Sum and Difference Amplifier Modules

Position Sensing Modules

QD7-0-SD or QD50-0-SD are quadrant photodiode arrays with associ-

ated circuitry to provide two difference signals and a sum signal. The two
difference signals are voltage analogs of the relative intensity difference of
the light sensed by opposing pairs of the photodiode quadrant elements.
In addition the amplified sum of all 4 quadrant elements is provided as the
sum signal. This makes the QD7-0-SD or QD50-0-SD ideal for both light
beam nulling and position applications. Very precise light beam alignments
are possible, and the circuit can also be used for target acquisition and
alignment.

APPLICATIONS FEATURES
• Position Measuring • Other QD7-XX or QD50-XX
• Beam Centering are available upon request
• Targeting
• Guidance Systems

Values given as per element unless otherwise stated

Rise Temp
Active Area Responsivity Capacitance NEP
Element Gap (mm)

Time Range
Total (A/W) (pF) (W/Hz)
Model Number

Reverse (ns) (˚C)

Dark Current
Voltage
(nA) -30 V Package
(V)
Area (mm2)

Dimensions

0V

Operating
900 nm 0V 900 nm Style ¶

Storage
900 nm
(mm)

50 Ω

min. typ. typ. typ. max. typ. max. typ.

‘O’ Series
QD7-0 7 3.0 φ 20 4.0 15.0 9.0 e-14 41 / TO-5

-40 ~

-55 ~
+100

+125
0.2 0.47 0.54 30 10
QD50-0 50 8.0 φ 125 15.0 30.0 1.3 e-13 70 / TO-8

INPUT OUTPUT
Power supply voltage Vcc = ±4.5V min; ±15V typical; ±18V max Where ix is the current from quadrant x
Photodiode bias voltage = (.91) x (VPDBIAS) VT-B = -{(i1 +i2) - (i3 + i4)} x (104)
VPDBIAS = 0 TO +Vcc; Absolute maximum VPDBIAS is +Vcc VL-R = -{(i2 +i3) - (i1 + i4)} x (104)
NOTE: Negative voltages applied to PDBIAS will render the VSUM = -{(i1 + i2 + i3 + i4)} x (104)
QD7-0-SD or QD50-0-SD inoperative.

MAXIMUM OUTPUT VOLTAGE

ENVIRONMENTAL Positive: (+Vcc - 3V)
Operating temperature 0 to 70° C
Negative: (- Vcc + 3V)
Theoretical noise 15 nV/Hz½
Frequency response (-3dB): 120kHz @ VPDBIAS=0V;880nm
250kHz @ VPDBIAS=15V;880nm
Max slew rate 10V/µs
Output current limit 25 mA

54
 Photodiode Care and Handling Instructions

AVOID DIRECT LIGHT

Since the spectral response of silicon photodiode includes the visible light region, care must be taken to avoid photodiode exposure to
high ambient light levels, particularly from tungsten sources or sunlight. During shipment from OSI Optoelectronics, your photodiodes are
packaged in opaque, padded containers to avoid ambient light exposure and damage due to shock from dropping or jarring.

AVOID SHARP PHYSICAL SHOCK

Photodiodes can be rendered inoperable if dropped or sharply jarred. The wire bonds are delicate and can become separated from the
photodiode’s bonding pads when the detector is dropped or otherwise receives a sharp physical blow.

CLEAN WINDOWS WITH OPTICAL GRADE CLOTH / TISSUE

Most windows on OSI Optoelectronics photodiodes are either silicon or quartz. They should be cleaned with isopropyl alcohol and a soft
(optical grade) pad.

OBSERVE STORAGE TEMPERATURES AND HUMIDITY LEVELS

Photodiode exposure to extreme high or low storage temperatures can affect the subsequent performance of a silicon photodiode. Storage
temperature guidelines are presented in the photodiode performance specifications of this catalog. Please maintain a non-condensing
environment for optimum performance and lifetime.

OBSERVE ELECTROSTATIC DISCHARGE (ESD) PRECAUTIONS

OSI Optoelectronics photodiodes, especially with IC devices (e.g. Photops) are considered ESD sensitive. The photodiodes are shipped in
ESD protective packaging. When unpacking and using these products, anti-ESD precautions should be observed.

