Dismantling information
The document is intended for use by end-of-life recyclers or treatment facilities. It provides
the basic instructions for the disassembly of LG products to remove components and
materials requiring selective treatment.
Product Identification
Type of Product Monitor
Model name 27GS60QC-B
This document covers derivation model
which has same conceptual design and
dismantling process
Displays must be stored in accordance with the requirements stipulated in Appendix VIII
(1) or (2) of Directive 2012/19/EU and must, amongst other things, be stored in a
weatherproof manner. Containers with covers must be used when storing and transporting
the Displays.
Contents
1. Materials and components for Selective Treatment
2. Tools Required
3. Product Disassembly Process
4. Disassembly of External enclosure
1. Materials and components for Selective Treatment
Displays may contain hazardous substances like Pb and BFRs which are covered by exemptions under
the RoHS directive. However, the majority is present in the PCB assembly. In order to reduce emissions
as much as possible, a complete disposal of the old appliance is required. This treatment may only be
performed in authorized handling plants.
Materials and components Notes Included Location
Printed Circuit Boards (PCB) or With a surface greater
O
Printed Circuit Assemblies (PCA) than 10 square cm
For Remote control -
Batteries
Internal batteries -
Mercury containing components display backlights -
Includes background
Liquid Crystal Displays (LCD) with a illuminated displays with
O
surface greater than 100 square cm gas discharge lamps
Capacitors / condensers (Containing
-
PCB / PCT)
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in -
diameter or height
Power cord -
External electric cables cords
Signal cable O
Gas Discharge Lamps -
Plastics containing Brominated Flame
-
Retardants
Components and waste containing
-
asbestos
Components, parts and materials
-
containing refractory ceramic fibers
Components, parts and materials
-
containing radioactive substances
2. Tools Required
List the type that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description Tool information
Screw driver
Nipper
Plastic Hera Jig
3. Product Disassembly Process
1. PCBs and LCD Module
Use a screwdriver to remove the four screws in the red circle at the bottom of the rear
shell, and use the disassembly tool to remove the rear shell
Use a screwdriver to remove 10 motherboard, iron plate, and wall mounted screws, as
shown in the red circle in the picture.
After removing the screws, remove the red framed iron sheet, tear off the yellow
framed 2x acetic acid tape and 2x Mylar, and remove the wall hanging at the green
framed position
Remove the button cap from the front frame buckle, as shown in the red box in the picture.
Pull out the motherboard and mirror section wires from the interface, as shown in the yellow
box in the picture, and remove the motherboard. Remove the double foam on the back of
the motherboard
Use a screwdriver to remove 13 screws from the middle frame and remove the middle
frame from the mirror surface
Use a screwdriver to remove 13 screws from the middle frame and remove the middle
frame from the mirror surface
LCD module(together with their casing) is only left after all other parts like electronic
units and casing have been removed.
Main Board Control Board LCD module
Module PCB
3. Product Disassembly Process
2. Power cord and signal cables
A Power cord plugged into the back of the display can easily be removed by hand or
cables are provided as de-attached from the product
Adapter, DP cable
4. Capacitors > 25 mm (N/A)
Capacitors > 25 mm are located in the power supply units and can be removed by
nipper : doesn't exist (Cap size is under 25mm)
4. Disassembly of External enclosure
Unscrew 2ea screws and stand remove stand base assy
Unscrew 2ea screws and stand remove stand neck assy
Unscrew 4ea screws
Remove the back cover using a plastic Hera jig.
(*Be careful when remove the bottom(blue color) area to avoid Tcon COF damage)
Example
