Inchange Semiconductor Product Specification
Silicon NPN Power Transistors
www.DataSheet4U.com 3DD200
DESCRIPTION
With TO-3 package
High collector-base breakdown voltage
: VCBO=250V
APPLICATIONS
For TV horizontal output applications
PINNING(see Fig.2)
PIN DESCRIPTION
1 Base
2 Emitter
Fig.1 simplified outline (TO-3) and symbol
3 Collector
Absolute maximum ratings(Ta= )
SYMBOL PARAMETER CONDITIONS VALUE UNIT
VCBO Collector-base voltage Open emitter 250 V
VCEO Collector-emitter voltage Open base 100 V
VEBO Emitter-base voltage Open collector 6 V
IC Collector current 3 A
PC Collector power dissipation TC=75 30 W
Tj Junction temperature 150
Tstg Storage temperature -55~150
THERMAL CHARACTERISTICS
SYMBOL CHARACTERISTICS MAX UNIT
R jc Thermal resistance junction to case 1.5 /W
Inchange Semiconductor Product Specification
Silicon NPN Power Transistors
www.DataSheet4U.com
3DD200
CHARACTERISTICS
Tj=25 unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN TYP. MAX UNIT
V(BR)CEO Collector-emitter breakdown voltage IC=50mA ;IB=0 100 V
V(BR)CBO Collector-base breakdown voltage IC=1mA ;IE=0 250 V
V(BR)EBO Emitter-base breakdown voltage IE=1mA ;IC=0 6 V
VCEsat Collector-emitter saturation voltage IC=3A; IB=0.3A 1.5 V
VBEsat Base-emitter saturation voltage IC=3A; IB=0.3A 1.5 V
ICBO Collector cut-off current VCB=250V; IE=0 0.5 mA
IEBO Emitter cut-off current VEB=6V; IC=0 0.1 mA
hFE DC current gain IC=2A ; VCE=5V 30 120
tf Fall time IC=3A; IB1=0.2A; IB2=-0.3A 1 s
2
Inchange Semiconductor Product Specification
Silicon NPN Power Transistors
www.DataSheet4U.com
3DD200
PACKAGE OUTLINE
T O R
导体 D UC
半 N
固电 EM IC O
E S
H A NG
IN C
Fig.2 outline dimensions (unindicated tolerance: 0.1mm)