STM32WB1MMC

Datasheet

Bluetooth® Low Energy 5.4 module

Features

• Includes ST state-of-the-art patented technology

• Integrated chip antenna, and option for external antenna
• Bluetooth® Low Energy 5.4 certified
• Supports 2 Mbits/s
• Frequency band: 2400 to 2483.5 MHz
• Advertising extension
• TX output power up to +5.5 dBm
• RX sensitivity: -96 dBm (1 Mbps)
• Dedicated Arm® Cortex®-M0+ for radio and security tasks
• Dedicated Arm® Cortex®-M4 CPU with FPU and ART (adaptative real-time
accelerator), up to 64 MHz speed
• 320-Kbyte flash memory, 48-Kbyte SRAM
• Fully integrated BOM, including 32 MHz radio and 32 kHz RTC crystals
• Integrated SMPS
• Ultra-low power modes for battery longevity
• 27 GPIOs
• SWD, JTAG
• Integrated IPD for best-in-class and reliable antenna matching
• VDD range: 1.71 to 3.6 V
• Temperature range: -40 to 85 °C
• Built-in security features, such as secure firmware installation (SFI) for radio
stack, PKA, AES 256-bit, RNG, PCROP, CRC, 96-bit UID, possibility to derive
48-bit UEI
• Certifications: CE, FCC, ISED, JRF, RoHS, REACH, UKCA, NCC, KC, SRRC
• 2-layer PCB

Applications

• Home automation
• Wellness, healthcare, personal trackers
• Gaming and toys
• Beacons and accessories
• Industrial

Product status

STM32WB1MMC

DS14096 - Rev 7 - August 2024 www.st.com

For further information contact your local STMicroelectronics sales office.
 STM32WB1MMC
Introduction

1 Introduction

This document provides the ordering information and mechanical device characteristics of the STM32WB1MMC
module. It must be read in conjunction with DS13258 and RM0473, available on www.st.com.
For information on the Arm® Cortex® cores, refer to the Cortex® Technical Reference Manual, available from the
www.arm.com website.
Note: Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

DS14096 - Rev 7 page 2/30

 STM32WB1MMC
Description

2 Description

The STM32WB1MMC is an ultra-low power, small form factor, certified 2.4 GHz wireless module, supporting
Bluetooth® Low Energy 5.4. Based on the STM32WB15CCY wireless microcontroller, it provides best-in-class RF
performance thanks to its good receiver sensitivity and a high output power signal. Its low power features enable
extended battery life time, small coin-cell batteries, or energy harvesting.
The STM32WB1MMC requires no RF expertise, and is the best way to speed up the application development and
to reduce the associated costs. The module is completely protocol stack royalty-free.

DS14096 - Rev 7 page 3/30

 STM32WB1MMC
Module overview

3 Module overview

The module is a SiP-LGA77 package (system in package land grid array), based on the proven STM32WB15CCY
MCU. The package includes:
• LSE and HSE crystals
• Passive components for SMPS
• Antenna matching and antenna
• IPD for RF matching and harmonics rejection

Figure 1. Block diagram

External antenna

Communication
interfaces
SMPS passive
components STM32WB15CCY
Antenna
RF IPD
matching
320 KB flash memory
Power supply 48 KB SRAM
filtering

XTAL XTAL

DT55981
32.768 kHz 32 MHz

3.1 Power supply

The power supply requirements are identical to those of the STM32WB1x devices, detailed in the datasheet
DS13258. Filtering capacitors on power supply pins and components for the SMPS are already integrated into the
module.
The SMPS passive components fitted in the module are in configuration-imposing function at 4 MHz, always ON.
This is the only available configuration. For additional information on the SMPS, check the reference manual or
AN5246, available on www.st.com.

