LM158, LM158A, LM258, LM258A

LM2904, LM2904B, LM2904BA, LM2904V

LM358, LM358A, LM358B, LM358BA
SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024

Industry-Standard Dual Operational Amplifiers

1 Features devices provide outstanding value for cost-sensitive
applications, with features including low offset (300µV,
• Wide supply range of 3V to 36V (B, BA versions)
typical), common-mode input range to ground, and
• Quiescent current: 300µA/ch (B, BA versions)
high differential input voltage capability.
• Unity-gain bandwidth of 1.2MHz (B, BA versions)
• Common-mode input voltage range includes The LM358B and LM2904B op amps simplify circuit
ground, enabling direct sensing near ground design with enhanced features such as unity-gain
• 2mV input offset voltage maximum at 25°C (BA stability, lower offset voltage maximum of 3mV (2mV
version) maximum for LM358BA and LM2904BA), and lower
• 3mV input offset voltage maximum at 25°C (A, B quiescent current of 300µA per amplifier (typical).
versions) High ESD (2kV, HBM) and integrated EMI and RF
• Internal RF and EMI filter (B, BA versions) filters enable the LM358B and LM2904B devices to be
• On products compliant to MIL-PRF-38535, all used in the most rugged, environmentally challenging
parameters are tested unless otherwise noted. On applications.
all other products, production processing does not
The LM358B and LM2904B amplifiers are available
necessarily include testing of all parameters.
in micro-sized packaging, such as the SOT23-8, as
2 Applications well as industry standard packages including SOIC,
TSSOP, and VSSOP.
• Merchant network and server power supply units
• Multi-function printers Package Information
• Power supplies and mobile chargers PART NUMBER(1) PACKAGE PACKAGE SIZE(2)

• Motor control: AC induction, brushed DC, LM358B, LM358BA, LM2904B,

LM2904BA, LM358, LM358A,
brushless DC, high-voltage, low-voltage, LM2904, LM2904V, LM258,
D (SOIC, 8) 4.9mm × 6mm
permanent magnet, and stepper motor LM258A
• Desktop PC and motherboard LM358B, LM358BA, LM2904B,
PW (TSSOP,
• Indoor and outdoor air conditioners LM2904BA, LM358, LM358A, 3mm × 6.4mm
8)
LM2904, LM2490V
• Washers, dryers, and refrigerators
LM358B, LM358BA, LM2904B,
• AC inverters, string inverters, central inverters, and LM2904BA, LM358, LM358A, DGK (VSSOP,
3mm × 4.9mm
voltage frequency drives LM2904, LM2904V, LM258, 8)
LM258A
• Uninterruptible power supplies
LM358B, LM358BA, LM2904B, DDF (SOT-23,
• Electronic point-of-sale systems LM2904BA 8)
2.9mm × 2.8mm

3 Description LM358, LM2904 PS (SO, 8) 6.2mm × 7.8mm

LM358, LM2904, LM358A,
P (PDIP, 8) 9.81mm × 9.43mm
The LM358B and LM2904B devices are the LM258, LM258A
next-generation versions of the industry-standard LM158, LM158A JG (CDIP, 8) 9.6mm × 6.67mm
operational amplifiers (op amps) LM358 and LM2904, LM158, LM158A FK (LCCC, 20) 8.89mm × 8.89mm
which include two high-voltage (36V) op amps. These
Family Comparison
LM358B LM2904B LM358 LM2904V LM258 LM158
Specification LM2904 Units
LM358BA LM2904BA LM358A LM2904AV LM258A LM158A
Supply voltage 3 to 36 3 to 36 3 to 30 3 to 26 3 to 30 3 to 30 3 to 30 V
±3 ±3 ±7 ±7 ±5 ±5
Offset voltage (max, 25°C) ±7 mV
±2 ±2 ±3 ±2 ±3 ±2
20 / 250 20 / 150 20 / 150
Input bias current (typ / max) 10 / 35 10 / 35 20 / 250 20 / 250 nA
15 / 100 15 / 80 15 / 50
Gain bandwidth product 1.2 1.2 0.7 0.7 0.7 0.7 0.7 MHz
Supply current (typ, per channel) 0.3 0.3 0.35 0.35 0.35 0.35 0.35 mA
ESD (HBM) 2000 2000 500 500 500 500 500 V
Operating ambient temperature −40 to 85 −40 to 125 0 to 70 −40 to 125 −40 to 125 −25 to 85 −55 to 125 °C

(1) For all available packages, see the orderable addendum at the end of the data sheet.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

Table of Contents
1 Features............................................................................1 7 Detailed Description......................................................25
2 Applications..................................................................... 1 7.1 Overview................................................................... 25
3 Description.......................................................................1 7.2 Functional Block Diagram: LM358B, LM358BA,
4 Pin Configuration and Functions...................................3 LM2904B, LM2904BA................................................. 25
5 Specifications.................................................................. 4 7.3 Feature Description...................................................26
5.1 Absolute Maximum Ratings........................................ 4 7.4 Device Functional Modes..........................................26
5.2 ESD Ratings............................................................... 4 8 Application and Implementation.................................. 27
5.3 Recommended Operating Conditions.........................5 8.1 Application Information............................................. 27
5.4 Thermal Information....................................................5 8.2 Typical Application.................................................... 27
5.5 Electrical Characteristics: LM358B and LM358BA..... 6 8.3 Power Supply Recommendations.............................28
5.6 Electrical Characteristics: LM2904B and 8.4 Layout....................................................................... 28
LM2904BA.....................................................................8 9 Device and Documentation Support............................30
5.7 Electrical Characteristics: LM358, LM358A.............. 10 9.1 Receiving Notification of Documentation Updates....30
5.8 Electrical Characteristics: LM2904, LM2904V.......... 11 9.2 Support Resources................................................... 30
5.9 Electrical Characteristics: LM158, LM158A.............. 12 9.3 Trademarks............................................................... 30
5.10 Electrical Characteristics: LM258, LM258A............ 14 9.4 Electrostatic Discharge Caution................................30
5.11 Typical Characteristics: LM358B and LM2904B..... 15 9.5 Glossary....................................................................30
5.12 Typical Characteristics: LM158, LM158A, 10 Revision History.......................................................... 30
LM258, LM258A, LM358, LM358A, LM2904, and 11 Mechanical, Packaging, and Orderable
LM2904V..................................................................... 22 Information.................................................................... 32
6 Parameter Measurement Information.......................... 24

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 LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
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4 Pin Configuration and Functions

OUT1
NC

NC

NC
V+
OUT1 1 8 V+

IN1± 2 7 OUT2

20

19
IN1+ 3 6 IN2±
NC 4 18 NC

V± 4 5 IN2+ IN1± 5 17 OUT2

NC 6 16 NC

Not to scale IN1+ 7 15 IN2±

Figure 4-1. D, DDF, DGK, P, PS, PW, and JG NC 8 14 NC

Package

10

11

12

13
8-Pin SOIC, SOT23-8, VSSOP, PDIP, SO, TSSOP,

9
and CDIP
Top View Not to scale

NC

V±

NC

IN2+

NC
NC - No internal connection
Figure 4-2. FK Package
20-Pin LCCC
Top View

Table 4-1. Pin Functions

PIN
SOIC, SOT23-8, VSSOP, CDIP, I/O DESCRIPTION
NAME LCCC(1)
PDIP, SO, TSSOP, CFP(1)
IN1– 5 2 I Negative input
IN1+ 7 3 I Positive input
IN2– 15 6 I Negative input
IN2+ 12 5 I Positive input
OUT1 2 1 O Output
OUT2 17 7 O Output
Negative (lowest) supply or ground (for single-
V– 10 4 —
supply operation)
1, 3, 4, 6, 8, 9, 11,
NC — — No internal connection
13, 14, 16, 18, 19
V+ 20 8 — Positive (highest) supply

(1) For a listing of which devices are available in what packages, see Section 3.

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LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

5 Specifications
5.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted)(1)
MIN MAX UNIT
LM358B, LM358BA,
±20 or 40
LM2904B, LM2904BA
LM158, LM258, LM358,
Supply voltage, VS = ([V+] – [V–]) V
LM158A, LM258A, LM358A, ±16 or 32
LM2904V
LM2904 ±13 or 26
LM358B, LM358BA,
LM2904B, LM2904BA,LM158,
–32 32
Differential input voltage, VID (2) LM258, LM358, LM158A, V
LM258A, LM358A, LM2904V
LM2904 –26 26
LM358B, LM358BA,
–0.3 40
LM2904B, LM2904BA
LM158, LM258, LM358,
Input voltage, VI Either input V
LM158A, LM258A, LM358A, –0.3 32
LM2904V
LM2904 –0.3 26
Duration of output short circuit (one amplifier) to ground at (or below) TA = 25°C,
Unlimited s
VS ≤ 15 V(3)
LM158, LM158A –55 125
LM258, LM258A –25 85
LM358B, LM358BA –40 85
Operating ambient temperature, TA °C
LM358, LM358A 0 70
LM2904B, LM2904BA,
–40 125
LM2904, LM2904V
Operating virtual-junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Differential voltages are at IN+, with respect to IN−.
(3) Short circuits from outputs to VS can cause excessive heating and eventual destruction.
5.2 ESD Ratings
VALUE UNIT
LM358B, LM358BA, LM2904B, AND LM2904BA
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
LM158, LM258, LM358, LM158, LM258A, LM358A, LM2904, AND LM2904V
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±500
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

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 LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
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5.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)
MIN MAX UNIT
LM358B, LM358BA, LM2904B,
3 36
LM2904BA
VS Supply voltage, VS= ([V+] – [V–]) LM158, LM258, LM358, LM158A, V
3 30
LM258A, LM358A, LM2904V
LM2904 3 26
VCM Common-mode voltage V– V+ – 2 V
LM358B, LM358BA –40 85
LM2904B, LM2904BA, LM2904,
–40 125
LM2904V
TA Operating ambient temperature °C
LM358, LM358A 0 70
LM258, LM258A –20 85
LM158, LM158A –55 125

5.4 Thermal Information

LM258, LM258A, LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B,
LM158, LM158A
LM2904BA, LM2904V(2)
THERMAL METRIC(1) D DGK P PS PW DDF FK JG UNIT
(SOIC) (VSSOP) (PDIP) (SO) (TSSOP) (SOT-23) (LCCC) (CDIP)
8 PINS 8 PINS 8 PINS 8 PINS 8 PINS 8PINS 20 PINS 8 PINS
Junction-to-ambient
RθJA 124.7 181.4 80.9 116.9 171.7 164.3 84.0 112.4 °C/W
thermal resistance
Junction-to-case (top)
RθJC(top) 66.9 69.4 70.4 62.5 68.8 98.1 56.9 63.6 °C/W
thermal resistance
Junction-to-board thermal
RθJB 67.9 102.9 57.4 68.6 99.2 82.1 57.5 100.3 °C/W
resistance
Junction-to-top
ψJT characterization 19.2 11.8 40 21.9 11.5 11.4 51.7 35.7 °C/W
parameter
Junction-to-board
ψJB characterization 67.2 101.2 56.9 67.6 97.9 81.7 57.1 93.3 °C/W
parameter
Junction-to-case (bottom)
RθJC(bot) — — — — — — 10.6 22.3 °C/W
thermal resistance

(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) For a listing of which devices are available in what packages, see Section 3.

