Display Elektronik GmbH

OLED-MODULE

DEP 128064C1-Y
0,96“ - OLED

Product Specification Ver.: 5

18.12.2019
DEP 128064C1-Y Production Specification

Revision History

VERSION DATE REVISED PAGE NO. Note

0 29.08.2017 First release

1 22.01.2018 Modify Reliability test
Condition,Add
Initial,ICC,CIE
2 27.11.2018 Modify Static
electricity test
Content of Test
3 02.08.2019 Modify Pin 26
Interface Pin Function
& Application
recommendations &
Initial code &
Brightness
4 02.09.2019 Modify Precautions in
use of OLED
Modules
5 18.12.2019 Modify Reliability Test
and measurement
conditions &
Inspection
specification:" Accept
no dense" modify to
"ignore"& Precautions

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Contents
1. General Specification
2. Interface Pin Function
3. Contour Drawing & Block Diagram
4. Absolute Maximum Ratings
5. Electrical Characteristics
6. Optical Characteristics
7. OLED Lifetime
8. Reliability
9. Inspection specification
10. Precautions in use of OLED Modules

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1. General Specification
The Features is described as follow:
n Module dimension: 26.70 x 19.26 x 1.26 mm
n Active area: 21.738 x 10.858mm
n Dot Matrix: 128 x 64
n Dot size: 0.148 x 0.148 mm
n Dot pitch: 0.17 x 0.17mm
n Display Mode：Passive Matrix
n Duty: 1/64 Duty
n Display Color: OLED , Yellow
n Interface: 6800,8080,SPI,I2C
n Controller IC: SSD1306
n SIZE: 0.96 Inch

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2. Interface Pin Function

No. Symbol Function
Reserved Pin (Supporting Pin)
N.C.
1 The supporting pins can reduce the influences from stresses on the function
(GND)
pins. These pins must be connected to external ground.
2 C2N
Positive Terminal of the Flying Inverting Capacitor Negative Terminal of the
3 C2P
Flying Boost Capacitor The charge-pump capacitors are required between the
4 C1P
terminals. They must be floated when the converter is not used.
5 C1N
Power Supply for DC/DC Converter Circuit
This is the power supply pin for the internal buffer of the DC/DC voltage
6 VBAT
converter. It must be connected to external source when the converter is used.
It should be connected to VDD when the converter is not used.
7 NC NC
Ground of Logic Circuit
8 VSS This is a ground pin. It acts as a reference for the logic pins. It must be
connected to external ground.
Power Supply for Logic
9 VDD
This is a voltage supply pin. It must be connected to external source.
Communicating Protocol Select
10 BS0 These pins are MCU interface selection input. See the
following table:
11 BS1

12 BS2

Chip Select
13 CS# This pin is the chip select input. The chip is enabled for MCU communication
only when CS# is pulled low.
Power Reset for Controller and Driver
14 RES# This pin is reset signal input. When the pin is low, initialization of the chip is
executed.
Data/Command Control
This pin is Data/Command control pin. When the pin is pulled high, the input at
D7~D0 is treated as display data.
When the pin is pulled low, the input at D7~D0 will be transferred to the
command register. For detail relationship to MCU interface signals, please refer
15 D/C#
to the Timing Characteristics Diagrams.
When the pin is pulled high and serial interface mode is selected, the data at
SDIN is treated as data. When it is pulled low, the data at SDIN will be
transferred to the command register. In I2C mode, this pin acts as SA0 for slave
address selection.