3.2 Clocks
As the crystals are already integrated into the package, it is not possible to use any clock in bypass mode. The
module integrates a 32.768 kHz crystal for LSE, and a 32 MHz crystal for the HSE clock.
• HSE is already tuned.
RCC_HSECR.HSETUNE[5:0] value is loaded automatically by hardware. The RCC_HSECR register
configuration must not be changed by the user to keep the default parameters.
• LSCO and MCO outputs are available.

3.3 Antenna
The rectangular module has one shorter side clearly different from the remaining finish surface. This side is
unshielded and the mold cover contains the integrated antenna.
To use the internal antenna, pins 6 (ANT_INT) and 7 (ANT_EXT) must be connected as in Figure 2.
If an external antenna is used, ANT_IN must be shorted to ground, and ANT_OUT connected to the external
antenna matching network and to the antenna itself, as in Figure 3.
Note: Regulatory certifications obtained by ST apply only to the module with its internal antenna. Designs with external
antennas require new certifications.

DS14096 - Rev 7 page 4/30

 STM32WB1MMC
Module overview

Figure 2. Connections when using the internal antenna

Figure 3. Connections when using an external antenna

3.4 OTP
The STM32WB1MMC features a 1-Kbyte one time programmable (OTP) memory for use by the end product (see
DS13258 and RM0473).
Note: The device uses the first and last words of this area for trimming and identification purposes. As a consequence,
addresses 0x1FFF7000h to 0x1FFF7007h and 0x1FFF73F8h to 0x1FFF73FFh cannot be changed.

DS14096 - Rev 7 page 5/30

 STM32WB1MMC
Available peripherals

4 Available peripherals

All the peripherals available in STM32WB series microcontrollers based on the WLCSP49 package are available
and accessible on this module.
The pins on the module offer access to the following system peripherals:
• 1× DMA controllers (seven channels each) supporting ADC, SPI, I2C, USART, AES, timers
• 1× USART (ISO 7816, IrDA, SPI master, Modbus and Smartcard mode)
• 1× LPUART (low power)
• SPI running at 32 Mbit/s
• I²C (SMBus/PMBus®)
• 1× touch sensing controller, up to 8 sensors
• 1× 16-bit, four-channel advanced timer
• 2× 16-bit, two-channel timers
• 1× 32-bit, four-channel timer
• 2× 16-bit ultra-low power timers
• 1× independent SysTick
• 1× independent watchdog
• 1× window watchdog.
The full pin description is available in DS13258.

DS14096 - Rev 7 page 6/30

 STM32WB1MMC
Pin description

5 Pin description

Figure 4 shows the module pinout package bottom view.

Figure 4. STM32WB1MMC module pinout: bottom view

30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
PA PA PB PA PA PA PA PA PA PB PB PB
VSS VSS VSS VSS VSS VSS
12 11 4 14 13 10 0 9 5 1 0 2