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LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

5.5 Electrical Characteristics: LM358B and LM358BA

VS = (V+) – (V–) = 5 V – 36 V (±2.5 V – ±18 V), TA = 25°C, VCM = VOUT = VS / 2, RL = 10k connected to VS / 2
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OFFSET VOLTAGE
±0.3 ±3.0 mV
LM358B
TA = –40°C to +85°C ±4 mV
VOS Input offset voltage
±2.0 mV
LM358BA
TA = –40°C to +85°C ±2.5 mV
dVOS/dT Input offset voltage drift TA = -40°C to +85°C(1) ±3.5 11 µV/°C
PSRR Power supply rejection ratio ±2 15 µV/V
Channel separation, dc f = 1 kHz to 20 kHz ±1 µV/V
INPUT VOLTAGE RANGE
VS = 3 V to 36 V (V–) (V+) – 1.5 V
VCM Common-mode voltage range
VS = 5 V to 36 V TA = –40°C to +85°C (V–) (V+) – 2 V
(V–) ≤ VCM ≤ (V+) – 1.5 V VS = 3 V to 36 V 20 100
CMRR Common-mode rejection ratio µV/V
(V–) ≤ VCM ≤ (V+) – 2.0 V VS = 5 V to 36 V TA = –40°C to +85°C 25 316
INPUT BIAS CURRENT
–10 –35 nA
IB Input bias current
TA = –40°C to +85°C(1) –50 nA
0.5 4 nA
IOS Input offset current
TA = –40°C to +85°C(1) 5 nA
dIOS/dT Input offset current drift TA = –40°C to +85°C 10 pA/℃
NOISE
En Input voltage noise f = 0.1 to 10 Hz 3 µVPP
en Input voltage noise density f = 1 kHz 40 nV/√/Hz
INPUT IMPEDANCE
ZID Differential 10 || 0.1 MΩ|| pF
ZIC Common-mode 4 || 1.5 GΩ|| pF
OPEN-LOOP GAIN
70 140 V/mV
AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 10 kΩ, connected to (V–)
TA = –40°C to +85°C 35 V/mV
FREQUENCY RESPONSE
GBW Gain bandwidth product 1.2 MHz
SR Slew rate G=+1 0.5 V/µs
Θm Phase margin G = + 1, RL = 10kΩ, CL = 20 pF 56 °
tOR Overload recovery time VIN × gain > VS 10 µs
ts Settling time To 0.1%, VS = 5 V, 2-V step , G = +1, CL = 100 pF 4 µs
THD+N Total harmonic distortion + noise G = + 1, f = 1 kHz, VO = 3.53 VRMS, VS = 36 V, RL = 100k, IOUT ≤ ±50 µA, BW = 80 kHz 0.001 %
OUTPUT
IOUT = 50 µA 1.35 1.42 V
Positive rail (V+) IOUT = 1 mA 1.4 1.48 V
IOUT = 5 mA(1) 1.5 1.61 V
VO Voltage output swing from rail
IOUT = 50 µA 100 150 mV
Negative rail (V–) IOUT = 1 mA 0.75 1 V
VS = 5 V, RL ≤ 10 kΩ connected to (V–) TA = –40°C to +85°C 5 20 mV

VS = 15 V; VO = V–; -20 -30

Source(1)
VID = 1 V TA = –40°C to +85°C -10
mA
IO Output current VS = 15 V; VO = V+; 10 20
Sink(1)
VID = –1 V TA = –40°C to +85°C 5
VID = –1 V; VO = (V–) + 200 mV 60 100 μA
ISC Short-circuit current VS = 20 V, (V+) = 10 V, (V–) = –10 V, VO = 0 V ±40 ±60 mA
CLOAD Capacitive load drive 100 pF
RO Open-loop output resistance f = 1 MHz, IO = 0 A 300 Ω

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 LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
www.ti.com SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024

5.5 Electrical Characteristics: LM358B and LM358BA (continued)

VS = (V+) – (V–) = 5 V – 36 V (±2.5 V – ±18 V), TA = 25°C, VCM = VOUT = VS / 2, RL = 10k connected to VS / 2
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLY
IQ Quiescent current per amplifier VS = 5 V; IO = 0 A 300 460 µA
TA = –40°C to +85°C
IQ Quiescent current per amplifier VS = 36 V; IO = 0 A 800 µA

(1) Specified by characterization only.

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LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

5.6 Electrical Characteristics: LM2904B and LM2904BA

VS = (V+) – (V–) = 5 V - 36 V (±2.5 V - ±18 V), TA = 25°C, VCM = VOUT = VS/2, RL = 10k connected to VS/2
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OFFSET VOLTAGE
±0.3 ±3.0 mV
LM2904B
TA = –40°C to +125°C ±4 mV
VOS Input offset voltage
±2.0 mV
LM2904BA
TA = –40°C to +125°C ±3.0 mV
dVOS/dT Input offset voltage drift TA = –40°C to +125°C(1) ±3.5 12 µV/°C
PSRR Power Supply Rejection Ratio ±2 15 µV/V
Channel separation, dc f = 1 kHz to 20 kHz ±1 µV/V
INPUT VOLTAGE RANGE
VS = 3 V to 36 V (V–) (V+) – 1.5 V
VCM Common-mode voltage range
VS = 5 V to 36 V TA = –40°C to +125°C (V–) (V+) – 2 V
(V–) ≤ VCM ≤ (V+) – 1.5 V VS = 3 V to 36 V 20 100
CMRR Common-mode rejection ratio µV/V
(V–) ≤ VCM ≤ (V+) – 2.0 V VS = 5 V to 36 V TA = –40°C to +125°C 25 316
INPUT BIAS CURRENT
–10 –35 nA
IB Input bias current
TA = –40°C to +125°C(1) –50 nA
0.5 4 nA
IOS Input offset current
TA = –40°C to +125°C(1) 5 nA
dIOS/dT Input offset current drift TA = –40°C to +125°C 10 pA/℃
NOISE
En Input voltage noise f = 0.1 to 10 Hz 3 µVPP
en Input voltage noise density f = 1 kHz 40 nV/√/Hz
INPUT IMPEDANCE
ZID Differential 10 || 0.1 MΩ|| pF
ZIC Common-mode 4 || 1.5 GΩ|| pF
OPEN-LOOP GAIN
70 140 V/mV
AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 10 kΩ, connected to (V-)
TA = –40°C to +125°C 35 V/mV
FREQUENCY RESPONSE
GBW Gain bandwidth product 1.2 MHz
SR Slew rate G=+1 0.5 V/µs
Θm Phase margin G = + 1, RL = 10kΩ, CL = 20 pF 56 °
tOR Overload recovery time VIN × gain > VS 10 µs
ts Settling time To 0.1%, VS = 5 V, 2-V Step , G = +1, CL = 100 pF 4 µs
THD+N Total harmonic distortion + noise G = + 1, f = 1 kHz, VO = 3.53 VRMS, VS = 36V, RL = 100k, IOUT ≤ ±50µA, BW = 80 kHz 0.001 %
OUTPUT
IOUT = 50 µA 1.35 1.42 V
Positive Rail (V+) IOUT = 1 mA 1.4 1.48 V
IOUT = 5 mA(1) 1.5 1.61 V
VO Voltage output swing from rail
IOUT = 50 µA 100 150 mV
Negative Rail (V-) IOUT = 1 mA 0.75 1 V
VS = 5 V, RL ≤ 10 kΩ connected to (V–) TA = –40°C to +125°C 5 20 mV

VS = 15 V; VO = V-; VID = -20 -30

Source(1)
1V TA = –40°C to +125°C -10
mA
IO Output current VS = 15 V; VO = V+; VID = 10 20
Sink(1)
-1 V TA = –40°C to +125°C 5
VID = -1 V; VO = (V-) + 200 mV 60 100 μA
ISC Short-circuit current VS = 20 V, (V+) = 10 V, (V-) = -10 V, VO = 0 V ±40 ±60 mA
CLOAD Capacitive load drive 100 pF
RO Open-loop output resistance f = 1 MHz, IO = 0 A 300 Ω
POWER SUPPLY

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 LM158, LM158A, LM258, LM258A
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LM358, LM358A, LM358B, LM358BA
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VS = (V+) – (V–) = 5 V - 36 V (±2.5 V - ±18 V), TA = 25°C, VCM = VOUT = VS/2, RL = 10k connected to VS/2
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IQ Quiescent current per amplifier VS = 5 V; IO = 0 A 300 460 µA
TA = –40°C to +125°C
IQ Quiescent current per amplifier VS = 36 V; IO = 0 A 800 µA