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Read/Write Select or Write
This pin is MCU interface input. When interfacing to a 68XX-series
microprocessor, this pin will be used as Read/Write (R/W#) selection input.
16 R/W# Pull this pin to “High” for read mode and pull it to “Low” for write mode.
When 80XX interface mode is selected, this pin will be the Write (WR#)
input. Data write operation is initiated when this pin is pulled low and the
CS# is pulled low.
Read/Write Enable or Read
This pin is MCU interface input. When interfacing to a 68XX-series
microprocessor, this pin will be used as the Enable (E) signal. Read/write
17 E/RD# operation is initiated when this pin is pulled high and the CS# is pulled low.
When connecting to an 80XX-microprocessor, this pin receives the Read
(RD#) signal. Data read operation is initiated when this pin is pulled low
and CS# is pulled low.
Host Data Input/Output Bus
These pins are 8-bit bi-directional data bus to be connected to the
microprocessor’s data bus. When serial mode is selected, D1 will be the
18~25 D0~D7
serial data input SDIN and D0 will be the serial clock input SCLK. When
I2C mode is selected, D2 & D1 should be tired together and serve as
SDAout & SDAin in application and D0 is the serial clock input SCL.
Current Reference for Brightness Adjustment
26 IREF This pin is segment current reference pin. A resistor should be connected
between this pin and VSS. Set the current lower than 30uA.
Voltage Output High Level for COM Signal
27 VCOMH This pin is the input pin for the voltage output high level for COM signals. A
capacitor should be connected between this pin and VSS.
Power Supply for OEL Panel
This is the most positive voltage supply pin of the chip. A stabilization
28 VCC capacitor should be connected between this pin and VSS when the
converter is used. It must be connected to external source when the
converter is not used.
Ground of Analog Circuit
29 VLSS
This is an analog ground pin. It should be connected to VSS externally.
Reserved Pin (Supporting Pin)
NC
30 The supporting pins can reduce the influences from stresses on the
(GND)
function pins. These pins must be connected to external ground.

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3. Contour Drawing & Block Diagram

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3.1 Application recommendations
External VCC Solution

Recommended components：
C1, C2：2.2uF
C4：1.0uF

Bus Interface selection: (Must be set the BS[2:0], refer to Section 3)

8-bits 6800 and 8080 parallel, 3 or 4-wire SPI, I2C

Voltage at IREF = VCC – 3V. For VCC = 12V, IREF = 30uA:

R1 = (Voltage at IREF - VSS) / IREF
= (12-3)V / 30u
= 300K ohm

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4. Absolute Maximum Ratings

Parameter Symbol Min Max Unit Notes

Supply Voltage for Logic VDD 0 4.0 V 1,2

Supply Voltage for Display VCC 0 15.0 V 1,2

Operating Temperature TOP -40 +80 °C —

Storage Temperature TSTG -40 +85 °C —

Note 1: All the above voltages are on the basis of “VSS = 0V”.
Note 2: When this module is used beyond the above absolute maximum ratings, permanent
breakage of the module may occur. Also, for normal operations, it is desirable to use
this module under the conditions according to Section 6 “Electrical Characteristics”. If
this module is used beyond these conditions, malfunctioning of the module can occur
and the reliability of the module may deteriorate

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5. Electrical Characteristics
5.1 DC Electrical Characteristics

Item Symbol Condition Min Typ Max Unit

Supply Voltage for Logic VDD － 2.8 3.0 3.3 V

Supply Voltage for Display VCC － 11.5 12.0 12.5 V

Input High Volt. VIH － 0.8×VDD － VDD V

Input Low Volt. VIL － 0 － 0.2×VDD V

Output High Volt. VOH － 0.9×VDD － VDD V

Output Low Volt. VOL － 0 － 0.1×VDD V

Operating Current for VCC
ICC VCC =12V － 13 17 mA
(50% display ON)

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5.2 Initial code

void Initial_ic(void){

Write_Command(0xAE); //Display Off

Write_Command(0xD5); //SET DISPLAY CLOCK

Write_Command(0x80); //105HZ

Write_Command(0xA8); //Select Multiplex Ratio

Write_Command(0x3F); //Default => 0x3F (1/64 Duty)

Write_Command(0xD3); //Setting Display Offset

Write_Command(0x00); //00H Reset

Write_Command(0x40); //Set Display Start Line

Write_Command(0x8D); //Set Charge Pump

Write_Command(0x10); //Disable Charge Pump
Write_command(0x14); //Enable Charge Pump