PA
29 7 53 VSS VSS VSS VSS VSS VSS

52 51 50 49 48
PA
28 3 54 VSS

PB
27 6 55 VSS

PB
26 5 56 VSS
77 76 75
VSS VSS VSS
PB
25 7 57 VSS

72 73 74
24 VSS VSS VSS VSS 58 VSS

23 NRST 71 70 69 59 VSS
VSS VSS VSS

22 BOOT
0 60 VSS

21 VSS
SMPS 61 VSS

20 VDD
SMPS 62 VSS

64 65 66 67 68
19 VSS 63 VSS VSS VSS VSS VSS VSS

VDD PB PA PA PA PA PA VSS ANT_ ANT_ VSS

VBAT VSS A
VSS VSS VSS VSS VSS
8 2 6 1 8 4 RF OUT IN RF

DT56434
18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

Table 1. STM32WB1MMC pin/ball definition

Pin name
Pin name (function after reset) Pin type
STM32WB1MMC STM32WB15CCY

1 - VSS S
2 - VSS S
3 - VSS S
4 - VSS S
5 G1 VSSRF S
6 - ANT_IN I
7 - ANT_OUT O
8 G3 VSSRF S
9 G7 PA4 I/O

DS14096 - Rev 7 page 7/30

 STM32WB1MMC
Pin description

Pin name
Pin name (function after reset) Pin type
STM32WB1MMC STM32WB15CCY

10 G6 PA8 I/O
11 F7 PA1 I/O
12 F6 PA6 I/O
13 E6 PA2 I/O
14 C6 PB8 I/O
15 - VSS S
16 E7 VDDA S
17 - VSS S
18 C5 VBAT S
19 - VSS S
20 A1 VDDSMPS S
21 C1 VSSSMPS S
22 B6 BOOT0 I/O
23 C7 NRST I/O
24 - VSS S
25 A6 PB7 I/O
26 A5 PB5 I/O
27 B5 PB6 I/O
28 D5 PA3 I/O
29 E5 PA7 I/O
30 A3 PA12 I/O
31 - VSS S
32 A2 PA11 I/O
33 B4 PB4 I/O
34 B3 PA14 I/O
35 B2 PA13 I/O
36 C2 PA10 I/O
37 C4 PA0 I/O
38 D3 PA9 I/O
39 D4 PA5 I/O
40 E1 PB1 I/O
41 E2 PB0 I/O
42 E4 PB2 I/O
43 - VSS S
44 - VSS S
45 - VSS S
46 - VSS S
47 - VSS S
48 - VSS S
49 - VSS S

DS14096 - Rev 7 page 8/30

 STM32WB1MMC
Pin description

Pin name
Pin name (function after reset) Pin type
STM32WB1MMC STM32WB15CCY

50 - VSS S
51 - VSS S
52 - VSS S
53 - VSS S
54 - VSS S
55 - VSS S
56 - VSS S
57 - VSS S
58 - VSS S
59 - VSS S
60 - VSS S
61 - VSS S
62 - VSS S
63 - VSS S
64 - VSS S
65 - VSS S
66 - VSS S
67 - VSS S
68 - VSS S
69 - VSS S
70 - VSS S
71 - VSS S
72 - VSS S
73 - VSS S
74 - VSS S
75 - VSS S
76 - VSS S
77 - VSS S

DS14096 - Rev 7 page 9/30

 6 Schematics
DS14096 - Rev 7

Figure 5. Reference board schematics

STM32WB1MMC
Schematics
page 10/30
 STM32WB1MMC
PCB

7 PCB

Figure 6. Top layer

Figure 7. Bottom layer

Sensitive GPIOs
Among the multiple GPIOs available on this product, three are particularly sensitive, namely PB0, PB1, and PB2.
If possible, do not use them, and do not connect these pins. If they must be used, ensure that the connections are
made with very short wires, to avoid the creation of parasitic antennas. In addition, place a small scale factor
(such as 201) 2.7 pF capacitor as close as possible to the output pin, and border these tracks with the ground
plane.

DS14096 - Rev 7 page 11/30

 STM32WB1MMC
PCB

Layout recommendations
Decoupling capacitors must be placed as close as possible to the pins.
100 nF capacitors on external supplies must be placed as close as possible to the supply pads of the MEMs.

DS14096 - Rev 7 page 12/30

 STM32WB1MMC
Electrical characteristics

8 Electrical characteristics

8.1 Operating conditions

Table 2. STM32WB1MMC operating conditions

Parameter Min Typ Max Unit

VDD 1.71 3.3 3.6 V

Operating ambient temperature range -40 - 85

°C
Storing temperature range -40 - 125

8.2 Power consumption

The power consumption is identical to the regular STM32WB15. For full details refer to DS13258.

8.3 RF characteristics
Refer to DS13258.

8.4 Antenna radiation patterns and efficiency

The following figures present the radiation patterns, taken from certification measurements.