(1) Specified by characterization only

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LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
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5.7 Electrical Characteristics: LM358, LM358A

For VS = (V+) – (V–) = 5 V, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT
OFFSET VOLTAGE
3 7
LM358
VS = 5 V to 30 V; VC M = 0 V; VO = 1.4 TA = 0°C to 70°C 9
VOS Input offset voltage mV
V LM358A 2 3
TA = 0°C to 70°C 5
LM358 TA = 0°C to 70°C 7
dVOS/dT Input offset voltage drift µV/°C
LM358A TA = 0°C to 70°C 7 20
Input offset voltage vs power
PSRR VS = 5 V to 30 V 65 100 dB
supply (ΔVIO/ΔVS)
VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB
INPUT VOLTAGE RANGE
VS = 5 V to 30 V LM358
(V–) (V+) – 1.5
VS = 30 V LM358A
VCM Common-mode voltage range V
VS = 5 V to 30 V LM358
TA = 0°C to 70°C (V–) (V+) – 2
VS = 30 V LM358A
CMRR Common-mode rejection ratio VS = 5 V to 30 V; VCM = 0 V 65 80 dB
INPUT BIAS CURRENT
–20 –250
LM358
TA = 0°C to 70°C –500
IB Input bias current VO = 1.4 V nA
–15 –100
LM358A
TA = 0°C to 70°C –200
2 50
LM358
TA = 0°C to 70°C 150
IOS Input offset current VO = 1.4 V nA
2 30
LM358A
TA = 0°C to 70°C 75
10
dIOS/dT Input offset current drift pA/°C
LM358A TA = 0°C to 70°C 300
NOISE
en Input voltage noise density f = 1 kHz 40 nV/√ Hz
OPEN-LOOP GAIN
25 100
AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ V/mV
TA = 0°C to 70°C 15
FREQUENCY RESPONSE
GBW Gain bandwidth product 0.7 MHz
SR Slew rate G = +1 0.3 V/µs
OUTPUT
VS = 30 V; RL = 2 kΩ TA = 0°C to 70°C 4
Positive rail VS = 30 V; RL ≥ 10 kΩ 2 3 V
VO Voltage output swing from rail
VS = 5 V; RL ≥ 2 kΩ 1.5
Negative rail VS = 5 V; RL ≤ 10 kΩ TA = 0°C to 70°C 5 20 mV
–20 –30
VS = 15 V; VO = 0 V; VID
Source LM358A –60
=1V
TA = 0°C to 70°C –10 mA
IO Output current
VS = 15 V; VO = 15 V; 10 20
Sink
VID = –1 V TA = 0°C to 70°C 5
VID = –1 V; VO = 200 mV 12 30 µA
ISC Short-circuit current VS = 10 V; VO = VS / 2 ±40 ±60 mA
POWER SUPPLY
VO = 2.5 V; IO = 0 A 350 600
IQ Quiescent current per amplifier TA = 0°C to 70°C µA
VS = 30 V; VO = 15 V; IO = 0 A 500 1000

(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VS for testing purposes is 30 V for LM358 and LM358A.
(2) All typical values are TA = 25°C.

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
 LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
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5.8 Electrical Characteristics: LM2904, LM2904V

For VS = (V+) – (V–) = 5 V, TA = 25°C (unless otherwise noted)
(2)
PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT
OFFSET VOLTAGE

Non-A suffix 3 7
devices TA = –40°C to 125°C 10
VS = 5 V to maximum; VC M = 0 V; VO =
VOS Input offset voltage mV
1.4 V 1 2
A-suffix
devices TA = –40°C to 125°C 4
dVOS/dT Input offset voltage drift TA = –40°C to 125°C 7 µV/°C
Input offset voltage vs power supply
PSRR VS = 5 V to 30 V 65 100 dB
(ΔVIO/ΔVS)
VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB
INPUT VOLTAGE RANGE
(V–) (V+) – 1.5
VCM Common-mode voltage range VS = 5 V to maximum V
TA = –40°C to 125°C (V–) (V+) – 2
CMRR Common-mode rejection ratio VS = 5 V to maximum; VCM = 0 V 65 80 dB
INPUT BIAS CURRENT
–20 –250
IB Input bias current VO = 1.4 V nA
TA = –40°C to 125°C –500

Non-V suffix 2 50
device TA = –40°C to 125°C 300
IOS Input offset current VO = 1.4 V nA
V-suffix 2 50
device TA = –40°C to 125°C 150
dIOS/dT Input offset current drift TA = –40°C to 125°C 10 pA/°C
NOISE
en Input voltage noise density f = 1 kHz 40 nV/√ Hz
OPEN-LOOP GAIN
25 100
AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ V/mV
TA = –40°C to 125°C 15
FREQUENCY RESPONSE
GBW Gain bandwidth product 0.7 MHz
SR Slew rate G = +1 0.3 V/µs
OUTPUT
RL ≥ 10 kΩ VS – 1.5
VS = maximum; RL =
4
Non-V suffix 2 kΩ
device VS = maximum; RL ≥
2 3
Positive rail 10 kΩ V
VO Voltage output swing from rail TA = –40°C to 125°C
VS = maximum; RL =
6
2 kΩ
V-suffix device
VS = maximum; RL ≥
4 5
10 kΩ
Negative rail VS = 5 V; RL ≤ 10 kΩ TA = –40°C to 125°C 5 20 mV
–20 –30
VS = 15 V; VO = 0 V; VID = 1 V Source
TA = –40°C to 125°C –10
mA
10 20
IO Output current VS = 15 V; VO = 15 V; VID = –1 V Sink
TA = –40°C to 125°C 5
Non-V suffix device 30
VID = -1 V; VO = 200 mV µA
V-suffix device 12 40
ISC Short-circuit current VS = 10 V; VO = VS / 2 ±40 ±60 mA
POWER SUPPLY
VO = 2.5 V; IO = 0 A 350 600
IQ Quiescent current per amplifier TA = –40°C to 125°C µA
VS = maximum; VO = maximum / 2; IO = 0 A 500 1000

(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VS for testing purposes is 26 V for LM2904 and 32 V for LM2904V.
(2) All typical values are TA = 25°C.

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

5.9 Electrical Characteristics: LM158, LM158A

For VS = (V+) – (V–) = 5 V, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT
OFFSET VOLTAGE
3 5
LM158
TA = –55°C to 125°C 7
VOS Input offset voltage VS = 5 V to 30 V; VC M = 0 V; VO = 1.4 V mV
2
LM158A
TA = –55°C to 125°C 4
LM158 TA = –55°C to 125°C 7
dVOS/dT Input offset voltage drift µV/°C
LM158A TA = –55°C to 125°C 7 15(3)
Input offset voltage vs power supply
PSRR VS = 5 V to 30 V 65 100 dB
(ΔVIO/ΔVS)
VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB
INPUT VOLTAGE RANGE
VS = 5 V to 30 V LM158
(V–) (V+) – 1.5
VS = 30 V LM158A
VCM Common-mode voltage range V
VS = 5 V to 30 V LM158
TA = –55°C to 125°C (V–) (V+) – 2
VS = 30 V LM158A
CMRR Common-mode rejection ratio VS = 5 V to 30 V; VCM = 0 V 70 80 dB
INPUT BIAS CURRENT
–20 –150
LM158
TA = –55°C to 125°C –300
IB Input bias current VO = 1.4 V nA
–15 –50
LM158A
TA = –55°C to 125°C –100
2 30
LM158
TA = –55°C to 125°C 100
IOS Input offset current VO = 1.4 V nA
2 10
LM158A
TA = –55°C to 125°C 30
10
dIOS/dT Input offset current drift pA/°C
LM158A TA = –55°C to 125°C 200
NOISE
en Input voltage noise density f = 1 kHz 40 nV/√ Hz
OPEN-LOOP GAIN
50 100
AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ V/mV
TA = –55°C to 125°C 25
FREQUENCY RESPONSE
GBW Gain bandwidth product 0.7 MHz
SR Slew rate G = +1 0.3 V/µs
OUTPUT
VS = 30 V; RL = 2 kΩ TA = –55°C to 125°C 4
Positive rail VS = 30 V; RL ≥ 10 kΩ 2 3 V
VO Voltage output swing from rail
VS = 5 V; RL ≥ 2 kΩ 1.5
Negative rail VS = 5 V; RL ≤ 10 kΩ TA = –55°C to 125°C 5 20 mV
–20 –30
VS = 15 V; VO = 0 V; VID = 1 V Source LM158A –60
TA = –55°C to 125°C –10 mA
IO Output current
VS = 15 V; VO = 15 V; VID = –1 10 20
Sink
V TA = –55°C to 125°C 5
VID = –1 V; VO = 200 mV 12 30 µA
ISC Short-circuit current VS = 10 V; VO = VS / 2 ±40 ±60 mA

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
 LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
www.ti.com SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024

5.9 Electrical Characteristics: LM158, LM158A (continued)

For VS = (V+) – (V–) = 5 V, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT
POWER SUPPLY
VO = 2.5 V; IO = 0 A 350 600
IQ Quiescent current per amplifier TA = –55°C to 125°C µA
VS = 30 V; VO = 15 V; IO = 0 A 500 1000

(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VS for testing purposes is 30 V for LM158 and LM158A.
(2) All typical values are TA = 25°C.
(3) On products compliant to MIL-PRF-38535, this parameter is not production tested.