Write_Command(0xA1); //Set Segment Re-Map Default

Write_Command(0xC8); //Set COM Output Scan Direction

Write_Command(0xDA); //Set COM Hardware Configuration

Write_Command(0x12); //Alternative COM Pin

Write_Command(0x81); //Set Contrast Control

Write_Command(0x2F);

Write_Command(0xD9); //Set Pre-Charge period

Write_Command(0x22);

Write_Command(0xDB); //Set Deselect Vcomh level

Write_Command(0x30);

Write_Command(0xA4); //Entire Display ON

Write_Command(0xA6); //Set Normal Display

Write_Command(0xAF); //Display ON
}

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6. Optical Characteristics
Item Symbol Condition Min Typ Max Unit
(V)θ － 160 － － deg
View Angle
(H)φ － 160 － － deg

Contrast Ratio CR Dark 2000:1 － － －

T rise － － 10 － μs
Response Time
T fall － － 10 － μs

Display with 50% check Board Brightness 80 100 － cd/m2

CIEx(Yellow) (CIE1931) 0.45 0.47 0.49 －

CIEy(Yellow) (CIE1931) 0.48 0.50 0.52 －

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7. OLED Lifetime

ITEM Conditions Min Typ Remark

Ta=25°C
Operating
/ Initial 50% check board 50,000 Hrs - Note
Lifetime
brightness Typical Value

Notes:
1. Life time is defined the amount of time when the luminance has decayed to <50% of the
initial value.
2. This analysis method uses life data obtained under accelerated conditions to extrapolate
an estimated probability density function (pdf) for the product under normal use
conditions.
3. Screen saving mode will extend OLED lifetime.

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8. Reliability
Content of Reliability Test
Environmental Test
Applicable
Test Item Content of Test Test Condition
Standard
High
Endurance test applying the high 85°C
Temperature ——
storage temperature for a long time. 240hrs
Storage
Low
Endurance test applying the low storage -40°C
Temperature ——
temperature for a long time. 240hrs
Storage
Endurance test applying the electric
High
stress (Voltage & Current) and the 80°C
Temperature ——
thermal stress to the element for a long 240hrs
Operation
time.
Low Endurance test applying the electric
-40°C
Temperature stress under low temperature for a long ——
240hrs
Operation time.
High
Endurance test applying the high
Temperature/ 60°C,90%RH
temperature and high humidity storage ——
Humidity 240hrs
for a long time.
Storage
High
Endurance test applying the high
Temperature/ 60°C,90%RH
temperature and high humidity ——
Humidity 120hrs
Operation for a long time.
Operation
Endurance test applying the low and
high temperature cycle.
Temperature -40°C 25°C 80°C -40°C /80°C
——
Cycle 30 cycles
30min 5min 30min
1 cycle
Mechanical Test
Frequency:10~55Hz
Endurance test applying the vibration amplitude:1.5mm
Vibration Test ——
during transportation and using. Time:0.5hrs/axis
Test axis:X,Y,Z
Others

Static Endurance test applying the electric Air Discharge model

——
Electricity Test stress to the finished product housing. ±4kV,10 times

*** Supply voltage for OLED system =Operating voltage at 25°C

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Test and measurement conditions
1. All measurements shall not be started until the specimens attain to temperature stability.
After the completion of the described reliability test, the samples were left at room
temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH.
2. All-pixels on/off exchange is used as operation test pattern.
3. The degradation of Polarizer are ignored for High Temperature storage, High Temperature/
Humidity Storage, Temperature Cycle
Evaluation criteria
1. The function test is OK.
2. No observable defects.
3. Luminance: > 50% of initial value.
4. Current consumption: within ± 50% of initial value.
APPENDIX:
RESIDUE IMAGE
Because the pixels are lighted in different time, the luminance of active pixels
may reduce or differ from inactive pixels. Therefore, the residue image will occur.
To avoid the residue image, every pixel needs to be lighted up uniformly.