DS14096 - Rev 7 page 13/30

 STM32WB1MMC
Electrical characteristics

Figure 8. Radiaton pattern - 2402 MHz

DS14096 - Rev 7 page 14/30

 STM32WB1MMC
Electrical characteristics

Figure 9. Radiaton pattern - 2440 MHz

DS14096 - Rev 7 page 15/30

 STM32WB1MMC
Electrical characteristics

Figure 10. Radiaton pattern - 2480 MHz

DS14096 - Rev 7 page 16/30

 STM32WB1MMC
Package information

9 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

9.1 Device marking for SiP-LGA77

Refer to technical note “Reference device marking schematics for STM32 microcontrollers and microprocessors”
(TN1433) available on www.st.com, for the location of pin 1 / ball A1, as well as the location and orientation of the
marking areas versus pin 1 / ball A1.
Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and
therefore not approved for use in production. ST is not responsible for any consequences resulting from such use.
In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality
department must be contacted prior to any decision to use these engineering samples to run a qualification
activity.

9.2 LGA77 package information (B0HQ)

This LGA is a 77-lead, 10 x 6.5 mm, 0.45/0.50 mm pitch, land grid array package.

Figure 11. LGA77 - Outline

TOP VIEW SIDE VIEW BOTTOM VIEW

PIN A1 CORNER
A
PIN A1 CORNER bbb C 5.550
A1
0.525
M S 2.300
47 48
+
+
+ +

68 1

(x10) 0.30x0.30
49
6.018 ref

46 67 2
0.600
2.400

45 50 66 3
0.525

Top surface sputter: 3~6 µm 44 51 65 4

5.450
43
52
+

64 5
42
53 54 55 56 57 58 50 60 61 62 63 6
+

A’ 41
+ 7

40 8
D1
D

39 9

+ 75 74 +69
SEATING PLANE

38 10
6.983 ref

+ 37 11 (x54) 0.35x0.30
36 +76 73 70 12
(x9) 0.60x0.60
1.050
eD

35 13

34
+77 +73 71 14

33 15
0.525
32 0.950 16
17
31
22 21 19
+
18
+ + + 20 + +
C

29 28 27 26 25 24 23
30

(x4) 0.35x0.35
Side wall sputter: 1~3 µm B 0.525
eE
ddd C

E1
A
E
aaa (4x)

0.600 µm ref.

0.150 µm ref.

0.400 µm ref.

B0HQ_LGA77_ME
DETAIL A’

DS14096 - Rev 7 page 17/30

 STM32WB1MMC
Package information

1. All dimensions, except where are indicated, are in millimeters.

2. Drawing is not in scale.

Table 3. LGA77 - Mechanical data

millimeters inches
Symbol
Min Typ Max Min Typ Max

A 1.372 ± 0.046 0.0540 ± 0.0018

A1 0.030 ± 0.020 0.0012 ± 0.0008
D 9.900 10.000 10.100 0.3898 0.3937 0.3976
E 6.400 6.500 6.600 0.2520 0.2559 0.2598
D1 9.075 0.3573
E1 5.550 0.2185
eD 0.500 0.0197
eE 0.450 0.0177
M 1.100 REF 0.0433 REF
S 0.24 REF 0.0094 REF
0.300 x 0.300 0.118 x 0.0118
0.350 x 0.300 0.0138 x 0.0118
Lead width
0.350 x 0.350 0.0138 x 0.0138
0.600 x 0.600 0.0236 x 0.0236
aaa 0.100 0.0039
bbb 0.100 0.0039
ddd 0.100 0.0039