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

5.10 Electrical Characteristics: LM258, LM258A

For VS = (V+) – (V–) = 5 V, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT
OFFSET VOLTAGE
3 5
LM258
TA = –25°C to 85°C 7
VOS Input offset voltage VS = 5 V to 30 V; VC M = 0 V; VO = 1.4 V mV
2 3
LM258A
TA = –25°C to 85°C 4
LM258 7
dVOS/dT Input offset voltage drift TA = –25°C to 85°C µV/°C
LM258A 7 15
Input offset voltage vs power supply
PSRR VS = 5 V to 30 V 65 100 dB
(ΔVIO/ΔVS)
VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB
INPUT VOLTAGE RANGE
VS = 5 V to 30 V LM258
(V–) (V+) – 1.5
VS = 30 V LM258A
VCM Common-mode voltage range V
VS = 5 V to 30 V LM258
TA = –25°C to 85°C (V–) (V+) – 2
VS = 30 V LM258A
CMRR Common-mode rejection ratio VS = 5 V to 30 V; VCM = 0 V 70 80 dB
INPUT BIAS CURRENT
–20 –150
LM258
TA = –25°C to 85°C –300
IB Input bias current VO = 1.4 V nA
–15 –80
LM258A
TA = –25°C to 85°C –100
2 30
LM258
TA = –25°C to 85°C 100
IOS Input offset current VO = 1.4 V nA
2 15
LM258A
TA = –25°C to 85°C 30
10
dIOS/dT Input offset current drift pA/°C
LM258A TA = –25°C to 85°C 200
NOISE
en Input voltage noise density f = 1 kHz 40 nV/√ Hz
OPEN-LOOP GAIN
50 100
AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ V/mV
TA = –25°C to 85°C 25
FREQUENCY RESPONSE
GBW Gain bandwidth product 0.7 MHz
SR Slew rate G = +1 0.3 V/µs
OUTPUT
VS = 30 V; RL = 2 kΩ TA = –25°C to 85°C 4
Positive rail VS = 30 V; RL ≥ 10 kΩ 2 3 V
VO Voltage output swing from rail
VS = 5 V; RL ≥ 2 kΩ 1.5
Negative rail VS = 5 V; RL ≤ 10 kΩ TA = –25°C to 85°C 5 20 mV
–20 –30
VS = 15 V; VO = 0 V; VID = 1 V Source LM258A –60
TA = –25°C to 85°C –10 mA
IO Output current
VS = 15 V; VO = 15 V; VID = –1 10 20
Sink
V TA = –25°C to 85°C 5
VID = –1 V; VO = 200 mV 12 30 µA
ISC Short-circuit current VS = 10 V; VO = VS / 2 ±40 ±60 mA
POWER SUPPLY
VO = 2.5 V; IO = 0 A 350 600
IQ Quiescent current per amplifier TA = –25°C to 85°C µA
VS = 30 V; VO = 15 V; IO = 0 A 500 1000

(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VS for testing purposes is 30 V for LM258 and LM258A.
(2) All typical values are TA = 25°C.

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
 LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
www.ti.com SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024

5.11 Typical Characteristics: LM358B and LM2904B

This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was
taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).

20 30
18 27
16 24
14 21
Amplifiers (%)

Amplifiers (%)
12 18
10 15
8 12
6 9
4 6
2 3
0 0
-1800 -1200 -600 0 600 1200 1800 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75
Offset Voltage (µV) DC11 Offset Voltage Drift (µV/°C) DC12
Figure 5-1. Offset Voltage Production Distribution Figure 5-2. Offset Voltage Drift Distribution
750 500

450 300
Offset Voltage (µV)

Offset Voltage (µV)

150 100

-150 -100

-450 -300

-750 -500
-40 -20 0 20 40 60 80 100 120 -18 -12 -6 0 6 12 17
Temperature (°C) DC10
Common-Mode Voltage (V) DC10

Figure 5-3. Offset Voltage vs Temperature Figure 5-4. Offset Voltage vs Common-Mode Voltage
90 100 70
G=1
80 90 60 G = 10
Closed Lopp Voltage Gain (dB)

G = 100
Open Loop Voltage Gain (dB)

70 80 50
G = 1000
60 70 G = –1
40
50 60
30
Phase ( )

40 50
20
30 40
10
20 30
0
10 20
0 10 -10
Gain (dB) -20
-10 0
Phase (°)
-20 -10 -30
1k 10k 100k 1M 1k 10k 100k 1M
Frequency (Hz) D012
Frequency (Hz) D017

Figure 5-5. Open-Loop Gain and Phase vs Frequency Figure 5-6. Closed-Loop Gain vs Frequency

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

5.11 Typical Characteristics: LM358B and LM2904B (continued)

This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was
taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).

-5 120
IB+
IB– 100

Input Offset Current (pA)

-7.5 80
Input Bias Current (nA)

60

-10 40

20

-12.5 0

-20

-15 -40
-20 -15 -10 -5 0 5 10 15 20 -20 -15 -10 -5 0 5 10 15 20
Common-Mode Voltage (V) DC3I Common-Mode Voltage (V) DC3I
Figure 5-7. Input Bias Current vs Common-Mode Voltage Figure 5-8. Input Offset Current vs Common-Mode Voltage
-6 0.06

-7 0.045
Input Offset Current (nA)
Input Bias Current (nA)

-8 0.03

-9 0.015

IB+
-10 IB– 0

-11 -0.015

-12 -0.03
-40 -10 20 50 80 110 130 -40 -10 20 50 80 110 130
Temperature (°C) DCIB
Temperature (°C) DCIO

Figure 5-9. Input Bias Current vs Temperature Figure 5-10. Input Offset Current vs Temperature
V+ (V–) + 18 V
–40 C
25 C
(V–) + 15 V 125 C
(V+) – 3 V
Output Voltage (V)
Output Voltage (V)

(V–) + 12 V

(V+) – 6 V (V–) + 9 V

(V–) + 6 V
(V+) – 9 V
–40 C (V–) + 3 V
25 C
125 C
(V+) – 12 V V–
0 10 20 30 40 50 0 5 10 15 20 25 30 35 40
Output Current (mA) Output Current (mA) DC1-
DC13

Figure 5-11. Output Voltage Swing vs Output Current (Sourcing) Figure 5-12. Output Voltage Swing vs Output Current (Sinking)

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
 LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
www.ti.com SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024

5.11 Typical Characteristics: LM358B and LM2904B (continued)

This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was
taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).

100 120
PSRR+
90

Common-Mode Rejection Ratio (dB)

PSRR- 115
80 CMRR
PSRR and CMRR (dB)

70 110

60
105
50
40 100

30 95
20
90 VS = 36V
10
VS = 5V
0 85
1k 10k 100k 1M -40 -10 20 50 80 110 130
Frequency (Hz) D001 Temperature (°C) DC2_
Figure 5-13. CMRR and PSRR vs Frequency Figure 5-14. Common-Mode Rejection Ratio vs
Temperature (dB)
-118 1.6

1.2
Power Supply Rejection Ratio (dB)

-119 0.8

0.4
Voltage (µV)

-120
0

-0.4
-121
-0.8

-1.2
-122
-1.6

-123 -2
-40 -20 0 20 40 60 80 100 120 140 0 1 2 3 4 5 6 7 8 9 10
Temperature (°C) Time (s) D011
DC8_

VS = 5 V to 36 V
Figure 5-15. Power Supply Rejection Ratio vs Temperature (dB) Figure 5-16. 0.1-Hz to 10-Hz Noise

100 -32
Voltage Noise Spectral Density (nV/—Hz)

10 k
90 -40 2k
80 -48
70 -56
THD+N (dB)

60 -64

50 -72

40 -80

30 -88

20 -96

10 -104

0 -112
10 100 1k 10k 100k 100 1k 10k
Frequency (Hz) Frequency (Hz) D013
D010

G = 1, f = 1 kHz, BW = 80 kHz,
Figure 5-17. Input Voltage Noise Spectral Density vs Frequency VOUT = 10 VPP, RL connected to V–
Figure 5-18. THD+N Ratio vs Frequency, G = 1

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

5.11 Typical Characteristics: LM358B and LM2904B (continued)

This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was
taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).

-32 -30
10 k
-40 2k -40

-48 -50

-56 -60
THD+N (dB)

THD+N (dB)
-64 -70

-72 -80

-80 -90

-88 -100

-96 -110 10 k
2k
-104 -120
100 1k 10k 0.001 0.01 0.1 1 10 20
Frequency (Hz) D014
Amplitude (VPP) D015

G = –1, f = 1 kHz, BW = 80 kHz, G = 1, f = 1 kHz, BW = 80 kHz,

VOUT = 10 VPP, RL connected to V– RL connected to V–
See Figure 6-3
Figure 5-19. THD+N Ratio vs Frequency, G = –1 Figure 5-20. THD+N vs Output Amplitude, G = 1
-20 460

-35 430
Quiescent Current (µA)

-50 400
THD+N (dB)

-65 370

-80 340

-95 310
10 k
2k
-110 280
0.001 0.01 0.1 1 10 20 3 9 15 21 27 33 36
Amplitude (VPP) D016
Supply Voltage (V) DC_S

G = –1, f = 1 kHz, BW = 80 kHz,

RL connected to V–
See Figure 6-3
Figure 5-21. THD+N vs Output Amplitude, G = –1 Figure 5-22. Quiescent Current vs Supply Voltage
600 500
VS = 36V
Quiescent Current per Amplifier (µA)

VS = 5V
Open Loop Output Impedance ( )

540
400
480

420 300

360
200
300

240 100
-40 -20 0 20 40 60 80 100 120 1k 10k 100k 1M
Temperature (°C) DC4_
Frequency (Hz) D006

Figure 5-23. Quiescent Current vs Temperature Figure 5-24. Open-Loop Output Impedance vs Frequency

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 LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
www.ti.com SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024

5.11 Typical Characteristics: LM358B and LM2904B (continued)

This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was
taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).

