of wideband mixer regarding both the RF and IF
mixer exhibits an RF bandwidth from 1 GHz to 10 GHz and IF bandwidth from 100 MHz
to 1 GHz with a conversion gain of 5.5±2.5 dB. Due to the superiority of the proposed
155
topology, both port impedance matching and good gain flatness are achieved throughout
Lastly, the vector-sum phase shifter, which is among the most popular active phase
range, as well as minimizing the control complexity. Two wideband VGAs with linear-
in-magnitude controlled gain are proposed for vector-sum phase shifter applications, one
of which also exhibits the reversible output phase. Based on the proposed phase-
reversible VGA, a 2-16 GHz vector-sum phase shifter with over 400°phase control range
This thesis has contributed to the field of microwave engineering in several ways
regarding the design and application of low voltage subharmonic mixer, wideband mixer,
where the use of a subharmonic mixer can reduce the significant problem of LO self-
mixer employing the conventional cascode FET cell. The implementation in discrete
circuit form with measurement results was presented. Furthermore, due to the superiority
of the proposed biasing scheme, this subharmonic mixer had a conversion gain and other
156
performance metrics similar to fundamental mixers using the conventional cascode FET
cell, and the performance comparison was made and summarized. This circuit was the
first subharmonic mixer using Class-B biasing on a conventional mixer topology, and it
achieves low voltage and low LO power requirement as well as the high conversion gain,
regardless of fabrication technology used. Note that the aim of the discrete design is to
integrated circuit can drastically reduce these problems and increase the frequency of
operation further. This circuit also provides the foundation for a more advanced higher-
spectral coverage of the RF band with a proper adjustment of the LO frequency for a
fixed IF. Meanwhile, the IF bandwidth also needs to be sufficiently large as it limits the
allowed spectral width of individual channels in UWB systems. For a wideband mixer
design, it is desirable but challenging to have broadband impedance matching at the input
and output ports to ensure effective power transfers. Chapter 4 provided a CMOS 1-10
GHz mixer based on the modified Gilbert-cell topology. Adopting the CG transistor as
the RF stage, the proposed mixer inherently has wideband impedance matching at the RF
port, however the transconductance of the RF stage is limited and therefore degrades the
the RF stage, high conversion gain can be achieved while maintaining excellent gain
157
conversion gain. An interstage inductor is also employed to alleviate the conversion gain
roll-off at higher frequencies. In addition, the proposed mixer adopts on-chip LO and IF
active baluns to facilitate the interface with single-ended 50 Ω measurement systems, and
process, the proposed wideband mixer is measured with an RF bandwidth of 9 GHz from
1 to 10 GHz and IF bandwidth of 900 MHz from 100 MHz to 1 GHz, with a conversion
gain of 5.5±2.5 dB. Note that the reflection coefficients for both RF and IF ports
throughout the whole band are lower than -10 dB. With a compact circuit layout, it can be
integrated with other RF building blocks and the baseband digital circuitry for system-on-
regarding gain flatness and wideband impedance matching. Next, the feasibility of output
shifter with the single-ended input signal. Subsequently, employing the proposed phase-
one DC control voltage, by means of the quasi-sine and cosine DC control generator.
shifter exhibits a continuously adjustable phase shift of more than 400ºthroughout the
entire band of 2-16 GHz, and the average in-band insertion loss varies from 5 to 2 dB,
associated with all measured phase states. The RMS gain and phase error is less than 1.05
dB and 6.3° respectively, over the measured frequency span. The total power
158
consumption is 25.5 mW. The measured input and output reflection coefficient are lower
than -10 and -5 dB throughout the 2-16 GHz band. To the best of the authors' knowledge,
6.3 Recommendations
The proposed 2× subharmonic mixer topology becomes even more attractive when
the operational frequency increases, since it is more difficult to design a local oscillator at
and verified at a much higher frequency, for example, 40 GHz or above, in monolithic IC
with the use of the proposed subharmonic mixer. An increase in the order of subharmonic
using the basic concept provided for the proposed 2× subharmonic mixer. However, this
may be challenging using the proposed topologies since it would require splitting the LO
into 4 or 8 phases. Furthermore, a study into increasing the performance of the proposed
Regarding the CMOS wideband mixer design, gain flatness can be further improved,
159
linearity version of the proposed wideband mixer could be designed to further increase
the attractiveness of using the proposed topology in a variety of applications, besides the
Last but not least, it is challenging to design the on-chip quadrature coupler for
wideband applications, due to the substrate losses and the inferior Q-factors of the
wideband quadrature coupler as the I/Q splitter for vector-sum phase shifter applications
160
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