1. Values in inches are converted from mm and rounded to four decimal digits.

9.3 Thermal characteristics

The device thermal characteristics are defined below, and the constant values are given in Table 4:
• ϴJA is the junction-to-ambient thermal resistance (EIA/JESD51-2 and EIA/JESD51-6)
ϴJA represents the resistance to the heat flowing from the chip to ambient air. It is an indicator of package
heat dissipation capability, a lower ϴJA means better overall thermal performance. It is calculated as
follows:
ϴJA = (TJ - TA) / PH,
where:
– TJ = junction temperature
– TA = ambient temperature
– PH = power dissipation.
• ΨJT is the junction-to-top-center thermal characterization parameter (EIA/JESD51-2 and EIA/JESD51-6).
ΨJT is used for estimating the junction temperature by measuring TT in an actual environment. It is
calculated as follows:
ΨJT = (TJ - TT) / PH
where TT = temperature at the top-center of the package.
• ϴJC is the junction-to-case thermal resistance.
ϴJC represents the resistance to the heat flowing from the chip to package top case. ϴJC is important when
an external heat sink is attached on package top. It is calculated as follows:
ϴJC = (TJ – TC) / PH
where TC = case temperature attached with a cold plate.

DS14096 - Rev 7 page 18/30

 STM32WB1MMC
Package information

• ϴJB is the junction-to-board thermal resistance (EIA/JESD51-8).

ϴJB represents the resistance to the heat flowing from the chip to PCB. ϴJB is used in compact thermal
models for system-level thermal simulation. It is calculated as follows:
ϴJB = (TJ – TB) / PH
where TB = board temperature with ring cold plate fixture applied.

Table 4. Thermal characteristics

Symbol Max TJ (° C) TT (° C) ΨJT (° C/W) ϴJA (° C/W) ϴJB (° C/W) ϴJC (° C/W)

Value 99.65 99.53 0.26 37.36 16.96 14.41

9.4 Board design

For information and recommendations related to board design, landing pads, stencils and the solder reflow profile
for LGA packages, refer to AN 5886 "Guidelines for design and board assembly of land grid array packages",
available on www.st.com.

DS14096 - Rev 7 page 19/30

 STM32WB1MMC
Ordering information

10 Ordering information

Table 5. Ordering information scheme

Example: STM32 WB 1 M M C H 6 TR
Device family
STM32 = Arm-based 32-bit microcontroller
Product type
WB = wireless Bluetooth
Device subfamily
1 = STM32WB15 die 1, full set of features
Pin count
M = 77 pins
Component type
M = module
Flash memory size
C = 320 Kbytes
Package
H = LGA77 6.5 x 10 mm
Temperature range
6 = industrial temperature range, –40 to 85 °C
Packing
TR = tape and reel

For a list of available options (such as speed and package) or for further information on any aspect of this device,
contact your nearest ST sales office.

DS14096 - Rev 7 page 20/30

 STM32WB1MMC
Certifications

11 Certifications

The STM32WB1MMC module, with its internal antenna, has passed the following certifications:
• BLE (RF_PHY)
• CE (RED)
• FCC
• ISED
• REACH
• ROHS
• Taiwan
• KC
Certifications for China (SRRC) are in progress. All certification reports are available on the STM32WB1MMC
webpage.

11.1 BLE(RF_PHY) certification

The module has obtained BLE RF_PHY certification.
The module is published under BLE SIG web site.

11.2 CE certification
The STM32WB1MMC module has obtained CE certification, and is provided with CE marking.

Figure 12. CE certification logo

11.3 FCC certification

The STM32WB1MMC module complies with part 15 of the FCC Rules.
The FCC ID is YCP-32WB1MMCH01.
The module label includes the corresponding FCC ID.
The operation is subject to the following two conditions:
• This device may not cause harmful interference
• This device must accept any interference received, including interference that may cause undesired
operation.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in
a residential installation.

Label requirements
If the identification number is not visible when the module is installed inside another device, then the outside of
the device into which the module is installed must also display a label referring to the enclosed module. This label
must contain the FCC ID that matches the one on the module.

Documentation requirements
The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that
changes or modifications not expressly approved by the party responsible for compliance could void the user's
authority to operate the equipment.