44 18
Overshoot (+) Overshoot (+)
40 Overshoot (-) 16 Overshoot (–)

36 14

32 12

Overshoot (%)
Overshoot (%)

28 10

24 8

20 6

16 4

12 2

8 0
0 40 80 120 160 200 240 280 320 360 40 80 120 160 200 240 280 320 360
Capacitance load (pF) Capacitance load (pF) D020
D019

G = 1, 100-mV output step, RL = open G = –1, 100-mV output step, RL = open

Figure 5-25. Small-Signal Overshoot vs Capacitive Load Figure 5-26. Small-Signal Overshoot vs Capacitive Load

60 20
Input
57 Output
54
10
51
Phase Margin (°)

Voltage (V)

48
45 0
42
39
-10
36
33
30 -20
0 40 80 120 160 200 240 280 320 360 0 200 400 600 800 1000
Capacitance Load (pF) D018
Time ( s) D021

G = –10
Figure 5-27. Phase Margin vs Capacitive Load Figure 5-28. Overload Recovery
10 10

7.5 7.5

5 5
Voltage (mV)

Voltage (mV)

2.5 2.5

0 0

-2.5 -2.5

-5 -5

-7.5 Input -7.5 Input

Output Output
-10 -10
0 20 40 60 80 100 0 20 40 60 80 100
Time ( s) D022
Time ( s) D023

G = 1, RL = open G = –1, RL = open, RFB = 10K

See Figure 6-3
Figure 5-29. Small-Signal Step Response, G = 1 Figure 5-30. Small-Signal Step Response, G = –1

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

5.11 Typical Characteristics: LM358B and LM2904B (continued)

This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was
taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).

20 40
16 32
Output Delta from Final Value (mV)

Output Delta from Final Value (mV)

12 24
8 16
4 8
0 0
-4 -8
-8 -16
-12 -24
-16 -32
-20 -40
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
Time ( s) D003
Time ( s) D004

G = 1, RL = open G = 1, RL = open
Figure 5-31. Large-Signal Step Response (Rising) Figure 5-32. Large-Signal Step Response (Falling)
2.5 0.675
Output Positive
2 Input Negative
1.5 0.625
1
Slew Rate(V/ s)
Votlage (V)

0.5 0.575
0
-0.5 0.525
-1
-1.5 0.475
-2
-2.5 0.425
0 20 40 60 80 100 -40 -25 -10 5 20 35 50 65 80 95 110 125
Time (µs) AC_S
Temp( C) D009

G = 1, RL = open
Figure 5-33. Large-Signal Step Response Figure 5-34. Slew Rate vs Temperature
60 15
14
13
Maximum Output Voltage (V PP)

40
12
Short-Circuit Current (mA)

11
20 10
9
Sinking 8
0 Sourcing 7
6
-20 5
4
3
-40
2
1
-60 0
-40 -25 -10 5 20 35 50 65 80 95 110 125 1k 10k 100k 1M
Temperature (°C) DC7_ Frequency (Hz) D005

VS = 15 V
Figure 5-35. Short-Circuit Current vs Temperature Figure 5-36. Maximum Output Voltage vs Frequency

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
 LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
www.ti.com SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024

5.11 Typical Characteristics: LM358B and LM2904B (continued)

This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was
taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).

-75 90
84
-85 78
Channel Separation (dB)

72
-95
66

EMIRR (dB)
60
-105
54

-115 48
42
-125 36
30
-135 24
1k 10k 100k 1M 1M 10M 100M 1G
Frequency (Hz) D008 Frequency (Hz) D007
Figure 5-37. Channel Separation vs Frequency Figure 5-38. EMIRR (Electromagnetic Interference Rejection
Ratio) vs Frequency

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 21

Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

5.12 Typical Characteristics: LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and
LM2904V
Typical characteristics section is applicable for LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V.

20 0.36
18 0.34 –55C
16 0C
0.32

Supply Current (mA)

Input Current (nAdc)

14 125C
12 0.3

10 0.28
8
0.26
6 5Vdc
15Vdc 0.24
4
30Vdc
2 0.22
0 0.2
–55 –35 –15 5 25 45 65 85 105 125 0 5 10 15 20 25 30
Temperature (°C) Supply Voltage (Vdc)
Figure 5-39. Input Current vs Temperature Figure 5-40. Supply Current vs Supply Voltage
160 100
RL=20K 90 CMRR
140
RL=2K 80
120
Avol Voltage Gain (dB)

70
100
CMRR (dB)

60
80 50

60 40
30
40
20
20 10
0 0
0 5 10 15 20 25 30 35 40 0.1 1 10 100 1000
V+ Supply Voltage (Vdc) Frequency (kHz) C001

Figure 5-41. Voltage Gain vs Supply Voltage Figure 5-42. Common-Mode Rejection Ratio vs Frequency
3.5 0.50
VOUT
3.0 0.45

2.5
0.40
Voltage (V)

Voltage (V)

2.0
0.35
1.5
0.30
1.0

0.5 0.25
VOUT
0.0 0.20
0 4 8 12 16 20 24 28 32 36 40 0 2 4 6 8 10
Time ( s) C001 Time ( s) C001

Figure 5-43. Voltage Follower Large Signal Response (50 pF) Figure 5-44. Voltage Follower Small Signal Response (50 pF)

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
 LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
www.ti.com SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024

5.12 Typical Characteristics: LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and
LM2904V (continued)
Typical characteristics section is applicable for LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V.

20 8

Output Voltage (Vdc) relative to Vcc

17.5 7
15
Output Swing (Vp-p)

6
12.5
5
10
4
7.5
3
5

2.5 2

0 1
1 10 100 1k 0.001 0.01 0.1 1 10 100
Frequency (kHz) Output Sink Current (mAdc)
Figure 5-45. Maximum Output Swing vs Frequency (VCC = 15 V) Figure 5-46. Output Sourcing Characteristics
10 90
5Vdc
15Vdc 80
Output Current (mAdc)

30Vdc 70
Output Voltage (Vdc)

1 60
50
40

0.1 30
20
10

0.01 0
0.001 0.01 0.1 1 10 100 –55 –35 –15 5 25 45 65 85 105 125
Output Sink Current (mAdc) Temperature (°C)
Figure 5-47. Output Sinking Characteristics Figure 5-48. Source Current Limiting

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

6 Parameter Measurement Information

900 Ω
VCC+
VCC+
− 100 Ω
VO −
+ VI = 0 V
VI VO
RS
CL +
VCC− RL
VCC−

Figure 6-2. Noise-Test Circuit

Figure 6-1. Unity-Gain Amplifier

10 k

+18V
–
VIN
+
-18V

RL
GND GND

Figure 6-3. Test Circuit, G = –1, for THD+N and Small-Signal Step Response

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
 LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
www.ti.com SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024

7 Detailed Description
7.1 Overview
These devices consist of two independent, high-gain frequency-compensated operational amplifiers designed to
operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the
difference between the two supplies is within the supply voltage range specified in Recommended Operating
Conditions and VS is at least 1.5 V more positive than the input common-mode voltage. The low supply-current
drain is independent of the magnitude of the supply voltage.
Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier
circuits that now can be implemented more easily in single-supply-voltage systems. For example, these devices
can be operated directly from the standard 5-V supply used in digital systems and easily can provide the
required interface electronics without additional ±5-V supplies.
7.2 Functional Block Diagram: LM358B, LM358BA, LM2904B, LM2904BA

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

7.3 Feature Description

7.3.1 Unity-Gain Bandwidth
The unity-gain bandwidth is the frequency up to which an amplifier with a unity gain may be operated without
greatly distorting the signal. These devices have a 1.2-MHz unity-gain bandwidth (B Version).
7.3.2 Slew Rate
The slew rate is the rate at which an operational amplifier can change its output when there is a change on the
input. These devices have a 0.5-V/µs slew rate (B Version).
7.3.3 Input Common-Mode Range
The valid common-mode range is from device ground to VS – 1.5 V (VS – 2 V across temperature). Inputs
may exceed VS up to the maximum VS without device damage. At least one input must be in the valid input
common-mode range for the output to be the correct phase. If both inputs exceed the valid range, then the
output phase is undefined. If either input more than 0.3 V below V– then input current should be limited to 1 mA
and the output phase is undefined.
7.4 Device Functional Modes
These devices are powered on when the supply is connected. This device can be operated as a single-supply
operational amplifier or dual-supply amplifier, depending on the application.

26 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
 LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
www.ti.com SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024

8 Application and Implementation

Note
Information in the following applications sections is not part of the TI component specification, and
TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.

8.1 Application Information

The LMx58 and LM2904 operational amplifiers are useful in a wide range of signal conditioning applications.
Inputs can be powered before VSfor flexibility in multiple supply circuits.
8.2 Typical Application
A typical application for an operational amplifier is an inverting amplifier. This amplifier takes a positive voltage
on the input, and makes it a negative voltage of the same magnitude. In the same manner, it also makes
negative voltages positive.
RF

RI Vsup+

VOUT
+
VIN
Vsup-

Figure 8-1. Application Schematic

8.2.1 Design Requirements

The supply voltage must be chosen such that it is larger than the input voltage range and output range. For
instance, this application scales a signal of ±0.5 V to ±1.8 V. Setting the supply at ±12 V is sufficient to
accommodate this application.
8.2.2 Detailed Design Procedure
Determine the gain required by the inverting amplifier using Equation 1 and Equation 2:

VOUT
AV
VIN (1)

1.8
AV 3.6
0.5 (2)

Once the desired gain is determined, choose a value for RI or RF. [Subscripts should be fixed in the
accompanying figures and equations also.] Choosing a value in the kilohm range is desirable because the
amplifier circuit uses currents in the milliampere range. This ensures the part does not draw too much current.
This example uses 10 kΩ for RI which means 36 kΩ is used for RF. This was determined by Equation 3.

RF
AV
RI (3)

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 27

Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

8.2.3 Application Curve

2
VIN
1.5
VOUT
1

0.5

Volts
0

-0.5

-1

-1.5

-2
0 0.5 1 1.5 2
Time (ms)

Figure 8-2. Input and Output Voltages of the Inverting Amplifier

8.3 Power Supply Recommendations

CAUTION
Supply voltages larger than specified in the recommended operating region can permanently
damage the device (see Absolute Maximum Ratings).