DO NOT EXPOSE PHOTODIODES TO HARSH CHEMICALS

Photodiode packages and/or operation may be impaired if exposed to CHLOROTHENE, THINNER, ACETONE, or TRICHLOROETHYLENE.

INSTALL WITH CARE

Most photodiodes in this catalog are provided with wire or pin leads for installation in circuit boards or sockets. Observe the soldering
temperatures and conditions specified below:

Soldering Iron: Soldering 30 W or less

Temperature at tip of iron 300°C or lower.

Dip Soldering: Bath Temperature: 260±5°C.

Immersion Time: within 5 Sec.
Soldering Time: within 3 Sec.

Vapor Phase Soldering: DO NOT USE

Reflow Soldering: DO NOT USE

Photodiodes in plastic packages should be given special care. Clear plastic packages are more sensitive to environmental stress than those
of black plastic. Storing devices in high humidity can present problems when soldering. Since the rapid heating during soldering stresses
the wire bonds and can cause wire to bonding pad separation, it is recommended that devices in plastic packages to be baked for 24 hours
at 85°C.

The leads on the photodiode SHOULD NOT BE FORMED. If your application requires lead spacing modification, please contact OSI
Optoelectronics Applications group at (310)978-0516 before forming a product’s leads. Product warranties could be voided.

*Most of our standard catalog products are RoHS Compliant. Please contact us for details

World Class Products - Light Sensing Solutions 59

1. Parameter Definitions:

Mechanical Specifications and Die Topography

Mechanical Drawings
A = Distance from top of chip to top of glass.
a = Photodiode Anode.
B = Distance from top of glass to bottom of case.
c = Photodiode Cathode
(Note: cathode is common to case in metal package products unless otherwise noted).
W = Window Diameter.
F.O.V. = Filed of View (see definition below).

2. Dimensions are in inches (1 inch = 25.4 mm).

3. Pin diameters are 0.018 ± 0.002" unless otherwise specified.

4. Tolerances (unless otherwise noted)

General: 0.XX ±0.01"
0.XXX ±0.005"
Chip Centering: ±0.010"
Dimension ‘A’: ±0.015"

5. Windows
All ‘UV’ Enhanced products are provided with QUARTZ glass windows,
0.027 ± 0.002" thick.

All ‘XUV’ products are provided with removable windows.

All ‘DLS’ PSD products are provided with A/R coated glass windows.

All ‘FIL’ photoconductive and photovoltaic products are epoxy filled

instead of glass windows.

For Further Assistance

Please Call One of Our Experienced
Sales and Applications Engineers
310-978-0516

- Or -
visit our website at
www.osioptoelectronics.com

61
 Mechanical Specifications
All units in inches. Pinouts are bottom view.

SPOT-2DMI SC-4D SL5-1

SL3-1
SPOT-2D
SPOT-3D
SPOT-4D
SPOT-4DMI
QD7-0

QD7-0 0.050 0.130 0.230

QD7-0

SPOT-9D SC-10D SC-25D

SPOT-9DMI

68
 Mechanical Specifications
All units in inches. Pinouts are bottom view.
65 TO-52 66 TO-52L 67

APD02-8-150-T52 APD02-8-150-T52L APD15-8-150-TO5

APD05-8-150-T52 APD05-8-150-T52L APD30-8-150-TO5
APD10-8-150-T52 APD10-8-150-T52L

0.213 0.213
0.185 0.185
0.098 0.059 .163
(W) 0.026
.091
0.098 0.128 0.150
0.098
0.511 min.
TO-8
0.551 min. 0.551 min.

68 Plastic 69 TO-8 70 TO-8

CD-1705 OSD60-0 QD50-0

0.12 DIA. OSD60-5T
0.55 DIA. OSD60-E 0.55 DIA.
0.44 0.44
DIA. DIA.
0.16
MAX. 0.17 0.17
0.08

0.08 0.08
NOM. 0.50 MIN. NOM. 0.50 MIN.

0.61
0.018 DIA.
0.018 DIA.
CATHODE & Q4
CATHODE &
CASE CASE
0.018 DIA. 1 2 3
0.012 DIA. ANODE 0.60 Q3 0.60
0.04 0.40 DIA.
0.40 DIA.
DIA. Q2 6 5 4

ANODE 0.10 QUADRANT

TYP. ANODE 1
CATHODE

TO-5 Plastic Molded

World Class Products - Light Sensing Solutions 73