DS14096 - Rev 7 page 21/30

 STM32WB1MMC
Certifications

Integration requirements
Co-location of this module with other transmitters that operate simultaneously are required to be evaluated using
the multi-transmitter procedures.
The host integrator must follow the integration instructions provided in this document and ensure that the
composite-system end product complies with the requirements by a technical assessment or evaluation to the
rules and to KDB Publication 996369.
The host integrator installing this module into their product must ensure that the final composite product complies
with the requirements by a technical assessment or evaluation to the rules, including the transmitter operation and
should refer to guidance in KDB 996369.

11.4 ISED certification

The STM32WB1MMC module has been tested and found compliant with the ISED RSS-247 and RSS-Gen rules.
The IC ID is 8976A-32WB1MMCH01.
This module contains license-exempt transmitter(s) that comply with Innovation, Science and Economic
Development Canada’s license-exempt RSS(s). Operation is subject to the following two conditions:
• This module may not cause interference
• This module must accept any interference, including interference that may cause undesired operation of
the module.
L’émetteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et
Développement économique Canada applicables aux appareils radio exempts de licence. L’exploitation est
autorisée aux deux conditions suivantes :
• L’appareil ne doit pas produire de brouillage.
• L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en
compromettre le fonctionnement.

11.5 JRF certification

The STM32WB1MMC module is certified in Japan with certification number 217-230934.

Figure 13. JRF logo

11.6 NCC certification

The STM32WB1MMC is certified in Taiwan with NCC certification number CCAN24Y10600T7.
取得審驗證明之低功率射頻器材，非經核准，公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計之
特性及功能。低功率射頻器材之使用不得影響飛航安全及干擾合法通信；經發現有干擾現象時，應立即停用，並改
善至無干擾時方得繼續使用。前述合法通信，指依電信管理法規定作業之無線電通信。低功率射頻器材須忍受合法
通信或工業、科學及醫療用電波輻射性電機設備之干擾
For module:

DS14096 - Rev 7 page 22/30

 STM32WB1MMC
Certifications

11.7 KC certification
Applicant company name: STMicroelectronics (Rousset) SAS
Equipment: Module for Bluetooth Low Energy, STM32WB1MMC
Manufacturing date: Notified separately
Manufacturer: STMicroelectronics (Rousset) SAS, France

Figure 14. KC logo

11.8 SRRC certification

The module STM32WB1MMC has received regulatory approval in China (SRRC) with CMIIT ID 24J31B9F8878.

DS14096 - Rev 7 page 23/30

 STM32WB1MMC
Important security notice

12 Important security notice

The STMicroelectronics group of companies (ST) places a high value on product security, which is why the ST
product(s) identified in this documentation may be certified by various security certification bodies and/or may
implement our own security measures as set forth herein. However, no level of security certification and/or built-in
security measures can guarantee that ST products are resistant to all forms of attacks. As such, it is the
responsibility of each of ST's customers to determine if the level of security provided in an ST product meets the
customer needs both in relation to the ST product alone, as well as when combined with other components and/or
software for the customer end product or application. In particular, take note that:
• ST products may have been certified by one or more security certification bodies, such as Platform
Security Architecture (www.psacertified.org) and/or Security Evaluation standard for IoT Platforms
(www.trustcb.com). For details concerning whether the ST product(s) referenced herein have received
security certification along with the level and current status of such certification, either visit the relevant
certification standards website or go to the relevant product page on www.st.com for the most up to date
information. As the status and/or level of security certification for an ST product can change from time to
time, customers should re-check security certification status/level as needed. If an ST product is not shown
to be certified under a particular security standard, customers should not assume it is certified.
• Certification bodies have the right to evaluate, grant and revoke security certification in relation to ST
products. These certification bodies are therefore independently responsible for granting or revoking
security certification for an ST product, and ST does not take any responsibility for mistakes, evaluations,
assessments, testing, or other activity carried out by the certification body with respect to any ST product.
• Industry-based cryptographic algorithms (such as AES, DES, or MD5) and other open standard
technologies which may be used in conjunction with an ST product are based on standards which were not
developed by ST. ST does not take responsibility for any flaws in such cryptographic algorithms or open
technologies or for any methods which have been or may be developed to bypass, decrypt or crack such
algorithms or technologies.
• While robust security testing may be done, no level of certification can absolutely guarantee protections
against all attacks, including, for example, against advanced attacks which have not been tested for,
against new or unidentified forms of attack, or against any form of attack when using an ST product outside
of its specification or intended use, or in conjunction with other components or software which are used
bycustomer to create their end product or application. ST is not responsible for resistance against such
attacks. As such, regardless of the incorporated security features and/or any information or support that
may be provided by ST, each customer is solely responsible for determining if the level of attacks tested for
meets their needs, both in relation to the ST product alone and when incorporated into a customer end
product or application.
• All security features of ST products (inclusive of any hardware, software, documentation, and the like),
including but not limited to any enhanced security features added by ST, are provided on an "AS IS"
BASIS. AS SUCH, TO THE EXTENT PERMITTED BY APPLICABLE LAW, ST DISCLAIMS ALL
WARRANTIES, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, unless the
applicable written and signed contract terms specifically provide otherwise.