Place 0.1-µF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or
high-impedance power supplies. For more detailed information on bypass capacitor placement, see Section 8.4.
8.4 Layout
8.4.1 Layout Guidelines
For best operational performance of the device, use good PCB layout practices, including:
• Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the
operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low-impedance
power sources local to the analog circuitry.
– Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-
supply applications.
• Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective
methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes.
A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital
and analog grounds, paying attention to the flow of the ground current.
• To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If it
is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as opposed
to in parallel with the noisy trace.
• Place the external components as close to the device as possible. Keeping RF and RG close to the inverting
input minimizes parasitic capacitance, as shown in Layout Examples.
• Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
• Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce
leakage currents from nearby traces that are at different potentials.

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
 LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
www.ti.com SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024

8.4.2 Layout Examples

Place components close to

device and to each other to
reduce parasitic errors
Run the input traces as far
VS+
away from the supply lines
as possible RF

OUT1 V+
RG

GND IN1í OUT2

GND
VIN IN1+ IN2í
R IN
Ví IN2+
Only needed for Use low-ESR, ceramic
dual-supply bypass capacitor
operation
VSí
GND
(or GND for single supply) Ground (GND) plane on another layer

Figure 8-3. Operational Amplifier Board Layout for Noninverting Configuration

RIN
VIN +
VOUT
RG
RF

Figure 8-4. Operational Amplifier Schematic for Noninverting Configuration

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 29

Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

9 Device and Documentation Support

9.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Notifications to register and receive a weekly digest of any product information that has changed. For change
details, review the revision history included in any revised document.
9.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
9.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
9.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.

9.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.

10 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision AA (March 2022) to Revision AB (October 2024) Page
• Changed Device Information table to Package Information .............................................................................. 1
• Changed the polarity of the LM358B and LM358BA input bias current value from ± to – in the Electrical
Characteristics section........................................................................................................................................6
• Changed the polarity of the LM2904B and LM2904BA input bias current value from ± to – in the Electrical
Characteristics section........................................................................................................................................8

Changes from Revision Z (July 2021) to Revision AA (March 2022) Page

• Added LM358BA and LM2904BA to the Device Information table.....................................................................1
• Added Family Comparison table to the Description section .............................................................................. 1
• Raised ESD (CDM) for B-versions and BA-versions from 1 kV to 1.5 kV in the ESD Ratings table .................4
• Changed Input Offset Voltage Max of LM2904BA from TA = -40℃ to +125℃ from ±2.5 mV to ±3.0 mV..........8

Changes from Revision Y (February 2021) to Revision Z (July 2021) Page

• Deleted preview tag from LM358B and LM2904B SOT-23 (8) package in Device Information table.................1
• Updated DDF (SOT-23) package thermal information in the Thermal Information table....................................5
• Deleted Related Links from the Device and Documentation Support section.................................................. 30

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
 LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
www.ti.com SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024

Changes from Revision X (June 2020) to Revision Y (February 2021) Page

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1
• Added SOT23-8 (DDF) package information throughout data sheet................................................................. 1
• Deleted preview tag from LM358B and LM2904B VSSOP (8) package in Device Information table.................1
• Added SOT23-8 (DDF) package information to the Pin Configuration and Functions section...........................3
• Added DDF (SOT-23) package to the Thermal Information table...................................................................... 5

Changes from Revision W (October 2019) to Revision X (June 2020) Page

• Added application links to Applications section.................................................................................................. 1
• Deleted preview tag from LM358B and LM2904B TSSOP (8) package in Device Information table ................ 1

Changes from Revision V (September 2018) to Revision W (October 2019) Page

• Changed CDM ESD rating for LM358B and LM2904B in ESD Ratings ............................................................4
• Changed VS to V+ in Recommended Operating Conditions ............................................................................. 5
• Changed Thermal Information for the LM158FK and LM158JG devices........................................................... 5
• Added Typical Characteristics section for the LM358B and LM2490B op amps.............................................. 15
• Added test circuit for THD+N and small-signal step response, G = –1 in the Parameter Measurement
Information section........................................................................................................................................... 24
• Changed the Functional Block Diagram .......................................................................................................... 25

Changes from Revision U (January 2017) to Revision V (September 2018) Page

• Changed the data sheet title ............................................................................................................................. 1
• Changed first four items in the Features section ...............................................................................................1
• Changed the first item in the Applications section and added four new items .................................................. 1
• Changed voltage values in the first paragraph of the Description section..........................................................1
• Changed text in the second paragraph of the Description section..................................................................... 1
• Added devices LM358B and LM2904B to data sheet........................................................................................ 1
• Changed the first three rows of the Device Information table and added a cross-referenced note for
PREVIEW-status devices................................................................................................................................... 1
• Added a table note to the Pin Functions table ...................................................................................................3
• Changed "free-air temperature" to "ambient temperature" in the Absolute Maximum Ratings
condition statement.............................................................................................................................................4
• Changed all entries in the Absolute Maximum Ratings table except TJ and Tstg .............................................. 4
• Deleted lead temperature and case temperature from Absolute Maximum Ratings ......................................... 4
• Changed device listings and their voltage values in the ESD Ratings table ..................................................... 4
• Changed "free-air temperature" to "ambient temperature" in the Recommended Operating Conditions
condition statement ........................................................................................................................................... 5
• Changed table entries for all parameters in the Recommended Operating Conditions table.............................5
• Added rows to the Thermal Information table, and a table note regarding device-package combinations ....... 5
• Deleted the Operating Conditions table............................................................................................................14
• Added a condition statement to the Typical Characteristics section.................................................................22
• Changed specific voltages to a Recommended Operating Conditions reference............................................ 25
• Changed unity-gain bandwidth from 0.7 MHz for all devices to 1.2 MHz for B-version devices...................... 26
• Changed slew rate from.3 V/µs for all devices to o.5 V/µs for B-version devices............................................ 26
• Changed the Input Common-Mode Range section in multiple places throughout........................................... 26
• Changed VCC to VS in the Application Information section ..............................................................................27
• Subscripted the suffixes fro RI and RF .............................................................................................................27

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 31

Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068AB – JUNE 1976 – REVISED OCTOBER 2024 www.ti.com

• Changed Operational Amplifier Board Layout for Noninverting Configuration with an image that includes a
dual op amp......................................................................................................................................................29

Changes from Revision T (April 2015) to Revision U (January 2017) Page

• Changed data sheet title.....................................................................................................................................1

Changes from Revision S (January 2014) to Revision T (April 2015) Page

• Added Applications section, ESD Ratings table, Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ........... 1

Changes from Revision R (July 2010) to Revision S (January 2014) Page

• Converted this data sheet from the QS format to DocZone using the PDF on the web.....................................1
• Deleted Ordering Information table.................................................................................................................... 1
• Updated Features to include Military Disclaimer................................................................................................ 1
• Added Typical Characteristics section..............................................................................................................22

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most-
current data available for the designated devices. This data is subject to change without notice and without
revision of this document. For browser based versions of this data sheet, see the left-hand navigation pane.

32 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358 LM358A LM358B LM358BA
 PACKAGE OPTION ADDENDUM

www.ti.com 2-May-2025

PACKAGING INFORMATION

Orderable Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
part number (1) (2) (3) Ball material Peak reflow (6)
(4) (5)

5962-87710012A Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-
87710012A
LM158FKB
5962-8771001PA Active Production CDIP (JG) | 8 50 | TUBE No SNPB N/A for Pkg Type -55 to 125 8771001PA
LM158
5962-87710022A Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-
87710022A
LM158AFKB
5962-8771002PA Active Production CDIP (JG) | 8 50 | TUBE No SNPB N/A for Pkg Type -55 to 125 8771002PA
LM158A
LM158AFKB Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-
87710022A
LM158AFKB
LM158AJG Active Production CDIP (JG) | 8 50 | TUBE No SNPB N/A for Pkg Type -55 to 125 LM158AJG
LM158AJGB Active Production CDIP (JG) | 8 50 | TUBE No SNPB N/A for Pkg Type -55 to 125 8771002PA
LM158A
LM158FKB Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-
87710012A
LM158FKB
LM158JG Active Production CDIP (JG) | 8 50 | TUBE No SNPB N/A for Pkg Type -55 to 125 LM158JG
LM158JGB Active Production CDIP (JG) | 8 50 | TUBE No SNPB N/A for Pkg Type -55 to 125 8771001PA
LM158
LM258ADGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU | SN | NIPDAU Level-1-260C-UNLIM -25 to 85 (M3L, M3P, M3S, M3
U)
LM258ADR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -25 to 85 LM258A
LM258ADRG4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A
LM258AP Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -25 to 85 LM258AP
LM258APE4 Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -25 to 85 LM258AP
LM258DGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -25 to 85 (M2L, M2P, M2S, M2
U)
LM258DR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -25 to 85 LM258
LM258DRG3 Obsolete Production SOIC (D) | 8 - - Call TI Call TI -25 to 85 LM258
LM258DRG4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU | NIPDAU Level-1-260C-UNLIM -25 to 85 LM258

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 2-May-2025

Orderable Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
part number (1) (2) (3) Ball material Peak reflow (6)
(4) (5)

LM258P Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU | SN N/A for Pkg Type -25 to 85 LM258P
LM258PE4 Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -25 to 85 LM258P
LM2904AVQDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
LM2904AVQDRG4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
LM2904AVQPWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
LM2904AVQPWRG4 Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
LM2904BAIDDFR Active Production SOT-23-THIN (DDF) | 8 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2904A
LM2904BAIDGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 28CB
LM2904BAIDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2904BA
LM2904BAIPWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2904BA
LM2904BIDDFR Active Production SOT-23-THIN (DDF) | 8 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
LM2904BIDGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 28BB
LM2904BIDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B
LM2904BIPWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B
LM2904DE4 NRND Production null (null) | 75 | TUBE - Call TI Call TI -40 to 125
LM2904DGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 (MBL, MBP, MBS, MB
U)
LM2904DR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
LM2904DRG3 Obsolete Production SOIC (D) | 8 - - Call TI Call TI -40 to 125 LM2904
LM2904DRG4 Obsolete Production SOIC (D) | 8 - - Call TI Call TI -40 to 125 LM2904
LM2904P Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 125 LM2904P
LM2904PE4 Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 125 LM2904P
LM2904PSR Active Production SO (PS) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
LM2904PWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 L2904
LM2904PWRG3 Obsolete Production TSSOP (PW) | 8 - - Call TI Call TI -40 to 125 L2904
LM2904PWRG4-JF Obsolete Production TSSOP (PW) | 8 - - Call TI Call TI -40 to 125 L2904
LM2904QDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1
LM2904QDRG4 Obsolete Production SOIC (D) | 8 - - Call TI Call TI -40 to 125 2904Q1
LM2904VQDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
LM2904VQDRG4 Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
LM2904VQPWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V