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9. Inspection specification
Inspection Standard:
MIL-STD-105E table normal inspection single sample level II.
Definition
1 Major defect : The defect that greatly affect the usability of product.
2 Minor defect : The other defects, such as cosmetic defects, etc.
Definition of inspection zone:
C
B

Zone A: Active Area

Zone B: Viewing Area except Zone A
Zone C: Outside Viewing Area
Note: As a general rule, visual defects in Zone C are permissible, when it is no trouble of
quality and assembly to customer`s product.

Inspection Methods
1 The general inspection : Under fluorescent light illumination: 750~1500 Lux, about 30cm
viewing distance, within 45º viewing angle, under 25±5°C.
2 The luminance and color coordinate inspection : By SR-3 or BM-7 or the equal
equipments, in the dark room, under 25±5°C.

NO Item Criterion AQL

1.1 Missing vertical, horizontal segment, segment contrast defect.
1.2 Missing character , dot or icon.
1.3 Display malfunction.
Electrical 1.4 No function or no display.
01 0.65
Testing 1.5 Current consumption exceeds product specifications.
1.6 OLED viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.
Black or
white
2.1 White and black spots on display ≦0.25mm, no more than
spots on
02 three white or black spots present. 2.5
OLED
2.2 Densely spaced: No more than two spots or lines within 3mm.
(display
only)

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NO Item Criterion AQL

3.1 Round type :

As following
OLED
drawing SIZE Acceptable
Black Zone
Φ=( x + y ) / 2 QTY
Spots,
Φ≦0.10 ignore A+ B,
White 2.5
Spots, 0.10＜Φ≦0.20 2 A+ B
Contamin
ation (non- 0.20＜Φ≦0.25 1 A+ B
display)
0.25＜Φ 0 A+ B

3.2 Line type : (As following drawing)

03

Length Width Acceptable

Zone
Q TY 2.5
--- W≦0.02 ignore A+B
L≦3.0 0.02＜W≦0.03 A+B
2
L≦2.5 0.03＜W≦0.05 A+B
--- 0.05＜W As round type

If bubbles are Size Φ Acceptable Q TY Zone

visible, judge Φ≦0.20 ignore A+B
using black spot
Polarizer specifications, 0.20＜Φ≦0.50 3 A+B
04 2.5
Bubbles not easy to find, 2
0.50＜Φ≦1.00 A+B
must check in
specify direction. 1.00＜Φ 0 A+B
Total Q TY 3

05 Scratches Follow NO.3 OLED black spots, white spots, contamination.

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NO Item Criterion AQL

Symbols Define:
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: OLED side length
L: Electrode pad length:
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:

2.5

z: Chip thickness y: Chip width x: Chip length

Z≦1/2t Not over viewing area x≦1/8a
1/2t＜z≦2t Not exceed 1/3k x≦1/8a
Chipped
Glass ☉If there are 2 or more chips, x is total length of each chip.

6.1.2 Corner crack:

06

2.5
z: Chip thickness y: Chip width x: Chip length
Z≦1/2t Not over viewing area x≦1/8a
1/2t＜z≦2t Not exceed 1/3k x≦1/8a
☉If there are 2 or more chips, x is the total length of each chip.

Symbols :
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: OLED side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
Glass
2.5
Crack

y: Chip width x: Chip length z: Chip thickness

y≦0.5mm x≦1/8a 0 ＜ z≦t

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NO Item Criterion AQL

6.2.2 Non-conductive portion:

y: Chip width x: Chip length z: Chip thickness

y≦ L x≦1/8a 0 ＜ z≦t
☉If the chipped area touches the ITO terminal, over 2/3 of the ITO
must remain and be inspected according to electrode terminal
Glass specifications.
06 2.5
Crack
☉If the product will be heat sealed by the customer, the alignment
mark not be damaged.