DS14096 - Rev 7 page 24/30

 STM32WB1MMC

Revision history
Table 6. Document revision history

Date Version Changes

03-Mar-2023 1 Initial release.

Updated Features and Sensitive GPIOs.
Added certification logos on cover page.
28-Jul-2023 2 Updated Figure 4. STM32WB1MMC module pinout: bottom view.
Added Section 11.5: JRF certification.
Minor text edits across the whole document.
Updated document title and image on cover page.
05-Sep-2023 3
Updated Features and Section 2: Description.
Updated Features, Section 11.3: FCC certification, and Section 11.4: ISED certification.
26-Jan-2024 4
Removed former Section 11: Tape and reel.
Updated Features and Section 11: Certifications.
19-Jun-2024 5 Added Taiwan certification logo on cover page.
Added Section 11.6: NCC certification and Section 12: Important security notice.
Updated Features and Section 11: Certifications.
Updated Taiwan certification logo and added Korean certification logo on cover page.
09-Jul-2024 6
Updated Section 11.6: NCC certification.
Added Section 11.7: KC certification.
Updated Features.
16-Aug-2024 7
Added Section 11.8: SRRC certification.

DS14096 - Rev 7 page 25/30

 STM32WB1MMC
Contents

Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
3 Module overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
3.1 Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2 Clocks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.3 Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.4 OTP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Available peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
6 Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
7 PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
8 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
8.1 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8.2 Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8.3 RF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8.4 Antenna radiation patterns and efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
9 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
9.1 Device marking for SiP-LGA77 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
9.2 LGA77 package information (B0HQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
9.3 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
9.4 Board design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
10 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
11 Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
11.1 BLE(RF_PHY) certification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
11.2 CE certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
11.3 FCC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
11.4 ISED certification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
11.5 JRF certification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
11.6 NCC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
11.7 KC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
11.8 SRRC certification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
12 Important security notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

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Contents

List of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

List of figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29

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 STM32WB1MMC
List of tables

List of tables
Table 1. STM32WB1MMC pin/ball definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 2. STM32WB1MMC operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 3. LGA77 - Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 4. Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 5. Ordering information scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 6. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

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 STM32WB1MMC
List of figures

List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 2. Connections when using the internal antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. Connections when using an external antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 4. STM32WB1MMC module pinout: bottom view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 5. Reference board schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. Top layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 7. Bottom layer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 8. Radiaton pattern - 2402 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 9. Radiaton pattern - 2440 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 10. Radiaton pattern - 2480 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 11. LGA77 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 12. CE certification logo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 13. JRF logo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 14. KC logo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

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