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Orderable Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
part number (1) (2) (3) Ball material Peak reflow (6)
(4) (5)

LM2904VQPWRG4 Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
LM358ADE4 NRND Production null (null) | 75 | TUBE - Call TI Call TI 0 to 70
LM358ADGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 (M6L, M6P, M6S, M6
U)
LM358ADR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM358A
LM358ADRG4 Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 70 LM358A
LM358AP Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM358AP
LM358APE4 Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM358AP
LM358APW Obsolete Production TSSOP (PW) | 8 - - Call TI Call TI 0 to 70 L358A
LM358APWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L358A
LM358BAIDDFR Active Production SOT-23-THIN (DDF) | 8 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 358BA
LM358BAIDGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 28DB
LM358BAIDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 L358BA
LM358BAIPWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 L358BA
LM358BIDDFR Active Production SOT-23-THIN (DDF) | 8 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM358
LM358BIDGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 85 (1TKR, 358B)
LM358BIDR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B
LM358BIPWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B
LM358D Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 70 LM358
LM358DGKR Active Production VSSOP (DGK) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 (M5L, M5P, M5S, M5
U)
LM358DR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LM358
LM358DRG3 Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 70 LM358
LM358DRG4 Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 70 LM358
LM358P Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM358P
LM358PE3 Obsolete Production PDIP (P) | 8 - - Call TI Call TI 0 to 70 LM358P
LM358PE4 Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 LM358P
LM358PSR Active Production SO (PS) | 8 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 L358
LM358PW Obsolete Production TSSOP (PW) | 8 - - Call TI Call TI 0 to 70 L358
LM358PWR Active Production TSSOP (PW) | 8 2000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L358
LM358PWRG3 Obsolete Production TSSOP (PW) | 8 - - Call TI Call TI 0 to 70 L358

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Orderable Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
part number (1) (2) (3) Ball material Peak reflow (6)
(4) (5)

LM358PWRG4 Obsolete Production TSSOP (PW) | 8 - - Call TI Call TI 0 to 70 L358

LM358PWRG4-JF Obsolete Production TSSOP (PW) | 8 - - Call TI Call TI 0 to 70 L358

(1)
Status: For more details on status, see our product life cycle.

(2)
Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without
limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available
for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3)
RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4)
Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the
finish value exceeds the maximum column width.

(5)
MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per
JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6)
Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the
previous line and the two combined represent the entire part marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF LM258A, LM2904, LM2904B, LM2904BA :

• Automotive : LM2904-Q1, LM2904B-Q1, LM2904BA-Q1

• Enhanced Product : LM258A-EP, LM2904-EP

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NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications

Addendum-Page 5
 PACKAGE MATERIALS INFORMATION

www.ti.com 26-Apr-2025

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM258ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM258DGKR VSSOP DGK 8 2500 330.0 12.4 5.25 3.35 1.25 8.0 12.0 Q1
LM258DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

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Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1

Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM258DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904AVQDR SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1
LM2904AVQDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904AVQDRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904AVQDRG4 SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1
LM2904AVQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904AVQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904AVQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904AVQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904BAIDDFR SOT-23- DDF 8 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
THIN
LM2904BAIDGKR VSSOP DGK 8 2500 330.0 12.4 5.25 3.35 1.25 8.0 12.0 Q1
LM2904BAIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904BAIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904BAIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904BAIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904BAIPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904BAIPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904BIDDFR SOT-23- DDF 8 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
THIN
LM2904BIDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2904BIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904BIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904BIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904BIPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904BIPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904DGKR VSSOP DGK 8 2500 330.0 12.4 5.25 3.35 1.25 8.0 12.0 Q1
LM2904DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2904DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904PSR SO PS 8 2000 330.0 16.4 8.35 6.6 2.4 12.0 16.0 Q1
LM2904PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904VQDR SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1
LM2904VQDRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904VQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

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Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1

Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2904VQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904VQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904VQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358ADGKR VSSOP DGK 8 2500 330.0 12.4 5.25 3.35 1.25 8.0 12.0 Q1
LM358ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358BAIDDFR SOT-23- DDF 8 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
THIN
LM358BAIDGKR VSSOP DGK 8 2500 330.0 12.4 5.25 3.35 1.25 8.0 12.0 Q1
LM358BAIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358BAIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358BAIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358BAIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358BAIPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358BAIPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358BIDDFR SOT-23- DDF 8 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
THIN
LM358BIDGKR VSSOP DGK 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358BIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358BIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358BIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358BIPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358BIPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358DGKR VSSOP DGK 8 2500 330.0 12.4 5.25 3.35 1.25 8.0 12.0 Q1
LM358DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358PSR SO PS 8 2000 330.0 16.4 8.35 6.6 2.4 12.0 16.0 Q1
LM358PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1

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TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM258ADGKR VSSOP DGK 8 2500 356.0 356.0 35.0
LM258ADR SOIC D 8 2500 340.5 336.1 25.0
LM258ADR SOIC D 8 2500 356.0 356.0 35.0
LM258ADR SOIC D 8 2500 353.0 353.0 32.0
LM258ADR SOIC D 8 2500 353.0 353.0 32.0
LM258ADRG4 SOIC D 8 2500 356.0 356.0 35.0
LM258ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM258ADRG4 SOIC D 8 2500 356.0 356.0 35.0
LM258ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM258DGKR VSSOP DGK 8 2500 356.0 356.0 35.0
LM258DGKR VSSOP DGK 8 2500 366.0 364.0 50.0
LM258DR SOIC D 8 2500 353.0 353.0 32.0
LM258DR SOIC D 8 2500 353.0 353.0 32.0
LM258DR SOIC D 8 2500 340.5 336.1 25.0
LM258DR SOIC D 8 2500 356.0 356.0 35.0
LM258DR SOIC D 8 2500 340.5 338.1 20.6
LM258DR SOIC D 8 2500 356.0 356.0 35.0
LM258DRG4 SOIC D 8 2500 356.0 356.0 35.0

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Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM258DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM258DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM258DRG4 SOIC D 8 2500 356.0 356.0 35.0
LM2904AVQDR SOIC D 8 2500 353.0 353.0 32.0
LM2904AVQDR SOIC D 8 2500 340.5 338.1 20.6
LM2904AVQDRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2904AVQDRG4 SOIC D 8 2500 353.0 353.0 32.0
LM2904AVQPWR TSSOP PW 8 2000 356.0 356.0 35.0
LM2904AVQPWR TSSOP PW 8 2000 356.0 356.0 35.0
LM2904AVQPWRG4 TSSOP PW 8 2000 356.0 356.0 35.0
LM2904AVQPWRG4 TSSOP PW 8 2000 356.0 356.0 35.0
LM2904BAIDDFR SOT-23-THIN DDF 8 3000 210.0 185.0 35.0
LM2904BAIDGKR VSSOP DGK 8 2500 366.0 364.0 50.0
LM2904BAIDR SOIC D 8 2500 356.0 356.0 35.0
LM2904BAIDR SOIC D 8 2500 353.0 353.0 32.0
LM2904BAIDR SOIC D 8 2500 353.0 353.0 32.0
LM2904BAIDR SOIC D 8 2500 340.5 336.1 25.0
LM2904BAIPWR TSSOP PW 8 2000 353.0 353.0 32.0
LM2904BAIPWR TSSOP PW 8 2000 356.0 356.0 35.0
LM2904BIDDFR SOT-23-THIN DDF 8 3000 210.0 185.0 35.0
LM2904BIDGKR VSSOP DGK 8 2500 353.0 353.0 32.0
LM2904BIDR SOIC D 8 2500 353.0 353.0 32.0
LM2904BIDR SOIC D 8 2500 353.0 353.0 32.0
LM2904BIDR SOIC D 8 2500 340.5 336.1 25.0
LM2904BIPWR TSSOP PW 8 2000 356.0 356.0 35.0
LM2904BIPWR TSSOP PW 8 2000 353.0 353.0 32.0
LM2904DGKR VSSOP DGK 8 2500 366.0 364.0 50.0
LM2904DGKR VSSOP DGK 8 2500 356.0 356.0 35.0
LM2904DR SOIC D 8 2500 353.0 353.0 32.0
LM2904DR SOIC D 8 2500 340.5 338.1 20.6
LM2904PSR SO PS 8 2000 356.0 356.0 35.0
LM2904PWR TSSOP PW 8 2000 353.0 353.0 32.0
LM2904PWR TSSOP PW 8 2000 356.0 356.0 35.0
LM2904QDR SOIC D 8 2500 353.0 353.0 32.0
LM2904QDR SOIC D 8 2500 350.0 350.0 43.0
LM2904VQDR SOIC D 8 2500 353.0 353.0 32.0
LM2904VQDRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2904VQPWR TSSOP PW 8 2000 356.0 356.0 35.0
LM2904VQPWR TSSOP PW 8 2000 356.0 356.0 35.0
LM2904VQPWRG4 TSSOP PW 8 2000 356.0 356.0 35.0
LM2904VQPWRG4 TSSOP PW 8 2000 356.0 356.0 35.0
LM358ADGKR VSSOP DGK 8 2500 366.0 364.0 50.0
LM358ADR SOIC D 8 2500 340.5 338.1 20.6