6.2.3 Substrate protuberance and internal crack.

y: width x: length
y≦1/3L x≦a

Cracked
07 The OLED with extensive crack is not acceptable. 2.5
Glass

8.1 Illumination source flickers when lit. 0.65

Backlight 8.2 Spots or scratched that appear when lit must be judged. Using 2.5
08
Elements OLED spot, lines and contamination standards.
8.3 Backlight doesn’t light or color wrong. 0.65

9.1 Bezel may not have rust, be deformed or have fingerprints, 2.5
09 Bezel stains or other contamination.
9.2 Bezel must comply with job specifications. 0.65

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NO Item Criterion AQL
10.1 COB seal may not have pinholes larger than 0.2mm or
contamination. 2.5
10.2 COB seal surface may not have pinholes through to the
IC. 2.5
10.3 The height of the COB should not exceed the height 0.65
indicated in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside the 2.5
seal area on the PCB. And there should be no more than
10 PCB , COB three places.
10.5 No oxidation or contamination PCB terminals. 2.5
10.6 Parts on PCB must be the same as on the production 0.65
characteristic chart. There should be no wrong parts,
missing parts or excess parts.
10.7 The jumper on the PCB should conform to the product 0.65
characteristic chart.
10.8 If solder gets on bezel tab pads, OLED pad, zebra pad or 2.5
screw hold pad, make sure it is smoothed down.

11.1 No un-melted solder paste may be present on the PCB. 2.5

11.2 No cold solder joints, missing solder connections, 2.5
11 Soldering oxidation or icicle.
11.3 No residue or solder balls on PCB. 2.5
11.4 No short circuits in components on PCB. 0.65

12.1 No oxidation, contamination, curves or, bends on interface 2.5

Pin (OLB) of TCP.
12.2 No cracks on interface pin (OLB) of TCP. 0.65
12.3 No contamination, solder residue or solder balls on 2.5
product.
12.4 The IC on the TCP may not be damaged, circuits. 2.5
12.5 The uppermost edge of the protective strip on the interface 2.5
pin must be present or look as if it cause the interface pin
General
12 to sever.
Appearance
12.6 The residual rosin or tin oil of soldering (component or 2.5
chip component) is not burned into brown or black color.
12.7 Sealant on top of the ITO circuit has not hardened. 2.5
12.8 Pin type must match type in specification sheet. 0.65
12.9 OLED pin loose or missing pins. 0.65
12.10 Product packaging must the same as specified on 0.65
packaging specification sheet.
12.11 Product dimension and structure must conform to product 0.65
specification sheet.

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Check Item Classification Criteria

No Display Major

Missing Line Major

Pixel Short Major

Darker Short Major

Wrong Display Major

Un-uniform
B/A x 100% < 70% Major
A/C x 100% < 70%

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10. Precautions in use of OLED Modules

Modules
(1) Avoid applying excessive shocks to module or making any alterations or modifications to it.
(2) Don’t make extra holes on the printed circuit board, change the components or modify its
shape of OLED display module.
(3) Don’t disassemble the OLED display module.
(4) Do not apply input signals while the logic power is off.
(5) Don’t operate it above the absolute maximum rating.
(6) Don’t drop, bend or twist OLED display module.
(7) Soldering: only to the I/O terminals.
(8) Hot-Bar FPC soldering condition: 280~350C, less than 5 seconds.
(9) Display Elektronik GmbH has the right to change the passive components (Resistors,
capacitors and other passive components will have different appearance and color caused
by the different supplier.) and change the PCB Rev. (In order to satisfy the supplying stability,
management optimization and the best product performance...etc, under the premise of not
affecting the electrical characteristics and external dimensions, Display Elektronik GmbH
have the right to modify the version.)
(10) Display Elektronik GmbH has the right to upgrade or modify the product function.