Pack Materials-Page 5
 PACKAGE MATERIALS INFORMATION

www.ti.com 26-Apr-2025

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM358ADR SOIC D 8 2500 353.0 353.0 32.0
LM358ADR SOIC D 8 2500 353.0 353.0 32.0
LM358ADR SOIC D 8 2500 340.5 336.1 25.0
LM358ADR SOIC D 8 2500 356.0 356.0 35.0
LM358APWR TSSOP PW 8 2000 356.0 356.0 35.0
LM358APWR TSSOP PW 8 2000 353.0 353.0 32.0
LM358BAIDDFR SOT-23-THIN DDF 8 3000 210.0 185.0 35.0
LM358BAIDGKR VSSOP DGK 8 2500 366.0 364.0 50.0
LM358BAIDR SOIC D 8 2500 353.0 353.0 32.0
LM358BAIDR SOIC D 8 2500 353.0 353.0 32.0
LM358BAIDR SOIC D 8 2500 340.5 336.1 25.0
LM358BAIDR SOIC D 8 2500 356.0 356.0 35.0
LM358BAIPWR TSSOP PW 8 2000 356.0 356.0 35.0
LM358BAIPWR TSSOP PW 8 2000 353.0 353.0 32.0
LM358BIDDFR SOT-23-THIN DDF 8 3000 210.0 185.0 35.0
LM358BIDGKR VSSOP DGK 8 2500 353.0 353.0 32.0
LM358BIDR SOIC D 8 2500 353.0 353.0 32.0
LM358BIDR SOIC D 8 2500 353.0 353.0 32.0
LM358BIDR SOIC D 8 2500 340.5 336.1 25.0
LM358BIPWR TSSOP PW 8 2000 353.0 353.0 32.0
LM358BIPWR TSSOP PW 8 2000 356.0 356.0 35.0
LM358DGKR VSSOP DGK 8 2500 366.0 364.0 50.0
LM358DGKR VSSOP DGK 8 2500 356.0 356.0 35.0
LM358DR SOIC D 8 2500 340.5 338.1 20.6
LM358DR SOIC D 8 2500 353.0 353.0 32.0
LM358PSR SO PS 8 2000 356.0 356.0 35.0
LM358PWR TSSOP PW 8 2000 356.0 356.0 35.0
LM358PWR TSSOP PW 8 2000 353.0 353.0 32.0

Pack Materials-Page 6
 PACKAGE MATERIALS INFORMATION

www.ti.com 26-Apr-2025

TUBE

T - Tube
height L - Tube length

W - Tube
width

B - Alignment groove width

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
5962-87710012A FK LCCC 20 55 506.98 12.06 2030 NA
5962-87710022A FK LCCC 20 55 506.98 12.06 2030 NA
LM158AFKB FK LCCC 20 55 506.98 12.06 2030 NA
LM158FKB FK LCCC 20 55 506.98 12.06 2030 NA
LM258AP P PDIP 8 50 506 13.97 11230 4.32
LM258APE4 P PDIP 8 50 506 13.97 11230 4.32
LM258P P PDIP 8 50 506 13.97 11230 4.32
LM258P P PDIP 8 50 506.1 9 600 5.4
LM258PE4 P PDIP 8 50 506 13.97 11230 4.32
LM2904P P PDIP 8 50 506 13.97 11230 4.32
LM2904PE4 P PDIP 8 50 506 13.97 11230 4.32
LM358AP P PDIP 8 50 506 13.97 11230 4.32
LM358APE4 P PDIP 8 50 506 13.97 11230 4.32
LM358P P PDIP 8 50 506 13.97 11230 4.32
LM358PE4 P PDIP 8 50 506 13.97 11230 4.32

Pack Materials-Page 7
 PACKAGE OUTLINE
JG0008A CDIP - 5.08 mm max height
CERAMIC DUAL IN-LINE PACKAGE

7.11
B 1.60
A 6.22
0.38

6X 2.54

1.65
10.16 4X
1.14
9.00

4X (0.94)

0.58
8X
0.51 3.30 0.38
MIN MIN 0.25 C A B

5.08 MAX
7.87 SEATING PLANE
7.37 C

0.36 0 -15 TYP

TYP
0.20

4230036/A 09/2023
NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package can be hermetically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification.
5. Falls within MIL STD 1835 GDIP1-T8

www.ti.com
 EXAMPLE BOARD LAYOUT
JG0008A CDIP - 5.08 mm max height
CERAMIC DUAL IN-LINE PACKAGE

(7.62)

0.05 MAX
ALL AROUND
TYP
1 8
(1.6)

6X (2.54) (R0.05) TYP

SYMM

7X ( 1.6)

8X ( 1)
THRU

METAL
TYP 5
4

SOLDER MASK
OPENING SYMM
TYP

LAND PATTERN EXAMPLE

NON SOLDER MASK DEFINED
SCALE: 9X

4230036/A 09/2023

www.ti.com
 PACKAGE OUTLINE
DGK0008A SCALE 4.000
VSSOP - 1.1 mm max height
SMALL OUTLINE PACKAGE

C
5.05
TYP
A 4.75
0.1 C
PIN 1 INDEX AREA
SEATING
PLANE
6X 0.65
8
1

2X
3.1
1.95
2.9
NOTE 3

4
5 0.38
8X
0.25
3.1 0.13 C A B
B
2.9
NOTE 4

0.23
0.13

SEE DETAIL A
0.25
GAGE PLANE

1.1 MAX

0.7 0.15
0 -8 0.4 0.05
DETAIL A
A 20

TYPICAL

4214862/A 04/2023
PowerPAD is a trademark of Texas Instruments.
NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-187.

www.ti.com
 EXAMPLE BOARD LAYOUT
TM
DGK0008A VSSOP - 1.1 mm max height
SMALL OUTLINE PACKAGE

SYMM
8X (1.4) (R0.05) TYP

8X (0.45) 1 8

SYMM

6X (0.65)
5
4

SEE DETAILS

(4.4)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 15X

SOLDER MASK METAL UNDER SOLDER MASK

METAL
OPENING SOLDER MASK OPENING

EXPOSED METAL EXPOSED METAL

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS
15.000

4214862/A 04/2023
NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
9. Size of metal pad may vary due to creepage requirement.

www.ti.com
 EXAMPLE STENCIL DESIGN
TM
DGK0008A VSSOP - 1.1 mm max height
SMALL OUTLINE PACKAGE

SYMM

8X (1.4) (R0.05) TYP

8X (0.45) 1 8

SYMM

6X (0.65)
5
4

(4.4)

SOLDER PASTE EXAMPLE

SCALE: 15X

4214862/A 04/2023
NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.

www.ti.com
 GENERIC PACKAGE VIEW
FK 20 LCCC - 2.03 mm max height
8.89 x 8.89, 1.27 mm pitch LEADLESS CERAMIC CHIP CARRIER

This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.

4229370\/A\

www.ti.com
 PACKAGE OUTLINE
DDF0008A SCALE 4.000
SOT-23-THIN - 1.1 mm max height
PLASTIC SMALL OUTLINE

C
2.95 SEATING PLANE
TYP
2.65

A PIN 1 ID 0.1 C
AREA

6X 0.65
8
1

2.95
2.85 2X
NOTE 3 1.95

4 4X 0 -15
5
0.38
8X
0.22
1.65 0.1 C A B
B 1.1
1.55
MAX

4X 4 -15

0.20
TYP
0.08

SEE DETAIL A

0.25
GAGE PLANE

0.1
0 -8 0.6 0.0
0.3
DETAIL A
TYPICAL

4222047/E 07/2024

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.

www.ti.com
 EXAMPLE BOARD LAYOUT
DDF0008A SOT-23-THIN - 1.1 mm max height
PLASTIC SMALL OUTLINE

8X (1.05)
SYMM
1
8

8X (0.45)
SYMM

6X (0.65)
5
4

(R0.05)
TYP (2.6)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:15X

SOLDER MASK METAL UNDER SOLDER MASK

METAL OPENING
OPENING SOLDER MASK

0.05 MAX EXPOSED EXPOSED

METAL 0.05 MIN
ALL AROUND ALL AROUND METAL

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

4222047/E 07/2024
NOTES: (continued)

4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
DDF0008A SOT-23-THIN - 1.1 mm max height
PLASTIC SMALL OUTLINE

8X (1.05) SYMM
(R0.05) TYP
1
8

8X (0.45)
SYMM

6X (0.65)
5
4

(2.6)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE:15X

4222047/E 07/2024
NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.

www.ti.com
 PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1

.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]

4X (0 -15 )

4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4

.005-.010 TYP
[0.13-0.25]

4X (0 -15 )

SEE DETAIL A
.010
[0.25]

.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]

4214825/C 02/2019

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.

www.ti.com
 EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8

8X (.024)
[0.6] SYMM

(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:8X

SOLDER MASK SOLDER MASK

METAL METAL UNDER
OPENING OPENING SOLDER MASK

EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

4214825/C 02/2019

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 )
[1.55] SYMM

1
8

8X (.024)
[0.6] SYMM

(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]

SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X

4214825/C 02/2019

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
 PACKAGE OUTLINE
PW0008A SCALE 2.800
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

C
6.6 SEATING PLANE
TYP
6.2

A PIN 1 ID 0.1 C
AREA
6X 0.65
8
1

3.1 2X
2.9
NOTE 3 1.95

4
5
0.30
8X
0.19
4.5 1.2 MAX
B 0.1 C A B
4.3
NOTE 4

(0.15) TYP
SEE DETAIL A

0.25
GAGE PLANE

0.75 0.15
0 -8 0.05
0.50

DETAIL A
TYPICAL

4221848/A 02/2015

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.

www.ti.com
 EXAMPLE BOARD LAYOUT
PW0008A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

8X (1.5)
8X (0.45) SYMM
(R0.05)
1 TYP
8

SYMM

6X (0.65)
5
4

(5.8)

LAND PATTERN EXAMPLE

SCALE:10X

SOLDER MASK METAL UNDER SOLDER MASK

METAL OPENING
OPENING SOLDER MASK

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

NOT TO SCALE

4221848/A 02/2015
NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
PW0008A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

8X (1.5)
SYMM (R0.05) TYP
8X (0.45)
1
8

SYMM

6X (0.65)
5
4

(5.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE:10X

4221848/A 02/2015
NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
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