10.1. Handling Precautions

(1) Since the display panel is being made of glass, do not apply mechanical impacts such as
dropping from a high position.
(2) If the display panel is broken by some accident and the internal organic substance leaks out,
be careful not to inhale nor lick the organic substance.
(3) If pressure is applied to the display surface or its neighborhood of the OLED display module,
the cell structure may be damaged. So, be careful not to apply pressure to these sections.
(4) The polarizer covering the surface of the OLED display module is soft and easily scratched.
(5) When the surface of the polarizer of the OLED display module has soil, clean the surface. It
takes advantage by using following adhesion tape.
* Scotch Mending Tape No. 810 or an equivalent
Never try to breathe upon the soiled surface nor wipe the surface using cloth containing
solvent such as ethyl alcohol, since the surface of the polarizer will become cloudy.
Also, pay attention that the following liquid and solvent may spoil the polarizer:
* Water
* Ketone
* Aromatic Solvents
(6) Protection film is being applied to the surface of the display panel and removes the protection
film before assembling it. At this time, if the OLED display module has been stored for a long
period of time, residue adhesive material of the protection film may remain on the surface of
the display panel after removed of the film. In such case, remove the residue material by the
method introduced in the above Section 5.
(7) Do not touch the following sections whenever possible while handling the OLED display
modules.
* Pins and electrodes
* Pattern layouts such as the TCP & FPC
(8) Hold OLED display module very carefully when placing OLED display module into the

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System housing. Do not apply excessive stress or pressure to OLED display module. And,
do not over bend the film with electrode pattern layouts. These stresses will influence the
display performance. Also, secure sufficient rigidity for the outer cases.

(9) Do not apply stress to the LSI chips and the surrounding molded sections.
(10) Pay sufficient attention to the working environments when handing OLED display modules
to prevent occurrence of element breakage accidents by static electricity.
* Be sure to make human body grounding when handling OLED display modules.
* Be sure to ground tools to use or assembly such as soldering irons.
* To suppress generation of static electricity, avoid carrying out assembly work under dry
environments.
* Protective film is being applied to the surface of the display panel of the OLED display
module. Be careful since static electricity may be generated when exfoliating the protective
film.

10.2. Storage Precautions

(1) When storing OLED display modules, put them in static electricity preventive bags to avoid
be directly exposed to sun or lights of fluorescent lamps. (We recommend you to store these
modules in the packaged state when they were shipped from Display Elektronik GmbH. At
that time, be careful not to let water drops adhere to the packages or bags.)

(2) When the OLED display module is being dewed or when it is placed under high temperature
or high humidity environments, the electrodes may be corroded if electric current is applied.
Please store it in clean environment.

10.3. Designing Precautions

(1) The absolute maximum ratings are the ratings which cannot be exceeded for OLED display
module, and if these values are exceeded, OLED display module may be damaged.
(2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH
specification and to make the signal line cable as short as possible.
(3) We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit
(VDD / VCC). (Recommend value: 0.5A)
(4) Pay sufficient attention to avoid occurrence of mutual noise interference with the nearby
devices.
(5) As for EMI, take necessary measures on the equipment side basically.
(6) If the power supplied to the OLED display module is forcibly shut down by such errors as
taking out the main battery while the OLED display panel is in operation, we cannot
guarantee the quality of this OLED display module.
* Connection (contact) to any other potential than the above may lead to rupture of the IC.
(7) If this OLED driver is exposed to light, malfunctioning may occur and semiconductor
elements may change their characteristics.
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(8) The internal status may be changed, if excessive external noise enters into the module.
Therefore, it is necessary to take appropriate measures to suppress noise generation or to
protect module from influences of noise on the system design.
(9) We recommend you to make periodical refreshment of the operation statuses (re-setting of
the commands and re-transference of the display data) to cope with catastrophic noise.
(10) It's pretty common to use "Screen Saver" to extend the lifetime and Don't use the same
image for long time in real application. When an OLED display module is operated for a long
of time with fixed pattern, an afterimage or slight contrast deviation may occur.
(11) The limitation of FPC and Film bending.

(12) The module should be fixed balanced into the housing, or the module may be twisted.
(0.1 Max.)

0.1

(13) Please heat up a little the tape sticking on the components when removing it; otherwise the
components might be damaged.

10.4. Precautions when disposing of the OLED display modules

(1) Request the qualified companies to handle industrial wastes when disposing of the OLED
display modules. Or, when burning them, be sure to observe the environmental and hygienic
laws and regulations.

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